74FCT163543CPA [IDT]

TSSOP-56, Tube;
74FCT163543CPA
型号: 74FCT163543CPA
厂家: INTEGRATED DEVICE TECHNOLOGY    INTEGRATED DEVICE TECHNOLOGY
描述:

TSSOP-56, Tube

光电二极管 逻辑集成电路
文件: 总7页 (文件大小:86K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
3.3V CMOS 16-BIT  
LATCHED TRANSCEIVER  
IDT74FCT163543A/C  
DESCRIPTION:  
FEATURES:  
The FCT163543 16-bit latched transceivers are built using advanced  
dual metal CMOS technology. These high-speed, low-power devices are  
organized as two independent 8-bit D-type latched transceivers with  
separateinputandoutputcontroltopermitindependentcontrolofdataflow  
in either direction. For example, the A-to-B Enable (xCEAB) must be low  
inordertoenterdatafromtheAportortooutputdatafromtheBport. xLEAB  
controlsthelatchfunction. WhenxLEABislow,thelatchesaretransparent.  
A subsequent low-to-high transition of xLEAB signal puts the A latches in  
the storage mode. xOEAB performs output enable function on the B port.  
Data flow from the B port to the A port is similar but requires using xCEBA,  
xLEBA, and xOEBA inputs. Flow-through organization of signal pins  
simplifieslayout.Allinputsaredesignedwithhysteresisforimprovednoise  
margin.  
• 0.5 MICRON CMOS Technology  
• Typical tSK(o) (Output Skew) < 250ps  
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using  
machine model (C = 200pF, R = 0)  
• VCC = 3.3V ± 0.3V, Normal Range, or VCC = 2.7V to 3.6V, Extended  
Range  
• CMOS power levels (0.4µ W typ. static)  
• Rail-to-rail output swing for increased noise margin  
• Low Ground Bounce (0.3V typ.)  
• Inputs (except I/O) can be driven by 3.3V or 5V components  
• Available in SSOP and TSSOP packages  
TheFCT163543haveseriescurrentlimitingresistors. Theseofferlow  
ground bounce, minimal undershoot, and controlled output fall times–  
reducing the need for external series terminating resistors.  
FUNCTIONALBLOCKDIAGRAM  
29  
56  
2OEBA  
1OEBA  
31  
54  
2CEBA  
1CEBA  
55  
30  
28  
2LEBA  
2OEAB  
1LEBA  
1
1OEAB  
26  
27  
3
2CEAB  
2LEAB  
1CEAB  
2
1LEAB  
C
D
C
5
2A1  
1A1  
52  
42  
2B1  
1B1  
D
C
D
C
D
TO SEVEN OTHER CHANNELS  
TO SEVEN OTHER CHANNELS  
TheIDTlogoisaregisteredtrademarkofIntegratedDeviceTechnology,Inc.  
INDUSTRIAL TEMPERATURE RANGE  
MAY 2002  
1
© 2002 Integrated Device Technology, Inc.  
DSC-3250/5  
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
ABSOLUTEMAXIMUMRATINGS(1)  
PINCONFIGURATION  
Symbol  
Description  
Max  
Unit  
V
1
2
56  
55  
54  
53  
52  
1OEAB  
1OEBA  
1LEBA  
(2)  
(3)  
(4)  
VTERM  
VTERM  
VTERM  
TSTG  
Terminal Voltage with Respect to GND  
Terminal Voltage with Respect to GND  
–0.5 to +4.6  
–0.5 to 7  
1LEAB  
1CEAB  
V
3
Terminal Voltage with Respect to GND –0.5 to VCC+0.5  
V
1CEBA  
GND  
Storage Temperature  
DC Output Current  
–65 to +150  
–60 to +60  
°C  
mA  
GND  
4
5
6
IOUT  
1A1  
1A2  
VCC  
1A3  
1B1  
1B2  
VCC  
1B3  
NOTES:  
51  
50  
49  
48  
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause  
permanent damage to the device. This is a stress rating only and functional operation  
of the device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect reliability.  
2. Vcc terminals.  
7
8
9
1A4  
1A5  
1B4  
1B5  
3. Input terminals.  
4. Outputs and I/O terminals.  
10  
47  
46  
45  
44  
11  
12  
13  
14  
15  
16  
17  
18  
GND  
1A6  
GND  
1B6  
1A7  
1A8  
2A1  
2A2  
2A3  
1B7  
1B8  
CAPACITANCE (TA = +25°C, F = 1.0MHz)  
43  
42  
Symbol  
Parameter(1)  
Input Capacitance  
Output Capacitance  
Conditions  
Typ.  
Max. Unit  
2B1  
2B2  
2B3  
CIN  
VIN = 0V  
3.5  
6
8
pF  
pF  
41  
COUT  
VOUT = 0V  
3.5  
40  
39  
38  
NOTE:  
1. This parameter is measured at characterization but not tested.  
GND  
GND  
19  
20  
21  
22  
23  
2A4  
2A5  
2A6  
VCC  
2A7  
2A8  
2B4  
2B5  
2B6  
VCC  
2B7  
2B8  
37  
36  
35  
34  
33  
32  
31  
30  
29  
FUNCTIONTABLE(1, 3)  
24  
FOR A-TO-B(SYMMETRIC WITH B-TO-A)  
GND  
25  
26  
27  
GND  
Latch  
Output  
Buffers  
xBx  
Inputs  
Status  
xAx to xBx  
Storing  
2CEBA  
2LEBA  
2CEAB  
2LEAB  
2OEAB  
xCEAB  
xLEAB  
xOEAB  
H
X
L
L
L
L
X
H
L
X
X
L
Z
28  
2OEBA  
Storing  
X
Transparent  
Storing  
Current A Inputs  
Previous(2) A Inputs  
SSOP/ TSSOP  
TOP VIEW  
H
L
L
H
H
Transparent  
Storing  
Z
Z
H
PINDESCRIPTION  
NOTES:  
1. A-to-B data flow shown; B-to-A flow control is the same, except using xCEBA, xLEBA  
and xOEBA.  
Pin Names  
Description  
xOEAB  
xOEBA  
xCEAB  
xCEBA  
xLEAB  
xLEBA  
xAx  
A-to-BOutputEnableInput(ActiveLOW)  
B-to-AOutputEnableInput(ActiveLOW)  
A-to-B Enable Input (Active LOW)  
2. Before xLEAB LOW-to-HIGH Transition  
3. H = HIGH Voltage Level  
L = LOW Voltage Level  
X = Don’t Care  
B-to-A Enable Input (Active LOW)  
Z = High-Impedance  
A-to-BLatchEnableInput(ActiveLOW)  
B-to-ALatchEnableInput(ActiveLOW)  
A-to-BDataInputsorB-to-A3-StateOutputs  
B-to-ADataInputsorA-to-B3-StateOutputs  
xBx  
2
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
DCELECTRICALCHARACTERISTICSOVEROPERATINGRANGE  
FollowingConditionsApplyUnlessOtherwiseSpecified:  
Industrial: TA = –40°C to +85°C, VCC = 2.7V to 3.6V  
Symbol  
Parameter  
Test Conditions(1)  
Min.  
2
Typ.(2)  
Max.  
5.5  
Unit  
VIH  
Input HIGH Level (Input pins)  
Input HIGH Level (I/O pins)  
Guaranteed Logic HIGH Level  
V
2
VCC+0.5  
0.8  
VIL  
IIH  
Input LOW Level (Input and I/O pins) Guaranteed Logic LOW Level  
–0.5  
V
Input HIGH Current (Input pins)  
Input HIGH Current (I/O pins)  
Input LOW Current (Input pins)  
Input LOW Current (I/O pins)  
High Impedance Output Current  
(3-State Output pins)  
VCC = Max.  
VI = 5.5V  
VI = VCC  
±1  
±1  
µA  
IIL  
VI = GND  
VI = GND  
VO = VCC  
VO = GND  
±1  
±1  
IOZH  
IOZL  
VIK  
VCC = Max.  
±1  
µA  
±1  
Clamp Diode Voltage  
VCC = Min., IIN = –18mA  
–0.7  
–60  
–1.2  
–110  
V
IODH  
Output HIGH Current  
VCC = 3.3V, VIN = VIH or VIL, VO = 1.5V(3)  
VCC = 3.3V, VIN = VIH or VIL, VO = 1.5V(3)  
–36  
mA  
mA  
IODL  
VOH  
Output LOW Current  
Output HIGH Voltage  
50  
VCC-0.2  
2.4  
90  
3
200  
VCC = Min.  
IOH = –0.1mA  
VIN = VIH or VIL  
VCC = 3V  
IOH = –3mA  
IOH = –8mA  
V
2.4(5)  
3
VIN = VIH or VIL  
VCC = Min.  
VOL  
OutputLOWVoltage  
IOL = 0.1mA  
IOL = 16mA  
IOL = 24mA  
IOL = 24mA  
0.2  
0.3  
0.3  
0.2  
0.4  
VIN = VIH or VIL  
0.55  
0.5  
V
VCC = 3V  
VIN = VIH or VIL  
IOS  
VH  
Short Circuit Current(4)  
VCC = Max., VO = GND(3)  
–60  
–135  
–240  
mA  
Input Hysteresis  
150  
0.1  
10  
mV  
µA  
ICCL  
ICCH  
ICCZ  
Quiescent Power Supply Current  
VCC = Max.  
VIN = GND or VCC  
NOTES:  
1. For conditions shown as Min. or Max., use appropriate value specified under Electrical Characteristics for the applicable device type.  
2. Typical values are at VCC = 3.3V, +25°C ambient.  
3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.  
4. This parameter is guaranteed but not tested.  
5. VOH = VCC–0.6V at rated current.  
3
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
POWERSUPPLYCHARACTERISTICS  
Symbol  
Parameter  
Test Conditions(1)  
Min.  
Typ.(2)  
Max.  
Unit  
ICC  
Quiescent Power Supply  
Current TTL Inputs HIGH  
VCC = Max.  
2
30  
µA  
VIN = VCC –0.6V(3)  
ICCD  
Dynamic Power Supply Current(4)  
VCC = Max., Outputs Open  
xCEAB and xOEAB = GND  
xCEBA = VCC  
VIN = VCC  
VIN = GND  
60  
100  
µA/  
MHz  
OneInputToggling  
50% Duty Cycle  
IC  
TotalPowerSupplyCurrent(6)  
VCC = Max., Outputs Open  
fi = 10MHz  
50% Duty Cycle  
xLEAB, xCEAB and  
xOEAB= GND  
VIN = VCC  
VIN = GND  
0.6  
0.6  
2.4  
2.4  
1
1
mA  
VIN = VCC –0.6V  
VIN = GND  
xCEBA = VCC  
OneBitToggling  
VCC = Max., Outputs Open  
fi = 2.5MHz  
50% Duty Cycle  
xLEAB, xCEAB and  
xOEAB= GND  
VIN = VCC  
VIN = GND  
4(5)  
VIN = VCC –0.6V  
VIN = GND  
4.3(5)  
xCEBA = VCC  
Sixteen BitsToggling  
NOTES:  
1. For conditions shown as max. or min., use appropriate value specified under Electrical Characteristics for the applicable device type.  
2. Typical values are at VCC = 3.3V, +25°C ambient.  
3. Per TTL driven input; all other inputs at VCC or GND.  
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.  
5. Values for these conditions are examples of the ICC formula. These limits are guaranteed but not tested.  
6. IC = IQUIESCENT + IINPUTS + IDYNAMIC  
IC = ICC + DICC DHNT + ICCD (fCPNCP/2 + fiNi)  
ICC = Quiescent Current (ICCL, ICCH and ICCZ)  
ICC = Power Supply Current for a TTL High Input  
DH = Duty Cycle for TTL Inputs High  
NT = Number of TTL Inputs at DH  
ICCD = Dynamic Current Caused by an Input Transition Pair (HLH or LHL)  
fCP = Clock Frequency for Register Devices (Zero for Non-Register Devices)  
NCP = Number of Clock Inputs at fCP  
fi = Input Frequency  
Ni = Number of Inputs at fi  
4
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
SWITCHINGCHARACTERISTICSOVEROPERATINGRANGE(1)  
FCT163543A  
FCT163543C  
Symbol Parameter  
Condition(2)  
CL = 50pF  
RL = 500Ω  
Min.(3)  
Max.  
Min.(3)  
Max.  
Unit  
tPLH  
tPHL  
PropagationDelay  
1.5  
6.5  
1.5  
5.3  
ns  
TransparentMode  
xAx to xBx or xBx to xAx  
PropagationDelay  
tPLH  
tPHL  
tPZH  
tPZL  
1.5  
1.5  
8
9
1.5  
1.5  
7
8
ns  
ns  
xLEBA to xAx, xLEAB to xBx  
OutputEnableTime  
xOEBA or xOEAB xAx or xBx  
xCEBA or xCEAB xAx or xBx  
OutputDisableTime  
tPHZ  
tPLZ  
1.5  
7.5  
1.5  
6.5  
ns  
xOEBA or xOEAB xAx or xBx  
xCEBA or xCEAB xAx or xBx  
Set-up Time HIGH or LOW  
xAx or xBx to xLEAB or xLEBA  
Hold Time HIGH or LOW  
xAx or xBx to xLEAB or xLEBA  
xLEBA or xLEAB Pulse Width LOW  
OutputSkew(4)  
tSU  
tH  
2
2
2
2
ns  
ns  
tW  
5
5
ns  
ns  
tSK(o)  
0.5  
0.5  
NOTES:  
1. Propagation Delays and Enable/Disable times are with VCC = 3.3V ±0.3V, Normal Range. For VCC = 2.7V to 3.6V, Extended Range, all Propagation Delays and Enable/Disable  
times should be degraded by 20%.  
2. See test circuit and waveforms.  
3. Minimum limits are guaranteed but not tested on Propagation Delays.  
4. Skew between any two outputs, of the same package, switching in the same direction. This parameter is guaranteed by design.  
5
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
TESTCIRCUITSANDWAVEFORMS  
SWITCHPOSITION  
6v  
Test  
Switch  
6V  
VCC  
Open  
Open Drain  
Disable Low  
Enable Low  
GND  
500Ω  
VOUT  
VIN  
Disable High  
Enable High  
GND  
Open  
Pulse  
Generator  
D.U.T.  
50pF  
All Other Tests  
500Ω  
T
R
L
C
DEFINITIONS:  
CL = Load capacitance: includes jig and probe capacitance.  
RT = Termination resistance: should be equal to ZOUT of the Pulse Generator.  
Test Circuits for All Outputs  
3V  
DATA  
1.5V  
INPUT  
0V  
LOW-HIGH-LOW  
tH  
tSU  
1.5V  
PULSE  
3V  
1.5V  
0V  
TIMING  
INPUT  
tW  
ASYNCHRONOUS CONTROL  
tREM  
PRESET  
CLEAR  
ETC.  
3V  
1.5V  
0V  
HIGH-LOW-HIGH  
PULSE  
1.5V  
SYNCHRONOUS CONTROL  
PRESET  
3V  
1.5V  
0V  
CLEAR  
tSU  
tH  
CLOCK ENABLE  
ETC.  
Pulse Width  
Set-up, Hold, and Release Times  
ENABLE  
DISABLE  
3V  
1.5V  
0V  
3V  
SAME PHASE  
CONTROL  
INPUT  
1.5V  
0V  
INPUT TRANSITION  
tPLH  
tPLH  
tPHL  
tPHL  
tPZL  
tPLZ  
VOH  
1.5V  
VOL  
OUTPUT  
3V  
1.5V  
3V  
OUTPUT  
NORMALLY  
LOW  
SWITCH  
6V  
0.3V  
0.3V  
VOL  
VOH  
3V  
1.5V  
0V  
tPZH  
tPHZ  
OPPOSITE PHASE  
INPUT TRANSITION  
OUTPUT  
NORMALLY  
HIGH  
SWITCH  
GND  
1.5V  
0V  
0V  
Propagation Delay  
Enable and Disable Times  
NOTES:  
1. Diagram shown for input Control Enable-LOW and input Control Disable-HIGH.  
2. Pulse Generator for All Pulses: Rate 1.0MHz; tF 2.5ns; tR 2.5ns.  
3. if VCC is below 3V, input voltage swings should be adjusted not to exceed VCC.  
6
IDT74FCT163543A/C  
3.3VCMOS16-BITLATCHEDTRANSCEIVER  
INDUSTRIALTEMPERATURERANGE  
ORDERINGINFORMATION  
IDT  
XX  
FCT  
XXX  
XXXX  
X
Device Type  
Temp. Range  
Family  
Package  
PV  
PA  
Shrink Small Outline Package  
Thin Shrink Small Outline Package  
543A  
543C  
16-Bit Latched Transceiver  
Double-Density 3.3Volt  
163  
74  
40°C to +85°C  
DATASHEETDOCUMENTHISTORY  
4/22/2002 Removed blank speed grade  
5/21/2002 Removed TVSOP package  
CORPORATE HEADQUARTERS  
2975StenderWay  
Santa Clara, CA 95054  
for SALES:  
800-345-7015 or 408-727-6116  
fax: 408-492-8674  
for Tech Support:  
logichelp@idt.com  
(408) 654-6459  
www.idt.com  
7

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