8V97053LNLGI8 [IDT]
Low Power Wideband Fractional RF Synthesizer / PLL;型号: | 8V97053LNLGI8 |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | Low Power Wideband Fractional RF Synthesizer / PLL |
文件: | 总68页 (文件大小:1094K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Low Power Wideband Fractional
8V97053L
Datasheet
RF Synthesizer / PLL
General Description
Features
The 8V97053L is a high performance Wideband RF Synthesizer /
PLL optimized for use as the local oscillator (LO) in Multi-Carrier,
Multi-mode FDD & TDD Base Station radio card. It is offered in a
compact 5x5, 32-VFQFN package.
• Dual Differential Outputs
• Output frequency range: 34.375MHz to 4400MHz (continuous
range)
• RF Output Divide by 1, 2, 4, 8, 16, 32, 64
The 8V97053L Wideband RF Synthesizer / PLL offers a default
Fractional Mode with the option to use it with an Integer mode. It
requires an external loop filter.
• Open Drain Outputs (see Output Distribution Section)
• Fractional-N synthesizer (also supports Integer-N mode)
• 16-bit integer and 12-bit fractional
(16-bit fractional when using the extended registers)
The 8V97053L with integrated Voltage Controlled Oscillator (VCO)
supports output frequencies from 34.375MHz to 4400MHz and
maintains superior phase noise and spurious performance.
• 3- or 4-wire SPI interface (compatible with 3.3V and 1.8V)
• Single 3.3V supply
RF_OUT[A:B] output drivers have independently programmable
output power ranging from –4dBm to +7dBm. The RF_OUT outputs
can be muted. The mute function is accessible via a SPI command
or mute pin.
• Logic compatibility: 1.8V
• Integrated high performance low dropout regulators (LDOs) for
excellent power supply noise rejection
The operation of the 8V97053L is controlled by writing to registers
through a 3-wire SPI interface. The 8V97053L also has an additional
option that allows users to read back values from registers by
configuring the MUX_OUT pin as a SDO for the SPI interface. The
SPI interface is compatible with 1.8V logic and tolerant to 3.3V.
• Programmable output power level: -4dBm to +5dBm
(up to +7 when using the extended registers)
• Mute Function
• Ultra low PN for 1.65GHz LO: -142.21dBc/Hz @ 1MHz Offset,
(typical)
In multi-service base stations, very low noise oscillators are required
to generate a large variety of frequencies to the mixers while
maintaining excellent phase noise performance and low power. The
8V97053L offers a large tuning range capable of providing multi-band
local oscillator (LO) frequency synthesis in multi-mode base stations,
thus limiting the use of multiple narrow band RF Synthesizers and
reducing the BOM complexity and cost. The device can operate over
-40°C to +85°C industrial temperature range.
• Lock Detect Indicators
• Input Reference frequency: 5MHz to 310MHz
• 32-Lead, 5x5 VFQFN package
• Automatic VCO band selection (Autocal feature)
• -40°C to +85°C ambient operating temperature
• Lead-free (RoHS 6) packaging
• Supports case temperature 105°C operations
Applications
• Wireless Infrastructure
• Test Equipment
• CATV Equipment
• Military and Aerospace
• Wireless LAN
• Clock Generation
©2016 Integrated Device Technology, Inc.
1
August 18, 2016
8V97053L Datasheet
Table of Contents
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
8V97053L Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pin Description and Characteristic Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 1. Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Table 2. Pin Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Table 3. Supply Pins and Associated Current Return Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Principles of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Synthesizer Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reference Input Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Reference Doubler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Table 4A. Lock Detect Precision (LDP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Feedback Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Figure 1. RF Feedback N Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Table 4B. Fractional Spurs Due to the Quantization Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Phase and Frequency Detector (PFD) and Charge Pump . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Figure 2. Simplified PFD Circuit using D-type Flip-flop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
PFD Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
External Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Phase Detector Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Charge Pump High-Impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Integrated Low Noise VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Output Distribution Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 3. Output Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 4. Output Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Output Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 5. Broadband Matching Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 6. Optimal Matching Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Band Selection Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Phase Adjust . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Phase Resync . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Figure 7. 12-bit Counter for Fast Lock and Phase Resync . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Fast Lock Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 8. Example of Fast Lock Mode Loop Filter Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
RF Output Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
MUX_OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Table 4C. MUX_OUT Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Default Power-Up Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Program Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
Table 4D. Control Bits Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
©2016 Integrated Device Technology, Inc.
2
August 18, 2016
8V97053L Datasheet
Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 9. SPI Write Cycle Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 10. SPI Read Cycle Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 4E. SPI Read / Write Cycle Timing Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3- or 4-Wire SPI Interface Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 4F. SPI Mode Serial Word Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Register Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Register 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 5A. Register 0 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 5B. Register 0: 16-Bit Feedback Divider Integer Value (INT). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 5C. Register 0: 12-Bit Feedback Divider Fractional Value (FRAC). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 5D. Register 0: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Register 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6A. Register 1 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6B. Register 1: 1-Bit BAND_SEL_DISABLE. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6C. Register 1: 12-Bit Phase Value (PHASE). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Table 6D. Register 1: 12-Bit Modulus Value (MOD). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 6E. Register 1: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Register 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7A. Register 2 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7B. Register 2: 2-Bit NOISE MODE. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7C. Register 2: 3-Bit MUX_OUT. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 7D. Register 2: 1-Bit REF DOUBLER. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 7E. Register 2: 1-Bit REF DIV2. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 7F. Register 2: 10-Bit R COUNTER (R). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 7G. Register 2: 1-Bit DOUBLE BUFFER. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 7H. Register 2: 4-Bit Charge Pump Setting (ICP SETTING). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 7I. Register 2: 1-Bit Lock Detect Function (LDF). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 7J. Register 2: 1-Bit Lock Detect Precision. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 7K. Register 2: 1-Bit Phase Detector Polarity. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 7L. Register 2: 1-Bit Power Down. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 7M. Register 2: 1-Bit Charge Pump High-Impedance. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Table 7N. Register 2: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Register 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8A. Register 3 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8B. Register 3: 1-Bit Band Select Clock Mode. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8C. Register 3: 2-Bit Clock Divider Mode. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8D. Register 3: 12-Bit Clock Divider Value (CLKDIV). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8E. Register 3: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Register 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 9A. Register 4 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 9B. Register 4: 1-Bit Feedback Select. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 9C. Register 4: 3-Bit RF Output Divider (÷ MO) Select. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 9D. Register 4: 8-Bit Band Select Clock Counter. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 9E. Register 4: 1-Bit VCO Power Down. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 9F. Register 4: 1-Bit Mute Till Lock Detect. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 9G. Register 4: 1-Bit RF_OUTB Select. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
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Table 9H. Register 4: 1-Bit RF_OUTB Enable. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 9I. Register 4: 2-Bit RF_OUTB Output Power. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 9I. Register 4: 1-Bit RF_OUTA Enable. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Table 9J. Register 4: 2-Bit RF_OUTA Output Power. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Table 9K. Register 4: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Register 5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 10A. Register 5 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 10B. Register 5: 2-Bit LD (Lock Detect) Pin Mode. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Table 10C. Register 5: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Extended Registers, (Registers 6 and 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Register 6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 11A. Register 6 Bit Allocation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 11B. Register 6: 1-Bit Digital Lock Detect. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 11C. Register 6: 1-Bit Band Select Status (Read Only). Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Table 11D. Register 6: 2-Bit Extra Lock Detect Precision. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Table 11E. Register 6: 1-Bit Extra Bit of RF_OUTB Power. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
Table 11F. Register 6: 1-Bit Extra Bit of RF_OUTA Power. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 11G. Register 6: 2-Bit Sigma Delta Modulator Order Configuration. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 11H. Register 6: 2-Bit Dither Gain Configuration. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 11I. Register 6: 1-Bit Dither Noise Shaping Configuration. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 11J. Register 6: 1-Bit Sigma Delta Modulator Type Configuration. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Table 11K. Register 6: 2-Bit VCO Band Selection Accuracy Configuration. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Table 11N. Register 6: 4-Bit Extra Most Significant Bits of Band Select Divider. Function Description . . . . . . . . . . . . . . . . . . . . . . . . .39
Table 11O. Register 6: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Register 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 12A. Register 7 Bit Allocation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 12B. Register 7: 1-Bit Loss of Digital Lock. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 12C. Register 7: 1-Bit Loss of Analog Lock. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 12D. Register 7: 1-Bit SPI Error. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Table 12E. Register 7: 3-Bit Revision ID. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 12F. Register 7: 4-Bit Device ID. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 12G. Register 7: 1-Bit Resolution Select. Function Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
Table 12J. Register 7: 4-Bit Extra Bits of MOD Value. Function Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Table 12K. Register 7: 4-Bit Extra Bits of FRAC Value. Function Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Table 12L. Register 7: 1-Bit SCLKE. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Table 12M. Register 7: 1-Bit READBACK_ADDR. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Table 12N. Register 7: 1-Bit SPI_R_WN. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Table 12O. Register 7: 3-Bit Control Bits. Function Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Table 13. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Table 14A. Power Supply DC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to +85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Table 14B. Output Divider Incremental Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Table 14C. Typical Current by Power Domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Table 14D. LVCMOS DC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to 85°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
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AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Table 15A. AC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Table 15B. RF_OUT[A:B] Phase Noise and Jitter Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to 85°C . . . . . . . . . . . . . . . . .48
Phase Noise (Closed-Loop) at 156.25MHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Phase Noise (Closed-Loop) at 1.76GHz (3.3V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Phase Noise (Closed-Loop) at 2.05GHz (3.3V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Phase Noise (Open-Loop) at 745MHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Phase Noise Performance (Open-Loop) at 1.1GHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Phase Noise Performance (Open-Loop) at 1.65GHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52
Phase Noise Performance (Open-Loop) at 2.3GHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Phase Noise Performance (Open-Loop) at 3.8GHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Phase Noise Performance (Open-Loop) at 4.4GHz (3.3V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
Applications Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Loop Filter Calculations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
2nd Order Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
Figure 11. Typical 2nd Order Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
3rd Order Loop Filter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 12. Typical 3rd Order Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Recommendations for Unused Input and Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57
Schematic Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58
Figure 13A. An 8V97053L General Application Schematic Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .59
Figure 13B. Schematic Example for Driving Single Ended Mixer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60
Power Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Table 16. Thermal Resistance JA for 32 Lead VFQFN, Forced Convection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .61
Example 2: VCO Frequency Range = 2590MHz to 3624MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .62
Reliability Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Table 17A. JA vs. Air Flow Table for a 32 lead VFQFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
Table 17B. JB vs. Air Flow Table for a 32 lead VFQFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63
32-Lead VFQFN Package Outline and Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
32-Lead VFQFN Package Outline and Package Dimensions (Continued) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Table 18. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Table 19. Pin 1 Orientation in Tape and Reel Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .66
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .68
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8V97053L Datasheet
8V97053L Block Diagram
SDO
MUX_OUT
Lock
Detect
LD
CP_OUT
Charge
Pump
PFD
÷R
÷2
x2
REF_IN
External
Loop
Filter
VTUNE
16/1`2 or 16/
16 bit Frac-N
Divider
FLSW
SCLK
SPI
SDI
nCS
RF_OUTA
÷M0
nRF_OUTA
Logic & Registers
CE
RF_OUTB
nRF_OUTB
MUTE
NOTE: 16-Bit Integer / 16-Bit Fractional feedback divider is available when using extended register.
Pin Assignment
31 30 29 28 27 26 25
32
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
SCLK
SDI
VREF
VCOM
nCS
RCP
CE
GNDA_VCO
VTUNE
8V97053L
FLSW
V_CP
VBIAS
CP_OUT
GND_CP
GNDA_VCO
VVCO
9
10 11 12 13 14 15 16
32-Lead 5mm x 5mm VFQFN
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8V97053L Datasheet
Pin Description and Characteristic Tables
1
Table 1. Pin Description
Pin
1
Name
SCLK
SDI
Type
LVCMOS Input
Description
Pulldown Serial Clock Input. High-Impedance CMOS input. 1.8V logic. 3.3V tolerant.
2
LVCMOS Input
LVCMOS Input
Pullup
Serial Data Input. High-Impedance CMOS input. 1.8V logic. 3.3V tolerant.
Load Enable. High-Impedance CMOS input. 1.8V logic. 3.3V tolerant. Active
Low.
3
4
5
6
nCS
CE
Pulldown
Chip Enable. On logic Low, powers down the device and puts the charge
pump into High-Impedance mode. Powers up the device on logic High.
LVCMOS Input
Analog
Pullup
Fast Lock Switch. A connection should be made from the loop filter to this pin
when using the fast lock mode.
FLSW
V_CP
Charge Pump Power Supply. V_CP must have the same value as VDDA. Place
decoupling capacitors to the ground plane as close to this pin as possible.
Power
Charge Pump Output. When enabled, this output provides ±ICP to the
external loop filter. The output of the loop filter is connected to VTUNE to drive
the internal VCO.
7
CP_OUT
Analog
8
9
GND_CP
GNDA
Ground
Ground
Charge Pump Power Supply Ground.
Analog Power Supply Ground.
Analog Supply. This pin ranges from 3.3V ± 5%. VDDA must have the same
value as VDDD.
10
VDDA
Power
11
12
13
14
15
GNDA_VCO
RF_OUTA
nRF_OUTA
RF_OUTB
nRF_OUTB
Ground
Output
Output
Output
Output
VCO Analog Power Supply Ground.
Clock Output pair A. The output level is programmable.
Clock Output pair A. The output level is programmable.
Clock Output pair B. The output level is programmable.
Clock Output pair B. The output level is programmable.
VCO Supply. This pin ranges from 3.3V ± 5%. VVCO must have the same
value as VDDA.
16
17
VVCO
Power
Power
VCO Supply. This pin ranges from 3.3V ± 5%. VVCO must have the same
value as VDDA.
VVCO
18
19
20
21
22
GNDA_VCO
VBIAS
Ground
Analog
VCO Analog Power Supply Ground.
Place decoupling capacitors (10µF) to ground, as close to this pin as possible.
Control Input to tune the VCO.
VTUNE
GNDA_VCO
RCP
Ground
Analog
VCO Analog Power Supply Ground.
Sets the charge pump current. Requires external resistor.
Place decoupling capacitors (1µF – 10µF) to ground, as close to this pin as
possible.
23
24
25
VCOM
VREF
LD
Analog
Analog
Place decoupling capacitors (10µF) to ground, as close to this pin as possible.
Lock Detect. Logic High indicates PLL lock. Logic Low indicates loss of PLL
lock.
LVCMOS Output
RF_OUTA and RF_OUTB Power-Down. A logic low on this pin mutes the
RF_OUT outputs and puts them in High-Impedance.
26
27
MUTE
GNDD
LVCMOS Input
Ground
Pullup
Digital Power Supply Ground.
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1
Table 1. Pin Description (Continued)
28
VDDD
Power
Digital Supply. VDDD must have the same value as VDDA.
Reference Input. This CMOS input has a nominal threshold of VDDA/2 and a
DC equivalent input resistance of 100k. This input can be driven from a TTL
or CMOS crystal oscillator, or it can be AC-coupled.
29
REF_IN
LVCMOS Input
Analog
30
31
MUX_OUT
GND_SD
LVCMOS Output
Ground
Multiplexed Output and Serial Data Out. Refer to Table 4C, Page 18.
Digital Sigma Delta Modulator Power Supply Ground.
Digital Sigma Delta Modulator Supply. VDD_SD must have the same value as
VDDA.
32
VDD_SD
Power
EP
Exposed Pad
Ground
Must be connected to GND.
NOTE 1. Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Cin
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
pF
Input Capacitance
LVCMOS Output Impedance
Input Pullup Resistor
4
ROUT
MUX_OUT & LD
38
51
51
RPULLUP
k
k
RPULLDOWN Input Pulldown Resistor
Table 3. Supply Pins and Associated Current Return Paths
Power Supply Pin Number
Power Supply Pin Name
Associated Ground Pin Number
Associated Ground Pin Name
10
28
VDDA
VDDD
9
GNDA
GNDD
27
32
VDD_SD
VVCO
31
11, 18, 21
8
GND_SD
GNDA_VCO
GND_CP
16, 17
6
V_CP
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Principles of Operation
Synthesizer Programming
The Fractional-N architecture is implemented via a cascaded programmable dual modulus prescaler. The N divider offers a division ratio in the
feedback path of the PLL, and is given by programming the value of INT, FRAC and MOD in the following equation:
N = INT + FRAC/MOD
(1)
INT is the divide ratio of the binary 16-bits counter (refer to Table 5B, Page 22).
FRAC is the numerator value of the fractional divide ratio. It is programmable from 0 to (MOD – 1). Refer to Table 5C when in 12-bit mode, or
Table 12K when in 16-bit mode.
MOD is the 12-bit or 16-bit modulus. It is programmable from 2 to 4095 in 12-bit mode, and 2 to 65535 in 16-bit mode. Refer to Table 6D when
in 12-bit mode, or Table 12J when in 16-bit mode.
The VCO frequency (fVCO) at RF_OUTA or RF_OUTB is given by the following equation:
f
VCO = fPFD x (INT + FRAC/MOD)
(2)
fPFD is the frequency at the input of the Phase and Frequency Detector (PFD).
The 8V97053L offers an Integer mode. To enable that mode, the user has to program the FRAC value to 0.
The device’s VCO features three VCO band-splits to cover the entire range with sufficient margin for process, voltage, and temperature
variations. These are automatically selected by invoking the Autocal feature. The charge pump current is also programmable via the ICP
SETTING register for maximum flexibility.
Via Register 4, one can enable RF_OUTA or both outputs. Similarly, one can disable RF_OUTB or both outputs.
Reference Input Stage
The 8V97053L features one single-ended reference clock input (REF_IN). This single-ended input can be driven by an ac-coupled sine wave
or square wave.
In Power Down mode this input is set to High-Impedance to prevent loading of the reference source.The reference input signal path also
includes an optional doubler.
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Reference Doubler
To improve the phase noise performance of the device, the reference doubler can be used. By using the doubler, the PFD frequency is also
doubled and the phase noise performance typically improves by 3dB. When operating the device in Fractional mode, the speed of the Sigma
Delta modulator of the N counter is limited to 125MHz, which is also the maximum PFD frequency that can be used in the fractional mode.
When the part operates in Integer-N mode, the PFD frequency is limited to 310MHz.
The user has the possibility to select a higher PFD frequency (up to 310MHz in Integer mode) by doing the following steps using the extended
registers (Register 6 and 7):
1. The user needs to increase the size of the Band Select Clock Divider (normally 8-bits) by setting the bit [D6:D3] in the Register 6 to divide
down to a frequency lower than 500kHz and higher than 125kHz.
2. Use the Bit[D27:D26] to increase the lock detect precision for the faster PFD frequency.
The Lock Detect window should be set as large as possible but less than a period of the phase detector. The phase detector frequency should
be greater than 500kHz.
Table 4A. Lock Detect Precision (LDP)
LDP_Ext2
LDP_Ext1
LDP
(D27 of Register 6)
(D26 of Register 6)
(D7 of Register 2)
LDP value (ns)
0
0
0
0
0
1
10
6
Use of Extended Register 6
0
0
1
1
1
1
1
1
0
0
1
1
0
1
0
1
0
1
3
3
4
4.5
1.5
1.5
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Feedback Divider
The feedback divider N supports fractional division capability in the PLL feedback path. It consists in an integer N divider of 16-bits, and a
Fractional divider of 12-bits (FRAC) over 12-bits (MOD). FRAC and MOD can be extended to 16-bits when using extended registers.
To select an integer mode only, the user sets FRAC to 0.
FROM VCO OUTPOUT
or FROM M0 OUTPUT
TO PFD
N counter
3rd Order
ΣΔ Modulator
12 Bit FRAC
16 Bit INT
+
12 Bit MOD
Figure 1. RF Feedback N Divider
The 16 INT bits (Bit[D30:D15] in Register 0) set the integer part of the feedback division ratio.
The 12 FRAC bits (Bit[D14:D3] in Register 0) set the numerator of the fraction that goes into the Sigma Delta modulator. FRAC can be extended
to 16-bits using the EXT_FRAC bits in Register 7.
The 12 MOD bits (Bit[D14:D3] in Register 1) set the denominator of the fraction that goes into the Sigma Delta modulator. MOD can be
extended to 16-bits using the EXT_MOD bits in Register 7.
From the relation (2), the VCO minimum step frequency is determined by (1/MOD) * fPFD.
FRAC values from 0 to (MOD – 1) cover channels over a frequency range equal to the PFD reference frequency.
The PFD frequency is calculated as follows:
(3)
Use 2R instead of R if the Reference Divide by 2 is used.
REFCLK = the input reference frequency (REF_IN)
D
R
= the input reference doubler (0 if not active or 1 if active)
= the 10-Bits programmable input reference pre-divider
The programmable modulus (MOD) is determined based on the input reference frequency (REF_IN) and the desired channelization (or output
frequency resolution). The high resolution provided on the R counter and the Modulus allows the user to choose from several configuration (by
using the doubler or not) of the PLL to achieve the same channelization. Using the doubler may offer better phase noise performance. The
high resolution Modulus also allows to use the same input reference frequency to achieve different channelization requirements. Using a
unique PFD frequency for several needed channelization requirements allows the user to design a loop filter for the different needed setups
and ensure the stability of the loop.
The channelization is given by
(4)
In low noise mode (dither disabled), the Sigma Delta modulator can generate some fractional spurs that are due to the quantization noise.
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The spurs are located at regular intervals equal to fPFD/L where L is the repeat length of the code sequence in the Sigma Delta modulator. That
repeat length depends on the MOD value, as described in Table 4B.
Table 4B. Fractional Spurs Due to the Quantization Noise
Condition (Dither Disabled)
L
Spur intervals
MOD can be divided by 2,
but not by 3
2 x MOD
f
f
PFD/(2*MOD)
PFD/(3*MOD)
MOD can be divided by 3,
but not by 2
3 x MOD
6 x MOD
MOD
MOD can be divided by 6
Other conditions
f
f
PFD/(6*MOD)
PFD/MOD
(channel step)
In order to reduce the spurs, the user can enable the dither function to increase the repeat length of the code sequence in the Sigma Delta
modulator. The increased repeat length is 221 cycles so that the resulting quantization error is spread to appear like broadband noise. As a
result, the in-band phase noise may be degraded when using the dither function.
When the application requires the lowest possible phase noise and when the loop bandwidth is low enough to filter most of the undesirable
spurs, or if the spurs won’t affect the system performance, it is recommended to use the low noise mode with dither disabled.
Phase and Frequency Detector (PFD) and Charge Pump
The phase detector compares the outputs from the R counter and from the N counter and generates an output corresponding to the phase and
frequency difference between the two inputs the PFD. The charge pump current is programmable through the serial port (SPI) to several
different levels.
The PFD offers an anti-backlash function that helps to avoid any dead zone in the PFD transfer function.
I
CP
VDD
D1
Q1
REF_IN x (1+D)/R
CP_OUT
DELAY
VDD
FB
D1
Q1
I
CP
Figure 2. Simplified PFD Circuit using D-type Flip-flop
The Band Select logic operates between 125kHz and 500kHz. The Band Select clock divider needs to be set to divide down the PFD frequency
to between 125kHz to 500kHz (logic maximum frequency).
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PFD Frequency
The VCO Band Selection can be used while operating at PFD frequencies up to 310MHz.
If the application requires the PFD frequency to be higher than 125MHz, the user can use one of the following two techniques (Technique A is
the recommended procedure):
A.The user can use the extended register ExtBndSelDiv[4:1] bits (Bits[D6:D3]) in Register 6. These additional band select divider bits
extend the band select divider from 8-bits (available in Register 4) to 12-bits. The four additional band select divider bits in Register 4 are
the most significant bits of the divide value. For proper VCO band selection, the PFD frequency divided by the band select divide value
must be 500kHz and 125kHz.
B.If choosing this second technique, the user must follow the three following steps:
1. Disable the Phase Adjust function by setting the bit D28 In Register 1 to 0, keep the PFD frequency lower than 125MHz, and program
the desired VCO frequency.
2. Enable the phase adjust function by setting BAND_SEL_DISABLE (Bit D28 in Register 1) to 1.
3. Set the desired PFD frequency and program the relevant
R divider and N counter values.
In either technique, the Lock Detect Precision should be programmed to be lower than the PFD period using the bit [D7] in Register 2 and the
bits [D27:D26] in Register 6 (Refer to Table 4A, Page 10).
External Loop Filter
The 8V97053L requires an external loop filter. The design of that filter is application specific. For additional information, refer to the Applications
Information section.
Phase Detector Polarity
The phase detector polarity is set by bit D6 in Register 2. This bit should be set to 1 when using a passive loop filter or a non-inverting active
loop filter. If an inverting active filter is used, this bit should be set to 0.
Charge Pump High-Impedance
In order to put the charge pump into three-state mode, the user must set the bit D4 [CP HIGHZ] in Register 2 to 1. This bit should be set to 0
for normal operation.
Integrated Low Noise VCO
The VCO function of the 8V97053L consists in three separate VCOs. This allows keeping narrow tuning ranges for the VCOs while offering a
large frequency tuning range for VCO core. Keeping narrow VCO tuning ranges allows for lower VCO sensitivity (KVCO), which results in the
best possible VCO phase noise and spurious performance.
The user does not have to select the different VCO bands. The VCO band select logic of the 8V97053L will automatically select the most
suitable band of operation at power up or when Register 0 is written.
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Output Distribution Section
The 8V97053L device provides two outputs. These two outputs can generate the same frequency (fVCO / M0) or two integer related different
frequencies (in this case, RF_OUTB would generate a frequency equal to the VCO frequency and RF_OUTA would generate fVCO / M0).
Figure 3. Output Clock Distribution
RF_OUT and nRF_OUT are derived from the drain of an NMOS differential pair driven by the VCO output (or by the M0 Divider), as shown in
Figure 4, Output Stage.
RF_OUT
nRF_OUT
÷ M0
Figure 4. Output Stage
Eight programmable output power levels can be programmed from -4dBm to +7dBm (see RF Output Power section).
The 8V97053L offers an auxiliary output (RF_OUTB). If the auxiliary output stage is not used, it can be powered down by using the
RF_OutB_En bit in Register 4.
The supply current to the output stage can be shut down until the part achieves lock. To enable this mode, the user will set the MTLD bit in
Register 4. The MUTE pin can be used to mute all outputs and be used as a similar function.
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Output Matching
The outputs of the 8V97053L are Open Drain Output and can be matched in different ways.
A simple broadband matching is to terminate the open drain RF_OUT output with, for example, a 50 to VDDA, and with an AC coupling
capacitor in series. An example of this termination scheme is shown on Figure 5, Broadband Matching Termination.
Figure 5. Broadband Matching Termination
This termination scheme allows to provide one of the selected output power on the differential pair when connected to a 50 load. (See the
RF Output Power section for more information about the output power selection).
The 50 resistor connected to VDDA can also be replaced by a choke, for better performance and optimal power transmission.
The pull up inductor value is frequency dependent. For impedance
of 50 pull-up, the inductance value can be calculated as
L = 50/(2*3.14*F), where F is operating frequency. In this example,
L = 3.9nF is for an operating frequency of approximately 2GHz.
Figure 6. Optimal Matching Termination
See Applications Information section for more recommendations on the termination scheme.
Band Selection Disable
For a given frequency, the output phase can be adjusted when using the Band_Sel_Disable bit (Bit D28 in Register 1). When this bit is enabled
(Bit D28 set to 1), the part does not do a VCO band selection or phase resync after an update to Register 0.
When the Band_Sel_Disable bit is set to 0, and when Register 0 is updated, the part proceeds to a VCO band selection, and to a phase resync
if phase_resync is also enabled in Register 3 (Bits[D16:D15] set to D16 = 1 and D15 = 0).
The “Band_Sel_Disable” bit is useful when the user wants to make small changes in the output frequency (<1MHz from the nominal frequency)
without recalibrating the VCO and minimizing the settling time.
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Phase Adjust
The output phase is controlled by the 12-Bit phase value Bits[D26:D15] in Register 1. The output phase can vary over 360° with a 360°/MOD
step. For dynamic adjustments of the phase after an initial phase setting, it is recommended to select the BAND_SEL_DISABLE function by
setting the Band_Sel_Disable bit (D28 in Register 1) to 1.
The PHASE value can be extended to 16-bits when using the extended registers. In this 16 bit mode, both registers 1 and 7 define the PHASE
value.
Phase Resync
The phase alignment function operates based on adjusting the “fractional” phase, so the phase can settle to any one of the MOD phase offsets,
MOD being the modulus of the fractional feedback divider.
The phase adjustment can provide a 0-360° of phase adjust, assuming that the output divider ratio is set to 1.
The phase step is TVCO/MOD for the normal case of fundamental feedback. TVCO is the period of the VCO.
The feedback select bit (FbkSel bit, Bit D23 in Register 4) gives the choices of fundamental feedback or divided feedback. This bit controls the
mux that sends the VCO signal or the output divider signal to the feedback loop. The user can get larger phase steps in the divided mode, but
the phase noise may be degraded, especially in fractional mode. Should the user select this option, the phase adjustment step would be
~TOUT/MOD, where TOUT is the output signal period.
When the part is in fractional mode, the device is dithering the feedback divider value. As an example, when using a 4GHz VCO frequency,
the feedback divider value may dither between Div-by-20 and Div-by-21. Since the period is 250ps, there will be 250ps of jitter added to the
phase detector. This jitter is filtered by the loop, but can still show up at the output if the loop bandwidth is high. When using a divider before
the feedback divider, the effective VCO period is increased. If a Div-by-64 is used for example, the period becomes 64x250ps = 16ns. This
means that there could be an additional 16ns of jitter at the PFD, rather than 250ps. It is more challenging for the loop to filter this larger amount
of jitter and this will degrade the overall performance of the part, unless the user chooses to use a very low loop bandwidth. With normal loop
bandwidth configurations (for optimal noise), the phase noise would be degraded when using a divided feedback mode.
The Phase Resync is controlled by setting Bits[D16:D15] in Register 3 to D16 = 1 and D15 = 0. When phase resync is used, an internal timer
generates sync signals every TSYNC where:
TSYNC = ClkDiv x MOD x TPFD
(5)
ClkDiv = the value (from 1 and 4095) programmed in the 12-bit clock counter in Bits[D14:D3] in Register 3. The 12-bit counter is used as a
timer for Fast Lock and for the Phase Resync function.
MOD = the Modulus value (Bits[D14:D3] of Register 1)
TPFD = the PFD period
In Equation 5, the minimum of either MOD value or 4095 is used for calculating TSYNC when in 16-bit mode.
Figure 7. 12-bit Counter for Fast Lock and Phase Resync
After the user program a frequency, the second sync pulse coming from the 12-bit counter, after the nCS is asserted high, is used to
resynchronize the output phase to the input phase. To ensure that the PLL is locked before to resynchronize the output phase, TSYNC must
be larger than the worst case lock time.
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Fast Lock Function
The device uses a fast-lock mode to decrease lock time.
In order to allow the Fast Lock mode, the Fast Lock Switch (FLSW) is shorted to Ground and the charge pump current (ICP) is changed
temporarily until the Fast Lock mode is disabled.
The loop bandwidth needs to be increased temporarily in order to allow a faster lock time. By doing this, the loop filter needs to be initially
designed so that it addresses the risk of instability of having the zero and the poles too close to the actual bandwidth knee, when the user
switches to a fast lock mode.
The loop bandwidth is proportional to:
RS and ICP (BW ~ RS * ICP)
Where:
BW = the loop bandwidth
RS = the damping resistor
ICP = the programmable charge pump current
In order to enable the fast lock mode, the charge pump current is increased to the maximum value in order to increase the loop bandwidth. In
parallel, the FLSW filter is set to ON so that the RS value is ¼ of its initial value in order to maintain the loop stability. By doing so, the zero and
the first pole are moved (by a factor of 4x in the example below), so that the zero and the pole are kept at a suitable distance around the loop
bandwidth.
Figure 8. Example of Fast Lock Mode Loop Filter Topology
In the example of Figure 8, Example of Fast Lock Mode Loop Filter Topology, the damping resistor RS is equal to:
RS1 + RS2 in normal mode (FSLW switch OFF), with RS2 = 3 * RS1
When the FLSW switch is ON, the damping resistor value is reduced by ¼ of its initial value (RS = RS1).
The second pole defined by R3 and C3 need needs to be designed so that there is no risk of instability when widening the loop bandwidth.
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RF Output Power
For RF_OUTA and RF_OUTB, the output power can be programmed from -4dBm to +7dBm.
Refer to Table 9I, Page 33, Table 9J, Table 11E, Page 37 and Table 11F in the Register Map section for more information.
MUX_OUT
MUX_OUT is a multipurpose output that can be programmed to provide the user with some internal status and values for test and debugging
purpose. In addition, MUX_OUT can also be programmed to provide an additional Serial Data Out Pin for a 4-wire SPI interface when needed.
The MUX_OUT function is described in the Table 4C and can be programmed in Bits[D28:D26] in Register 2.
Table 4C. MUX_OUT Pin Configuration
MUX_OUT Register Value
MUX_OUT Function
High-Impedance Output
VDDD
000
001
010
011
100
101
110
111
GNDD
R Counter Output
N counter Output
Reserved
Lock Detect
MUX_OUT configured as SDO
Power-Down Mode
When power-down is activated, the following events occur:
1. Counters are forced to their load state conditions
2. VCO is powered down
3. Charge pump is forced into three-state mode
4. Digital lock detect circuitry is reset
5. RF_OUT buffers are disabled
6. The input stage is powered down and set to High-Impedance
7. Input registers remain active and capable of loading and latching data
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Default Power-Up Conditions
All the RF outputs are muted at power up until the loop is locked. Refer to the Register Map section for default values in registers.
Program Modes
Table 4D and the Register Map indicate how the program modes are set up in the 8V97053L.
Table 4D. Control Bits Configuration
Control Bits (CB)
C3
0
C2
0
C1
0
Register
Register 0
0
0
1
Register 1
0
1
0
Register 2
0
1
1
Register 3
1
0
0
Register 4
1
0
1
Register 5
1
1
0
Extended Register 6
Extended Register 7
1
1
1
Double Buffering
The following bits are Doubled Buffered:
1. PHASE (Bits[D26:D15] in Register 1)
2. MOD (Bits[D14:D3] in Register 1)
3. REF DOUBLER (Bit D25 in Register 2)
4. REF DIV2 (Bit D24 in Register 2)
5. R COUNTER (Bits[D23:D14] in Register 2)
6. ICP SETTING (Bits[D12:D9] in Register 2)
The user must proceed to the following steps before any value written in these bits are used.
1. The new values are written in the double buffered bits
2. A new Write is performed on Register 0
The RF DIVIDER value in Register 4 (Bits[D22:D20]) is also double buffered, but only if the DOUBLE BUFFER bit (Bit D13 in Register 2) is
set to 1.
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Timing Characteristics
tSU tH
tLO tHI
tPW
nCS
SCLK
SDI
D31
D30
D29
D28
D1
D0
Start Write Command
Complete Write Command
Figure 9. SPI Write Cycle Timing Diagram
tPW
nCS
SCLK
D1
D0
SDI
SDO (SCLKE = 1)
SDO (SCLKE = 0)
D31
D30
D29
D28
D1
D0
D31
D30
D29
D28
D1
D0
Start Read Transmission
Complete read command (Write to Register 7)
Complete Read Transmission
Figure 10. SPI Read Cycle Timing Diagram
Table 4E. SPI Read / Write Cycle Timing Parameters
Symbol
fCLK
tSU
Parameter
Minimum
Maximum
Unit
MHz
ns
SCLK Frequency
-
20
-
nCS, SDI Setup Time to SCLK
SCLK to nCS, SDI Hold Time
SCLK Low Pulse Width
SCLK High Pulse Width
nCS De-asserted Pulse Width
10
10
25
25
20
tH
-
ns
tLO
-
ns
tHI
-
ns
tPW
-
ns
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3- or 4-Wire SPI Interface Description
The 8V97053L has a serial control port capable of responding as a slave in an SPI compatible configuration to allow access to any of the
internal registers (see section, “Register Map” on page 22) for device programming or examination of internal status. See the specific sections
for each register for details on meanings and default conditions.
SPI mode slave operation requires that a device external to the 8V97053L has performed any necessary serial bus arbitration and/or address
decoding at the level of the board or system. The 8V97053L begins a cycle by detecting an asserted (low) state on the nCS input at a rising
edge of SCLK. This is also coincident with the first bit of data being shifted into the device. In SPI mode, the first bit is the Most Significant Bit
(MSB) of the data word being written. Data must be written in 32-bit words, with nCS remaining asserted and one data bit being shifted in to
the 8V97053L on every rising edge of SCLK. If nCS is de-asserted (high) at any time except after the complete 32nd SCLK cycle, this is treated
as an error and the shift register contents are discarded. No data is written to any internal registers. If nCS is de-asserted (high) as expected
at a time at least tSU after the 32nd falling edge of SCLK, then this will result in the shift register contents being acted on according to the control
bit in it.
It is recommended to write the registers in reverse sequential order, starting with the highest register number first and ending with Register 0.
The word format of the 32-bit quantity in the shift register is shown in Table 4F. The register fields in the 8V97053L have been organized so
that the three LSBs in each 32-bit register row are not used for data transfer. These bits will represent the base address for the 32-bit register
row.
To perform a register Read, the user needs set the MUX_OUT bits (Bits[28:D26]) in Register 2 to 111 to configure the MUX_OUT pin as SDO.
Register 7 (Instruction register) needs to be set for Read operation. Bit D3 of Register 7 will set the Read or Write command, and Bits[D4:D6]
determine the read back address.
If a read operation is requested, 32-bits of read data will be provided in the immediately subsequent access. nCS must be de-asserted (high)
for at least tPW, and then reasserted (low).
If SCLKE = 1 (default condition), one data bit will be transmitted on the SDO output at the falling edge of nCS and each falling edge of SCLK
as long as nCS remains asserted (low), and the master device should capture data on the rising edge of SCLK. If SCLKE = 0, one data bit will
be transmitted on the SDO output at each rising edge of SCLK as long as nCS remains asserted (low), and the master device should capture
data on the falling edge of SCLK.
If nCS is de-asserted (high) before 32-bits of read data have been shifted out, the read cycle will be considered to be completed. If nCS remains
asserted (low) longer than 32-bit times, then the data during those extra clock periods will be undefined. The MSB of the data will be presented
first.
Table 4F. SPI Mode Serial Word Structure
MSB
31
LSB
0
Bit #
…
5
4
3
2
1
Meaning
Width
D[31:3]
29
Control Bits
3
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Register Map
Register 0
Table 5A. Register 0 Bit Allocation
FEEDBACK DIVIDER FRACTIONAL VALUE
(FRAC)
CONTROL
BITS
FEEDBACK DIVIDER INTEGER VALUE (INT)
Table 5B. Register 0: 16-Bit Feedback Divider Integer Value (INT). Function Description
Name
Description
Factory Default
Function
0000 0000 0000 0000 = Not allowed
0000 0000 0000 0001 = Not allowed
...
0000 0000 0000 0111 = Not allowed
0000 0000 0000 1000 = 8
…
0000 0000 0110 0100
(INT = 100)
NDiv[16:1]
Feedback Divider Integer Value (INT)
0000 0000 0001 0111 = 23
0000 0000 0001 1000 = 24
…
1111 1111 1111 1111 = 65,535
1
Table 5C. Register 0: 12-Bit Feedback Divider Fractional Value (FRAC). Function Description
Name
Description
Factory Default
Function
0000 0000 0000 = 0
0000 0000 0001 = 1
…
0000 0000 0000
(FRAC = 0)
FDiv[12:1]
Feedback Divider Fractional Value (FRAC)
1111 1111 1111 = 4095
NOTE 1. This table is used when bit 16b_12b_sel is set to 0 (default). If the 16b_12b_sel is set to 1, refer to Table 12K, Page 42.
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Table 5D. Register 0: 3-Bit Control Bits. Function Description
Name
Description
Function
000 = Register 0 is programmed
CB[3:1]
Control Bits
NOTE 1. The user has to set CB[3:1] to 000 in order to write to Register 0.
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Register 1
Table 6A. Register 1 Bit Allocation
CONTROL
BITS
RESERVED
PHASE VALUE (PHASE)
MODULUS VALUE (MOD)
Table 6B. Register 1: 1-Bit BAND_SEL_DISABLE. Function Description
Name
Description
Factory Default
Function
0 = VCO Band Selection occurs after a Write to Register 0
Band_Sel_Disable BAND_SEL_DISABLE
0
1 = VCO Band selection is not active and hold to previous VCO band
selection
Table 6C. Register 1: 12-Bit Phase Value (PHASE). Function Description
16b_12b_sel
Name
Description
(Bit D20, Register7)
Factory Default
Function
0000 0000 0000 = 0
0000 0000 0001 = 1
…...
0
0000 0000 0001
1111 1111 1111 = 4095
0000 0000 0000 = 0
0000 0000 0001 = 16
…...
Phase [12:1]
PHASE
1
0000 0000 0001
1111 1111 1111 = 65520
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Table 6D. Register 1: 12-Bit Modulus Value (MOD). Function Description
Name
Description
Factory Default
Function
0000 0000 0000 = Not Allowed
0000 0000 0001 = Not Allowed
0000 0000 0010 = 2
…
Mod[12:1]
MOD
0000 0000 0010
1111 1111 1111 = 4095
NOTE 1. This table is used when bit D20 in Register 7 (16b_12B_sel) is set to 0 (default). If 16b_12b_sel is set to 1, refer to Table 12J, Page
42.
1
Table 6E. Register 1: 3-Bit Control Bits. Function Description
Name
Description
Function
CB[3:1]
Control Bits
001 = Register 1 is programmed
NOTE 1. The user has to set CB[3:1] to 001 in order to write to Register 1.
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Register 2
Table 7A. Register 2 Bit Allocation
CONTROL
BITS
MUX_OUT
R COUNTER
ICP SETTING
Table 7B. Register 2: 2-Bit NOISE MODE. Function Description
Name
Description
Factory Default
Function
00 = Low Noise Mode (Dither OFF)
01 = Reserved
ModeNoise[2:1]
NOISE MODE
00
10 = Reserved
11 = Low Spur Mode (Dither Enabled)
Table 7C. Register 2: 3-Bit MUX_OUT. Function Description
Name
Description
Factory Default
Function
000 = High-Impedance output
001 = VDDD
010 = GNDD
011 = R counter output
100 = N counter output
101 = Reserved
MUX_OUT[3:1]
MUX_OUT
000
110 = Lock Detect
111 = MUX_OUT configured as SDO
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Table 7D. Register 2: 1-Bit REF DOUBLER. Function Description
Name
Description
Factory Default
Function
0 = Disabled
1 = Enabled
RefDoub
REF DOUBLER
0
Table 7E. Register 2: 1-Bit REF DIV2. Function Description
Name
Description
Factory Default
Function
0 = Disabled
1 = Enabled
RDIV2
REF DIV2
0
Table 7F. Register 2: 10-Bit R COUNTER (R). Function Description
Name
Description
Factory Default
Function
00 0000 0000 = Not Allowed
00 0000 0001 = 1
00 0000 0010 = 2
…
R[10:1]
R
00 0000 0001
11 1111 1111 = 1023
1
Table 7G. Register 2: 1-Bit DOUBLE BUFFER. Function Description
Name
Description
Factory Default
Function
0 = Disabled
1 = Enabled
DoubBuff1
DOUBLE BUFFER
0
NOTE 1. Bit D13 enables or disables Double Buffering of Bits[D22:D20] in Register 4. Refer to Program Modes section.
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Table 7H. Register 2: 4-Bit Charge Pump Setting (ICP SETTING). Function Description
Name
Description
Factory Default
Function
Icp (mA) assuming RCP = 5.1k
0000 = 0.31
0001 = 0.63
0010 = 0.94
0011 = 1.25
0100 = 1.56
0101 = 1.88
0110 = 2.19
ChrgPmp[4:1]
ICP SETTING
0000
0111 = 2.50
1000 = 2.81
1001 = 3.13
1010 = 3.44
1011 = 3.75
1100 = 4.06
1101 = 4.38
1110 = 4.69
1111 = 5.00
1
Table 7I. Register 2: 1-Bit Lock Detect Function (LDF). Function Description
Name
Description
Factory Default
Function
0 = 40 consecutive cycles (recommended for FRAC-N mode)
1 = 5 consecutive cycles (recommended for INT-N mode)
LDF
LDF
0
NOTE 1. LDF controls the number of PFD cycles that needs to be considered by the Lock Detect function to decide if the part has achieved
lock.
Table 7J. Register 2: 1-Bit Lock Detect Precision. Function Description
Name
Description
Factory Default
Function
0 = 10ns
1 = 6ns
LDP
LDP
0
Table 7K. Register 2: 1-Bit Phase Detector Polarity. Function Description
Name
Description
Factory Default
Function
0 = NEGATIVE
1 = POSITIVE
PD_Pol
PD POLARITY
1
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Table 7L. Register 2: 1-Bit Power Down. Function Description
Name
Description
Factory Default
Function
0 = Disabled
1 = Enabled
PwrDwn
POWER DOWN
0
Table 7M. Register 2: 1-Bit Charge Pump High-Impedance. Function Description
Name
Description
Factory Default
Function
0 = Disabled
1 = Enabled
CP_HIGHZ
CP HIGHZ
0
1
Table 7N. Register 2: 3-Bit Control Bits. Function Description
Name
Description
Function
010 = Register 2 is programmed
CB[3:1]
Control Bits
NOTE 1. The user has to set CB[3:1] to 010 in order to write to Register 2.
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Register 3
Table 8A. Register 3 Bit Allocation
CONTROL
BITS
RESERVED
CLOCK COUNTER VALUE
1
Table 8B. Register 3: 1-Bit Band Select Clock Mode. Function Description
Name
Description
Factory Default
Function
0 = LOW (125kHz)
BandSelCM
BAND SELECT (CLOCK RATE)
0
1 = HIGH (up to 500kHz logic sequence for
Faster Lock applications)
NOTE 1. BAND SELECT (CLOCK RATE) selects the speed of the logic sequence for the band selection. BandSelCM = 1 sets the logic se-
quence rate faster, which is recommended for fast lock operation and when high PFD frequencies are used. BandSelCM = 0 is rec-
ommended when low PFD frequencies (125kHz) are used. When using BandSelCM = 1, the value of the BAND SELECT CLOCK
COUNTER (BndSelDiv[8:1]) must be less than or equal to 254.
Table 8C. Register 3: 2-Bit Clock Divider Mode. Function Description
Name
Description
Factory Default
Function
00 = Clock Divider OFF
01 = Fast Lock Enabled
10 = Resync Enabled
11 = Reserved
ClkDivMode[2:1] CLK DIV MODE
00
Table 8D. Register 3: 12-Bit Clock Divider Value (CLKDIV). Function Description
Name
Description
Factory Default
Function
0000 0000 0000 = Not allowed
0000 0000 0001 = 1
0000 0000 0010 = 2
…
ClkDiv[12:1]
CLKDIV
0000 0000 0001
1111 1111 1111 = 4095
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Table 8E. Register 3: 3-Bit Control Bits. Function Description
Name
Description
Function
011 = Register 3 is programmed
CB[3:1]
CONTROL BITS
NOTE 1. The user has to set CB[3:1] to 011 in order to write to Register 3.
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Register 4
Table 9A. Register 4 Bit Allocation
BAND SELECT CLOCK
COUNTER
CONTROL
BITS
RESERVED
Table 9B. Register 4: 1-Bit Feedback Select. Function Description
Name
Description
Factory Default
Function
0 = Divided
FbkSel
FEEDBACK SELECT
1
1 = Fundamental
Table 9C. Register 4: 3-Bit RF Output Divider (÷ MO) Select. Function Description
Name
Description
Factory Default
Function
000 = Div by 1
001 = Div by 2
010 = Div by 4
011 = Div by 8
100 = Div by 16
101 = Div by 32
110 = Div by 64
111 = Reserved
RFDiv[3:1]
RF OUTPUT DIVIDER
000
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Table 9D. Register 4: 8-Bit Band Select Clock Counter. Function Description
Name
Description
Factory Default
Function
0000 0000 = Not Allowed
0000 0001 = 1
0000 0010 = 2
...
BndSelDiv[8:1]
BAND SELECT CLOCK COUNTER
0000 0001
1111 1111 = 255
NOTE 1. BAND SELECT CLOCK COUNTER sets the value of the divider for the band select logic clock input. By default, the output frequency
of the R counter is used to clock the band select logic. If this frequency is larger than 125kHz, the Band Select Clock counter can
be used to divide the R counter output to a smaller frequency suitable for the band selection logic.
Table 9E. Register 4: 1-Bit VCO Power Down. Function Description
Name
Description
Factory Default
Function
0 = VCO Powered Up
VCOPwrDwn
VCO POWER DOWN
0
1 = VCO Powered Down
Table 9F. Register 4: 1-Bit Mute Till Lock Detect. Function Description
Name
Description
Factory Default
Function
0 = Mute Disabled
1 = Mute Enabled
MTLD
MTLD
0
Table 9G. Register 4: 1-Bit RF_OUTB Select. Function Description
Name
Description
Factory Default
Function
0 = Divided Output
1 = Fundamental
RF_OUTB_Sel
RF_OUTB SELECT
0
Table 9H. Register 4: 1-Bit RF_OUTB Enable. Function Description
Name
Description
Factory Default
Function
0 = Disabled (High-Impedance)
1 = Enabled1
RF_OUTB_En
RF_OUTB ENABLE
0
NOTE 1. RF_OUTA must also be enabled.
Table 9I. Register 4: 1-Bit RF_OUTA Enable. Function Description
Name
Description
Factory Default
Function
0 = Disabled1 (High-Impedance)
1 = Enabled
RF_OUTA_En
RF_OUTA ENABLE
0
NOTE 1. RF_OUTB will also disable.
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Table 9J. Register 4: 2-Bit RF_OUTA Output Power. Function Description
Name
Description
Factory Default
Function
00 = -4dBm
01 = -1dBm
10 = +2dBm
11 = +5dBm
RF_OUTA_Pwr[2:1]
RF_OUTA OUTPUT POWER
10
NOTE 1. fRF_OUT = 34.375MHz.
1
Table 9K. Register 4: 3-Bit Control Bits. Function Description
Name
Description
Function
100 = Register 4 is programmed
CB[3:1]
CONTROL BITS
NOTE 1. The user has to set CB[3:1] to 100 in order to write to Register 4.
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Register 5
1
Table 10A. Register 5 Bit Allocation
CONTROL
BITS
RESERVED
RESERVED
NOTE 1. D19 and D20 must be set to 1.
Table 10B. Register 5: 2-Bit LD (Lock Detect) Pin Mode. Function Description
Name
Description
Factory Default
Function
00 = Low
01 = Digital Lock Detect
10 = Low
LDPInMode[2:1]
LD PIN MODE
01
11 = High
1
Table 10C. Register 5: 3-Bit Control Bits. Function Description
Name
Description
Function
CB[3:1]
CONTROL BITS
101 = Register 5 is programmed
NOTE 1. The user has to set CB[3:1] to 101 in order to write to Register 5.
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Extended Registers, (Registers 6 and 7)
Register 6
1 2 3
Table 11A. Register 6 Bit Allocation
EXT_BND_SE CONTROL
RESERVED (RO)
L_DIV
BITS
NOTE 1. It is recommended that the user writes to Register 0 after writing to Register 6.
NOTE 2. Bit D7 must be set to 0 for correct operation.
NOTE 3. RO Bits are Read Only Bits.
Table 11B. Register 6: 1-Bit Digital Lock Detect. Function Description
Name
Description
Function
0 = PLL Not Locked
DigLock
DIGITAL LOCK
1 = PLL Locked (according LDF and LDP in Register 2)
Table 11C. Register 6: 1-Bit Band Select Status (Read Only). Function Description
Name
Description
Function
0 = Band Selection Not Complete
1 = Band Selection Complete
Band_select_done
BAND_SELECT_DONE
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Table 11D. Register 6: 2-Bit Extra Lock Detect Precision. Function Description
Function
Name
Description
Factory Default
Extra Bit
LDP Bits in Register 2
Value
10ns
6ns
0
1
0
1
0
1
0
1
00
3ns
01
10
11
3ns
LDP_EXT
LDP_Ext[2:1]
00
Extra Lock Detect Precision
4ns
4.5ns
1.5ns
1.5ns
NOTE 1. LDP_Ext[2:1] are Extra Lock Detect Precision bits. When these bits are set to 00, then the precision of the Lock Detect precision
only relies on the LDP bit in Register 2, so that the lock detect window is 10ns or 6ns, depending on the LDP bit in Register 2. For
high PFD frequencies, the 6ns window may be larger than the entire ref/FB period. The LDP_ext bits reduce the size of the lock
detect window to the value described in Table 11B, Page 36, allowing an accurate lock detection with higher PFD frequencies.
1 2
Table 11E. Register 6: 1-Bit Extra Bit of RF_OUTB Power. Function Description
Function
RF_OUTB OUTPUT POWER Bits
Name
Description
Factory Default
Extra Bit
in Register 4
Value (dBm)
00
01
10
11
00
01
10
11
-4
-1
0
+2
+5
+2
+5
+6
+7
rf_outb_hi_pwr
RF_OUTB_HI_PWR
0
1
NOTE 1. RF_OUTB_HI_PWR is an Extra Bit of RF_OUTB Power that increases the output power to the RF_OUTB output.
NOTE 2. fRF_OUT = 34.375MHz.
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1 2
Table 11F. Register 6: 1-Bit Extra Bit of RF_OUTA Power. Function Description
Function
RF_OUTA OUTPUT POWER Bits
in Register 4
Name
Description
Factory Default
Extra Bit
Value (dBm)
00
01
10
11
00
01
10
11
-4
-1
0
+2
+5
+2
+5
+6
+7
rf_outa_hi_pwr
RF_OUTA_HI_PWR
0
1
NOTE 1. RF_OUTA_HI_PWR is an Extra Bit of RF_OUTA Power that increases the output power to the RF_OUTA output.
NOTE 2. fRF_OUT = 34.375MHz.
Table 11G. Register 6: 2-Bit Sigma Delta Modulator Order Configuration. Function Description
Name
Description
Factory Default
Function
00 = OFF. The device operates in integer mode and the fractional
part is ignored.
01 = 1st order
10 = 2nd order
11 = 3rd order
SDMOrder[2:1]
SDM_ORDER
11
Table 11H. Register 6: 2-Bit Dither Gain Configuration. Function Description
Name
Description
Factory Default
Function
0 = LSB Dither (Recommended)
1 = LSB x4 Dither
DitherG
DITHER GAIN
0
Table 11I. Register 6: 1-Bit Dither Noise Shaping Configuration. Function Description
Name
Description
Factory Default
Function
0 = Dither Noise Shaping Disabled
1 = Dither Noise Shaping Enabled
ShapeDitheren
SHAPE_DITHER_EN
1
Table 11J. Register 6: 1-Bit Sigma Delta Modulator Type Configuration. Function Description
Name
Description
Factory Default
Function
00 = Reserved
01 = SSMF-II
10 = SSMF-I
11 = SSMF-B
SDMType[2:1]
SDM_TYPE
01
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Table 11K. Register 6: 2-Bit VCO Band Selection Accuracy Configuration. Function Description
Name Description Factory Default Function
00 = 1 cycle of the band select clock (output of the Band Select Divider)
01 = 2 cycles
10 = 4 cycles
11 = Reserved
band_select_acc[2:1] BAND_SELECT_ACC 00
1 2
Table 11N. Register 6: 4-Bit Extra Most Significant Bits of Band Select Divider. Function Description
Name
Description
Factory Default
Value
Function
0000 = [BSCC_R4]
0001 =[BSCC_R4]+256
0010 = [BSCC_R4] + 512
….…
BSCC_R4 +
[EXT_BND_SEL_DIV]x256
ExtBndSelDiv[4:1]
EXT_BND_SEL_DIV
0000
1111 = [BSCC_R4]+3840
NOTE 1. EXT_BND_SEL_DIV are Extra 4 MSBs that extend the Band Select Clock Counter in Register 4. These additional bits are necessary
for band selection to divide down to <500kHz when high PFD frequencies are used.
NOTE 2. BSCC_R4 is the BAND SELECT CLOCK COUNTER value in Register 4.
1
Table 11O. Register 6: 3-Bit Control Bits. Function Description
Name
Description
Function
CB[3:1]
CONTROL BITS
110 = Register 6 is programmed
NOTE 1. The user has to set CB[3:1] to 110 in order to write to Register 6.
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Register 7
1 2
Table 12A. Register 7 Bit Allocation
REV_ID
(RO)
CONTROL
BITS
DEV_ID (RO)
EXT_MOD
EXT_FRAC
NOTE 1. SB Bits are Sticky Bits and need to be cleared.
NOTE 2. RO Bits are Read Only Bits.
1
Table 12B. Register 7: 1-Bit Loss of Digital Lock. Function Description
Name
Description
Function
0 = Locked since last time register was cleared
Loss_Dig_Lock
LOSS_DIG_LOCK
1 = Loss of Digital Lock since last time register was cleared
NOTE 1. This bit is a sticky bit and needs to be cleared with a SPI write of 1 to detect further Loss of Digital Lock occurrences.
1
Table 12C. Register 7: 1-Bit Loss of Analog Lock. Function Description
Name
Description
Function
0 = Band Selection remained the same since last time register was cleared
1 = Band selection occurred since last time register was cleared
Loss_Anlg_Lock
LOSS_ANLG_LOCK
NOTE 1. This bit is a sticky bit and needs to be cleared with a SPI write of 1 to detect further Band Selection occurrences.
1
Table 12D. Register 7: 1-Bit SPI Error. Function Description
Name
Description
Function
0 = No SPI write error detection
1 = SPI Write error
Spi_error
SPI_ERROR
NOTE 1. Spi_error Bit goes high if the SPI interface detects a cycle with the incorrect number of SCLK cycles between nCS asserted Low
and nCS asserted High. The SPI interface expects 32 clock cycles between nCS asserted Low and nCS asserted High. Any
Read/Write via the SPI interface with more or less than 32 clock cycles will result in the Spi_error Bit switched to 1. This bit is a sticky
bit and needs to be cleared with a SPI write of 1 in order to detect further possible SPI Write/Read errors.
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Table 12E. Register 7: 3-Bit Revision ID. Function Description
Name
Description
Factory Default
Rev_ID[3:1]
REV_ID
001
Table 12F. Register 7: 4-Bit Device ID. Function Description
Name
Description
Factory Default
Dev_ID[4:1]
DEV_ID
0110
Table 12G. Register 7: 1-Bit Resolution Select. Function Description
Name
Description
Factory Default
Function
0 = FRAC, PHASE and MOD set to 12-Bit resolution,
Bit[D19:D8] set to 0 and unused
16b_12b_sel
16b_12b_SEL
0
1 = FRAC, PHASE and MOD set to 16-Bit resolution
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1
Table 12J. Register 7: 4-Bit Extra Bits of MOD Value. Function Description
Function
EXT_MOD
0000
Name
Description
Factory Default
MOD
Value
Not Allowed
0001
Not Allowed
0000 0000 0000
0000 0000 0001
1111 1111 1111
0010
2
. . . .
. . . .
15
1111
0000
16
ext_mod[4:1]
EXT_MOD
0000
. . . .
. . . .
31
1111
. . . .
0000
65520
. . . .
. . . .
1111
65535
NOTE 1. Bit D20 in Register 7 (16b_12b_SEL) is required to be set to 1 when using this table. If Bit D20 in Register 7 (16b_12b_SEL) is set
to 0, refer to Table 6D, Page 25.
1
Table 12K. Register 7: 4-Bit Extra Bits of FRAC Value. Function Description
Function
Name
Description
Factory Default
FRAC
EXT_FRAC
0000
0001
. . . .
Value
0
1
0000 0000 0000
. . . .
15
1111
0000
. . . .
16
ext_fdiv[4:1]
EXT_FRAC
0000
0000 0000 0001
. . . .
31
1111
. . . .
0000
. . . .
65520
. . . .
1111 1111 1111
1111
65535
NOTE 1. Bit D20 in Register 7 (16b_12b_SEL) is required to be set to 1 when using this table. If Bit D20 in Register 7 (16b_12b_SEL) is set
to 0, refer to Table 5C, Page 22.
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Table 12L. Register 7: 1-Bit SCLKE. Function Description
Name
Description
Factory Default
Function
0 = Output Data in a Read Cycle on a Rising Edge of SCLK
Sclke
SCLKE
1
1 = Output Data in a Read Cycle on a Falling Edge of
SCLK
1
Table 12M. Register 7: 1-Bit READBACK_ADDR. Function Description
Name
Description
Function
000 = Register 0
001 = Register 1
010 = Register 2
011 = Register 3
100 = Register 4
101 = Register 5
110 = Register 6
111 = Register 7
Rd_Addr[3:1]
READBACK_ADDR
NOTE 1. In order to Read a register, the user must write to Register 7 first and set the SPI_R_WN Bit to 1 (READ) and indicate the address
of the register to read in the READBACK_ADDR Bit (Bits[D6:D4]).
1
Table 12N. Register 7: 1-Bit SPI_R_WN. Function Description
Name
Description
Factory Default
Function
0 = WRITE
1 = READ
SPI_R_WN
SPI_R_WN
0
NOTE 1. Writing this bit to a ‘1’ will allow the user to read back the register selected in READBACK_ADDR on the next 32 SCLK cycle. This
bit will revert back to ‘0’ once it is written with ‘1’ and will not retain the ‘1’ value.
1
Table 12O. Register 7: 3-Bit Control Bits. Function Description
Name
Description
Function
CB[3:1]
CONTROL BITS
111 = Register 7 is programmed
NOTE 1. The user has to set CB[3:1] to 111 in order to write to Register 7.
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Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum
Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of
product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not
implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Table 13. Absolute Maximum Ratings
Item
Rating
3.63V
3.63V
Supply Voltage, VDDX
Analog Supply Voltage, VDDA
Input, VI
REF_IN
-0.5 to VDDA + 0.5V
Other Inputs (MUTE, SDI, FLSW, VTUNE
)
Outputs, VO
-0.5 to VDDA + 0.5V
-0.5 to VDDA + 0.5V
RF_OUTA-B, nRF_OUTA-B
Outputs, VO (SCLK, LD, nCS, MUX_OUT)
Outputs, IO
Continuous Current
Surge Current
40mA
65mA
Outputs, IO (SCLK, LD, nCS, MUX_OUT)
Continuous Current
8mA
13mA
Surge Current
Junction Temperature, TJ
Storage Temperature, TSTG
125°C
-65°C to 150°C
NOTE: VDDX denotes VDDD, V_CP, VDD_SD, VVCO.
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DC Electrical Characteristics
1 2 3
Table 14A. Power Supply DC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to +85°C
Symbol Parameter
Test Conditions
Minimum
3.135
Typical
Maximum
Units
V
VDDX
VDDA
Core Supply Voltage
3.3
3.3
95
3.465
3.465
105
Analog Supply Voltage
Power Supply Current
3.135
V
4
IDDX
mA
RF_OUTA / nRF_OUTA - Active
RF_OUTB / nRF_OUTB - Muted
60
80
37
75
100
45
mA
mA
mA
RF_OUTA / nRF_OUTA - Active
RF_OUTB / nRF_OUTB - Active
5
IDDA
Analog Supply Current
RF_OUTA / nRF_OUTA - Muted
RF_OUTB / nRF_OUTB - Muted
IVCO
VCO Supply Current
Power Down Mode
60
15
mA
mA
20
NOTE 1. VDDX denotes VDDD, V_CP, VDD_SD, VVCO.
NOTE 2. RF Outputs Terminated 50to VDDA.
NOTE 3. Output Power set to +2dBm.
NOTE 4. IDDX denotes IDDD + I_CP + IDD_SD + IVCO.
NOTE 5. IDDA is dependent on the value of the M0 output divider. The numbers indicated for IDDA show the current consumption when using
the output divider M0 = 64, for which IDDA is higher than when using any other M0 divider value.
1
Table 14B. Output Divider Incremental Current
Parameter
Test Conditions
Divide by 2
Minimum
Typical
8.0
Maximum
Units
mA
mA
mA
mA
mA
mA
Divide by 4
7.0
Divide by 8
1.5
Output Divider Supply Current
Divide by 16
Divide by 32
Divide by 64
1.5
1.5
1.5
NOTE 1. RF Output divider (÷MO) has an incremental increase in current as the divider value increases. This specification is the incremental
current change per output divider step. For example, current of divide-by-2 is 8mA more than divide-by-1, current of divide-by-4 is
7mA more than divide-by-2, and so on. The total increase from ÷1 to ÷64 is 8mA + 7mA + 1.5mA + 1.5mA + 1.5mA + 1.5mA = 21mA.
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8V97053L Datasheet
1
Table 14C. Typical Current by Power Domain
Pin Name
V_CP
Pin Number
Typical Current
Unit
mA
mA
mA
mA
mA
6
24
15
0.5
6
VVCO
16, 17
28
VDDD
VDD_SD
VDDA
32
10
52
NOTE 1. Operating conditions are:
REF_IN = 25MHz
INT = 100 (integer mode)
RF Divider = ÷1
RF_OUTA = RF_OUTB = 2.5GHz
RFPOWER = -1dBm
Charge Pump = 0.31mA
1
Table 14D. LVCMOS DC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to 85°C
Symbol
Parameter
Test Conditions
Minimum
1.8
Typical
Maximum
Units
V
MUTE, CE
VDDx
VDDx
0.6
VIH
Input High Voltage
Input Low Voltage
Input High Current
SDI, SCLK, nCS
1.5
V
VIL
-0.3
V
SDI, MUTE, CE
SCLK, nCS
VDDx = 3.465V, VIN = 1.8V
VDDx = 3.465V, VIN = 1.8V
5
µA
µA
µA
µA
V
IIH
150
SDI, MUTE, CE
SCLK, nCS
V
DDx = 3.465V, VIN = 0V
DDx = 3.465V, VIN = 0V
-150
-5
IIL
Input Low Current
V
VOH
VOL
Output High Voltage MUX_OUT, LD
Output Low Voltage MUX_OUT, LD
VDDx = 3.465V; IOH = -500µA
VDDx = 3.465V; IOL = 500µA
VDDX - 0.4
0.4
V
NOTE 1. VDDX denotes VDDD, V_CP, VDD_SD, VVCO.
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8V97053L Datasheet
AC Electrical Characteristics
1
Table 15A. AC Characteristics, VDDX = VDDA = 3.3V ± 5%, TA = -40°C to 85°C
Symbol
Parameter
Test Conditions
Ref Doubler Disabled
Ref Doubler Enabled
Biased at VDDA/23
Minimum
Typical
Maximum
Units
MHz
MHz
V
5
5
310
100
REF_IN
Input Reference Frequency2
VPP
Input Sensitivity
VCO Frequency
Output Frequency
REF_IN
0.7
VDDA
4400
4400
125
fVCO
Fundamental VCO Mode
Divider Values: 1, 2, 4, 8, 16, 32, 64
Fractional Mode
2200
34.375
MHz
MHz
MHz
MHz
MHz/V
fRF_OUT
fPFD
PFD Frequency
Integer Mode
310
KVCO
tLOCK
VCO Sensitivity
PLL Lock Time
40
Time from Low to High nCS until
at Normal Mode, Low to High LD
200
µs
-
-
-
Output Power Variation
RF Output Power
±1
dB
dBm
V
Muted, (M0 1)
80
Min/Max VCO Tuning Voltage
0.5 / 2.5
NOTE 1. VDDX denotes VDDD, V_CP, VDD_SD, VVCO.
NOTE 2. For REF_IN <10MHz, the slew rate must be >21V/µs.
NOTE 3. AC-coupling the reference signal ensures VDDA/2 biasing.
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8V97053L Datasheet
1 2
Table 15B. RF_OUT
Phase Noise and Jitter Characteristics, VDDX = VDDA = 3.3V ± 5%, T = -40°C to 85°C
[A:B]
A
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
f = 156.25MHz
Integration Range: 12kHz - 20MHz
220
218
166
fs
f = 2.05GHz
Integration Range: 12kHz - 20MHz
tjit(Ø)
RMS Phase Jitter (Random)
fs
fs
f = 1.76GHz
Integration Range: 12kHz - 20MHz
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
-122.76
-146.18
-147.80
-155.36
-156.50
-157.31
-114.07
-136.57
-138.67
-151.50
-154.42
-155.93
-114.30
-139.19
-141.38
-152.70
-154.39
-155.79
-108.48
-131.19
-133.38
-147.77
-152.47
-155.77
-103.22
-127.59
-129.92
-145.39
-150.27
-153.72
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
RF Output
Phase Noise Performance
@ 745MHz (Open Loop)
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
RF Output
Phase Noise Performance
@ 1.1GHz (Open Loop)
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
RF Output
Phase Noise Performance
@ 1.65GHz (Open Loop)
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
RF Output
Phase Noise Performance
@ 2.3GHz (Open Loop)
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
RF Output
Phase Noise Performance
@ 3.8GHz (Open Loop)
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8V97053L Datasheet
1 2
Table 15B. RF_OUT
Phase Noise and Jitter Characteristics, VDDX = VDDA = 3.3V ± 5%, T = -40°C to 85°C
[A:B]
A
Symbol
N(100k)
N(800k)
N(1M)
N(5M)
N(10M)
N()
Parameter
Test Conditions
100kHz Offset from Carrier
800kHz Offset from Carrier
1MHz Offset from Carrier
5MHz Offset from Carrier
10MHz Offset from Carrier
Noise Floor (30MHz from Carrier)
Minimum
Typical
Maximum
Units
-100.26
-125.80
-128.17
-143.81
-148.47
-153.01
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
RF Output
Phase Noise Performance
@ 4.4GHz (Open Loop)
Spurious Signals
Due to PFD Frequency
fPFD = 50MHz;
RF_OUTA = 2.2GHz
-
-74
dBc
RF Output Phase Noise
Performance @ 745MHz
(Open Loop)
N(100k)
100kHz Offset from Carrier
-106.75
dBc/Hz
NOTE 1. VDDX denotes VDDD, V_CP, VDD_SD, VVCO.
NOTE 2. RF_OUT[A:B] output power setting = +2dBm.
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8V97053L Datasheet
Phase Noise (Closed-Loop) at 156.25MHz (3.3V)
Offset Frequency (Hz)
Phase Noise (Closed-Loop) at 1.76GHz (3.3V)
Offset Frequency (Hz)
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8V97053L Datasheet
Phase Noise (Closed-Loop) at 2.05GHz (3.3V)
Offset Frequency (Hz)
Phase Noise (Open-Loop) at 745MHz (3.3V)
Offset Frequency (Hz)
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8V97053L Datasheet
Phase Noise Performance (Open-Loop) at 1.1GHz (3.3V)
Offset Frequency (Hz)
Phase Noise Performance (Open-Loop) at 1.65GHz (3.3V)
Offset Frequency (Hz)
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8V97053L Datasheet
Phase Noise Performance (Open-Loop) at 2.3GHz (3.3V)
Offset Frequency (Hz)
Phase Noise Performance (Open-Loop) at 3.8GHz (3.3V)
Offset Frequency (Hz)
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8V97053L Datasheet
Phase Noise Performance (Open-Loop) at 4.4GHz (3.3V)
Offset Frequency (Hz)
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8V97053L Datasheet
Applications Information
Loop Filter Calculations
nd
2
Order Loop Filter
This section helps design a 2nd order loop filter for the 8V97053L. A general 2nd order loop filter is shown in Figure 11, Typical 2nd Order Loop
Filter. Step-by-step calculations to determine Rz, Cz and Cp values for a desired loop bandwidth are described below. Required parameters
are provided. A spreadsheet for calculating the loop filter values is also available.
RZ
Cp
CZ
Figure 11. Typical 2nd Order Loop Filter
1. Determine desired loop bandwidth fc.
2. Calculate Rz:
2* *fc* N
Rz
Icp* Kvco
Where,
Icp is charge pump current. Icp is programmable from 310µA to 5mA.
N is effective feedback divider. N must be programmed into the following value.
Fvco
N
Fpd
FVCO is VCO frequency.
VCO frequency range: 2200MHz to 4400MHz
Fpd is phase detector input frequency.
F _ ref
Fpd
Pv
F_ref is reference clock (REF_IN) input frequency.
Pv is overall pre-divider setting.
Kvco is VCO gain. Kvco = 40MHz/V
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3. Calculate Cz:
Cz
2* * fc* Rz
Where,
= fc/ fz, user can determine an number.
> 6 is recommended.
fz is frequency at zero.
4. Calculate Cp:
Cz
Cp
*
Where,
= fp/fc, user can determine number.
> 4 is recommended.
fp is frequency at pole.
5. Verify Phase Margin (PM)
Where,
Cz
b 1
Cp
The phase margin (PM) should be greater than 50°.
A spreadsheet for calculating the loop filter component values is available at www.IDT.com. To use the spreadsheet, the user simply enters the
following parameters:
fc, F_ref, PV, Icp, FVCO, and .
The spreadsheet will provide the component values, Rz, Cz and Cp as the result. The spreadsheet also calculates the maximum phase margin
for verification.
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8V97053L Datasheet
3rd Order Loop Filter
This section helps design a 3rd order loop filter for the 8V97053L. A general 3rd order loop filter is shown in Figure 12, Typical 3rd Order Loop Filter
.
RP2
RZ
CP2
C
Cp
P
C
Z
rd
Figure 12. Typical 3 Order Loop Filter
The Rz, Cz and Cp can be calculated as 2nd order loop filter.
The following equation help determine the 3rd order loop filter Rp2 and Cp2.
Pick an Rp2 value. Rp2 ~ 1.5xRz is suggested.
Where,
is ratio between the 1st pole frequency and the 2nd pole frequency. > 4 is recommended.
Recommendations for Unused Input and Output Pins
Inputs:
LVCMOS Control Pins
All control pins have internal pullup and pulldown resistors; additional resistance is not required but can be added for additional protection. A
1k resistor can be used.
Outputs:
Output Pins
For any unused output, it can be left floating and disabled.
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8V97053L Datasheet
Schematic Example
Figure 13A and Figure 13B show general application schematic examples for the 8V97053L.
For power rails, bypass capacitors must be provided to all power supply pins. Suggest at least one bypass capacitor per power pin. Value can
be ranged from 0.01uF or 0.1uF. Mix values of bypass capacitor can help filtering wider range of power supply noise.
The 8V97053L input is high impedance. The input termination depends on the driver type termination requirements. In these examples, the
8V97053L REF_IN input is terminated with a matched load termination. For transmission line with characteristic impedance Zo = 50, the
termination resistor R8 is 50. The input is self biased to proper DC offset after the AC coupling.
The loop filter values can be calculated to meet the loop bandwidth requirement. Please refer to the section, "Loop Filter Calculations" for
detailed calculations. For fast lock mode, the loop filter can be configured as Fast Lock Loop Filter Option 1 or Fast Lock Loop Filter Option 2
shown in Figure 13A.
Fast Lock Loop Filter Option 1 is Parallel Resistor Configuration. For normal operating mode, only R5 is active and R5 = Rs, where Rs is the
resistor value for normal operating mode loop bandwidth. In fast lock mode, the combination of R4 in parallel with R5 is active. For example,
in normal operation mode, if the charge pump current is set at 0000 (ICP = 310uA), then, in fast lock mode, the loop bandwidth is set larger by
increasing the charge pump current to ICP~5mA (ICP setting = 1111 or 16 times the normal charge pump current). The combination of the R4
and R5 in parallel is 1/4 * Rs.
Fast Lock Loop Filter Option 2 is Series Resistor Configuration.
For normal operating mode, both R6 and R7 are active and
R6 + R7 = Rs. For fast lock mode, only R6 is active. For example, in normal operation mode, if the charge pump current is set at 0000 (ICP =
310uA), then, in fast lock mode, the loop bandwidth is set larger by increasing the charge pump current to ICP~5mA (ICP setting = 1111 or 16
times the normal charge pump current).
The sum of R6 and R7 equals to Rs, i.e. R6 + R7 = Rs.
R6 = 1/4 * Rs and R7 = 3/4 * Rs.
The 8V97053L output pull-up loading can be resistors or inductors. The pull up resistor value is typically 50. Resistor pull up loading covers
wide range of output frequencies. For inductor pull up loading, the inductor value is frequency dependent. One inductor value cannot cover all
the output frequency range. This example shows the L = 3.9nF that is suitable for approximately 2GHz operating frequency. The output can
also drive single ended LO input. Figure 13B shows an example of the 8V97053L output driving single ended LO input of the mixer through an
LC balun. The LC balun component values are frequency dependent. These values can be adjusted to optimize the performance. Single ended
LO receiver input also can tap to one side of the differential driver using resistor loading or inductor loading. For single ended LO input, both
sides of the differential driver still need to be loaded with pull up. The output power level can also be adjusted further through programming.
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8V97053L Datasheet
Inductor Loading
C1
C2
C3
C6
1u
VDD
C4
C5
10u
0.1u
0.1u
0.1u
10u
R1
4.7k
V_vco
L2
3.9n
L1
3.9n
Resistor Loading
nREF_OUTA
REF_OUTA
VDD
VDD
R2
50
R1
50
25
26
27
28
29
30
31
32
16
VDD
LD
VVCO
nRF_OUTB
RF_OUTB
nRF_OUTA
RF_OUTA
GNDA_VCO
VDDA
15
14
13
12
11
10
9
C7
1n
C8
1n
MUTE
Zdiff=100
GNDD
VDDD
REF_IN
MUX_OUT
GND_SD
VDD_SD
nREF_OUTA
REF_OUTA
C9
1n
RF Mixer
LO input
Zo = 50
R8
50
RF IN
GNDA
C10
33
E_PAD
1n
Zo = 50
U1
VDD
CP_OUT
VTUNE
SPI Compatible Serial Bus
C11
R5
R3
C12
C13
Loop Filter
All power supply pins require Bypass capacitors
without Fast Lock
Fast Lock Loop Filter Options 2
R3
Fast Lock Loop Filter Options 1
CP_OUT
C11
VTUNE
R3
CP_OUT
VTUNE
C13
C11
R6
R4
FLSW
FLSW
C12
R5
C12
C13
R7
Figure 13A. An 8V97053L General Application Schematic Example
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8V97053L Datasheet
Resistor Loading
Inductor Loading
VDD
VDD
R2
50
R1
50
L2
L1
3.9n
3.9n
C1
C2
nREF_OUTA
REF_OUTA
C3
C6
1u
nREF_OUTA
REF_OUTA
C4
C5
10u
0.1u
C9
0.1u
C9
0.1u
10u
R1
4.7k
V_v co
VDD
RF to IF Dual Down
converter Mixer
VDD
L2
L1
RFin_A
IFout_A
25
26
27
28
29
30
31
32
16
LD
VVCO
nRF_OUTB
RF_OUTB
nRF_OUTA
RF_OUTA
GNDA_VCO
VDDA
15
14
13
12
11
10
9
C7
1n
C8
1n
VDD
MUTE
C9
IDT F1100
IDT F1102
IDT F1150
IDT F1152
IDT F1160
IDT F1178
GNDD
VDDD
REF_IN
MUX_OUT
GND_SD
VDD_SD
LO input
Zo = 50
C14
RF IN
R8
50
GNDA
L3
33
E_PAD
C15
U1
RFin_B
IFout_B
VDD
R3
VTUNE
C13
SPI Compatible Serial Bus
C11
R5
R4
Optional
C12
All power supply pins require Bypass capacitors
Figure 13B. Schematic Example for Driving Single Ended Mixer
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8V97053L Datasheet
Power Considerations
The 8V97053L device was designed and characterized to operate within the ambient industrial temperature range of -40°C to +85°C. The
ambient temperature represents the temperature around the device, not the junction temperature. When using the device in extreme cases,
such as maximum operating frequency and high ambient temperature, external air flow may be required in order to ensure a safe and reliable
junction temperature. Extreme care must be taken to avoid exceeding 125°C junction temperature. The power calculation example below was
generated using a typical configuration. For many applications, the power consumption can vary depending on configuration. Please contact
IDT technical support for any concerns on calculating the power dissipation for your own specific configuration.
Example 1: VCO Frequency Range = 1991MHz to 2846MHz
1. Power Dissipation.
The total power dissipation for the 8V97053L is the sum of the core power plus the power dissipation in the output driver.
The following is the power dissipation for VDD = 3.465V, which gives worse case results.
•
Power (core)MAX = VDD_MAX * (IDDA + IVCO + ICP + IDD_SD + IDDD MAX
)
= VDD_MAX * (IDDA + IDDX)MAX =
3.465V * (100mA + 105) = 710.33mW
Total Power (with two outputs active at 2dBm output power level) = 710.33mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 34.34°C/W per Table 16 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs active is:
85°C + 0.710W * 34.34°C/W = 109.39°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 16. Thermal Resistance JA for 32 Lead VFQFN, Forced Convection
JA by Velocity
0
Meters per Second
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
34.34°C/W
30.7°C/W
29.12°C/W
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8V97053L Datasheet
Example 2: VCO Frequency Range = 2590MHz to 3624MHz
1. Power Dissipation.
The total power dissipation for the 8V97053L is the sum of the core power plus the power dissipation in the output driver.
The following is the power dissipation for VDD = 3.465V, which gives worse case results.
•
Power (core)MAX = VDD_MAX * (IDDA + IVCO + ICP + IDD_SD + IDDD MAX
)
= VDD_MAX * (IDDA + IDDX)MAX =
3.465V * (90mA + 95mA) = 640mW
Total Power (with two outputs active at 2dBm output power level) = 640mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj = JA * Pd_total + TA
Tj = Junction Temperature
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and
a multi-layer board, the appropriate value is 34.34°C/W per Table 16.
Therefore, Tj for an ambient temperature of 85°C with all outputs active is:
85°C + 0.640W * 34.34°C/W = 107°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
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Reliability Information
Table 17A. JA vs. Air Flow Table for a 32 lead VFQFN
JA vs. Air Flow
Meters per Second
0
1
2
Multi-Layer PCB, JEDEC Standard Test Boards
34.34°C/W
30.7°C/W
29.12°C/W
Table 17B. JB vs. Air Flow Table for a 32 lead VFQFN
JB vs. Air Flow
Meters per Second
0
Multi-Layer PCB, JEDEC Standard Test Boards
0.472°C/W
NOTE: JB is independent of airflow.
Transistor Count
The 8V97053L transistor count is: 404,777
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8V97053L Datasheet
32-Lead VFQFN Package Outline and Package Dimensions
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8V97053L Datasheet
32-Lead VFQFN Package Outline and Package Dimensions (Continued)
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8V97053L Datasheet
Ordering Information
Table 18. Ordering Information
Part/Order Number
8V97053LNLGI
Marking
Package
Shipping Packaging
Tray
Temperature
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
IDT8V97053LNLGI
IDT8V97053LNLGI
IDT8V97053LNLGI
32-lead VFQFN, Lead Free
32-lead VFQFN, Lead Free
32-lead VFQFN, Lead Free
8V97053LNLGI8
8V97053LNLGI/W
Tape & Reel
Tape & Reel
Table 19. Pin 1 Orientation in Tape and Reel Packaging
Part Number Suffix
Pin 1 Orientation
Illustration
CARRIER TAPE TOPSIDE
(Round Sprocket Holes)
Correct Pin 1 ORIENTATION
NLGI8
Quadrant 1 (EIA-481-C)
USER DIRECTION OF FEED
Correct Pin 1 ORIENTATION
CARRIER TAPE TOPSIDE
(Round Sprocket Holes)
NLGI/W
Quadrant 2 (EIA-481-D)
USER DIRECTION OF FEED
©2016 Integrated Device Technology, Inc.
66
August 18, 2016
8V97053L Datasheet
Revision History
Revision Date
Description of Change
This is the first release of the 8V97053L Datasheet.
August 18, 2016
©2016 Integrated Device Technology, Inc.
67
August 18, 2016
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