8312I_15

更新时间:2024-09-18 22:17:47
品牌:IDT
描述:Low Skew, 1-to-12 LVCMOS/LVTTL Fanout Buffer

8312I_15 概述

Low Skew, 1-to-12 LVCMOS/LVTTL Fanout Buffer

8312I_15 数据手册

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Low Skew, 1-to-12 LVCMOS/LVTTL  
Fanout Buffer  
8312I  
Datasheet  
General Description  
Features  
The 8312I is a low skew, 1-to-12 LVCMOS/ LVTTL Fanout Buffer  
and a member of the family of High Performance Clock Solutions  
from IDT. The 8312I single-ended clock input accepts LVCMOS or  
LVTTL input levels. The low impedance LVCMOS outputs are  
designed to drive 50series or parallel terminated transmission  
lines. The effective fanout can be increased from 12 to 24 by  
utilizing the ability of the outputs to drive two series terminated  
lines.  
Twelve LVCMOS/LVTTL outputs  
CLK input supports the following input types: LVCMOS, LVTTL  
Maximum output frequency: 250MHz  
Output skew: 160ps (maximum)  
Supply modes:  
Core/Output  
3.3V/3.3V  
3.3V/2.5V  
The 8312I is characterized at full 3.3V, 2.5V, and 1.8V, mixed  
3.3V/2.5V, 3.3V/1.8V and 2.5V/1.8V output operating supply  
modes. Guaranteed output and part-to-part skew characteristics  
along with the 1.8V output capabilities makes the 8312I ideal for  
high performance, single ended applications that also require a  
limited output voltage.  
3.3V/1.8V  
2.5V/2.5V  
2.5V/1.8V  
1.8V/1.8V  
-40°C to 85°C ambient operating temperature  
Available in lead-free (RoHS 6) package  
Block Diagram  
Pin Assignment  
Pullup  
CLK_EN  
D
32 31 30 29 28 27 26 25  
Q
1
2
3
4
5
6
7
8
GND  
Q4  
24  
23  
22  
21  
20  
LE  
VDD  
VDDO  
Q5  
CLK_EN  
12  
Pulldown  
Q[0:11]  
CLK  
OE  
GND  
Q6  
CLK  
GND  
OE  
VDD  
VDDO  
Q7  
19  
18  
17  
Pullup  
GND  
GND  
9
10 11 12 13 14 15 16  
8312I  
32-Lead LQFP  
7mm x 7mm x 1.4mm package body  
Y Package  
Top View  
©2015 Integrated Device Technology, Inc  
1
December 14, 2015  
8312I Datasheet  
Table 1. Pin Descriptions  
Number  
Name  
GND  
VDD  
Type  
Description  
1, 5, 8, 12, 16,  
17, 21, 25, 29  
Power  
Power  
Input  
Input  
Input  
Power supply ground.  
2, 7  
Positive supply pins.  
Synchronous control for enabling and disabling clock outputs.  
LVCMOS / LVTTL interface levels.  
3
CLK_EN  
CLK  
Pullup  
4
Pulldown Single-ended clock input. LVCMOS/LVTTL interface levels.  
Output enable. Controls enabling and disabling of outputs Q[0:11].  
LVCMOS / LVTTL interface levels.  
6
OE  
Pullup  
9, 11, 13, 15,  
18, 20, 22, 24,  
26, 28, 30, 32  
Q11, Q10, Q9, Q8,  
Q7, Q6, Q5, Q4,  
Q3, Q2, Q1, Q0  
Output  
Power  
Single-ended clock outputs. LVCMOS/LVTTL interface levels.  
Output supply pins.  
10, 14, 19, 23,  
27, 31  
VDDO  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
Table 2. Pin Characteristics  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum  
Typical  
Maximum  
Units  
pF  
k  
k  
pF  
pF  
pF  
Input Capacitance  
Input Pullup Resistor  
4
RPULLUP  
51  
51  
RPULLDOWN Input Pulldown Resistor  
VDDO = 3.465V  
VDDO = 2.625V  
19  
18  
16  
Power Dissipation Capacitance  
(per output); NOTE 1  
CPD  
VDDO = 2.V  
VDDO = 3.3V 5ꢀ  
VDDO = 2.5V 5ꢀ  
VDDO = 1.8V 0.2V  
7
7
ROUT  
Output Impedance  
10  
©2015 Integrated Device Technology, Inc  
2
December 14, 2015  
8312I Datasheet  
Function Tables  
Table 3A. Output Enable and Clock Enable Function Table  
Inputs  
Outputs  
Q [0:11]  
OE  
0
CLK_EN  
X
0
1
Hi-Z  
1
LOW  
1
Follows CLK input  
Table 3B. Output Enable and Clock Enable Function Table  
Inputs  
Outputs  
Q [0:11]  
LOW  
OE  
1
CLK_EN  
CLK  
1
1
0
1
1
HIGH  
©2015 Integrated Device Technology, Inc  
3
December 14, 2015  
8312I Datasheet  
Absolute Maximum Ratings  
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for  
extended periods may affect product reliability.  
Item  
Rating  
Supply Voltage, VDD  
Inputs, VI  
4.6V  
-0.5V to VDD + 0.5V  
-0.5V to VDDO + 0.5V  
47.9C/W (0 lfpm)  
-65C to 150C  
Outputs, VO  
Package Thermal Impedance, JA  
Storage Temperature, TSTG  
DC Electrical Characteristics  
Table 4A. Power Supply DC Characteristics, VDD = VDDO = 3.3V 5ꢀ, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
3.465  
10  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
3.135  
3.3  
V
mA  
mA  
IDDO  
10  
Table 4B. Power Supply DC Characteristics, VDD = VDDO = 2.5V 5ꢀ, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
2.5  
Maximum  
2.625  
2.625  
10  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
2.375  
2.5  
V
mA  
mA  
IDDO  
10  
Table 4C. Power Supply DC Characteristics, VDD = VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
1.6  
Typical  
1.8  
Maximum  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
2.0  
2.0  
10  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
1.6  
1.8  
V
mA  
mA  
IDDO  
10  
©2015 Integrated Device Technology, Inc  
4
December 14, 2015  
8312I Datasheet  
Table 4D. Power Supply DC Characteristics, VDD = 3.3V 5ꢀ, VDDO = 2.5V 5ꢀ, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
3.465  
2.625  
10  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
2.375  
2.5  
V
mA  
mA  
IDDO  
10  
Table 4E. Power Supply DC Characteristics, VDD = 3.3V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum  
3.465  
2.0  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
1.6  
1.8  
V
10  
mA  
mA  
IDDO  
10  
Table 4F. Power Supply DC Characteristics, VDD = 2.5V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Symbol Parameter  
Test Conditions  
Minimum  
2.375  
Typical  
2.5  
Maximum  
2.625  
2.0  
Units  
V
VDD  
VDDO  
IDD  
Positive Supply Voltage  
Output Supply Voltage  
Power Supply Current  
Output Supply Current  
1.6  
1.8  
V
10  
mA  
mA  
IDDO  
10  
©2015 Integrated Device Technology, Inc  
5
December 14, 2015  
8312I Datasheet  
Table 4G. LVCMOS/LVTTL DC Characteristics, TA = -40°C to 85°C  
Symbol Parameter Test Conditions  
DD = 3.465V  
VDD = 2.625V  
DD = 2.0V  
VDD = 3.465V  
DD = 2.625V  
Minimum  
2
Typical  
Maximum  
VDD + 0.3  
VDD + 0.3  
VDD + 0.3  
1.3  
Units  
V
V
V
V
V
V
V
VIH  
Input High Voltage  
1.7  
V
0.65*VDD  
-0.3  
VIL  
Input Low Voltage  
V
-0.3  
0.7  
VDD = 2.0V  
-0.3  
0.35*VDD  
VDD = VIN = 3.465V or  
2.625V or 2.0V  
CLK  
150  
5
µA  
µA  
µA  
µA  
Input  
High Current  
IIH  
VDD = VIN = 3.465V or  
2.625V or 2.0V  
OE, CLK_EN  
CLK  
V
DD = 3.465V or 2.625V or 2.0V,  
-5  
VIN = 0V  
Input  
Low Current  
IIL  
VDD = 3.465V or 2.625V or 2.0V,  
VIN = 0V  
OE, CLK_EN  
-150  
VDDO = 3.3V 5ꢀ  
VDDO = 2.5V 5ꢀ;  
2.6  
1.8  
V
V
V
V
V
V
V
V
V
V
VOH  
Output High Voltage; NOTE 1  
V
DDO = 2.5V 5ꢀ; IOH = -1mA  
2
VDDO = 1.8V 0.2V  
VDD – 0.3  
VDD – 0.2  
VDDO = 1.8V 0.2V; IOH = -100µA  
VDDO = 3.3V 5ꢀ  
0.5  
0.45  
0.4  
VDDO = 2.5V 5ꢀ;  
VOL  
Output Low Voltage; NOTE 1  
VDDO = 2.5V 5ꢀ; IOL = 1mA  
VDDO = 1.8V 0.2V  
0.35  
0.2  
VDDO = 1.8V 0.2V; IOL = 100µA  
NOTE 1: Outputs terminated with 50to VDDO/2. See Parameter Measurement Information, Output Load Test Circuit diagrams.  
©2015 Integrated Device Technology, Inc  
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December 14, 2015  
8312I Datasheet  
AC Electrical Characteristics  
Table 5A. AC Characteristics, VDD = VDDO = 3.3V 5ꢀ, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
250  
2.7  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 250MHz  
1.2  
2.0  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.037  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
150  
850  
800  
55  
ps  
ps  
ps  
20ꢀ to 80ꢀ  
175  
45  
ƒ 150MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
Table 5B. AC Characteristics, VDD = VDDO = 2.5V 5ꢀ, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
250  
3.5  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 250MHz  
1.25  
2.4  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.022  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
155  
1.1  
800  
55  
ps  
ns  
ps  
20ꢀ to 80ꢀ  
200  
45  
ƒ 150MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
©2015 Integrated Device Technology, Inc  
7
December 14, 2015  
8312I Datasheet  
Table 5C. AC Characteristics, VDD = VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
200  
4.9  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 200MHz  
1.6  
3.3  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.172  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
160  
2.4  
875  
55  
ps  
ns  
ps  
20ꢀ to 80ꢀ  
175  
45  
ƒ 100MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
Table 5D. AC Characteristics, VDD = 3.3V 5ꢀ, VDDO = 2.5V 5ꢀ, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
250  
2.8  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 250MHz  
1.5  
2.1  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.045  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
150  
1
ps  
ns  
ps  
20ꢀ to 80ꢀ  
200  
45  
800  
55  
ƒ 150MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
©2015 Integrated Device Technology, Inc  
8
December 14, 2015  
8312I Datasheet  
Table 5E. AC Characteristics, VDD = 3.3V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
200  
3.5  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 200MHz  
1.5  
2.5  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.136  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
150  
1.4  
800  
55  
ps  
ns  
ps  
20ꢀ to 80ꢀ  
200  
45  
ƒ 100MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
Table 5F. AC Characteristics, VDD = 2.5V 5ꢀ, VDDO = 1.8V 0.2V, TA = -40°C to 85°C  
Parameter Symbol  
Test Conditions  
Minimum Typical Maximum Units  
fMAX  
tpLH  
Output Frequency  
200  
3.9  
MHz  
ns  
Propagation Delay, Low to High; NOTE 1  
ƒ 200MHz  
1.4  
2.7  
Buffer Additive Phase Jitter, RMS; refer to  
Additive Phase Jitter Section  
100MHz, Integration Range:  
12kHz – 20MHz  
tjit  
0.114  
ps  
tsk(o)  
tsk(pp)  
tR / tF  
odc  
Output Skew; NOTE 2, 5  
Part-to-Part Skew; NOTE 3, 5  
Output Rise/Fall Time; NOTE 5  
Output Duty Cycle  
160  
1.6  
800  
55  
ps  
ns  
ps  
20ꢀ to 80ꢀ  
200  
45  
ƒ 100MHz  
All parameters measured at fMAX unless noted otherwise.  
NOTE 1: Measured from the VDD/2 of the input to VDDO/2 of the output.  
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDO/2.  
NOTE 3: Defined as skew between outputs on different devices operating a the same supply voltage and with equal load conditions.  
Using the same type of input on each device, the output is measured at VDDO/2.  
NOTE 4: These parameters are guaranteed by characterization. Not tested in production.  
NOTE 5: This parameter is defined in accordance with JEDEC Standard 65.  
©2015 Integrated Device Technology, Inc  
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December 14, 2015  
8312I Datasheet  
Additive Phase Jitter  
The spectral purity in a band at a specific offset from the  
to the power in the fundamental. When the required offset is  
fundamental compared to the power of the fundamental is called  
the dBc Phase Noise. This value is normally expressed using a  
Phase noise plot and is most often the specified plot in many  
applications. Phase noise is defined as the ratio of the noise power  
present in a 1Hz band at a specified offset from the fundamental  
frequency to the power value of the fundamental. This ratio is  
expressed in decibels (dBm) or a ratio of the power in the 1Hz band  
specified, the phase noise is called a dBc value, which simply  
means dBm at a specified offset from the fundamental. By  
investigating jitter in the frequency domain, we get a better  
understanding of its effects on the desired application over the  
entire time record of the signal. It is mathematically possible to  
calculate an expected bit error rate given a phase noise plot.  
Additive Phase Jitter, 3.3V @ 100MHz  
12kHz to 20MHz = 0.037ps (typical)  
Offset from Carrier Frequency (Hz)  
As with most timing specifications, phase noise measurements  
has issues relating to the limitations of the equipment. Often the  
noise floor of the equipment is higher than the noise floor of the  
device. This is illustrated above. The device meets the noise floor  
of what is shown, but can actually be lower. The phase noise is  
dependent on the input source and measurement equipment.  
©2015 Integrated Device Technology, Inc  
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December 14, 2015  
8312I Datasheet  
Parameter Measurement Information  
1.25V 5ꢀ  
1.65V 5ꢀ  
V
DD,  
V
DD,  
V
DDO  
V
DDO  
-1.25V 5ꢀ  
-1.65V 5ꢀ  
3.3V Core/3.3V LVCMOS Output Load AC Test Circuit  
2.5V Core/2.5V LVCMOS Output Load AC Test Circuit  
2.05V 5ꢀ  
1.25V 5ꢀ  
0.9V 0.1V  
SCOPE  
V
DD  
V
DD,  
V
DDO  
V
DDO  
Qx  
LVCMOS  
GND  
VDDO  
2
-1.25V 5ꢀ  
-0.9V 0.1V  
1.8V Core/1.8V LVCMOS Output Load AC Test Circuit  
3.3V Core/2.5V LVCMOS Output Load AC Test Circuit  
1.6V 5ꢀ  
2.4V 0.9V  
0.9V 0.1V  
0.9V 0.1V  
SCOPE  
SCOPE  
V
V
DD  
DD  
V
V
DDO  
DDO  
Qx  
Qx  
LVCMOS  
LVCMOS  
GND  
GND  
VDDO  
2
VDDO  
2
-0.9V 0.1V  
-0.9V 0.1V  
3.3V Core/1.8V LVCMOS Output Load AC Test Circuit  
2.5V Core/1.8V LVCMOS Output Load AC Test Circuit  
©2015 Integrated Device Technology, Inc  
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December 14, 2015  
8312I Datasheet  
Parameter Measurement Information, continued  
Part 1  
Part 2  
VDDO  
VDDO  
2
Qx  
Qy  
2
Qx  
Qy  
VDDO  
2
VDDO  
2
tsk(o)  
tsk(pp)  
Output Skew  
Part-to-Part Skew  
VDDO  
2
VDDO  
VDDO  
2
2
Q0:Q11  
VDD  
2
VDD  
2
tPW  
CLK  
tPERIOD  
VDDO  
2
VDDO  
2
tPW  
tPERIOD  
Q0:Q11  
odc =  
tpLH  
tpHL  
Propagation Delay  
Output Duty Cycle/Pulse Width/Period  
80ꢀ  
tF  
80ꢀ  
tR  
20ꢀ  
20ꢀ  
Q0:Q11  
Output Rise/Fall Time  
©2015 Integrated Device Technology, Inc  
12  
December 14, 2015  
8312I Datasheet  
Application Information  
Recommendations for Unused Input and Output Pins  
Inputs:  
Outputs:  
LVCMOS Control Pins:  
LVCMOS Outputs:  
All control pins have internal pull-ups or pull-downs; additional  
resistance is not required but can be added for additional  
protection. A 1kresistor can be used.  
All unused LVCMOS output can be left floating. There should be  
no trace attached.  
©2015 Integrated Device Technology, Inc  
13  
December 14, 2015  
8312I Datasheet  
Reliability Information  
Table 6. JA vs. Air Flow Table for a 32 Lead LQFP  
JA vs. Air Flow  
Linear Feet per Minute  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
55.9°C/W  
42.1°C/W  
50.1°C/W  
39.4°C/W  
NOTE: Most modern PCB design use multi-layered boards. The data in the second row pertains to most designs.  
Transistor Count  
The transistor count for 8312I is: 339  
©2015 Integrated Device Technology, Inc  
14  
December 14, 2015  
8312I Datasheet  
Package Outline and Package Dimensions  
Package Outline - Y Suffix for 32 Lead LQFP  
Table 7. Package Dimensions for 32 Lead LQFP  
JEDEC Variation: ABC - HD  
All Dimensions in Millimeters  
Symbol  
Minimum  
Nominal  
Maximum  
N
32  
A
1.60  
0.15  
1.45  
0.45  
0.20  
A1  
0.05  
1.35  
0.30  
0.09  
0.10  
1.40  
0.37  
A2  
b
c
D & E  
D1 & E1  
9.00 Basic  
7.00 Basic  
5.60 Ref.  
0.80 Basic  
0.60  
D2 & E2  
e
L
0.45  
0°  
0.75  
7°  
ccc  
N
0.10  
32  
Reference Document: JEDEC Publication 95, MS-026  
©2015 Integrated Device Technology, Inc  
15  
December 14, 2015  
8312I Datasheet  
Ordering Information  
Table 8. Ordering Information  
Part/Order Number  
8312AYILF  
8312AYILFT  
Marking  
ICS8312AYILF  
ICS8312AYILF  
Package  
“Lead-Free” 32 Lead LQFP  
“Lead-Free” 32 Lead LQFP  
Shipping Packaging  
Tray  
1000 Tape & Reel  
Temperature  
-40C to 85C  
-40C to 85C  
©2015 Integrated Device Technology, Inc  
16  
December 14, 2015  
8312I Datasheet  
Revision History Sheet  
Rev  
Table  
Page  
Description of Change  
Date  
1
9
12  
Features section - added lead-free bullet.  
Added Recommendations for Unused Input & Output Pins section.  
Ordering Information Table - added Lead-Free part number, marking and note.  
A
6/28/06  
T8  
T5A - T5F  
7 - 9  
10  
Added Additive Phase Jitter specs to AC Tables.  
Added Additive Phase Jitter Plot.  
B
B
B
6/6/08  
11/4/14  
12/14/15  
Updated datasheet to new format.  
1
16  
Updated Datasheet format  
Ordering Information - removed leaded devices - PDN CQ-13-02 expired.  
8
1
16  
Removed HiPerClockS from the description section.  
Removed LF note below the Ordering information table.  
Updated datasheet header and footer.  
©2015 Integrated Device Technology, Inc  
17  
December 14, 2015  
8312I Datasheet  
Corporate Headquarters  
6024 Silver Creek Valley Road  
San Jose, CA 95138 USA  
www.IDT.com  
Sales  
Tech Support  
www.idt.com/go/support  
1-800-345-7015 or 408-284-8200  
Fax: 408-284-2775  
www.IDT.com/go/sales  
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications  
and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein  
is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability,  
or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.  
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably  
expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.  
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of  
IDT or their respective third party owners.  
For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary.  
Copyright ©2015 Integrated Device Technology, Inc. All rights reserved.  

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