JK250-145M [HUAXINAN]

Resettable Fuse PTC SMD 250 Series;
JK250-145M
型号: JK250-145M
厂家: HuaXinAn Electronics CO.,LTD    HuaXinAn Electronics CO.,LTD
描述:

Resettable Fuse PTC SMD 250 Series

文件: 总4页 (文件大小:317K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SMD 250V Series  
Resettable Fuse PTC SMD 250 Series  
Features  
RoHS Compliant  
faster tripping, Surface mountable, Solid state  
Operation Current: 0.1A~0.2A  
Maximum Voltage: 250Vdc  
Operating Temperature-40to +85℃  
Agency recognition:  
Dimensions Unit: mm  
120M  
Terminal pad materials :Tin-Plated Nickle-copper  
Terminal pad solderability : Meets EIA specification  
RS 186-9E and ANSI/J-STD-002 Category 3.  
Certification  
Delivery Time  
A
B
C
D
Marking  
in stock Produce  
Part number  
UL  
TUV  
Min  
max  
Min  
Max  
Min Max  
Min  
3days 18days  
3days 18days  
3days 18days  
3days 18days  
3days 18days  
3days 18days  
JK250  
100M  
JK250  
110M  
JK250-100M  
8.5  
9.5  
6.0  
7.5  
2.5  
2.5  
2.5  
2.5  
2.5  
2.5  
3.5  
3.5  
3.5  
3.5  
3.5  
3.5  
0.50  
0.50  
0.50  
0.50  
0.50  
0.50  
-
-
JK250-110M  
JK250-120M  
JK250-145M  
JK250-180M  
JK250-200M  
8.5  
8.5  
8.5  
8.5  
8.5  
9.5  
9.5  
9.5  
9.5  
9.5  
6.0  
6.0  
6.0  
6.0  
6.0  
7.5  
7.5  
7.5  
7.5  
7.5  
-
-
-
-
-
-
-
-
-
-
JK250  
120M  
JK250  
145M  
JK250  
180M  
JK250  
200M  
Specifications are subject to change without notice  
1
Tel: +86-755-27465585  
HUAAN LIMITED  
www.huaandz.com  
Email: sales@huaandz.com  
SMD 250V Series  
Electrical characteristics(25)  
Maximum Time  
to Trip  
I
V
max Imax  
ResistanceΩ)  
I Trip  
Delivery Time  
in stock Produce  
Replacement  
Hold  
Part Number  
DIP part number  
Current  
Time  
R1max  
A)  
S)  
Rimin  
Rityp  
mA  
mA  
DC  
A
-
-
3days 18days = JK250-100U  
3days 18days = JK250-110U  
3days 18days = JK250-120U  
3days 18days = JK250-145U  
3days 18days = JK250-180U  
3days 18days = JK250-200U  
100 200  
110 220  
120 240  
145 290  
180 360  
200 400  
250  
3
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
2.0  
2.0  
2.0  
2.0  
2.0  
2.0  
-
-
JK250-100M  
JK250-110M  
JK250-120M  
JK250-145M  
JK250-180M  
JK250-200M  
250  
250  
250  
250  
250  
3
3
3
3
3
-
6
-
-
14  
-
25  
-
-
-
-
-
-
-
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.  
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.  
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).  
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).  
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.  
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.  
R1max = Maximum device resistance is measured one hour post reflow.  
Part number System  
JK- 250 -xxx M  
Surface Mount Device  
Holding Current Rating  
250V max  
Our Mark  
Test Conditions and Standards (JK250-120M)  
Item  
Test Conditions  
25  
Standard  
6~14Ω  
Initial Resistance  
Hold Current  
Time to Trip  
25,120mA,60min  
25,1.0A  
No Trip  
≤2.0s  
Trip Endurance  
250V,3A,15min  
No arcing or burning  
Specifications are subject to change without notice  
2
Tel: +86-755-27465585  
HUAAN LIMITED  
www.huaandz.com  
Email: sales@huaandz.com  
SMD 250V Series  
Recommended Pad layout(mm)  
Solder reflow conditions  
Profile Feature  
Pb-Free Assembly  
Average ramp-up rate (TS maxto TP)  
Preheat  
3/second max.  
-Temperature Min (TS min)  
-Temperature Max (TS max)  
-Time (min to max) (TS min to TS max)  
Time maintained above:  
-Temperature (TL)  
150℃  
200℃  
60-180 seconds  
217℃  
-Time (tL)  
60-150 seconds  
260℃  
Peak Temperature (TP)  
Time within 5of actual PeakTemperature (tP)  
Ramp-down Rate  
20-40 seconds  
3/second max.  
8 minutes max.  
0~35, ≤70%RH  
Time 25to Peak Temperature  
StorageCondition  
·Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free  
Specifications are subject to change without notice  
3
Tel: +86-755-27465585  
HUAAN LIMITED  
www.huaandz.com  
Email: sales@huaandz.com  
SMD 250V Series  
Solder reflow conditions  
·Devices are not designed to be wave soldered to the bottom side of the board.  
·Recommended maximum paste thickness is 0.25mm (0.010 inch)  
·Device can be cleaned using standard industry methods and solvents.  
·Soldering temprature profile meets RoHs leadfree process.  
Note : If reflow temperatures exceed the recommended profile, devices may not meet the performance Requirements  
Packaging Quantity  
Part Number  
Quantity  
1000PCS  
Part Number  
JK250-110M  
JK250-180M  
Quantity  
1000PCS  
Part Number  
JK250-120M  
JK250-200M  
Quantity  
1000PCS  
JK250-100M  
JK250-145M  
1000PCS  
1000PCS  
1000PCS  
Storage  
The maximum ambient temperature shall not exceed 38. Storage temperatures higher than 38could result in the  
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with  
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the  
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be  
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.  
Warning  
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and  
flame.  
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be  
used when repeated fault conditions or prolonged trip events are anticipated.  
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended  
electronic, thermal, and mechanical procedures for electronic components.  
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.  
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.  
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the  
performance of the devices.PPTC SMD can be cleaned by standard methods.  
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper  
board layouts or reflow profilecould negatively impact solderability performance of our devices.  
Notes  
The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit  
production devices,However,users should imdependently evaluate and test the suitability of each product.HUAAN makes  
on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,  
HUAAN’s only obligations are those im the HUAAN Standard Rerms and Conditions of Sale and in no case will HUAAN be  
liable for any incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. HUAAN  
reserves the right to change of update, without notice, any information contained in this specification.  
Specifications are subject to change without notice  
4
Tel: +86-755-27465585  
HUAAN LIMITED  
www.huaandz.com  
Email: sales@huaandz.com  

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