IS61LV6416-15KI

更新时间:2024-09-18 02:11:02
品牌:ICSI
描述:64K X 16 HIGH SPEED CMOS STATIC RAM WITH 3.3 V SUPPLY

IS61LV6416-15KI 概述

64K X 16 HIGH SPEED CMOS STATIC RAM WITH 3.3 V SUPPLY 64K ×16高速CMOS静态与3.3 V电源RAM SRAM

IS61LV6416-15KI 规格参数

是否Rohs认证: 不符合生命周期:Transferred
包装说明:SOJ, SOJ44,.44Reach Compliance Code:unknown
风险等级:5.86Is Samacsys:N
最长访问时间:15 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-J44JESD-609代码:e0
内存密度:1048576 bit内存集成电路类型:STANDARD SRAM
内存宽度:16端子数量:44
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:64KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOJ封装等效代码:SOJ44,.44
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
并行/串行:PARALLEL电源:3.3 V
认证状态:Not Qualified最大待机电流:0.015 A
最小待机电流:3 V子类别:SRAMs
最大压摆率:0.19 mA标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:J BEND端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

IS61LV6416-15KI 数据手册

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IS61LV6416  
64K x 16 HIGH-SPEED CMOS STATIC RAM  
WITH 3.3V SUPPLY  
FEATURES  
DESCRIPTION  
The ICSI IS61LV6416 is a high-speed, 1,048,576-bit static  
RAM organized as 65,536 words by 16 bits. It is fabricated  
using ICSI's high-performance CMOS technology. This highly  
reliable process coupled with innovative circuit design  
techniques, yields access times as fast as 8 ns with low power  
consumption.  
• High-speed access time: 8, 10, 12, and 15 ns  
• CMOS low power operation  
— 250 mW (typical) operating  
— 250 µW (typical) standby  
• TTL compatible interface levels  
• Single 3.3V power supply  
When CE is HIGH (deselected), the device assumes a standby  
mode at which the power dissipation can be reduced down with  
CMOS input levels.  
• Fully static operation: no clock or refresh  
required  
• Three state outputs  
Easy memory expansion is provided by using Chip Enable and  
Output Enable inputs, CE and OE. The active LOW Write  
Enable (WE) controls both writing and reading of the memory.  
A data byte allows Upper Byte (UB) and Lower Byte (LB)  
access.  
• Data control for upper and lower bytes  
• Industrial temperature available  
The IS61LV6416 is packaged in the JEDEC standard 44-pin  
400mil SOJ, 44-pin 400mil TSOP-2, and 48-pin 6*8mm TF-  
BGA.  
FUNCTIONAL BLOCK DIAGRAM  
64K x 16  
MEMORY ARRAY  
A0-A15  
DECODER  
VCC  
GND  
I/O0-I/O7  
Lower Byte  
I/O  
DATA  
COLUMN I/O  
CIRCUIT  
I/O8-I/O15  
Upper Byte  
CE  
OE  
WE  
CONTROL  
CIRCUIT  
UB  
LB  
ICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors  
which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.  
Integrated Circuit Solution Inc.  
SR013-0C  
1
IS61LV6416  
PIN CONFIGURATIONS  
44-Pin SOJ  
44-Pin TSOP-2  
A15  
A14  
A13  
A12  
A11  
CE  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A0  
A15  
A14  
A13  
A12  
A11  
CE  
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A10  
A9  
1
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A0  
A1  
A2  
OE  
UB  
LB  
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
2
A1  
2
3
A2  
3
4
OE  
4
5
UB  
5
6
LB  
6
I/O0  
I/O1  
I/O2  
I/O3  
Vcc  
GND  
I/O4  
I/O5  
I/O6  
I/O7  
WE  
A10  
A9  
7
I/O15  
I/O14  
I/O13  
I/O12  
GND  
Vcc  
I/O11  
I/O10  
I/O9  
I/O8  
NC  
7
8
8
9
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
A3  
A3  
A4  
A5  
A6  
A4  
A8  
A5  
A8  
A7  
NC  
A7  
A6  
NC  
NC  
NC  
48-Pin 6x8mm TF-BGA  
PIN DESCRIPTIONS  
1
2
3
4
5
6
A0-A15  
I/O0-I/O15  
CE  
Address Inputs  
Data Inputs/Outputs  
Chip Enable Input  
Output Enable Input  
Write Enable Input  
A3  
A2  
A7  
A1  
A6  
LB  
I/O  
OE  
UB  
N/C  
I/O  
A
B
C
D
E
F
CE  
0
15  
OE  
I/O  
I/O  
A0  
A4  
I/O  
I/O  
14  
1
2
13  
WE  
GND  
Vcc  
NC  
NC  
A9  
A5  
I/O  
I/O  
I/O  
12  
I/O  
11  
I/O  
10  
Vcc  
3
GND  
LB  
Lower-byte Control (I/O0-I/O7)  
Upper-byte Control (I/O8-I/O15)  
No Connection  
NC  
A8  
4
I/O  
5
I/O  
I/O  
9
UB  
6
A11  
I/O  
7
NC  
A12  
WE  
A15  
A10  
A14  
I/O  
8
NC  
G
H
NC  
A13  
NC  
Vcc  
Power  
GND  
Ground  
TRUTH TABLE  
I/O PIN  
Mode  
WE  
CE  
OE  
LB  
UB  
I/O0-I/O7 I/O8-I/O15 Vcc Current  
Not Selected  
X
H
X
X
X
High-Z  
High-Z  
ISB1, ISB2  
ICC  
Output Disabled  
H
X
L
L
H
X
X
H
X
H
High-Z  
High-Z  
High-Z  
High-Z  
Read  
Write  
H
H
H
L
L
L
L
L
L
L
H
L
H
L
L
DOUT  
High-Z  
DOUT  
High-Z  
DOUT  
ICC  
ICC  
DOUT  
L
L
L
L
L
L
X
X
X
L
H
L
H
L
L
DIN  
High-Z  
DIN  
High-Z  
DIN  
DIN  
2
Integrated Circuit Solution Inc.  
SR013-0C  
IS61LV6416  
ABSOLUTE MAXIMUM RATINGS(1)  
Note:  
1. Stress greater than those listed under  
ABSOLUTEMAXIMUMRATINGSmay  
cause permanent damage to the  
device. This is a stress rating only and  
functional operation of the device at  
these or any other conditions above  
those indicated in the operational sec-  
tions of this specification is not implied.  
Exposure to absolute maximum rating  
conditions for extended periods may  
affect reliability.  
Symbol Parameter  
Value  
Unit  
V
VTERM  
TSTG  
PT  
Terminal Voltage with Respect to GND –0.5 to Vcc+0.5  
1
Storage Temperature  
Power  
–65 to +150  
Dissipation1.5  
20  
°C  
W
IOUT  
DC Output Current (LOW)  
mA  
2
OPERATING RANGE  
3
Range  
Ambient Temperature  
Vcc  
Commercial  
Industrial  
0°C to +70°C  
3.3V ± 10%  
3.3V ± 10%  
–40°C to +85°C  
4
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)  
Symbol Parameter  
Test Conditions  
Min.  
2.4  
—
Max.  
—
Unit  
V
5
VOH  
VOL  
VIH  
VIL  
ILI  
Output HIGH Voltage  
VCC = Min., IOH = –4.0 mA  
VCC = Min., IOL = 8.0 mA  
Output LOW Voltage  
Input HIGH Voltage  
Input LOW Voltage(1)  
Input Leakage  
0.4  
V
2
VCC + 0.3  
0.8  
V
6
–0.3  
V
GND VIN VCC  
Com.  
Ind.  
–2  
-5  
2
5
µA  
7
ILO  
Output Leakage  
GND VOUT VCC, Outputs Disabled  
Com.  
Ind.  
–2  
-5  
2
5
µA  
Notes:  
8
1. VIL (min.) = –2.0V for pulse width less than 10 ns.  
2. The Vcc operating range for 8 ns is 3.3V +10%, -5%.  
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)  
9
-8 ns  
-10 ns  
Min. Max.  
-12 ns  
-15 ns  
Symbol Parameter  
Test Conditions  
Min. Max.  
Min. Max.  
Min. Max. Unit  
10  
11  
12  
ICC  
Vcc Dynamic Operating  
VCC = Max.,  
Com.  
Ind.  
—
—
220  
230  
—
—
200  
—
—
180  
190  
—
—
180  
190  
mA  
Supply Current  
IOUT = 0 mA, f = fMAX  
210  
ISB1  
TTL Standby Current  
(TTL Inputs)  
VCC = Max.,  
Com.  
Ind.  
—
—
30  
40  
—
—
30  
40  
—
—
30  
40  
—
—
30  
40  
mA  
VIN = VIH or VIL  
CE  
VIH , f = 0  
ISB2  
CMOS Standby  
VCC = Max.,  
Com.  
Ind.  
—
—
10  
15  
—
—
10  
15  
—
—
10  
15  
—
—
10  
15  
mA  
Current (CMOS Inputs)  
CE  
VIN  
VIN  
VCC – 0.2V,  
VCC – 0.2V, or  
0.2V, f = 0  
Note:  
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.  
Integrated Circuit Solution Inc.  
SR013-0C  
3
IS61LV6416  
CAPACITANCE(1)  
Symbol  
CIN  
Parameter  
Conditions  
VIN = 0V  
Max.  
Unit  
pF  
Input Capacitance  
6
8
COUT  
Input/Output Capacitance  
VOUT = 0V  
pF  
Note:  
1. Tested initially and after any design or process changes that may affect these parameters.  
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)  
-8  
-10  
Min.  
-12  
Min.  
-15  
Min.  
Symbol Parameter  
Min.  
8
Max.  
—
8
Max.  
—
10  
—
10  
5
Max.  
—
12  
—
12  
6
Max.  
—
15  
—
15  
7
Unit  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tRC  
Read Cycle Time  
10  
—
3
12  
—
3
15  
—
3
tAA  
Address Access Time  
Output Hold Time  
—
3
tOHA  
tACE  
tDOE  
tHZOE  
—
8
CE Access Time  
—
—
0
—
—
—
0
—
—
—
0
—
—
0
OE Access Time  
4
(2)  
OE to High-Z Output  
OE to Low-Z Output  
CE to High-Z Output  
CE to Low-Z Output  
LB, UB Access Time  
LB, UB to High-Z Output  
LB, UB to Low-Z Output  
4
5
6
6
(2)  
tLZOE  
0
—
4
—
5
—
6
0
—
6
(2  
tHZCE  
0
0
0
0
(2)  
tLZCE  
tBA  
3
—
4
3
—
5
3
—
6
3
—
7
—
0
—
0
—
0
—
0
tHZB  
tLZB  
4
5
6
6
0
—
0
—
0
—
0
—
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of  
0 to 3.0V and output loading specified in Figure 1a.  
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
3. Not 100% tested.  
AC TEST CONDITIONS  
Parameter  
Unit  
0V to 3.0V  
3 ns  
Input Pulse Level  
Input Rise and Fall Times  
Input and Output Timing  
and Reference Level  
1.5V  
Output Load  
See Figures 1a and 1b  
Notes:  
1. The Vcc operating range for 8 ns is 3.3V +10%, -5%.  
AC TEST LOADS  
319  
319 Ω  
3.3V  
3.3V  
OUTPUT  
OUTPUT  
353 Ω  
353 Ω  
5 pF  
30 pF  
Including  
jig and  
scope  
Including  
jig and  
scope  
Figure 1a.  
Figure 1b.  
4
Integrated Circuit Solution Inc.  
SR013-0C  
IS61LV6416  
AC WAVEFORMS  
READ CYCLE NO. 1(1,2) (Address Controlled) (CS = OE = VIL, UB or LB = VIL)  
1
t
RC  
ADDRESS  
2
t
AA  
t
OHA  
t
OHA  
DATA VALID  
DOUT  
PREVIOUS DATA VALID  
3
4
READ CYCLE NO. 2(1,3)  
t
RC  
5
ADDRESS  
OE  
t
AA  
t
OHA  
6
t
HZOE  
t
DOE  
LZOE  
ACE  
t
CE  
7
t
t
HZCE  
t
LZCE  
LB, UB  
8
t
BA  
t
HZB  
t
LZB  
HIGH-Z  
DOUT  
DATA VALID  
9
Notes:  
1. WE is HIGH for a Read Cycle.  
2. The device is continuously selected. OE, CE, UB, or LB = VIL.  
3. Address is valid prior to or coincident with CE LOW transition.  
10  
11  
12  
Integrated Circuit Solution Inc.  
SR013-0C  
5
IS61LV6416  
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)  
-8  
-10  
Min.  
-12  
Min.  
-15  
Min.  
Symbol Parameter  
Min.  
Max.  
—
Max.  
—
Max.  
—
Max.  
—
Unit  
ns  
tWC  
tSCE  
tAW  
Write Cycle Time  
8
7
7
10  
8
12  
9
15  
10  
10  
CE to Write End  
—
—
—
—
ns  
Address Setup Time  
to Write End  
—
8
—
9
—
—
ns  
tHA  
Address Hold from Write End  
Address Setup Time  
0
0
—
—
—
—
—
—
4
0
0
—
—
—
—
—
—
5
0
0
—
—
—
—
—
—
6
0
0
—
—
—
—
—
—
7
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tSA  
tPWB  
tPWE  
tSD  
LB, UB Valid to End of Write  
WE Pulse Width  
7
8
9
10  
10  
7
7
8
9
Data Setup to Write End  
Data Hold from Write End  
WE LOW to High-Z Output  
WE HIGH to Low-Z Output  
4.5  
0
5
6
tHD  
0
0
0
(2)  
tHZWE  
—
3
—
3
—
3
—
3
(2)  
tLZWE  
—
—
—
—
Notes:  
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V  
and output loading specified in Figure 1a.  
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.  
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals must be in valid states to  
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the  
rising or falling edge of the signal that terminates the write.  
6
Integrated Circuit Solution Inc.  
SR013-0C  
IS61LV6416  
AC WAVEFORMS  
WRITE CYCLE NO. 1 (WE Controlled)(1,2)  
1
t
WC  
2
ADDRESS  
CE  
t
HA  
t
SCE  
3
t
PWB  
LB, UB  
4
t
AW  
t
PWE  
5
WE  
t
SA  
(1)  
WRITE  
D
6
t
SD  
t
HD  
IN  
7
t
HZWE  
t
LZWE  
HIGH-Z  
HIGH-Z  
DOUT  
UNDEFINED  
UNDEFINED  
8
Notes:  
9
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at least  
one of the LB and UB inputs being in the LOW state.  
2. WRITE = (CE) [ (LB) = (UB) ] (WE).  
10  
11  
12  
Integrated Circuit Solution Inc.  
SR013-0C  
7
IS61LV6416  
ORDERING INFORMATION  
ORDERING INFORMATION  
Commercial Range: 0°C to +70°C  
Industrial Range: –40°C to +85°C  
Speed (ns) Order Part No.  
Package  
Speed (ns) Order Part No.  
Package  
8
8
8
IS61LV6416-8B  
IS61LV6416-8T  
IS61LV6416-8K  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
8
8
8
IS61LV6416-8BI  
IS61LV6416-8TI  
IS61LV6416-8KI  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
10  
10  
10  
IS61LV6416-10B  
IS61LV6416-10T  
IS61LV6416-10K  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
10  
10  
10  
IS61LV6416-10BI  
IS61LV6416-10TI  
IS61LV6416-10KI  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
12  
12  
12  
IS61LV6416-12B  
IS61LV6416-12T  
IS61LV6416-12K  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
12  
12  
12  
IS61LV6416-12BI  
IS61LV6416-12TI  
IS61LV6416-12KI  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
15  
15  
15  
IS61LV6416-15B  
IS61LV6416-15T  
IS61LV6416-15K  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
15  
15  
15  
IS61LV6416-15BI  
IS61LV6416-15TI  
IS61LV6416-15KI  
6*8mm TF-BGA  
400mil TSOP-2  
400mil SOJ  
Integrated Circuit Solution Inc.  
HEADQUARTER:  
NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,  
HSIN-CHU, TAIWAN, R.O.C.  
TEL: 886-3-5780333  
Fax: 886-3-5783000  
BRANCH OFFICE:  
7F, NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,  
HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.  
TEL: 886-2-26962140  
FAX: 886-2-26962252  
http://www.icsi.com.tw  
8
Integrated Circuit Solution Inc.  
SR013-0C  

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