JK-SMD-0603-050L [HUAXINAN]
Low Resistance Resettable Fuse PTC SMD0603 Series;型号: | JK-SMD-0603-050L |
厂家: | HuaXinAn Electronics CO.,LTD |
描述: | Low Resistance Resettable Fuse PTC SMD0603 Series |
文件: | 总6页 (文件大小:389K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SMD0603 Low Resistance Series
Low Resistance Resettable Fuse PTC SMD0603 Series
Features
RoHS Compliant & Halogen Free
faster tripping, 0603 Dimension, Surface mountable, Solid state
Operation Current: 0.35A~3.0A
Maximum Voltage: 6V
Operating Temperature:-40℃ to +85℃
Agency recognition:
Dimensions(1608mm / 0603 mils) Unit: mm
UL TUV
Delivery Time
A
B
C
D
E
Marking
in stock Produce
Part number
Min max Min Max
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
1.45 1.85 0.65 1.05
Min Max Min Min
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
JK-SMD-0603-035L
JK-SMD-0603-050L
JK-SMD-0603-075L
JK-SMD-0603-100L
JK-SMD-0603-125L
JK-SMD-0603-150L
JK-SMD-0603-175L
JK-SMD-0603-200L
JK-SMD-0603-260L
JK-SMD-0603-300L
A
A
A
B
B
C
C
C
E
E
0.3
0.3
0.3
0.4
0.4
0.5
0.5
0.7
0.7
0.7
0.7 0.15
0.7 0.15
0.7 0.15
1.0 0.15
1.0 0.15
1.2 0.15
1.2 0.15
1.4 0.15
1.4 0.15
1.4 0.15
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Specifications are subject to change without notice
1
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
SMD0603 Low Resistance Series
Electrical characteristics(25℃)
Pd
Maximum Time
to Trip
V
max
Imax
Resistance(Ω)
I Hold
I Trip
Max
Certification
Delivery Time
Current
Time
in stock Produce
Part Number
(A)
(S)
A
A
DC
A
Rimin
W
R1max
UL TUV
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
3days 18days
0.35 0.70
6.0V
6.0V
6.0V
6.0V
6.0V
6.0V
6.0V
6.0V
6.0V
6.0V
50
0.50
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
0.1
0.6
1.0
2.0
3.0
4.0
5.0
5.0
5.0
5.0
0.15
1.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
JK-SMD-0603-035L
JK-SMD-0603-050L
JK-SMD-0603-075L
JK-SMD-0603-100L
JK-SMD-0603-125L
JK-SMD-0603-150L
JK-SMD-0603-175L
JK-SMD-0603-200L
JK-SMD-0603-260L
JK-SMD-0603-300L
0.5
0.75
1.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
5.2
6.0
50
50
50
50
50
50
50
50
50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.07
0.4
0.055
0.045
0.035
0.025
0.015
0.012
0.008
0.008
0.25
0.12
0.10
0.08
0.07
0.06
0.05
0.04
1.25
1.5
1.75
2.0
2.6
3.0
Ihold = Hold Current. Maximum current device will not trip in 25°C still air.
Itrip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
Thermal Derating Chart-IH(A)
Maximum ambient operating temperatures ℃
Part Number
-40℃
0.46
0.66
0.99
1.32
1.96
-20℃
0.40
0.57
0.85
1.14
1.49
0℃
0.37
0.53
0.79
1.05
1.31
25℃
40℃
50℃
60℃
70℃
85℃
0.14
0.35A
0.50A
0.75A
1.00A
1.25A
0.29
0.41
0.61
0.82
1.02
0.25
0.36
0.44
0.73
0.91
0.24
0.34
0.30
0.69
0.86
0.20
0.28
0.17
0.56
0.70
JK-SMD-0603-035L
JK-SMD-0603-050L
JK-SMD-0603-075L
JK-SMD-0603-100L
JK-SMD-0603-125L
JK-SMD-0603-150L
JK-SMD-0603-175L
JK-SMD-0603-200L
JK-SMD-0603-260L
JK-SMD-0603-300L
0.21
0.07
0.41
0.51
2.35
2.30
1.79
1.99
1.58
1.84
1.50A
1.75A
1.22
1.43
1.09
1.27
1.03
1.20
0.84
0.98
0.62
0.72
2.00A
2.60A
3.00A
1.63
2.12
2.45
1.45
1.89
2.18
1.37
1.78
2.06
1.12
1.46
1.68
0.82
1.07
1.23
2.63
3.42
3.95
2.27
2.95
3.41
2.10
2.73
3.15
Specifications are subject to change without notice
2
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
SMD0603 Low Resistance Series
Part number System
JK- SMD-0603-XXX - L → Low Resistance
Holding Current Rating
0603 Dimension
Surface Mount Device
Our Mark
Test Procedures and Requirements
Test Item
Initial Resistance
Time to Trip
Test Conditions
In still air @ 25℃
Accept/Reject Criteria
Rimin ≤ R ≤ R1max
T≤maximum Time to Trip
No trip
Specified current,Vmax,25℃
30min ,at IH
Hold Current
Trip Cycle Life
Vmax,Imax,100cycles
Vmax,1hours
No arcing or burning
No arcing or burning
Trip Endurance
Physical Characteristics
Terminal materials :
Soldering zone
Tin-Plated Nickle-copper
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Level 2a, per IPC/JEDEC J-STD 020C
Moisture Sensitivity
Environmental Specifications
Test
Conditions
Resistance change
Passive aging
+85℃,1000hours
±10%
±5%
Humidity aging
+85℃/85%R.H.1000hours
Thermal shock
Solvent Resistance
Vibration
MIL-STD-202,Method 107G ,+85℃/-40℃,20times
MIL-STD-202,Method 215
-30% typical resistance change
No change
ML-STD-883C,Test Condition A
No change
Recommended Pad layout(mm)
Specifications are subject to change without notice
3
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
SMD0603 Low Resistance Series
Solder reflow conditions
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TS maxto TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (TS min to TS max)
Time maintained above:
-Temperature (TL)
150℃
200℃
60-180 seconds
217℃
-Time (tL)
60-150 seconds
260℃
Peak Temperature (TP)
Time within 5℃of actual PeakTemperature (tP)
Ramp-down Rate
20-40 seconds
3℃/second max.
8 minutes max.
Time 25℃to Peak Temperature
StorageCondition
0℃~35℃, ≤70%RH
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
Note 1: All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperature exceed the recommended profile, devices may not meet the performance requirements.
Specifications are subject to change without notice
4
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
SMD0603 Low Resistance Series
Tape Specification and Reel Dimensions
Symbol
Dimensions(mm)
Tape
W
F
8.00±0.30
3.50±0.05
1.75±0.10
1.55±0.05
0.50±0.10
E
D0
D1
P0
4.00±0.10
4.00±0.10
2.00±0.05
1.10±0.10
1.92±0.10
0.20±0.10
0.75/0.95±0.10
390
P1
P2
A0
B0
T
K0
Leader min
Trailer min
C
160
Φ178±1.0
Reel
D
H
Φ60.2±0.5
11.0±0.5
W
9.0±1.5
Packaging Quantity
Part Number
Quantity
5000pcs
Part Number
Quantity
4000pcs
JK-SMD-0603-035L
JK-SMD-0603-050L
JK-SMD-0603-075L
JK-SMD-0603-100L
JK-SMD-0603-125L
JK-SMD-0603-150L
JK-SMD-0603-175L
JK-SMD-0603-200L
JK-SMD-0603-260L
JK-SMD-0603-300L
5000pcs
5000pcs
5000pcs
5000pcs
4000pcs
4000pcs
4000pcs
4000pcs
Specifications are subject to change without notice
5
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
SMD0603 Low Resistance Series
Storage
The maximum ambient temperature shall not exceed 40℃. Storage temperatures higher than 40℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 70%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.
Warning
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
Notes
The specification is intended to present application,product and technical data to assist the user in selecting PPTC circuit
production devices,However,users should imdependently evaluate and test the suitability of each product.HUAAN makes
on warranties as to the acduracy or completeness of the information and disclaims any liatility resulting form its use,
HUAAN’s only obligations are those im the HUAAN Standard Rerms and Conditions of Sale and in no case will HUAAN be
liable for any incidental,imdirect,or consequential damages arising from the sale,resale,or misues of its products. HUAAN
reserves the right to change of update, without notice, any information contained in this specification.
Specifications are subject to change without notice
6
Tel: +86-755-27465585
HUAAN LIMITED
www.huaandz.com
Email: sales@huaandz.com
相关型号:
©2020 ICPDF网 联系我们和版权申明