HY1710B [HUAYI]
N-Channel Enhancement Mode MOSFET;
| 型号： | HY1710B |
| 厂家： | 
HUAYI MICROELECTRONICS CO.,LTD. |
| 描述： | N-Channel Enhancement Mode MOSFET |
| 文件： | 总14页 (文件大小：1254K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HY1710P/M/B/MF/PS/PM
N-Channel Enhancement Mode MOSFET
Feature
Pin Description
z
100V/70A
RDS(ON)= 15mΩ(typ.)@VGS = 10V
S
D
G
z
z
z
100% Avalanche Tested
Reliable and Rugged
S
D
G
S
D
G
Lead- Free Devices Available
(RoHS Compliant)
TO-263-2L
TO-220FB-3L
TO-220FB-3S
Applications
S
D
z
z
Switching application
Power management for inverter systems
G
S
S
D
D
G
G
TO-220MF-3L
TO-3PS-3L
TO-3PM-3M
N-Channel MOSFET
Ordering and Marking Information
Package Code
P
M
B
P :TO-220FB-3L
B:TO-263-2L
PS:TO-3PS-3L
M:TO-220FB-3S
MF:TO-220MF-3L
PM:TO-3PM-3S
HY1710
YYXXXJWW G
HY1710
HY1710
YYXXXJWW G YYXXXJWW G
MF
PS
PM
Date Code
YYXXX WW
Assembly Material
G:Lead Free
HY1710
YYXXXJWW G
HY1710
HY1710
YYXXXJWW G YYXXXJWW G
Note: HUAYI lead -free products contain molding compounds/die attach materials and 100% matte tin plate Termi-
Nation finish;which are fully compliant with RoHS. HUAYI lead -free products meet or exceed the lead-Free require-
ments of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines “Green”
to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous
material and total of Br and Cl does not exceed 1500ppm by weight).
HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr
-oduct and/or to this document at any time without notice.
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V1.0
1
HY1710P/M/B/MF/PS/PM
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings (Tc=25°C Unless Otherwise Noted)
VDSS
VGSS
TJ
Drain-Source Voltage
100
±25
V
V
Gate-Source Voltage
Maximum Junction Temperature
Storage Temperature Range
Source Current-Continuous(Body Diode)
-55 to 175
-55 to 175
70
°C
°C
A
TSTG
IS
Tc=25°C
Mounted on Large Heat Sink
IDM Pulsed Drain Current *
Tc=25°C
Tc=25°C
Tc=100°C
Tc=25°C
Tc=100°C
252**
70
A
A
ID
Continuous Drain Current
49
A
150
75
W
PD
Maximum Power Dissipation
W
RTJC
RTJA
EAS
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient **
SinglePulsed-Avalanche Energy ***
1.0
°C/W
°C/W
mJ
62.5
260***
L=0.3 mH
Note:
*
Repetitive rating˗pulse width limited by max.junction temperature.
** Surface mounted on 1in2 FR-4 board.
*** Limited by TJmax , starting TJ=25°C, L = 0.3mH, RG= 25Ω, VGS =10V.
Electrical Characteristics(Tc =25°C Unless Otherwise Noted)
HY1710
Symbol
Parameter
Test Conditions
Unit
Min
Typ.
Max
Static Characteristics
VGS=0V,IDS= 250μA
BVDSS
Drain-Source Breakdown Voltage
100
-
-
-
1
V
VDS= 100V,VGS=0V
-
-
μA
μA
V
IDSS
Drain-to-Source Leakage Current
TJ=125°C
-
50
4
VDS=VGS, IDS= 250μA
VGS=f25V,VDS=0V
VGS= 10V,IDS= 35A
VGS(th)
IGSS
Gate Threshold Voltage
2
-
3
-
Gate-Source Leakage Current
Drain-Source On-State Resistance
±100
18
nA
mΩ
RDS(ON)
-
15
Diode Characteristics
Diode Forward Voltage
ISD=35A,VGS=0V
-
-
-
0.8
50
1
-
V
VSD
trr
Reverse Recovery Time
Reverse Recovery Charge
ns
nC
ISD=35A,dISD/dt=100A/μs
Qrr
130
-
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V1.0
2
HY1710P/M/B/ MF /PS/PM
Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted)
HY1710
Typ.
Symbol
Parameter
Test Conditions
Unit
Min
Max
Dynamic Characteristics
RG
Ciss
Coss
Crss
td(ON)
Tr
Gate Resistance
VGS=0V,VDS=0V,F=1MHz
VGS=0V,
-
-
-
-
-
-
-
1.2
4200
273
190
27
-
-
-
-
-
-
-
-
Ω
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn-on Delay Time
Turn-on Rise Time
Turn-off Delay Time
Turn-off Fall Time
VDS= 25V,
pF
Frequency=1.0MHz
23
VDD= 50V,RG=6Ω,
ns
IDS= 35A,VGS= 10V
td(OFF)
Tf
60
45
Gate Charge Characteristics
Qg
Qgs
Qgd
Total Gate Charge
-
-
-
94
16
24
-
-
-
VDS = 80V, VGS= 10V,
IDs= 35A
nC
Gate-Source Charge
Gate-Drain Charge
Note: *Pulse testˈpulse width ≤ 300usˈduty cycle ≤ 2%
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V1.0
3
HY1710P/M/B/ MF /PS/PM
Typical Operating Characteristics
Figure 1: Power Dissipation
Figure 2: Drain Current
Tc-Case Temperature(ć)
Tc-Case Temperature(ć)
Figure 3: Safe Operation Area
Figure 4: Thermal Transient Impedance
VDS-Drain-Source Voltage(V)
Maximum Effective Transient Thermal
Impedance, Junction-to-Case
Figure 5: Output Characteristics
Figure 6: Drain-Source On Resistance
VDS-Drain-Source Voltage (V)
ID-Drain Current(A)
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V1.0
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HY1710P/M/B/ MF /PS/PM
Typical Operating Characteristics(Cont.)
Figure 7: On-Resistance vs. Temperature
Figure 8: Source-Drain Diode Forward
0
Tj-Junction Temperature (ć)
VSD-Source-Drain Voltage(V)
Figure 9: Capacitance Characteristics
Figure 10: Gate Charge Characteristics
VDS-Drain-Source Voltage (V)
QG-Gate Charge (Q&)
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V1.0
5
HY1710P/M/B/ MF /PS/PM
Avalanche Test Circuit
Switching Time Test Circuit
Gate Charge Test Circuit
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V1.0
6
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220FB-3L
Tube
50
Package Information
TO-220FB-3L
COMMON DIMENSIONS
mm
NOM
4.57
SYMBOL
MIN
4.37
1.25
2.20
0.70
1.17
0.40
15.10
8.80
5.50
9.70
7.00
MAX
4.77
1.45
2.60
0.95
1.47
0.65
16.10
9.40
-
A
A1
A2
b
1.30
2.40
0.80
b2
c
1.27
0.50
D
15.60
9.10
D1
D2
E
-
10.00
-
10.30
-
E3
e
2.54 BSC
5.08 BSC
6.50
e1
H1
L
6.25
12.75
-
6.85
13.80
3.40
3.80
3.00
13.50
3.10
L1
ΦP
Q
3.40
2.60
3.60
2.80
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V1.0
7
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220FB-3S
Tube
50
Package Information
TO-220FB-3S
COMMON DIMENSIONS
mm
NOM
4.57
SYMBOL
MIN
4.37
1.25
2.20
0.70
1.17
0.40
15.10
8.10
5.50
9.70
7.00
MAX
4.77
1.45
2.60
0.95
1.47
0.65
16.10
9.40
-
A
A1
A2
b
1.30
2.40
0.80
b2
c
1.27
0.50
D
15.60
9.10
D1
D2
E
-
10.00
-
10.30
-
E3
e
2.54 BSC
5.08 BSC
6.50
e1
H1
L
6.25
6.80
-
6.85
7.20
3.40
3.80
3.00
7.00
L1
ΦP
Q
3.10
3.40
2.60
3.60
2.80
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V1.0
8
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-263-2L
Reel
50
Package Information
TO-263-2L
COMMON DIMENSIONS
mm
NOM
4.57
1.27
2.69
0.13
0.81
1.27
0.38
8.7
SYMBOL
MIN
4.37
1.22
2.49
0
MAX
4.77
1.42
2.89
0.25
0.96
1.47
0.53
8.9
A
A1
A2
A3
b
0.7
b1
c
1.17
0.3
D1
D4
E
8.5
6.6
-
-
9.86
7.06
10.16
-
10.36
-
E5
e
2.54 BSC
15.1
1.27
2.3
H
14.7
1.07
2
15.5
1.47
2.6
H2
L
L1
L4
θ
1.4
1.55
0.25 BSC
5°
1.7
0°
9°
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V1.0
9
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-220MF-3L
Tube
50
Package Information
TO-220MF-3L
COMMON DIMENSIONS
mm
NOM
10.16
4.70
SYMBOL
MIN
9.96
4.50
2.34
0.30
2.56
0.40
1.20
15.57
MAX
10.36
4.90
2.74
0.60
2.96
0.65
1.35
16.17
E
A
A1
A2
A4
c
2.54
0.45
2.76
0.50
c1
D
1.30
15.87
6.70REF
2.54BSC
12.98
3.03
H1
e
L
12.68
2.93
3.03
3.15
3.15
1.25
1.18
0.70
13.28
3.13
3.38
3.65
3.45
1.55
1.43
0.95
L1
ΦP
ΦP3
F3
G3
b1
b2
3.18
3.45
3.30
1.35
1.28
0.80
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V1.0
10
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-3PS-3L
Tube
50
Package Information
TO-3PS-3L
COMMON DIMENSIONS
mm
NOM
3.56
1.30
1.54
0.80
1.27
0.50
15.70
9.20
10.00
SYMBOL
MIN
3.36
1.25
1.39
0.75
1.17
0.45
15.45
9.00
9.88
MAX
3.76
1.40
1.69
0.90
1.42
0.60
15.95
9.40
10.20
A
A1
A2
b
b2
c
D
D1
E
e
2.54
BSC
L
13.20
-
13.40
3.00
13.60
3.30
L1
ΦP1
Q
3.20 REF
4.00
3.88
4.12
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V1.0
11
HY1710P/M/B/ MF /PS/PM
Device Per Unit
Package Type
Unit
Quantity
TO-3PM-3S
Tube
50
Package Information
TO-3PM-3S
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V1.0
12
HY1710P/M/B/ MF /PS/PM
Classification Profile
Classification Reflow Profiles
Profile Feature
Preheat & Soak
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
150 °C
200 °C
Temperature min (Tsmin
)
Temperature max (Tsmax
)
60-120 seconds
60-120 seconds
Time (Tsmin to Tsmax) (t
Average ramp-up rate
s
)
3 °C/second max.
3°C/second max.
(Tsmaxto T
Liquidous temperature (T
Time at liquidous (t
Peak package body Temperature
(T )*
Time (t
classification temperature (T
Average ramp-down rate (T to Tsmax
Time 25°C to peak temperature
P
)
L
)
183 °C
217 °C
L
)
60-150 seconds
60-150 seconds
See Classification Temp in table 1 SeeClassification Tempin table 2
p
P
)** within 5°C of the specified
20** seconds
30** seconds
c)
p
)
6 °C/second max.
6 minutes max.
6 °C/second max.
8 minutes max.
*Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum.
p
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V1.0
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HY1710P/M/B/ MF /PS/PM
Table 1.SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
˘2.5 mm
≥2.5 mm
Volume mmϢ
<350
Volume mmϢ
ı350
235 °C
220 °C
220 °C
220 °C
Table 2.Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
Volume mmϢ
<350
Volume mmϢ
350-2000
260 °C
Volume mmϢ
ı2000
260 °C
260 °C
1.6 mm – 2.5 mm
ı2.5 mm
260 °C
250 °C
245 °C
250 °C
245 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HTRB
Method
Description
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
5 Sec, 245°C
168 Hrs /500 Hrs /1000 Hrs, Bias @ 150°C
96 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -55°C~150°C
PCT
TCT
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