ICS501GILFT [IDT]
Clock Generator, 140MHz, CMOS, PDSO8, 3 MM, GREEN, MSOP-8;型号: | ICS501GILFT |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Clock Generator, 140MHz, CMOS, PDSO8, 3 MM, GREEN, MSOP-8 时钟 光电二极管 外围集成电路 晶体 |
文件: | 总9页 (文件大小:86K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATASHEET
LOCO™ PLL CLOCK MULTIPLIER
ICS501
Description
Features
TM
The ICS501 LOCO is the most cost effective way to
• Packaged as 8-pin SOIC, MSOP, or die
generate a high-quality, high-frequency clock output from a
lower frequency crystal or clock input. The name LOCO
stands for Low Cost Oscillator, as it is designed to replace
crystal oscillators in most electronic systems. Using
Phase-Locked Loop (PLL) techniques, the device uses a
standard fundamental mode, inexpensive crystal to
produce output clocks up to 160 MHz.
• RoHS 5 (green) or RoHS 6 (green and lead free)
compliant packaging
• IDT’s lowest cost PLL clock
• Zero ppm multiplication error
• Input crystal frequency of 5 - 27 MHz
• Input clock frequency of 2 - 50 MHz
• Output clock frequencies up to 160 MHz
• Extremely low jitter of 25 ps (one sigma)
• Compatible with all popular CPUs
• Duty cycle of 45/55 up to 160 MHz
• Nine selectable frequencies
Stored in the chip’s ROM is the ability to generate nine
different multiplication factors, allowing one chip to output
many common frequencies (see table on page 2).
The device also has an output enable pin which tri-states
the clock output when the OE pin is taken low.
This product is intended for clock generation. It has low
output jitter (variation in the output period), but input to
output skew and jitter are not defined or guaranteed. For
applications which require defined input to output skew, use
the ICS570B.
• Operating voltage of 3.3 V or 5.0 V
• Tri-state output for board level testing
• 25 mA drive capability at TTL levels
• Ideal for oscillator replacement
• Industrial temperature version available
• Advanced, low-power CMOS process
Block Diagram
VDD
2
S1:0
PLL Clock
Multiplier
Circuitry
and ROM
X1/ICLK
CLK
Crystal or
Clock input
Crystal
Oscillator
X2
Optional crystal capacitors
OE
GND
IDT™ / ICS™ LOCO™ PLL CLOCK MULTIPLIER
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Pin Assignment
Clock Output Table
S1 S0
CLK
4X input
Minimum Input
0
0
0
M
1
per page 5
20 MHz
X1/ICLK
VDD
8
7
6
5
1
2
3
4
X2
5.3125X input
5X input
OE
S0
0
per page 5
4 MHz
M
M
M
1
0
6.25X input
2X input
GND
S1
M
1
per page 5
8 MHz
CLK
3.125X input
6X input
0
per page 5
per page 5
per page 5
8 Pin (150 mil) SOIC
1
M
1
3X input
1
8X input
0 = connect directly to ground
1 = connect directly to VDD
M = leave unconnected (floating)
Common Output Frequency Examples (MHz)
Output
Input
20
24
12
30
10
32
16
33.33
16.66
M, M
37.5
12
40
10
48
12
50
60
62.5
20
10
16.66
1, M
10
Selection (S1, S0) M, M
M, M
1, M
M, M
M, 1
0, 0
0, 0
1, 0
M, 1
Output
64
16
66.66
16.66
0, 0
72
12
75
12
80
10
83.33
16.66
0, 1
90
15
100
20
106.25
20
120
15
125
20
Input
Selection (S1, S0)
0, 0
1, 0
M, 0
1, 1
1, 0
0, 1
0, M
1, 1
M, 0
Pin Descriptions
Pin
Pin
Pin
Type
Pin Description
Number Name
1
2
3
4
5
6
7
8
XI/ICLK
VDD
GND
S1
Input
Power
Power
Crystal connection or clock input.
Connect to +3.3 V or +5 V.
Connect to ground.
Tri-level Iinput
Output
Select 1 for output clock. Connect to GND or VDD or float.
Clock output per table above.
CLK
S0
Tri-level Input
Input
Select 0 for output clock. Connect to GND or VDD or float.
OE
Output enable. Tri-states CLK output when low. Internal pull-up.
Crystal connection. Leave unconnected for clock input.
X2
Output
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Crystal Load Capacitors
External Components
The total on-chip capacitance is approximately 12 pF. A
parallel resonant, fundamental mode crystal should be
used. The device crystal connections should include pads
for small capacitors from X1 to ground and from X2 to
ground. These capacitors are used to adjust the stray
capacitance of the board to match the nominally required
crystal load capacitance. Because load capacitance can
only be increased in this trimming process, it is important to
keep stray capacitance to a minimum by using very short
PCB traces (and no vias) between the crystal and device.
Crystal capacitors, if needed, must be connected from each
of the pins X1 and X2 to ground.
Decoupling Capacitor
As with any high-performance mixed-signal IC, the ICS501
must be isolated from system power supply noise to perform
optimally.
A decoupling capacitor of 0.01µF must be connected
between VDD and the GND. It must be connected close to
the ICS501 to minimize lead inductance. No external power
supply filtering is required for the ICS501.
Series Termination Resistor
A 33Ωterminating resistor can be used next to the CLK pin
for trace lengths over one inch.
The value (in pF) of these crystal caps should equal (C -12
L
pF)*2. In this equation, C = crystal load capacitance in pF.
L
Example: For a crystal with a 16 pF load capacitance, each
crystal capacitor would be 8 pF [(16-12) x 2 = 8].
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS501. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDD
All Inputs and Outputs
7 V
-0.5 V to VDD+0.5 V
-40 to +85° C
-65 to +150° C
260°C
Ambient Operating Temperature
Storage Temperature
Soldering Temperature
Recommended Operation Conditions
Parameter
Min.
Typ.
Max.
+70
Units
° C
Ambient Operating Temperature (commercial)
Ambient Operating Temperature (industrial)
Power Supply Voltage (measured in respect to GND)
0
-40
+3.0
85
° C
+5.25
V
IDT™ / ICS™ LOCO™ PLL CLOCK MULTIPLIER
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DC Electrical Characteristics
VDD=5.0 V 5% , Ambient temperature -40 to +85° C, unless stated otherwise
Parameter
Symbol Conditions
Min.
3.0
Typ.
Max.
Units
Operating Voltage
VDD
5.25
(VDD/2)-1
0.8
V
V
Input High Voltage, ICLK only
Input Low Voltage, ICLK only
Input High Voltage
V
ICLK (pin 1)
ICLK (pin 1)
OE (pin 7)
OE (pin 7)
S0, S1
(VDD/2)+1
IH
V
V
IL
V
2.0
VDD-0.5
2.4
V
IH
Input Low Voltage
V
V
IL
Input High Voltage
V
V
IH
Input Low Voltage
V
S0, S1
0.5
V
IL
Output High Voltage
V
I
I
= -25 mA
= 25 mA
V
OH
OH
OL
Output Low Voltage
V
0.4
V
OL
IDD Operating Supply Current, 20
Short Circuit Current
No load, 100M
CLK output
Pin 7
20
+70
270
4
mA
mA
kΩ
pF
Ω
On-Chip Pull-up Resistor
Input Capacitance, S1, S0, and OE
Nominal Output Impedance
Pins 4, 6, 7
20
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AC Electrical Characteristics
VDD = 5.0 V 5%, Ambient Temperature -40 to +85° C, unless stated otherwise
Parameter
Symbol
Conditions
Min. Typ. Max. Units
Input Frequency, crystal input
Input Frequency, clock input
F
F
5
27
50
MHz
MHz
MHz
MHz
MHz
MHz
ns
IN
2
IN
Output Frequency, VDD = 4.75 to 5.25 V
F
0°C to +70°C
13
13
13
13
160
140
100
90
OUT
-40°C to +85°C
0°C to +70°C
Output Frequency, VDD = 3.0 to 3.6 V
F
OUT
-40°C to +85°C
0.8 to 2.0 V, Note 1
2.0 to 8.0 V, Note 1
Output Clock Rise Time
Output Clock Fall Time
Output Clock Duty Cycle
t
1
1
OR
t
ns
OF
OD
t
1.5 V, up to
160 MHz
45
10
49-51
55
%
PLL Bandwidth
kHz
ns
Output Enable Time, OE high to output
on
50
50
Output Disable Time, OE low to tri-state
ns
ps
ps
Absolute Clock Period Jitter
t
t
Deviation from
mean
+70
25
ja
One Sigma Clock Period Jitter
js
Note 1: Measured with 15 pF load.
Thermal Characteristics for 8SOIC
Parameter
Symbol
Conditions
Min.
Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
Still air
150
140
120
40
° C/W
° C/W
° C/W
° C/W
° C/W
JA
θ
1 m/s air flow
3 m/s air flow
JA
θ
JA
Thermal Resistance Junction to Case
θ
JC
Thermal Resistance Junction to Top
of Case
Ψ
Still air
20
JT
Thermal Characteristics for 8MSOP
Parameter
Symbol
Conditions
Min.
Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
Still air
95
° C/W
JA
JC
Thermal Resistance Junction to Case
θ
48
° C/W
IDT™ / ICS™ LOCO™ PLL CLOCK MULTIPLIER
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Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Min Max
Inches*
8
Symbol
Min
Max
A
A1
A2
b
--
1.10
0.15
0.97
0.38
0.23
--
0.043
0.006
0.038
0.015
0.009
0
0
0.79
0.22
0.08
0.031
0.008
0.003
E1
E
INDEX
AREA
C
D
E
3.00 BASIC
4.90 BASIC
3.00 BASIC
0.65 Basic
0.118 BASIC
0.193 BASIC
0.118 BASIC
0.0256 Basic
E1
e
1
2
L
0.40
0.80
0.016
0.032
D
α
0°
8°
0°
8°
aaa
-
0.10
-
0.004
*For reference only. Controlling dimensions in mm.
A
2
A
A
1
c
- C -
e
SEATING
PLANE
b
L
aaa
C
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CLOCK MULTIPLIER
Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
Millimeters
Inches*
Symbol
Min
Max
1.75
0.25
0.51
0.25
5.00
4.00
Min
Max
8
A
A1
B
C
D
E
e
1.35
0.10
0.33
0.19
4.80
3.80
.0532
.0040
.013
.0688
.0098
.020
.0075
.1890
.1497
.0098
.1968
.1574
E
H
INDEX
AREA
1.27 BASIC
5.80 6.20
0.25
0.40
0°
0.050 BASIC
H
h
.2284
.010
.016
0°
.2440
.020
.050
8°
1
2
0.50
1.27
8°
D
L
α
*For reference only. Controlling dimensions in mm.
A
h x 45
A1
C
- C -
e
SEATING
PLANE
B
L
.10 (.004)
C
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Ordering Information
Part / Order Number
501MLF
Marking
Shipping Packaging
Tubes
Package
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin SOIC
8-pin MSOP
8-pin MSOP
8-pin MSOP
8-pin MSOP
Temperature
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
0 to +70° C
0 to +70° C
-40 to +85° C
-40 to +85° C
0 to +70° C
0 to +70° C
0 to +70° C
501MLF
501MLF
501MILF
501MILF
501GL
501GL
1GIL
501MLFT
501MILF
501MILFT
501GLF
Tape and Reel
Tubes
Tape and Reel
Tubes
501GLFT
501GILF
501GILFT
501-DWF
501-DPK
Tape and Reel
Tubes
Tape and Reel
Die on uncut, probed wafers
Tested die in waffle pack
Tested die in waffle pack
1GIL
-
-
-
501E-DPK
"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility
for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses
are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range,
high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to
change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical
instruments.
IDT™ / ICS™ LOCO™ PLL CLOCK MULTIPLIER
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LOCO™ PLL CLOCK MULTIPLIER
CLOCK MULTIPLIER
Innovate with IDT and accelerate your future networks. Contact:
www.IDT.com
For Sales
800-345-7015
For Tech Support
www.idt.com/go/clockhelp
408-284-8200
Fax: 408-284-2775
Corporate Headquarters
Integrated Device Technology, Inc.
www.idt.com
© 2006 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device
Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered
trademarks used to identify products or services of their respective owners.
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