ICS557-03 概述
PCI-EXPRESS CLOCK SOURCE PCI - Express时钟源
ICS557-03 数据手册
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PCI-EXPRESS CLOCK SOURCE
ICS557-03
Description
Features
The ICS557-03 is a spread spectrum clock generator that
supports PCI-Express and Ethernet requirements. The
device is used for PC or embedded systems to substantially
reduce electromagnetic interference (EMI). The device
provides two differential (HCSL) spread spectrum outputs.
The spread type and amount are configured via select pin.
Using IDT’s patented Phase-Locked Loop (PLL)
techniques, the device takes a 25 MHz crystal input and
produces two pairs of differential outputs at 25 MHz, 100
MHz, 125 MHz or 200 MHz clock frequencies for HCSL,
and 25 MHz or 100 MHz for LVDS.
• Packaged in 16-pin TSSOP
• Available in RoHS 5 (green) or RoHS 6 (green and lead
free) compliant packaging
• Supports HCSL or LVDS output levels
• Operating voltage of 3.3 V
• Input frequency of 25 MHz
• Jitter 80 ps (peak-to-peak)
• Spread Spectrum capability
• Industrial and commercial temperature ranges
Block Diagram
VDD
2
SS1:SS0
2
CLK0
CLK0
Control
Logic
S1:S0
2
Phase Lock Loop
CLK1
CLK1
X1/ICLK
Clock
Buffer/
25 MHz
Crystal
crystal or clock
Oscillator
X2
2
GND
Optional tuning crystal
capacitors
Rr(IREF)
OE
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Output Select Table 1 (MHz)
Pin Assignment
S1
0
S0
0
CLK(1:0), CLK(1:0)
1
VDDXD
CLK0
16
15
14
13
12
11
10
9
S0
25M
100M
125M
200M
S1
SS0
2
3
4
5
6
7
8
0
1
CLK0
1
0
1
1
X1/ICLK
X2
GNDODA
VDDODA
CLK1
Spread Selection Table 2
OE
SS1 SS0
Spread%
No Spread
Down -0.5
Down -0.75
No Spread
GNDXD
SS1
CLK1
IREF
0
0
1
1
0
1
0
1
16-pin (173 mil) TSSOP
Pin Descriptions
Pin
Pin
Pin
Pin Description
Number
Name
Type
1
2
3
4
5
6
S0
S1
Input Select pin 0. See Table1. Internal pull-up resistor.
Input Select pin 1. See Table 1. Internal pull-up resistor.
Input Spread Select pin 0. See Table 2. Internal pull-up resistor.
SS0
X1/ICLK
X2
Input Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.
Output Crystal connection. Leave unconnected for clock input.
OE
Input Output enable. Tri-states outputs and device is not shut down. Internal
pull-up resistor.
7
8
9
GNDXD
SS1
Power Connect to ground.
Input Spread Select pin 1. See Table 2. Internal pull-up resistor.
IREF
Output Precision resistor attached to this pin is connected to the internal current
reference.
10
11
12
13
14
15
16
CLK1
CLK1
Output HCSL complimentary clock output 1.
Output HCSL true clock output 1.
VDDODA
GNDODA
CLK0
Power Connect to voltage supply +3.3 V for output driver and analog circuits
Power Connect to ground.
Output HCSL complimentary clock output 0.
Output HCSL true clock output 0.
CLK0
VDDXD
Power Connect to voltage supply +3.3 V for crystal oscillator and digital circuit.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Applications Information
External Components
Output Structures
A minimum number of external components are required for
proper operation.
6*IREF
IREF
=2.3 mA
Decoupling Capacitors
Decoupling capacitors of 0.01 µF should be connected
between each VDD pin and the ground plane, as close to
the VDD pin as possible. Do not share ground vias between
components. Route power from power source through the
capacitor pad and then into ICS pin.
Crystal
See Output Termination
Sections - Pages 3 ~ 5
A 25 MHz fundamental mode parallel resonant crystal
should be used. This crystal must have less than 300 ppm
of error across temperature in order for the ICS557-03 to
meet PCI Express specifications.
RR 475
Ω
General PCB Layout Recommendations
Crystal Capacitors
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
Crystal capacitors are connected from pins X1 to ground
and X2 to ground to optimize the accuracy of the output
frequency.
1. Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible.
C = Crystal’s load capacitance in pF
L
Crystal Capacitors (pF) = (C - 8) * 2
L
2. No vias should be used between decoupling capacitor
and VDD pin.
For example, for a crystal with a 16 pF load cap, each
external crystal cap would be 16 pF. (16-8)*2=16.
3. The PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from the
device is less critical.
Current Source (Iref) Reference Resistor - R
R
If board target trace impedance (Z) is 50Ω, then R = 475Ω
(1%), providing IREF of 2.32 mA. The output current (I ) is
R
OH
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (any ferrite beads and bulk decoupling capacitors can
be mounted on the back). Other signal traces should be
routed away from the ICS557-03.This includes signal traces
just underneath the device, or on layers adjacent to the
ground plane layer used by the device.
equal to 6*IREF.
Output Termination
The PCI-Express differential clock outputs of the ICS557-03
are open source drivers and require an external series
resistor and a resistor to ground. These resistor values and
their allowable locations are shown in detail in the
PCI-Express Layout Guidelines section.
The ICS557-03 can also be configured for LVDS compatible
voltage levels. See the LVDS Compatible Layout
Guidelines section.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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PCI-Express Layout Guidelines
Common Recommendations for Differential Routing
Dimension or Value Unit
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
L3 length, Route as non-coupled 50 ohm trace.
RS
RT
0.5 max
0.2 max
0.2 max
33
inch
inch
inch
ohm
ohm
49.9
Differential Routing on a Single PCB
Dimension or Value Unit
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
2 min to 16 max
1.8 min to 14.4 max
inch
inch
Differential Routing to a PCI Express Connector
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
Dimension or Value Unit
0.25 to 14 max inch
0.225 min to 12.6 max inch
PCI-Express Device Routing
L1
L2
L4
RS
RS
L4’
L1’
L2’
RT
RT
PCI-Express
Load or
Connector
ICS557-03
Output
L3’ L3
Clock
Typical PCI-Express (HCSL) Waveform
700 mV
0
500 ps
500 ps
tOR
tOF
0.525 V
0.175 V
0.525 V
0.175 V
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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LVDS Compatible Layout Guidelines
LVDS Recommendations for Differential Routing
Dimension or Value Unit
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
RP
RQ
RT
0.5 max
0.2 max
100
100
150
inch
inch
ohm
ohm
ohm
LVDS Device Routing
L1
L3
RQ
RP
L3’
L1’
RT
RT
ICS557-03
Clock
Output
LVDS
Device
Load
L2’ L2
Typical LVDS Waveform
1325 mV
1000 mV
500 ps
500 ps
tOR
tOF
1250 mV
1150 mV
1250 mV
1150 mV
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Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS557-03. These ratings are stress
ratings only. Functional operation of the device at these or any other conditions above those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for
extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended
operating temperature range.
Item
Supply Voltage, VDDXD, VDDODA
All Inputs and Outputs
Rating
7 V
-0.5 V to VDD+0.5 V
0 to +70° C
Ambient Operating Temperature (commercial)
Ambient Operating Temperature (industrial)
Storage Temperature
-40 to +85° C
-65 to +150° C
125°C
Junction Temperature
Soldering Temperature
260°C
ESD Protection (Input)
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85°C
Parameter
Symbo
l
Conditions
Min.
Typ.
Max.
Units
Supply Voltage
Input High Voltage
V
2.97
2.0
3.3
3.63
V
V
1
V
S0, S1, OE, ICLK, SS0, SS1
S0, S1, OE, ICLK, SS0, SS1
0 < Vin < VDD
VDD +0.3
IH
1
Input Low Voltage
Input Leakage Current
V
I
VSS-0.3
-5
0.8
5
V
IL
2
µA
mA
mA
pF
pF
nH
kΩ
kΩ
IL
Operating Supply Current
I
50Ω, 2 pF
OE =Low
78
44
7
DD
I
DDOE
Input Capacitance
Output Capacitance
Pin Inductance
C
Input pin capacitance
Output pin capacitance
IN
C
6
OUT
L
5
PIN
Output Resistance
Pull-up Resistor
R
CLK outputs
3.0
OUT
R
S0, S1, OE, SS0, SS1
100
PU
1. Single edge is monotonic when transitioning through region.
2. Inputs with pull-ups/-downs are not included.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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AC Electrical Characteristics - CLK0/CLK1, CLK0/CLK1
Unless stated otherwise, VDD=3.3 V ±10%, Ambient Temperature -40 to +85° C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
MHz
MHz
MHz
mV
mV
mV
mV
ps
Input Frequency
25
Output Frequency
HCSL termination
25
25
200
100
850
27
LVDS termination
HCSL
1,2
Output High Voltage
V
660
-150
250
700
0
OH
1,2
Output Low Voltage
V
HCSL
OL
1,2
Crossing Point Voltage
Crossing Point Voltage
Absolute
350
550
140
1,2,4
Variation over all edges
1,3
Jitter, Cycle-to-Cycle
80
0
Frequency Synthesis Error
Modulation Frequency
All outputs
ppm
kHz
ps
Spread spectrum
30
31.5
332
344
33
700
700
125
50
1,2
Rise Time
t
From 0.175 V to 0.525 V
From 0.525 V to 0.175 V
175
175
OR
1,2
Fall Time
t
ps
OF
1,2
Rise/Fall Time Variation
ps
Output to Output Skew
ps
1,3
Duty Cycle
45
55
%
5
Output Enable Time
All outputs
10
10
us
5
Output Disable Time
All outputs
us
Stabilization Time
t
From power-up VDD=3.3 V
3.0
3.0
ms
STABLE
Spread Spectrum Transition
Time
t
Stabilization time after spread
spectrum changes
ms
SPREAD
Note 1: Test setup is R =50 ohms with 2 pF, Rr = 475Ω (1%).
L
Note 2: Measurement taken from a single-ended waveform.
Note 3: Measurement taken from a differential waveform.
Note 4: Measured at the crossing point where instantaneous voltages of both CLK and CLK are equal.
Note 5: CLK pins are tri-stated when OE is low asserted. CLK is driven differential when OE is high.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ. Max. Units
Thermal Resistance Junction to
Ambient
q
Still air
1 m/s air flow
3 m/s air flow
78
70
68
37
° C/W
° C/W
° C/W
° C/W
JA
q
JA
q
JA
Thermal Resistance Junction to Case
q
JC
Marking Diagram (ICS557G-03)
Marking Diagram (ICS557GI-03)
16
9
16
9
557GI-03
######
YYWW$$
557G-03
######
YYWW$$
1
8
1
8
Marking Diagram (ICS557G-03LF)
Marking Diagram (ICS557GI-03LF)
16
9
16
9
557GI03L
######
YYWW
557G03LF
######
YYWW
1
8
1
8
Notes:
1. ###### is the lot code.
2. YYWW is the last two digits of the year, and the week number that the part was assembled.
3. “LF” designates Pb (lead) free package.
4. “I” deisgnates industrial temperature range.
5. Bottom marking: (origin). Origin = country of origin of not USA.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Package Outline and Package Dimensions (16-pin TSSOP, 173 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Inches*
16
Symbol
Min
--
Max
1.20
0.15
1.05
0.30
0.20
5.1
Min
--
Max
0.047
0.006
0.041
0.012
A
A1
A2
b
0.05
0.80
0.19
0.09
4.90
0.002
0.032
0.007
E1
E
INDEX
AREA
C
0.0035 0.008
0.193 0.201
0.252 BASIC
0.169 0.177
0.0256 Basic
D
E
6.40 BASIC
1
2
E1
e
4.30
4.50
D
0.65 Basic
L
0.45
0.75
0.018
0.030
a
0°
8°
0°
8°
aaa
--
0.10
--
0.004
A
A2
A1
c
- C -
e
SEATING
PLANE
b
L
aaa C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Tubes
Package
Temperature
0 to +70° C
0 to +70° C
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
-40 to +85° C
-40 to +85° C
ICS557G-03
ICS557G-03T
ICS557G-03LF
ICS557G-03LFT
ICS557GI-03
See Page 8
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
Tape and Reel
Tubes
Tape and Reel
Tubes
See Page 8
ICS557GI-03T
ICS557GI-03LF
ICS557GI-03LFT
Tape and Reel
Tubes
Tape and Reel
Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE
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Innovate with IDT and accelerate your future networks. Contact:
www.IDT.com
For Sales
800-345-7015
408-284-8200
Fax: 408-284-2775
For Tech Support
www.idt/go/clockhelp
Corporate Headquarters
Integrated Device Technology, Inc.
www.idt.com
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
Printed in USA
ICS557-03 相关器件
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ICS557-05A | ICSI | Quad Differential PCI-Express Clock Source | 获取价格 | |
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ICS557-06 | ICSI | ONE TO FOUR HCSL CLOCK BUFFER | 获取价格 | |
ICS557-08 | ICSI | 2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS | 获取价格 | |
ICS557G-03 | ICSI | PCI-EXPRESS CLOCK SOURCE | 获取价格 | |
ICS557G-03 | IDT | PCI-EXPRESS CLOCK SOURCE | 获取价格 | |
ICS557G-03LF | ICSI | PCI-EXPRESS CLOCK SOURCE | 获取价格 | |
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