ICS557G-08 [ICSI]
2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS; 2 ： 1多路复用器芯片的PCI-Express
| 型号： | ICS557G-08 |
| 厂家： | 
INTEGRATED CIRCUIT SOLUTION INC |
| 描述： | 2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS |
| 文件： | 总11页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ICS557-08
2:1 MULTIPLEXER CHIP FOR PCI-EXPRESS
Description
Features
The ICS557-08 is a 2:1 multiplexer chip that allows the
user to select one of the two HCSL (Host Clock Signal
Level) or LVDS input pairs and fan out to one pair of
differential HCSL or LVDS outputs. This chip is suited
especially for PCI-Express applications, where there is
a need to select the PCI-Express clock either locally
from the PCI-E card or from the motherboard.
• Packaged in 16-pin TSSOP
• Available in Pb (lead) free package
• Operating voltage of 3.3 V
• Low power consumption
• Input clock frequency of up to 200 MHz for HCSL and
up to 100 MHz for LVDS
• Jitter 60 ps (cycle-to-cycle)
Block Diagram
OE
VDD
3
IN1
CLK
CLK
IN1
MUX
2 to 1
IN2
IN2
3
Rr (IREF)
SEL
GND
PD
MDS 557-08 C
1
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Pin Assignment
Select Table
Input Pair
selected
1
SEL
CLK
16
15
14
13
12
11
10
9
SEL
VDD
IN1
IN1
PD
IN2
IN2
2
3
4
5
6
7
8
0
1
IN2/ IN2
IN1/ IN1
CLK
GND
GND
VDD
VDD
IREF
OE
GND
16-pin (173 mil) TSSOP
Pin Descriptions
Pin
Pin
Pin
Type
Pin Description
Name
1
2
3
4
5
6
7
VDD
IN1
IN1
PD
Power Connect to +3.3 V. Supply voltage for Input clocks.
Input
Input
Input
Input
Input
Input
HCSL/LVDS true input signal 1.
HCSL/LVDS complimentary input signal 1.
Powers down the chip and tri-states outputs when low. Internal pull-up resistor.
HCSL/LVDS true input signal 2.
IN2
IN2
OE
HCSL/LVDS complimentary input signal 2.
Provides output or, tri-states output (High = enable outputs; Low = disable). Internal
pull-up resistor.
8
GND
Power Connect to ground.
9
IREF
VDD
VDD
GND
GND
CLK
CLK
SEL
Output Precision resistor attached to this pin is connected to the internal current reference.
Power Connect to +3.3 V. Supply Voltage for Output Clocks.
Power Connect to +3.3 V. Supply Voltage for Output Clocks.
Power Connect to ground.
10
11
12
13
14
15
16
Power Connect to ground.
Output HCSL/LVDS Complimentary output clock .
Output HCSL/LVDS True output clock.
Input
SEL=1 selects IN1/IN1. SEL =0 selects IN2/ IN2. Internal pull-up resistor.
MDS 557-08 C
2
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Application Information
Decoupling Capacitors
External Components
As with any high-performance mixed-signal IC, the
ICS557-08 must be isolated from system power supply
noise to perform optimally.
A minimum number of external components are
required for proper operation. Decoupling capacitors of
0.01 µF should be connected between VDD and GND
pins as close to the device as possible.
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane.
Current Reference Source Rr (Iref)
If board target trace impedance (Z) is 50Ω, then Rr =
475Ω (1%), providing IREF of 2.32 mA, output current
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
(I ) is equal to 6*IREF.
OH
Load Resistors RL
Each 0.01µF decoupling capacitor should be mounted
on the component side of the board as close to the
VDD pin as possible. No vias should be used between
decoupling capacitor and VDD pin. The PCB trace to
VDD pin should be kept as short as possible, as should
the PCB trace to the ground via. Distance of the ferrite
bead and bulk decoupling from the device is less
critical.
Since the clock outputs are open source outputs, 50Ω
external resistors to ground are to be connected at
each clock output.
Output Termination
The PCI-Express differential clock outputs of the
ICS557-08 are open source drivers and require an
external series resistor and a resistor to ground. These
resistor values and their allowable locations are shown
in detail in the PCI-Express Layout Guidelines
section.
2) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers (the ferrite bead and bulk decoupling
capacitor can be mounted on the back). Other signal
traces should be routed away from the ICS557-08.
The ICS557-08 can also be configured for LVDS
compatible voltage levels. See the LVDS Compatible
Layout Guidelines section.
This includes signal traces just underneath the device,
or on layers adjacent to the ground plane layer used by
the device.
MDS 557-08 C
3
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Output Structures
6*IREF
IREF
=2.3 mA
See Output Termination
Sections - Pages 3 ~ 5
Ω
RR 475
General PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1. Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible.
2. No vias should be used between decoupling
capacitor and VDD pin.
3. The PCB trace to VDD pin should be kept as short
as possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from
the device is less critical.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers (any ferrite beads and bulk decoupling
capacitors can be mounted on the back). Other signal
traces should be routed away from the ICS557-08.This
includes signal traces just underneath the device, or on
layers adjacent to the ground plane layer used by the
device.
MDS 557-08 C
4
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
PCI-Express Layout Guidelines
Common Recommendations for Differential Routing
Dimension or Value Unit
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
L3 length, Route as non-coupled 50 ohm trace.
RS
RT
0.5 max
0.2 max
0.2 max
33
inch
inch
inch
ohm
ohm
49.9
Differential Routing on a Single PCB
Dimension or Value Unit
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
2 min to 16 max
1.8 min to 14.4 max
inch
inch
Differential Routing to a PCI Express Connector
L4 length, Route as coupled microstrip 100 ohm differential trace.
L4 length, Route as coupled stripline 100 ohm differential trace.
Dimension or Value Unit
0.25 to 14 max inch
0.225 min to 12.6 max inch
PCI-Express Device Routing
L1
L2
L4
RS
RS
L4’
L1’
L2’
RT
RT
PCI-Express
Load or
Connector
ICS557-08
Output
L3’ L3
Clock
Typical PCI-Express (HCSL)
Waveform
700 mV
0
500 ps
500 ps
tOR
tOF
0.525 V
0.175 V
0.525 V
0.175 V
MDS 557-08 C
5
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
LVDS Compatible Layout Guidelines
LVDS Recommendations for Differential Routing
Dimension or Value Unit
L1 length, Route as non-coupled 50 ohm trace.
L2 length, Route as non-coupled 50 ohm trace.
RP
RQ
0.5 max
0.2 max
100
100
150
inch
inch
ohm
ohm
ohm
RT
L3 length, Route as coupled 50 ohm differential trace.
L3 length, Route as coupled 50 ohm differential trace.
LVDS Device Routing
L1
L3
RQ
RP
L3’
L1’
RT
RT
ICS557-08
Clock
Output
LVDS
Device
Load
L2’ L2
Typical LVDS Waveform
1325 mV
1000 mV
500 ps
500 ps
tOR
tOF
1250 mV
1150 mV
1250 mV
1150 mV
MDS 557-08 C
6
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS557-08. These ratings are
stress ratings only. Functional operation of the device at these or any other conditions above those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed
only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDD
All Inputs and Outputs
7 V
-0.5 V to VDD+0.5 V
-40 to +85°C
-65 to +150°C
125°C
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
ESD Protection (Input)
260°C
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V 5%, Ambient Temperature -40 to +85°C
Parameter
Supply Voltage
Input High Voltage
Symbol
Conditions
Min.
3.135
2.0
Typ.
Max.
Units
V
V
3.465
1
V
OE, SEL, PD
VDD +0.3
V
IH
1
Input Low Voltage
V
OE, SEL, PD
VSS-0.3
-5
0.8
5
V
IL
2
Input Leakage Current
I
0 < Vin < VDD
50Ω, 2 pF
µA
mA
mA
µA
pF
pF
nH
kΩ
kΩ
IL
Operating Supply Current
I
40
20
400
7
DD
I
OE =Low
DDOE
I
No load, PD =Low
Input pin capacitance
Output pin capacitance
DDPD
Input Capacitance
Output Capacitance
Pin Inductance
C
IN
C
6
OUT
L
5
PIN
Output Resistance
Pull-up Resistor
R
R
CLK outputs
OE, SEL, PD
3.0
OUT
PUP
110
1 Single edge is monotonic when transitioning through region.
2 Inputs with pull-ups/-downs are not included.
MDS 557-08 C
7
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
AC Electrical Characteristics -
Unless stated otherwise, VDD=3.3 V 5%, Ambient Temperature -40 to +85°C
Parameter
Symbol
Conditions
HCSL termination
Min.
Typ.
Max.
200
100
850
Units
MHz
MHz
mV
Operating Frequency
LVDS termination
HCSL
1,2
Input High Voltage
V
660
-150
250
700
0
IH
1,2
Input Low Voltage
V
HCSL
mV
IL
Differential Input
Voltages
(V )
LVDS
350
450
mV
ID
Input Offset Voltage
(V )
LVDS
1.125
660
1.25
700
0
1.375
850
V
IS
1,2
Output High Voltage
V
HCSL
mV
mV
mV
OH
1,2
Output Low Voltage
V
HCSL
Absolute
-150
250
OL
Crossing Point
350
550
140
1,2
Voltage
Crossing Point
Variation over all edges
mV
1,2,4
Voltage
1,3
Jitter, Cycle-to-Cycle
60
ps
ps
ps
ps
1,2
Rise Time
t
From 0.175 V to 0.525 V
From 0.525 V to 0.175 V
175
175
332
344
700
700
125
OR
1,2
Fall Time
t
OF
Rise/Fall Time
1,2
Variation
1,3
Duty Cycle
45
55
%
µs
µs
ms
ns
5
Output Enable Time
Output Disable Time
Stabilization Time
All outputs
10
10
3.0
4
5
All outputs
t
From power-up VDD=3.3 V
STABLE
Input to Output Delay
Input differential clock to output
differential clock delay measured at
crossing point of input levels to
crossing point of output levels
1
2
3
4
5
Test setup is R =50 ohms with 2 pF, Rr = 475Ω (1%).
L
Measurement taken from a single-ended waveform.
Measurement taken from a differential waveform.
Measured at the crossing point where instantaneous voltages of both CLK and CLK are equal.
CLK and CLK pins are tri-stated when OE is Low asserted. CLK and CLK are driven differential when OE is High
unless its PD = low.
MDS 557-08 C
8
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Thermal Characteristics
Parameter
Symbol
Conditions
Min.
Typ. Max. Units
Thermal Resistance Junction to
Ambient
θ
θ
θ
Still air
93
78
65
20
°C/W
°C/W
°C/W
°C/W
JA
JA
JA
JC
1 m/s air flow
3 m/s air flow
Thermal Resistance Junction to Case
θ
Marking Diagram (ICS557G-08)
Marking Diagram (ICS557GI-08)
16
9
16
9
557G-08
######
YYWW$$
557GI-08
######
YYWW$$
1
8
1
8
Marking Diagram (ICS557G-08LF)
Marking Diagram (ICS557GI-08LF)
16
9
16
9
557GI08L
######
YYWW
557G08LF
######
YYWW
1
1
8
8
Notes:
1. ###### is the lot code.
2. YYWW is the last two digits of the year, and the week number that the part was assembled.
3. “LF” denotes Pb free package.
4. “I” denotes industrial temperature device
5. Bottom marking: (origin). Origin = country of origin if not USA.
MDS 557-08 C
9
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Package Outline and Package Dimensions (16-pin TSSOP, 173 Mil. Narrow Body)
Package dimensions are kept current with JEDEC Publication No. 95
16
Millimeters
Min Max
Inches*
Symbol
Min
Max
A
A1
A2
b
--
1.20
0.15
1.05
0.30
0.20
5.1
--
0.047
0.006
0.041
0.012
0.05
0.80
0.19
0.09
4.90
0.002
0.032
0.007
0.0035 0.008
0.193 0.201
0.252 BASIC
0.169 0.177
0.0256 Basic
E1
E
INDEX
AREA
C
D
E
E1
e
1
2
6.40 BASIC
4.30
4.50
D
0.65 Basic
L
α
0.45
0°
0.75
8°
0.018
0°
0.030
8°
aaa
--
0.10
--
0.004
A
A2
*For reference only. Controlling dimensions in mm.
A1
c
- C -
e
SEATING
PLANE
b
L
aaa C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
0 to +70° C
ICS557G-08
Tubes
Tape and Reel
Tubes
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
16-pin TSSOP
ICS557G-08T
0 to +70° C
See Page 9
See Page 9
ICS557G-08LF
ICS557G-08LFT
ICS557GI-08
0 to +70° C
Tape and Reel
Tubes
0 to +70° C
-40 to +85° C
-40 to +85° C
-40 to +85° C
-40 to +85° C
ICS557GI-08T
ICS557GI-08LF
ICS557GI-08LFT
Tape and Reel
Tubes
Tape and Reel
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
MDS 557-08 C
10
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
ICS557-08
2:1 Multiplexer Chip for PCI-Express
Revision History
Rev. Originator
Date
Description of Change
C
D.Chan
02/16/06 Added industrial temp range; updated PCI-Express Waveform diagram to include 0.525 V;
changed “Supply Voltage, VDD” spec in Absolute Max. Ratings from 5.5 V to 7 V; changed
CLKOUT to CLK and CLK ; added marking diagrams for I-temp device.
MDS 557-08 C
11
Revision 021606
Integrated Circuit Systems ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com
相关型号：
ICS557G-08T-LF
Low Skew Clock Driver, 557 Series, 1 True Output(s), 0 Inverted Output(s), PDSO16, 0.173 INCH, TSSOP-16
IDT
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