ICS557-03

更新时间:2024-09-18 06:48:14
品牌:IDT
描述:PCI-EXPRESS CLOCK SOURCE

ICS557-03 概述

PCI-EXPRESS CLOCK SOURCE PCI - Express时钟源

ICS557-03 数据手册

通过下载ICS557-03数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
DATASHEET  
PCI-EXPRESS CLOCK SOURCE  
ICS557-03  
Description  
Features  
The ICS557-03 is a spread spectrum clock generator that  
supports PCI-Express and Ethernet requirements. The  
device is used for PC or embedded systems to substantially  
reduce electromagnetic interference (EMI). The device  
provides two differential (HCSL) spread spectrum outputs.  
The spread type and amount are configured via select pin.  
Using IDT’s patented Phase-Locked Loop (PLL)  
techniques, the device takes a 25 MHz crystal input and  
produces two pairs of differential outputs at 25 MHz, 100  
MHz, 125 MHz or 200 MHz clock frequencies for HCSL,  
and 25 MHz or 100 MHz for LVDS.  
Packaged in 16-pin TSSOP  
Available in RoHS 5 (green) or RoHS 6 (green and lead  
free) compliant packaging  
Supports HCSL or LVDS output levels  
Operating voltage of 3.3 V  
Input frequency of 25 MHz  
Jitter 80 ps (peak-to-peak)  
Spread Spectrum capability  
Industrial and commercial temperature ranges  
Block Diagram  
VDD  
2
SS1:SS0  
2
CLK0  
CLK0  
Control  
Logic  
S1:S0  
2
Phase Lock Loop  
CLK1  
CLK1  
X1/ICLK  
Clock  
Buffer/  
25 MHz  
Crystal  
crystal or clock  
Oscillator  
X2  
2
GND  
Optional tuning crystal  
capacitors  
Rr(IREF)  
OE  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
1
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Output Select Table 1 (MHz)  
Pin Assignment  
S1  
0
S0  
0
CLK(1:0), CLK(1:0)  
1
VDDXD  
CLK0  
16  
15  
14  
13  
12  
11  
10  
9
S0  
25M  
100M  
125M  
200M  
S1  
SS0  
2
3
4
5
6
7
8
0
1
CLK0  
1
0
1
1
X1/ICLK  
X2  
GNDODA  
VDDODA  
CLK1  
Spread Selection Table 2  
OE  
SS1 SS0  
Spread%  
No Spread  
Down -0.5  
Down -0.75  
No Spread  
GNDXD  
SS1  
CLK1  
IREF  
0
0
1
1
0
1
0
1
16-pin (173 mil) TSSOP  
Pin Descriptions  
Pin  
Pin  
Pin  
Pin Description  
Number  
Name  
Type  
1
2
3
4
5
6
S0  
S1  
Input Select pin 0. See Table1. Internal pull-up resistor.  
Input Select pin 1. See Table 1. Internal pull-up resistor.  
Input Spread Select pin 0. See Table 2. Internal pull-up resistor.  
SS0  
X1/ICLK  
X2  
Input Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.  
Output Crystal connection. Leave unconnected for clock input.  
OE  
Input Output enable. Tri-states outputs and device is not shut down. Internal  
pull-up resistor.  
7
8
9
GNDXD  
SS1  
Power Connect to ground.  
Input Spread Select pin 1. See Table 2. Internal pull-up resistor.  
IREF  
Output Precision resistor attached to this pin is connected to the internal current  
reference.  
10  
11  
12  
13  
14  
15  
16  
CLK1  
CLK1  
Output HCSL complimentary clock output 1.  
Output HCSL true clock output 1.  
VDDODA  
GNDODA  
CLK0  
Power Connect to voltage supply +3.3 V for output driver and analog circuits  
Power Connect to ground.  
Output HCSL complimentary clock output 0.  
Output HCSL true clock output 0.  
CLK0  
VDDXD  
Power Connect to voltage supply +3.3 V for crystal oscillator and digital circuit.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
2
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Applications Information  
External Components  
Output Structures  
A minimum number of external components are required for  
proper operation.  
6*IREF  
IREF  
=2.3 mA  
Decoupling Capacitors  
Decoupling capacitors of 0.01 µF should be connected  
between each VDD pin and the ground plane, as close to  
the VDD pin as possible. Do not share ground vias between  
components. Route power from power source through the  
capacitor pad and then into ICS pin.  
Crystal  
See Output Termination  
Sections - Pages 3 ~ 5  
A 25 MHz fundamental mode parallel resonant crystal  
should be used. This crystal must have less than 300 ppm  
of error across temperature in order for the ICS557-03 to  
meet PCI Express specifications.  
RR 475  
General PCB Layout Recommendations  
Crystal Capacitors  
For optimum device performance and lowest output phase  
noise, the following guidelines should be observed.  
Crystal capacitors are connected from pins X1 to ground  
and X2 to ground to optimize the accuracy of the output  
frequency.  
1. Each 0.01µF decoupling capacitor should be mounted on  
the component side of the board as close to the VDD pin as  
possible.  
C = Crystal’s load capacitance in pF  
L
Crystal Capacitors (pF) = (C - 8) * 2  
L
2. No vias should be used between decoupling capacitor  
and VDD pin.  
For example, for a crystal with a 16 pF load cap, each  
external crystal cap would be 16 pF. (16-8)*2=16.  
3. The PCB trace to VDD pin should be kept as short as  
possible, as should the PCB trace to the ground via.  
Distance of the ferrite bead and bulk decoupling from the  
device is less critical.  
Current Source (Iref) Reference Resistor - R  
R
If board target trace impedance (Z) is 50, then R = 475Ω  
(1%), providing IREF of 2.32 mA. The output current (I ) is  
R
OH  
4. An optimum layout is one with all components on the  
same side of the board, minimizing vias through other signal  
layers (any ferrite beads and bulk decoupling capacitors can  
be mounted on the back). Other signal traces should be  
routed away from the ICS557-03.This includes signal traces  
just underneath the device, or on layers adjacent to the  
ground plane layer used by the device.  
equal to 6*IREF.  
Output Termination  
The PCI-Express differential clock outputs of the ICS557-03  
are open source drivers and require an external series  
resistor and a resistor to ground. These resistor values and  
their allowable locations are shown in detail in the  
PCI-Express Layout Guidelines section.  
The ICS557-03 can also be configured for LVDS compatible  
voltage levels. See the LVDS Compatible Layout  
Guidelines section.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
3
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
PCI-Express Layout Guidelines  
Common Recommendations for Differential Routing  
Dimension or Value Unit  
L1 length, Route as non-coupled 50 ohm trace.  
L2 length, Route as non-coupled 50 ohm trace.  
L3 length, Route as non-coupled 50 ohm trace.  
RS  
RT  
0.5 max  
0.2 max  
0.2 max  
33  
inch  
inch  
inch  
ohm  
ohm  
49.9  
Differential Routing on a Single PCB  
Dimension or Value Unit  
L4 length, Route as coupled microstrip 100 ohm differential trace.  
L4 length, Route as coupled stripline 100 ohm differential trace.  
2 min to 16 max  
1.8 min to 14.4 max  
inch  
inch  
Differential Routing to a PCI Express Connector  
L4 length, Route as coupled microstrip 100 ohm differential trace.  
L4 length, Route as coupled stripline 100 ohm differential trace.  
Dimension or Value Unit  
0.25 to 14 max inch  
0.225 min to 12.6 max inch  
PCI-Express Device Routing  
L1  
L2  
L4  
RS  
RS  
L4’  
L1’  
L2’  
RT  
RT  
PCI-Express  
Load or  
Connector  
ICS557-03  
Output  
L3’ L3  
Clock  
Typical PCI-Express (HCSL) Waveform  
700 mV  
0
500 ps  
500 ps  
tOR  
tOF  
0.525 V  
0.175 V  
0.525 V  
0.175 V  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
4
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
LVDS Compatible Layout Guidelines  
LVDS Recommendations for Differential Routing  
Dimension or Value Unit  
L1 length, Route as non-coupled 50 ohm trace.  
L2 length, Route as non-coupled 50 ohm trace.  
RP  
RQ  
RT  
0.5 max  
0.2 max  
100  
100  
150  
inch  
inch  
ohm  
ohm  
ohm  
LVDS Device Routing  
L1  
L3  
RQ  
RP  
L3’  
L1’  
RT  
RT  
ICS557-03  
Clock  
Output  
LVDS  
Device  
Load  
L2’ L2  
Typical LVDS Waveform  
1325 mV  
1000 mV  
500 ps  
500 ps  
tOR  
tOF  
1250 mV  
1150 mV  
1250 mV  
1150 mV  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
5
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Absolute Maximum Ratings  
Stresses above the ratings listed below can cause permanent damage to the ICS557-03. These ratings are stress  
ratings only. Functional operation of the device at these or any other conditions above those indicated in the  
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for  
extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended  
operating temperature range.  
Item  
Supply Voltage, VDDXD, VDDODA  
All Inputs and Outputs  
Rating  
7 V  
-0.5 V to VDD+0.5 V  
0 to +70° C  
Ambient Operating Temperature (commercial)  
Ambient Operating Temperature (industrial)  
Storage Temperature  
-40 to +85° C  
-65 to +150° C  
125°C  
Junction Temperature  
Soldering Temperature  
260°C  
ESD Protection (Input)  
2000 V min. (HBM)  
DC Electrical Characteristics  
Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature -40 to +85°C  
Parameter  
Symbo  
l
Conditions  
Min.  
Typ.  
Max.  
Units  
Supply Voltage  
Input High Voltage  
V
2.97  
2.0  
3.3  
3.63  
V
V
1
V
S0, S1, OE, ICLK, SS0, SS1  
S0, S1, OE, ICLK, SS0, SS1  
0 < Vin < VDD  
VDD +0.3  
IH  
1
Input Low Voltage  
Input Leakage Current  
V
I
VSS-0.3  
-5  
0.8  
5
V
IL  
2
µA  
mA  
mA  
pF  
pF  
nH  
kΩ  
kΩ  
IL  
Operating Supply Current  
I
50, 2 pF  
OE =Low  
78  
44  
7
DD  
I
DDOE  
Input Capacitance  
Output Capacitance  
Pin Inductance  
C
Input pin capacitance  
Output pin capacitance  
IN  
C
6
OUT  
L
5
PIN  
Output Resistance  
Pull-up Resistor  
R
CLK outputs  
3.0  
OUT  
R
S0, S1, OE, SS0, SS1  
100  
PU  
1. Single edge is monotonic when transitioning through region.  
2. Inputs with pull-ups/-downs are not included.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
6
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
AC Electrical Characteristics - CLK0/CLK1, CLK0/CLK1  
Unless stated otherwise, VDD=3.3 V ±10%, Ambient Temperature -40 to +85° C  
Parameter  
Symbol  
Conditions  
Min.  
Typ.  
Max.  
Units  
MHz  
MHz  
MHz  
mV  
mV  
mV  
mV  
ps  
Input Frequency  
25  
Output Frequency  
HCSL termination  
25  
25  
200  
100  
850  
27  
LVDS termination  
HCSL  
1,2  
Output High Voltage  
V
660  
-150  
250  
700  
0
OH  
1,2  
Output Low Voltage  
V
HCSL  
OL  
1,2  
Crossing Point Voltage  
Crossing Point Voltage  
Absolute  
350  
550  
140  
1,2,4  
Variation over all edges  
1,3  
Jitter, Cycle-to-Cycle  
80  
0
Frequency Synthesis Error  
Modulation Frequency  
All outputs  
ppm  
kHz  
ps  
Spread spectrum  
30  
31.5  
332  
344  
33  
700  
700  
125  
50  
1,2  
Rise Time  
t
From 0.175 V to 0.525 V  
From 0.525 V to 0.175 V  
175  
175  
OR  
1,2  
Fall Time  
t
ps  
OF  
1,2  
Rise/Fall Time Variation  
ps  
Output to Output Skew  
ps  
1,3  
Duty Cycle  
45  
55  
%
5
Output Enable Time  
All outputs  
10  
10  
us  
5
Output Disable Time  
All outputs  
us  
Stabilization Time  
t
From power-up VDD=3.3 V  
3.0  
3.0  
ms  
STABLE  
Spread Spectrum Transition  
Time  
t
Stabilization time after spread  
spectrum changes  
ms  
SPREAD  
Note 1: Test setup is R =50 ohms with 2 pF, Rr = 475(1%).  
L
Note 2: Measurement taken from a single-ended waveform.  
Note 3: Measurement taken from a differential waveform.  
Note 4: Measured at the crossing point where instantaneous voltages of both CLK and CLK are equal.  
Note 5: CLK pins are tri-stated when OE is low asserted. CLK is driven differential when OE is high.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
7
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Thermal Characteristics  
Parameter  
Symbol  
Conditions  
Min.  
Typ. Max. Units  
Thermal Resistance Junction to  
Ambient  
q
Still air  
1 m/s air flow  
3 m/s air flow  
78  
70  
68  
37  
° C/W  
° C/W  
° C/W  
° C/W  
JA  
q
JA  
q
JA  
Thermal Resistance Junction to Case  
q
JC  
Marking Diagram (ICS557G-03)  
Marking Diagram (ICS557GI-03)  
16  
9
16  
9
557GI-03  
######  
YYWW$$  
557G-03  
######  
YYWW$$  
1
8
1
8
Marking Diagram (ICS557G-03LF)  
Marking Diagram (ICS557GI-03LF)  
16  
9
16  
9
557GI03L  
######  
YYWW  
557G03LF  
######  
YYWW  
1
8
1
8
Notes:  
1. ###### is the lot code.  
2. YYWW is the last two digits of the year, and the week number that the part was assembled.  
3. “LF” designates Pb (lead) free package.  
4. “I” deisgnates industrial temperature range.  
5. Bottom marking: (origin). Origin = country of origin of not USA.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
8
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Package Outline and Package Dimensions (16-pin TSSOP, 173 Mil. Narrow Body)  
Package dimensions are kept current with JEDEC Publication No. 95  
Millimeters  
Inches*  
16  
Symbol  
Min  
--  
Max  
1.20  
0.15  
1.05  
0.30  
0.20  
5.1  
Min  
--  
Max  
0.047  
0.006  
0.041  
0.012  
A
A1  
A2  
b
0.05  
0.80  
0.19  
0.09  
4.90  
0.002  
0.032  
0.007  
E1  
E
INDEX  
AREA  
C
0.0035 0.008  
0.193 0.201  
0.252 BASIC  
0.169 0.177  
0.0256 Basic  
D
E
6.40 BASIC  
1
2
E1  
e
4.30  
4.50  
D
0.65 Basic  
L
0.45  
0.75  
0.018  
0.030  
a
0°  
8°  
0°  
8°  
aaa  
--  
0.10  
--  
0.004  
A
A2  
A1  
c
- C -  
e
SEATING  
PLANE  
b
L
aaa C  
Ordering Information  
Part / Order Number  
Marking  
Shipping Packaging  
Tubes  
Package  
Temperature  
0 to +70° C  
0 to +70° C  
0 to +70° C  
0 to +70° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
-40 to +85° C  
ICS557G-03  
ICS557G-03T  
ICS557G-03LF  
ICS557G-03LFT  
ICS557GI-03  
See Page 8  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
16-pin TSSOP  
Tape and Reel  
Tubes  
Tape and Reel  
Tubes  
See Page 8  
ICS557GI-03T  
ICS557GI-03LF  
ICS557GI-03LFT  
Tape and Reel  
Tubes  
Tape and Reel  
Parts that are ordered with a “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes  
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No  
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications  
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not  
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT  
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.  
IDT™ / ICS™ PCI-EXPRESS CLOCK SOURCE  
9
ICS557-03  
REV K 102907  
ICS557-03  
PCI-EXPRESS CLOCK SOURCE  
PCIE SSCG  
Innovate with IDT and accelerate your future networks. Contact:  
www.IDT.com  
For Sales  
800-345-7015  
408-284-8200  
Fax: 408-284-2775  
For Tech Support  
www.idt/go/clockhelp  
Corporate Headquarters  
Integrated Device Technology, Inc.  
www.idt.com  
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device  
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered  
trademarks used to identify products or services of their respective owners.  
Printed in USA  

ICS557-03 相关器件

型号 制造商 描述 价格 文档
ICS557-05A IDT QUAD DIFFERENTIAL PCI-EXPRESS CLOCK SOURCE 获取价格
ICS557-05A ICSI Quad Differential PCI-Express Clock Source 获取价格
ICS557-06 IDT 1 TO 4 HCSL CLOCK BUFFER 获取价格
ICS557-06 ICSI ONE TO FOUR HCSL CLOCK BUFFER 获取价格
ICS557-08 ICSI 2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS 获取价格
ICS557G-03 ICSI PCI-EXPRESS CLOCK SOURCE 获取价格
ICS557G-03 IDT PCI-EXPRESS CLOCK SOURCE 获取价格
ICS557G-03LF ICSI PCI-EXPRESS CLOCK SOURCE 获取价格
ICS557G-03LF IDT PCI-EXPRESS CLOCK SOURCE 获取价格
ICS557G-03LFT ICSI PCI-EXPRESS CLOCK SOURCE 获取价格

ICS557-03 相关文章

  • Bourns 密封通孔金属陶瓷微调电位计产品选型手册(英文版)
    2024-09-20
    6
  • Bourns 精密环境传感器产品选型手册(英文版)
    2024-09-20
    9
  • Bourns POWrTher 负温度系数(NTC)热敏电阻手册 (英文版)
    2024-09-20
    8
  • Bourns GMOV 混合过压保护组件产品选型手册(英文版)
    2024-09-20
    6