F2258NLGK [IDT]
PRODUCT/PROCESS CHANGE NOTICE (PCN);
| 型号： | F2258NLGK |
| 厂家： | 
INTEGRATED DEVICE TECHNOLOGY |
| 描述： | PRODUCT/PROCESS CHANGE NOTICE (PCN) PC PCN 个人通信 |
| 文件： | 总3页 (文件大小：94K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
PCN #: TB1701-02
Product Affected:
DATE:
February 9, 2017 MEANS OF DISTINGUISHING CHANGED DEVICES:
F2250, F2255, F2258 products. Refer
to the attached list for orderable part
numbers
Product Mark
Back Mark
Date Code
Other
Assembly Lot Number
Date Effective:
May 9, 2017
IDT PCN DESK
Contact:
E-mail:
Attachment:
Samples:
Yes
No
pcndesk@idt.com
Please contact your local sales representative for
sample request.
DESCRIPTION AND PURPOSE OF CHANGE:
Die Technology
Datasheet limit change for Idd supply current, and Ictrl, Vmode leakage currents per Table
Wafer Fabrication Process
Assembly Process
Equipment
1.
The is no change to the die/package technology or manufacturing.
Material
The purpose of the change is for yield improvement.
Testing
Manufacturing Site
Data Sheet
Other - Die revision
RELIABILITY/QUALIFICATION SUMMARY:
There is no change to the product quality or reliability performance.
CUSTOMER ACKNOWLEDGMENT OF RECEIPT:
IDT records indicate that you require written notification of this change. Please use the acknowledgement below or E-Mail
to grant approval or request additional information. If IDT does not receive acknowledgement within 30 days of this notice
it will be assumed that this change is acceptable.
Customer:
Name/Date:
Title:
Approval for shipments prior to effective date.
E-Mail Address:
Phone # /Fax #:
CUSTOMER COMMENTS:
IDT ACKNOWLEDGMENT OF RECEIPT:
RECD. BY:
DATE:
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT I - PCN #: TB1701-02
PCN Type:
Datasheet change
Yes
Data Sheet Change:
Detail of Change:
Production testing of F2250, F2255, F2258 is experiencing low yield. Adjustments to datasheet limits is required
to improve yield.
There is no change to the die/package technology or manufacturing. The change in datasheet is shown in Table 1.
The Datasheet revision with changes to the limits is available on request.
Table 1: Changes in Datasheet Limits
Device F2250
Existing Limits
New Limits
Ictrl Min -0.1uA Max 10uA
Imode Min -0.1uA Max 24uA
Idd Min 0.9mA Max 1.4mA
Ictrl Min no change Max 14uA
Imode Min no change Max 38uA
Idd Min 0.5mA Max 2mA
Datasheet Limits
Device F2255
Existing Limits
New Limits
Ictrl Min -1.0uA Max 10uA
Imode Min -1.0uA Max 24uA
Idd Min 0.8mA Max 1.5mA
Ictrl Min no change Max 14uA
Imode Min no change Max 38uA
Idd Min 0.5mA Max 2mA
Datasheet Limits
Device F2258
Existing Limits
New Limits
Ictrl Min -1.0uA Max 10uA
Idd Min 0.9mA Max 1.4mA
Ictrl Min no change Max 14uA
Idd Min 0.5mA Max 2mA
Datasheet Limits
Integrated Device Technology, Inc.
6024 Silver Creek Valley Road, San Jose, CA 95138
PRODUCT/PROCESS CHANGE NOTICE (PCN)
ATTACHMENT II - PCN #: TB1701-02
Part Number
F2250NLGI
Part Number
F2250NLGK8
Part Number
F2255NLGK
Part Number
F2258NLGI8
F2250NLGI8
F2250NLGK
F2255NLGI
F2255NLGI8
F2255NLGK8
F2258NLGI
F2258NLGK
F2258NLGK8
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