ICS84330BVT [ICSI]

700MHZ, LOW JITTER, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER; 700MHZ ,低抖动,水晶- TO- 3.3V的差分LVPECL频率合成器
ICS84330BVT
型号: ICS84330BVT
厂家: INTEGRATED CIRCUIT SOLUTION INC    INTEGRATED CIRCUIT SOLUTION INC
描述:

700MHZ, LOW JITTER, CRYSTAL-TO-3.3V DIFFERENTIAL LVPECL FREQUENCY SYNTHESIZER
700MHZ ,低抖动,水晶- TO- 3.3V的差分LVPECL频率合成器

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ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH , LOW JITTER, CRYSTAL-TO-3.3V  
Z
D
IFFERENTIAL LVPECL FREQUENCY  
SYNTHESIZER  
GENERAL DESCRIPTION  
FEATURES  
The ICS84330 is a general purpose, single output Fully integrated PLL, no external loop filter requirements  
ICS  
high frequency synthesizer and a member of the  
HiPerClockSfamily of High Performance Clock  
Crystal oscillator interface: 10MHz to 25MHz  
Solutions from ICS. The VCO operates at a fre-  
1 differential 3.3V LVPECL output  
HiPerClockS™  
Output frequency range: 25MHz to 700MHz  
VCO range: 250MHz to 700MHz  
Parallel or serial interface for programming M and N dividers  
during power-up  
quency range of 250MHz to 700MHz.TheVCO and  
output frequency can be programmed using the serial or parallel  
interfaces to the configuration logic. The output can be config-  
ured to divide the VCO frequency by 1, 2, 4, and 8. Output fre-  
quency steps from 250KHz to 2MHz can be achieved using a  
16MHz crystal depending on the output divider setting.  
RMS Period jitter: 5ps (maximum)  
Cycle-to-cycle jitter: 40ps (maximum)  
3.3V supply voltage  
0°C to 70°C ambient operating temperature  
Pin compatible with the MC12430  
Lead-Free/Annealed package available  
Industrial temperature information available upon request  
PIN ASSIGNMENT  
BLOCK DIAGRAM  
25 24 23 22 21 20 19  
OE  
XTAL1  
S_CLOCK  
26  
18  
N1  
N0  
M8  
M7  
M6  
M5  
M4  
1
0
OSC  
S_DATA  
S_LOAD  
27  
28  
1
17  
16  
15  
14  
13  
12  
XTAL2  
ICS84330  
28-Lead PLCC  
V Package  
FREF_EXT  
VCCA  
FREF_EXT  
XTAL_SEL  
÷ 16  
11.6mm x 11.4mm x 4.1mm  
body package  
2
XTAL_SEL  
3
TopView  
XTAL1  
4
PLL  
PHASE DETECTOR  
÷2  
÷4  
÷8  
÷1  
5
6
7
8
9 10 11  
1
0
FOUT  
VCO  
÷ 2  
nFOUT  
TEST  
÷ M  
S_LOAD  
S_DATA  
CONFIGURATION  
INTERFACE  
LOGIC  
S_CLOCK  
nP_LOAD  
32 31 30 29 28 27 26 25  
24  
1
2
3
4
5
6
7
8
S_CLOCK  
S_DATA  
S_LOAD  
VCCA  
n/c  
M0:M8  
N0:N1  
23  
22  
21  
20  
19  
18  
17  
N1  
N0  
M8  
M7  
M6  
M5  
M4  
ICS84330  
32-Lead LQFP  
Y package  
VCCA  
7mm x 7mm x 1.4mm  
body package  
TopView  
FREF_EXT  
XTAL_SEL  
XTAL1  
9
10 11 12 13 14 15 16  
84330BV  
www.icst.com/products/hiperclocks.html  
REV. B JULY 26, 2004  
1
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
FUNCTIONAL DESCRIPTION  
NOTE: The functional description that follows describes op-  
eration using a 16MHz crystal. Valid PLL loop divider values  
for different crystal or input frequencies are defined in the In-  
put Frequency Characteristics, Table 6, NOTE 1.  
latched and the M divider remains loaded until the next LOW  
transition on nP_LOAD or until a serial event occurs.TheTEST  
output is Mode 000 (shift register out) when operating in the  
parallel input mode.The relationship between theVCO frequency,  
the crystal frequency and the M divider is defined as follows:  
The ICS84330 features a fully integrated PLL and therefore  
requires no external components for setting the loop band-  
width. A quartz crystal is used as the input to the on-chip  
oscillator.The output of the oscillator is divided by 16 prior to  
the phase detector.With a 16MHz crystal this provides a 1MHz  
reference frequency. The VCO of the PLL operates over a  
range of 250MHz to 700MHz. The output of the M divider is  
also applied to the phase detector.  
fxtal  
16  
x
fVCO =  
2M  
The M value and the required values of M0 through M8 are  
shown in Table 3B, Programmable VCO Frequency Function  
Table. Valid M values for which the PLL will achieve lock are  
defined as 125 M 350. The frequency out is defined as  
follows:  
fVCO fxtal 2M  
The phase detector and the M divider force the VCO output fre-  
quency to be 2M times the reference frequency by adjusting the  
VCO control voltage. Note that for some values of M (either too  
high or too low), the PLL will not achieve lock.The output of the  
VCO is scaled by a divider prior to being sent to each of the  
LVPECL output buffers.The divider provides a 50% output duty  
cycle.  
fout  
x
=
=
N
N
16  
Serial operation occurs when nP_LOAD is HIGH and S_LOAD  
is LOW.The shift register is loaded by sampling the S_DATA  
bits with the rising edge of S_CLOCK. The contents of the  
shift register are loaded into the M divider when S_LOAD tran-  
sitions from LOW-to-HIGH.The M divide and N output divide  
values are latched on the HIGH-to-LOW transition of S_LOAD.  
If S_LOAD is held HIGH, data at the S_DATA input is passed  
directly to the M divider on each rising edge of S_CLOCK.  
The serial mode can be used to program the M and N bits and  
test bitsT2:T0.The internal registers T2:T0 determine the state  
of the TEST output as follows:  
The programmable features of the ICS84330 support two input  
modes to program the M divider and N output divider.The two  
input operational modes are parallel and serial. Figure 1 shows  
the timing diagram for each mode. In parallel mode the nP_LOAD  
input is LOW.The data on inputs M0 through M8 and N0 through  
N1 is passed directly to the M divider and N output divider. On  
the LOW-to-HIGH transition of the nP_LOAD input, the data is  
T2  
0
0
0
0
T1  
0
0
1
1
T0  
0
1
0
1
TEST Output  
fOUT  
fOUT  
fOUT  
fOUT  
fOUT  
Shift Register Out  
High  
PLL Reference Xtal ÷ 16  
(VCO ÷ M) /2 (non 50% Duty Cycle M divider)  
1
0
0
fOUT  
fOUT  
LVCMOS Output Frequency < 200MHz  
1
1
1
0
1
1
1
0
1
Low  
(S_CLOCK ÷ M) /2 (non 50% Duty Cycle M divider)  
fOUT ÷ 4  
fOUT  
S_CLOCK ÷ N divider  
fOUT  
S
ERIAL LOADING  
S_CLOCK  
S_DATA  
T2  
T1  
T0  
N1  
N0  
M8  
M7  
M6  
M5  
M4 M3  
M2  
M1  
M0  
t
t
H
S
S_LOAD  
nP_LOAD  
t
S
P
ARALLEL LOADING  
M, N  
M0:M8, N0:N1  
nP_LOAD  
t
t
H
Time  
S
FIGURE 1. PARALLEL & SERIAL LOAD OPERATIONS  
www.icst.com/products/hiperclocks.html  
84330BV  
REV. B JULY 26, 2004  
2
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
TABLE 1. PIN DESCRIPTIONS  
Name  
Type  
Description  
Analog supply pin.  
VCCA  
Power  
Crystal oscillator interface. XTAL1 is an oscillator input.  
XTAL2 is an oscillator output.  
XTAL1, XTAL2  
Selects between the crystal oscillator or FREF_EXT inputs as the PLL reference  
source. Selects XTAL inputs when HIGH. Selects FREF_EXT when LOW.  
LVCMOS / LVTTL interface levels.  
XTAL_SEL  
OE  
Input  
Input  
Input  
Pullup  
Pullup  
Pullup  
Output enable. LVCMOS / LVTTL interface levels.  
Parallel load input. Determines when data present at M8:M0 is loaded into  
M divider, and when data present at N1:N0 sets the N output divide value.  
LVCMOS / LVTTL interface levels.  
nP_LOAD  
M0, M1, M2  
M3, M4, M5  
M6, M7, M8  
M divider inputs. Data latched on LOW-to-HIGH transition of nP_LOAD input.  
LVCMOS / LVTTL interface levels.  
Input  
Pullup  
Pullup  
Determines N output divider value as defined in Table 3C Function Table.  
LVCMOS / LVTTL interface levels.  
N0, N1  
VEE  
Input  
Power  
Output  
Negative supply pins.  
Test output which is used in the serial mode of operation.  
LVCMOS / LVTTL interface levels.  
TEST  
VCC  
nFOUT, FOUT  
nc  
Power  
Output  
Unused  
Input  
Core supply pins.  
Differential output for the synthesizer. 3.3V LVPECL interface levels.  
Do not connect.  
FREF_EXT  
Pulldown PLL reference input. LVCMOS / LVTTL interface levels.  
Clocks the serial data present at S_DATA input into the shift register on the  
rising edge of S_CLOCK. LVCMOS / LVTTL interface levels.  
Shift register serial input. Data sampled on the rising edge of S_CLOCK.  
LVCMOS / LVTTL interface levels.  
Controls transition of data from shift register into the M divider.  
LVCMOS / LVTTL interface levels.  
S_CLOCK  
S_DATA  
Input  
Input  
Input  
Pulldown  
Pulldown  
S_LOAD  
Pulldown  
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.  
TABLE 2. PIN CHARACTERISTICS  
Symbol  
CIN  
Parameter  
Test Conditions  
Minimum Typical Maximum Units  
Input Capacitance  
Input Pullup Resistor  
4
pF  
KΩ  
KΩ  
RPULLUP  
51  
51  
RPULLDOWN Input Pulldown Resistor  
84330BV  
www.icst.com/products/hiperclocks.html  
REV. B JULY 26, 2004  
3
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH , LOW JITTER, CRYSTAL-TO-3.3V  
Z
D
IFFERENTIAL LVPECL FREQUENCY  
SYNTHESIZER  
TABLE 3A. PARALLEL AND SERIAL MODE FUNCTION TABLE  
Inputs  
Conditions  
nP_LOAD  
M
N
S_LOAD S_CLOCK S_DATA  
X
X
X
X
X
X
Reset. M and N bits are all set HIGH.  
Data on M and N inputs passed directly to M divider and  
N output divider. TEST mode 000.  
L
Data Data  
Data Data  
X
X
X
Data is latched into input registers and remains loaded  
until next LOW transition or until a serial event occurs.  
Serial input mode. Shift register is loaded with data on  
S_DATA on each rising edge of S_CLOCK.  
Contents of the shift register are passed to the M divider  
and N output divider.  
X
L
X
L
X
H
H
X
X
X
X
Data  
Data  
H
H
H
X
X
X
X
X
X
L
L
X
Data  
X
M divide and N output divide values are latched.  
Parallel or serial input do not affect shift registers.  
S_DATA passed directly to M divider as it is clocked.  
H
Data  
NOTE: L = LOW  
H = HIGH  
X = Don't care  
= Rising edge transition  
= Falling edge transition  
TABLE 3B. PROGRAMMABLE VCO FREQUENCY FUNCTION TABLE  
256  
M8  
0
128  
M7  
0
64  
M6  
1
32  
M5  
1
16  
M4  
1
8
M3  
1
4
M2  
1
2
M1  
0
1
M0  
1
VCO Frequency  
(MHz)  
M Divide  
250  
252  
254  
256  
125  
126  
127  
128  
0
0
1
1
1
1
1
1
0
0
0
1
1
1
1
1
1
1
0
1
0
0
0
0
0
0
0
696  
698  
700  
348  
349  
350  
1
0
1
0
1
1
1
0
0
1
0
1
0
1
1
1
0
1
1
0
1
0
1
1
1
1
0
NOTE 1: These M divide values and the resulting frequencies correspond to a crystal frequency of 16MHz.  
TABLE 3C. PROGRAMMABLE OUTPUT DIVIDER FUNCTION TABLE  
Inputs  
Output Frequency (MHz)  
N Divider Value  
N1  
N0  
0
Minimum  
125  
Maximum  
350  
0
0
1
1
2
4
8
1
1
62.5  
175  
0
31.25  
250  
87.5  
1
700  
84330BV  
www.icst.com/products/hiperclocks.html  
REV. B JULY 26, 2004  
4
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage, V  
4.6V  
CC  
NOTE: Stresses beyond those listed under Absolute  
Maximum Ratings may cause permanent damage to the  
device.These ratings are stress specifications only.Functional  
operation of product at these conditions or any conditions be-  
yond those listed in the DC Characteristics or AC Character-  
istics is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect product reliability.  
Inputs, V  
-0.5V to VCC + 0.5 V  
I
Outputs, IO  
Continuous Current  
Surge Current  
50mA  
100mA  
PackageThermal Impedance, θ  
32 Lead LQFP  
28 Lead PLCC  
JA  
47.9°C/W (0 lfpm)  
37.8°C/W (0 lfpm)  
StorageTemperature, T  
-65°C to 150°C  
STG  
TABLE 4A. DC POWER SUPPLY CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C  
Symbol Parameter  
Test Conditions  
Minimum  
3.135  
Typical  
3.3  
Maximum Units  
VCC  
VCCA  
ICC  
Core Supply Voltage  
3.465  
3.465  
130  
V
Analog Supply Voltage  
Power Supply Current  
Analog Supply Current  
3.135  
3.3  
V
mA  
mA  
ICCA  
15  
TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C  
Symbol Parameter Test Conditions Minimum Typical Maximum Units  
VIH  
VIL  
Input High Voltage  
2
VCC + 0.3  
0.8  
V
V
Input Low Voltage  
-0.3  
M0-M8, N0, N1,  
OE, nP_LOAD,  
XTAL_SEL  
S_LOAD, S_CLOCK  
FREF_EXT, S_DATA  
M0-M8, N0, N1,  
OE, nP_LOAD,  
XTAL_SEL  
S_LOAD, S_CLOCK  
FREF_EXT, S_DATA  
V
CC = VIN = 3.465V  
5
µA  
µA  
µA  
µA  
IIH  
Input High Current  
VCC = VIN = 3.465V  
150  
VCC = 3.465V, VIN = 0V  
VCC = 3.465V, VIN = 0V  
-150  
IIL  
Input Low Current  
-5  
VOH  
VOL  
Output High Voltage; NOTE 1  
Output Low Voltage; NOTE 1  
2.6  
V
V
0.5  
NOTE 1: Outputs terminated with 50to VCC/2.  
TABLE 4C. LVPECL DC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C  
Symbol Parameter  
Test Conditions  
Minimum  
VCC - 1.4  
VCC - 2.0  
0.6  
Typical Maximum Units  
VOH  
Output High Voltage; NOTE 1  
VCC - 1.0  
VCC - 1.7  
1.0  
V
V
V
VOL  
Output Low Voltage; NOTE 1  
VSWING  
Peak-to-Peak Output Voltage Swing  
NOTE 1: Outputs terminated with 50to VCC - 2V.  
84330BV  
www.icst.com/products/hiperclocks.html  
REV. B JULY 26, 2004  
5
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH , LOW JITTER, CRYSTAL-TO-3.3V  
Z
D
IFFERENTIAL LVPECL FREQUENCY  
SYNTHESIZER  
TABLE 5. CRYSTAL CHARACTERISTICS  
Parameter  
Test Conditions  
Minimum Typical Maximum  
Fundamental  
Units  
Mode of Oscillation  
Frequency  
10  
25  
70  
7
MHz  
Equivalent Series Resistance (ESR)  
Shunt Capacitance  
pF  
TABLE 6. INPUT FREQUENCY CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C  
Symbol Parameter  
fIN  
Test Conditions  
Minimum Typical Maximum Units  
XTAL; NOTE 1  
10  
25  
50  
MHz  
MHz  
MHz  
Input Frequency S_CLOCK  
FREF_EXT; NOTE 2  
10  
NOTE 1: For the crystal frequency range the M value must be set to achieve the minimum or maximum VCO frequency  
range of 250MHz to 700MHz. Using the minimum frequency of 10MHz, valid values of M are 200 M 511.  
Using the maximum frequency of 25MHz, valid values of M are 80 M 224.  
NOTE 2: Maximum frequency on FREF_EXT is dependent on the internal M counter limitations. See Application  
Information Section for recommendations on optimizing the performance using the FREF_EXT input.  
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = 3.3V 5%, TA = 0°C TO 70°C  
Symbol Parameter  
Test Conditions  
Minimum Typical Maximum Units  
FOUT  
Output Frequency  
700  
5
MHz  
ps  
ps  
ps  
ns  
ns  
ns  
ns  
ns  
ms  
%
tjit(per)  
tjit(cc)  
tR / tF  
Period Jitter, RMS; NOTE 1, 2  
Cycle-to-Cycle Jitter; NOTE 1, 2  
Output Rise/Fall Time  
40  
20% to 80%  
200  
20  
20  
20  
20  
20  
600  
S_DATA to S_CLOCK  
tS  
Setup Time S_CLOCK to S_LOAD  
M, N to nP_LOAD  
S_DATA to S_CLOCK  
Hold Time  
tH  
tL  
M, N to nP_LOAD  
PLL Lock Time  
10  
55  
55  
N 1  
45  
45  
N = 1, fOUT 250MHz  
%
odc  
Output Duty Cycle  
N = 1,  
40  
60  
%
250MHz < fOUT 500MHz  
See Parameter Measurement Information section.  
Characterized using a XTAL input.  
NOTE 1: This parameter is defined in accordance with JEDEC Standard 65  
NOTE 2: See Applications section.  
84330BV  
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REV. B JULY 26, 2004  
6
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH , LOW JITTER, CRYSTAL-TO-3.3V  
Z
D
IFFERENTIAL LVPECL FREQUENCY  
SYNTHESIZER  
PARAMETER MEASUREMENT INFORMATION  
2V  
VOH  
SCOPE  
VREF  
VCC,  
VCCA  
Qx  
VOL  
1σ contains 68.26% of all measurements  
2σ contains 95.4% of all measurements  
3σ contains 99.73% of all measurements  
LVPECL  
VEE  
nQx  
4σ contains 99.99366% of all measurements  
6σ contains (100-1.973x10-7)% of all measurements  
Histogram  
Reference Point  
(Trigger Edge)  
Mean Period  
(First edge after trigger)  
-1.3V 0.165V  
3.3V OUTPUT LOAD AC TEST CIRCUIT  
PERIOD JITTER  
nFOUT  
FOUT  
80%  
80%  
VSWING  
20%  
20%  
tcycle n+1  
tcycle n  
Clock Outputs  
t
t
F
R
tjit(cc) = tcycle n –tcycle n+1  
1000 Cycles  
CYCLE-TO-CYCLE JITTER  
OUTPUT RISE/FALL TIME  
nFOUT  
FOUT  
Pulse Width  
tPERIOD  
tPW  
odc =  
tPERIOD  
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD  
84330BV  
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REV. B JULY 26, 2004  
7
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
APPLICATION INFORMATION  
POWER SUPPLY FILTERING TECHNIQUES  
As in any high speed analog circuitry, the power supply pins  
are vulnerable to random noise. The ICS84330 provides  
separate power supplies to isolate any high switching  
noise from the outputs to the internal PLL. VCC and VCCA  
should be individually connected to the power supply  
plane through vias, and bypass capacitors should be  
used for each pin. To achieve optimum jitter performance,  
power supply isolation is required. Figure 2 illustrates how  
a 10resistor along with a 10µF and a .01µF bypass  
capacitor should be connected to each VCCA pin.  
3.3V  
VCC  
.01µF  
.01µF  
10Ω  
VCCA  
10µF  
FIGURE 2. POWER SUPPLY FILTERING  
TERMINATION FOR LVPECL OUTPUTS  
The clock layout topology shown below is a typical termina-  
tion for LVPECL outputs.The two different layouts mentioned  
are recommended only as guidelines.  
drive 50transmission lines. Matched impedance techniques  
should be used to maximize operating frequency and minimize  
signal distortion. Figures 3A and 3B show two different layouts  
which are recommended only as guidelines. Other suitable clock  
layouts may exist and it would be recommended that the board  
designers simulate to guarantee compatibility across all printed  
circuit and clock component process variations.  
FOUT and nFOUT are low impedance follower outputs that  
generate ECL/LVPECL compatible outputs.Therefore, terminat-  
ing resistors (DC current path to ground) or current sources  
must be used for functionality. These outputs are designed to  
3.3V  
Z
o = 50Ω  
125Ω  
125Ω  
FOUT  
FIN  
Zo = 50Ω  
Zo = 50Ω  
Zo = 50Ω  
FOUT  
FIN  
50Ω  
50Ω  
VCC - 2V  
1
RTT =  
Zo  
RTT  
((VOH + VOL) / (VCC – 2)) – 2  
84Ω  
84Ω  
FIGURE 3A. LVPECL OUTPUT TERMINATION  
FIGURE 3B. LVPECL OUTPUT TERMINATION  
84330BV  
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REV. B JULY 26, 2004  
8
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
LVCMOS TO XTAL INTERFACE  
The XTAL1 input can accept single ended LVCMOS signal ance trace may be required. The input can function with half  
swing amplitude. Reducing amplitude from full swing of 3.3V  
through an AC couple capacitor. A general interface diagram  
is shown in Figure 4.The XTAL2 input can be left floating.The to half swing of about 1.65V can prevent signal interfere with  
edge rate can be as slow as 10ns. If the incoming signal has power rail and may reduce noise. Please refer to the LVCMOS  
driver data sheet and application note for amplitude reduction  
sharp edge rate and the signal path is a long trace, proper  
termination for the driver and controlled characteristic imped- and termination approach.  
VDD  
Q1  
C1  
XTAL1  
0.1uF  
LVCMOS_Driver  
XTAL2  
Crystal Input Interface  
Figure 4. GENERAL DIAGRAM FOR LVCMOS DRIVER TO XTAL INPUT INTERFACE  
50  
40  
30  
20  
10  
0
Spec Limit  
N = 1  
200  
300  
400  
500  
600  
700  
Output Frequency (MHz)  
FIGURE 5. CYCLE-TO-CYCLE JITTER VS. fOUT (using a 16MHz XTAL)  
84330BV  
www.icst.com/products/hiperclocks.html  
REV. B JULY 26, 2004  
9
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
LAYOUT GUIDELINE  
The schematic of the ICS84330 layout example used in line. The layout in the actual system will depend on the  
this layout guideline is shown in Figure 6A. The ICS84330 selected component types, the density of the components,  
recommended PCB board layout for this example is shown  
in Figure 6B. This layout example is used as a general guide-  
the density of the traces, and the stack up of the P.C. board.  
C1  
X1  
C2  
SP  
SP  
16MHz, 18pF  
VCC  
U1  
R7  
10  
M4  
12  
13  
14  
15  
16  
17  
18  
4
M4  
M5  
M6  
M7  
M8  
N0  
N1  
XTAL1  
3
M5  
M6  
M7  
M8  
N2  
N1  
VCC=3.3V  
XTAL_SEL  
2
1
28  
27  
26  
FREF_EXT  
VCCA  
S_LOAD  
S_DATA  
S_CLOCK  
VCCA  
SP = Space (i.e. not intstalled)  
C11  
0.01u  
C16  
10u  
M[8:0]= 110010000 (400)  
N[1:0] =00 (Divide by 2)  
ICS84330  
C3  
VCC  
0.1uF  
Zo = 50 Ohm  
RU0  
SP  
RU1  
SP  
RU7  
1K  
RU8  
1K  
RU9  
SP  
RU10  
1K  
RU11  
SP  
RU12  
1K  
Fout = 200 MHz  
+
-
C4  
0.1u  
Zo = 50 Ohm  
R2  
50  
R1  
50  
RD0  
1K  
RD1  
1K  
RD7  
SP  
RD8  
SP  
RD9  
1K  
RD10  
SP  
RD6  
1K  
RD12  
SP  
R3  
50  
FIGURE 6A. SCHEMATIC OF RECOMMENDED LAYOUT  
84330BV  
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ITTER, CRYSTAL  
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IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
• The differential 50output traces should have the  
same length.  
The following component footprints are used in this layout  
example:  
• Avoid sharp angles on the clock trace.Sharp angle  
turns cause the characteristic impedance to change on  
the transmission lines.  
All the resistors and capacitors are size 0603.  
POWER AND GROUNDING  
Place the decoupling capacitors C3 and C4, as close as pos-  
sible to the power pins. If space allows, placement of the  
decoupling capacitor on the component side is preferred. This  
can reduce unwanted inductance between the decoupling  
capacitor and the power pin caused by the via.  
• Keep the clock traces on the same layer.Whenever pos-  
sible, avoid placing vias on the clock traces. Placement  
of vias on the traces can affect the trace characteristic  
impedance and hence degrade signal integrity.  
To prevent cross talk, avoid routing other signal traces in  
parallel with the clock traces. If running parallel traces is  
unavoidable, allow a separation of at least three trace  
widths between the differential clock trace and the other  
signal trace.  
Maximize the power and ground pad sizes and number of vias  
capacitors.This can reduce the inductance between the power  
and ground planes and the component power and ground pins.  
The RC filter consisting of R7, C11, and C16 should be placed  
as close to the VCCA pin as possible.  
• Make sure no other signal traces are routed between the  
clock trace pair.  
CLOCK TRACES AND TERMINATION  
• The matching termination resistors should be located as  
close to the receiver input pins as possible.  
Poor signal integrity can degrade the system performance or  
cause system failure. In synchronous high-speed digital systems,  
the clock signal is less tolerant to poor signal integrity than other  
signals. Any ringing on the rising or falling edge or excessive ring  
back can cause system failure. The shape of the trace and the  
trace delay might be restricted by the available space on the board  
and the component location.While routing the traces, the clock  
signal traces should be routed first and should be locked prior to  
routing other signal traces.  
CRYSTAL  
The crystal X1 should be located as close as possible to the pins  
4 (XTAL1) and 5 (XTAL2).The trace length between the X1 and  
U1 should be kept to a minimum to avoid unwanted parasitic in-  
ductance and capacitance. Other signal traces should not be  
routed near the crystal traces.  
X1  
C1  
C2  
U1  
GND  
VCC  
PIN 2  
PIN 1  
C16  
C11  
R7  
VCCA  
VIA  
VCCA  
Signals  
Traces  
C3  
C4  
50 Ohm  
Traces  
FIGURE 6B. PCB BOARD LAYOUT FOR ICS84330  
www.icst.com/products/hiperclocks.html  
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, LOW  
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ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
JITTER REDUCTION FOR FREF_EXT SINGLE END INPUT  
If the FREF_EXT input is driven by a 3.3V LVCMOS driver, the  
jitter performance can be improved by reducing the amplitude  
swing and slowing down the edge rate. Figure 7A shows an  
amplitude reduction approach for a long trace. The swing will  
be approximately 0.85V for logic low and 2.5V for logic high  
(instead of 0V to 3.3V). Figure 7B shows amplitude reduction  
approach for a short trace. The circuit shown in Figure 7C  
reduces amplitude swing and also slows down the edge rate  
by increasing the resistor value.  
VDD  
R1  
VDD  
100  
Zo = 50 Ohm  
Td  
Ro ~ 7 Ohm  
VDD  
GND  
RS  
43  
R2  
100  
FREF_EXT  
Driver_LVCMOS  
FIGURE 7A. AMPLITUDE REDUCTION FOR A LONG TRACE  
VDD  
VDD  
R1  
200  
Ro ~ 7 Ohm  
VDD  
GND  
RS  
100  
R2  
200  
FREF_EXT  
Driver_LVCMOS  
FIGURE 7B. AMPLITUDE REDUCTION FOR A SHORT TRACE  
VDD  
VDD  
R1  
400  
Ro ~ 7 Ohm  
VDD  
GND  
RS  
200  
R2  
400  
FREF_EXT  
Driver_LVCMOS  
FIGURE 7C. EDGE RATE REDUCTION BY INCREASING THE RESISTOR VALUE  
84330BV  
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700MH  
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, LOW  
J
ITTER, CRYSTAL  
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D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
POWER CONSIDERATIONS  
This section provides information on power dissipation and junction temperature for the ICS84330.  
Equations and example calculations are also provided.  
1. Power Dissipation.  
The total power dissipation for the ICS84330 is the sum of the core power plus the power dissipated in the load(s).  
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.  
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.  
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 145mA = 502.4mW  
Power (outputs)MAX = 30.2mW/Loaded Output pair  
If all outputs are loaded, the total power is 1 * 30.2mW = 30.2mW  
Total Power_MAX (3.465V, with all outputs switching) = 502.4 + 30.2mW = 532.6mW  
2. Junction Temperature.  
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the  
device.The maximum recommended junction temperature for HiPerClockSTM devices is 125°C.  
The equation for Tj is as follows: Tj = θJA * Pd_total + TA  
Tj = JunctionTemperature  
θJA = Junction-to-AmbientThermal Resistance  
Pd_total =Total Device Power Dissipation (example calculation is in section 1 above)  
TA = AmbientTemperature  
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming a  
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 31.1°C/W perTable 9A below.  
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:  
70°C + 0.533W * 31.1°C/W = 86.6°C. This is well below the limit of 125°C.  
This calculation is only an example.Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,  
and the type of board (single layer or multi-layer).  
TABLE 9A. THERMAL RESISTANCE θJA FOR 28-PIN PLCC, FORCED CONVECTION  
θJA by Velocity (Linear Feet per Minute)  
0
200  
500  
Multi-Layer PCB, JEDEC Standard Test Boards  
37.8°C/W  
31.1°C/W  
28.3°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TABLE 9B. THERMAL RESISTANCE θJA FOR 32-PIN LQFP, FORCED CONVECTION  
θJA by Velocity (Linear Feet per Minute)  
0
200  
500  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
55.9°C/W  
50.1°C/W  
47.9°C/W  
42.1°C/W  
39.4°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
84330BV  
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REV. B JULY 26, 2004  
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ICS84330  
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700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
3. Calculations and Equations.  
The purpose of this section is to derive the power dissipated into the load.  
LVPECL output driver circuit and termination are shown in the Figure 8.  
VCC  
Q1  
VOUT  
RL  
50  
VCC - 2V  
FIGURE 8. LVPECL DRIVER CIRCUIT AND TERMINATION  
To calculate worst case power dissipation into the load, use the following equations which assume a 50load, and a termination  
voltage ofV - 2V.  
CC  
For logic high, VOUT = V  
= V  
– 1.0V  
OH_MAX  
CC_MAX  
)
= 1.0V  
OH_MAX  
(V  
- V  
CC_MAX  
For logic low, VOUT = V  
= V  
– 1.7V  
OL_MAX  
CC_MAX  
)
= 1.7V  
OL_MAX  
(V  
- V  
CC_MAX  
Pd_H is power dissipation when the output drives high.  
Pd_L is the power dissipation when the output drives low.  
))  
Pd_H = [(V  
– (V  
- 2V))/R ] * (V  
- V  
) = [(2V - (V  
- V  
/R ] * (V  
- V  
) =  
OH_MAX  
CC_MAX  
CC_MAX  
OH_MAX  
_MAX  
OH_MAX  
CC_MAX  
OH_MAX  
L
CC  
L
[(2V - 1V)/50] * 1V = 20.0mW  
Pd_L = [(V – (V - 2V))/R ] * (V  
))  
- V  
) = [(2V - (V  
- V  
/R ] * (V  
- V  
) =  
OL_MAX  
CC_MAX  
CC_MAX  
OL_MAX  
_MAX  
OL_MAX  
CC_MAX  
OL_MAX  
L
CC  
L
[(2V - 1.7V)/50] * 1.7V = 10.2mW  
Total Power Dissipation per output pair = Pd_H + Pd_L = 30.2mW  
84330BV  
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REV. B JULY 26, 2004  
14  
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
RELIABILITY INFORMATION  
TABLE 10A. θJAVS. AIR FLOW PLCC TABLE FOR 28 LEAD PLCC  
θJA by Velocity (Linear Feet per Minute)  
0
200  
500  
Multi-Layer PCB, JEDEC Standard Test Boards  
37.8°C/W  
31.1°C/W  
28.3°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TABLE 10B. θJAVS. AIR FLOW LQFP TABLE FOR 32 LEAD LQFP  
θJA by Velocity (Linear Feet per Minute)  
0
200  
55.9°C/W  
42.1°C/W  
500  
50.1°C/W  
39.4°C/W  
Single-Layer PCB, JEDEC Standard Test Boards  
Multi-Layer PCB, JEDEC Standard Test Boards  
67.8°C/W  
47.9°C/W  
NOTE: Most modern PCB designs use multi-layered boards.The data in the second row pertains to most designs.  
TRANSISTOR COUNT  
The transistor count for ICS84330 is: 4442  
84330BV  
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REV. B JULY 26, 2004  
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ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
PACKAGE OUTLINE - V SUFFIX FOR 28 LEAD PLCC  
TABLE 11A. PACKAGE DIMENSIONS  
JEDEC VARIATION  
ALL DIMENSIONS IN MILLIMETERS  
SYMBOL  
MINIMUM  
MAXIMUM  
N
A
28  
4.19  
2.29  
4.57  
3.05  
A1  
A2  
b
1.57  
2.11  
0.33  
0.53  
c
0.19  
0.32  
D
12.32  
11.43  
4.85  
12.57  
11.58  
5.56  
D1  
D2  
E
12.32  
11.43  
4.85  
12.57  
11.58  
5.56  
E1  
E2  
Reference Document: JEDEC Publication 95, MS-018  
84330BV  
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ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
PACKAGE OUTLINE - Y SUFFIX FOR 32 LEAD LQFP  
TABLE 11B. PACKAGE DIMENSIONS  
JEDEC VARIATION  
ALL DIMENSIONS IN MILLIMETERS  
BBA  
SYMBOL  
MINIMUM  
NOMINAL  
MAXIMUM  
N
A
32  
--  
--  
--  
1.60  
0.15  
1.45  
0.45  
0.20  
A1  
A2  
b
0.05  
1.35  
0.30  
0.09  
1.40  
0.37  
c
--  
D
9.00 BASIC  
7.00 BASIC  
5.60 Ref.  
9.00 BASIC  
7.00 BASIC  
5.60 Ref.  
0.80 BASIC  
0.60  
D1  
D2  
E
E1  
E2  
e
L
0.45  
0.75  
θ
--  
0°  
7°  
ccc  
--  
--  
0.10  
Reference Document: JEDEC Publication 95, MS-026  
84330BV  
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ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH  
Z
, LOW  
J
ITTER, CRYSTAL  
-TO-3.3V  
D
IFFERENTIAL LVPECL FREQUENCY YNTHESIZER  
S
TABLE 12. ORDERING INFORMATION  
Part/Order Number  
ICS84330BV  
Marking  
Package  
Count  
38 per Tube  
500  
Temperature  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
0°C to 70°C  
ICS84330BV  
ICS84330BV  
ICS84330BY  
ICS84330BY  
ICS84330BYLN  
28 Lead PLCC  
ICS84330BVT  
ICS84330BY  
28 Lead PLCC on Tape and Reel  
32 Lead LQFP  
250 per Tray  
1000  
ICS84330BYT  
ICS84330BYLN  
32 Lead LQFP on Tape and Reel  
32 Lead "Lead Free/Annealed" LQFP 250 per Tray  
32 Lead "Lead Free/Annealed" LQFP  
ICS84330BYLNT  
ICS84330BYLN  
1000  
0°C to 70°C  
on Tape and Reel  
The aforementioned trademark, HiPerClockS™ is a trademark of Integrated Circuit Systems, Inc. or its subsidiaries in the United States and/or other countries.  
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use  
or for infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use  
in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are  
not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS  
product for use in life support devices or critical medical instruments.  
84330BV  
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18  
ICS84330  
Integrated  
Circuit  
Systems, Inc.  
700MH , LOW JITTER, CRYSTAL-TO-3.3V  
Z
D
IFFERENTIAL LVPECL FREQUENCY  
SYNTHESIZER  
REVISION HISTORY SHEET  
Description of Change  
Rev  
Table  
Page  
Date  
2
5
Switched S_DATA and S_CLOCK labels in Figure 1, CLK_EN Timing Diagram.  
DC Power Supply table - changed ICC Parameter to read Power.. from Core...  
Added "LVCMOS to XTAL Interface" section.  
T4A  
A
1/23/03  
3/24/03  
9
10  
Figure 7A Schematic Layout - revised, changed N[1:0]-01 to N[1:0}=00.  
Added C1 value (18p) and C2 value (22p).  
Block Diagram, replaced N with values.  
Deleted Crystal Input Interface section; external tune up capacitor not required.  
Revised Figure 6A, Schematic of Recommended Layout diagram.  
General Description & Features - changed VCO min. from 200MHz to 250MHz  
and replaced throughout the datasheet in (Functional Description pg2,  
T3C Program. Output Divider Func. Table pg4, and T6 Input Freq Charac. pg6).  
1
8
10  
1
A
T2  
3
4
Pin Characteristics Table - changed CIN 4pF max. to 4pF typical.  
B
B
5/5/03  
T3B  
Prog. VCO Freq. Func. Table - replaced VCO Frequency 200MHz to 206MHz  
with 250MHz to 256MHz. Replaced M Divide 100 to 103 to 125 to 128.  
Adjusted Logic High and Logic Low data.  
5
Absolute Maximum Rating - changed Outputs VO and rating to IO with Continous  
and Surge ratings.  
Ordering Information Table - added "Lead Free/Annealed" part number.  
Updated format throughout data sheet.  
T12  
18  
7/26/04  
84330BV  
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REV. B JULY 26, 2004  
19  

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