FH16M-80S-0.4SHW [HRS]
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch); 高密度FPC连接器（ 0.3毫米/ 0.4毫米/ 0.5mm间距）
| 型号： | FH16M-80S-0.4SHW |
| 厂家： | 
HRS |
| 描述： | High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch) |
| 文件： | 总8页 (文件大小：321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
High Density FPC Connector (0.3mm/0.4mm/0.5mm Pitch)
FH16 Series
FH16 Series Variation
0.3mm pitch 60 contact
0.3mm pitch 80 contact
0.3mm pitch 90 contact
0.4mm pitch 80 contact
0.5mm pitch 50 contact
0.5mm pitch 64 contact
ꢀFeatures
[Conventional product (FH12 series)]
0.5mm pitch 30 contact
1. High Density FPC Connector
The FH16 series is a fine pitch, zero insertion force (ZIF), right angle, bottom
contact, connector compatible with flexible printed circuits (FPC) with a pitch
of 0.3mm, 0.4mm, and 0.5mm and a recommended thickness of 0.295mm for
single-sided or 0.306mm for double-sided. The FH16 provides a higher pin Excellent Serviceability with Flip-Lock Design
count given the same amount of board space than other manufacturers of
similar product. With a large selection in pin density, the FH16 series greatly
improves design flexibility.
FH16 : 0.3mm pitch 60, 80, and 90 contacts
FH16M : 0.4mm pitch 80 and 96 contacts
FH16H : 0.5mm pitch 50 contacts
FH16P : 0.5mm pitch 64 contacts
Flip-lock type
2. Easy mounting on PCB
FH16 supports 0.3mm pitch cable but only requires a 0.6mm pitch pad
layout on the PCB. The FH16’s staggered pin design allows the
mounting lead area to be twice as wide as the FPC contact area making
it easier to place the connector on the board given the fine pitch of the
contacts.
Mechanism to prevent
FPC from escape and oblique
mating
3. User Friendly Flip-Lock Design
The flip-lock (one-touch rotating type) ZIF structure secures the FPC
connection with a single and light force. This design helps simplify
assembly and repair work. When locking the FPC, the audible click
assures the assembly worker of a steady FPC connection resulting in
improved customer service.
4. Prevents FPC from escape and oblique mating
The FH16 series with its recommended FPC dimensions prevents the
FPC from escape and oblique mating thereby securing a steady
connection.
5. Compatible with Automatic Assembly Tooling
Embossed tape packaging allows for automatic placement onto the PCB.
ꢀApplications
Notebook computers, printers, PDAs, digital cameras and other compact devices for interconnecting the main circuit board with the
(
),HDD or other device.
LCD,PDP Plasma Display
Hard
Disk-Drive
PCB
PCB
PCB
Notebook PC
HDD
PDP
66
ꢀProduct Specifications
Pitch
0.3mm
0.4mm
0.5mm
0.4A
Operating Temperature Range
:
–40ç to +70ç
Storage Temperature Range: –10ç to +50ç
Ratings
0.15A
0.3A
Current rating
Operating Relative Humidity: Relative humidity 90% max Storage Relative Humidity: Relative humidity 90% max
Voltage rating 30V AC 50V AC 60V AC (not dewed) Note1
(not dewed) Note2
Conditions
Applicable cable
t=0.30 0.05, Tin-lead plating (Note 3)
Specification
Item
1. Insulation Resistance
100V DC
500M ohms min.
0.3mm pitch: 090V AC
2. Withstanding Voltage
0.4mm pitch: 150V AC applied for one minute
0.5mm pitch: 200V AC
No flashover or insulation breakdown.
150m ohms max.
3. Contact Resistance
1mA
*Including FPC conductor resistance.
4. Durability
150m ohms max.
20 cycles
No damage, cracks, or parts dislocation.
(Insertion/withdrawal)
No electrical discontinuity of 1µs or more
Contact resistance: 150m ohms max.
No damage, cracks, or parts dislocation.
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm,
2 hours in each of the 3 directions.
5. Vibration
6. Shock
No electrical discontinuity of 1µs or more
Contact resistance: 150m ohms max.
No damage, cracks, or parts dislocation.
2
Acceleration of 490 m/s , 11 ms duration,
sine half-wave waveform, 3 cycles in each of the 3 axis.
Contact resistance: 150m ohms max.
Insulation resistance: 50M ohms min.
No damage, cracks, or parts dislocation.
7. Humidity
96 hours at temperature of 40ç and humidity of 90% to 95%
(Steady state)
+
+
+
ꢀꢀ 15ç to 35ç
Contact resistance: 150m ohms max.
Insulation resistance: 50M ohms min.
No damage, cracks, or parts dislocation.
Temperature: –40
ꢀꢀ 15 to 35ç
ꢀꢀ 85ç
8. Temperature cycle
Time
: 30 minutes ꢀꢀ5 minutes max. ꢀꢀ30 minutes ꢀꢀ5 minutes max.
5 cycles
9. Resistance to
Soldering heat
Reflow: At the recommended temperature profile
Manual soldering: 350 5ç for 3 seconds
No deformation of components affecting performance.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and
Humidity range covers nonconducting condition of installed connectors in storage, shipment or during transportation.
Note 3: When FPC is gold plated, the connector contacts should be also gold plated: Select the (05) specification.
ꢀMaterials
Part
Material
Polyamide
LCP
Finish
Remarks
UL94V-0
Color : Beige
Insulator
PPS
Color : Dark brown
Tin-lead plating
Gold plating
Contact
Phosphor bronze
–––––––
ꢀOrdering Information
q Series name
w Series No.
: FH
: 16
( )
FH 16 – 64S – 0.5 SHW 05
e
Number of contacts : 50, 60, 64, 80, 90, and 96 contacts
r Contact pitch
: 0.3mm, 0.4mm, 0.5mm
q
w
e
r
t
y
t
y
Terminal Shape
: SHW(SMT horizontal staggered row mount type)
Plating Specification : No symbol : Tin-lead plating (05) : gold plating
67
BConnector Operating Instructions, precautions and recommendations
Operation
Precautions
1) Fully insert the FPC parallel to mounting surface,
with the exposed conductive traces facing down.
1.FPC Termination procedure. Connector
installed on the board.
1) Remove and dispose the pick-and-place insert.
Positioning point
2) Rotate down the actuator until firmly closed.
It is critical that the inserted FPC is not moved and
remains fully inserted. Should the FPC be moved,
open the actuator and repeat the process, starting
with Step 1 above.
2) The connector will assure reliable performance
when the actuator is open to 120° maximum (see
fig.1) Do not exceed this angle, as this may cause
permanent damage to the connector.
Fig.1
120°
3) Do NOT push/pull actuator. Any damage to actua-
tor will require replacement of the entire connec-
tor.
2.FPC Removal
1) Lift up the actuator.
2) Carefully remove the FPC.
68
ꢀConnector Dimensions
A
B
Q
C
0.12
R
Mark
10
0.12
R
D
Suction Parts for Automatic Mounting
E
6.6
7.4
FPC Conductive Surface
Unit: mm
R
Number of
FPC
Part Number
CL No.
A
B
C
D
E
Q
contacts Contact Pitch
FH16-60S-0.3SHW
FH16-80S-0.3SHW
FH16-90S-0.3SHW
FH16M-80S-0.4SHW
FH16M-96S-0.4SHW
FH16H-50S-0.5SHW
FH16P-64S-0.5SHW
586-0620-2
586-0613-7
586-0697-7
586-0675-4
586-0715-7
586-0676-7
586-0649-4
60
80
90
80
96
50
64
0.3
0.3
0.3
0.4
0.4
0.5
0.5
21.9
27.9
30.9
36.1
42.5
29.4
36.0
17.7
23.7
26.7
31.6
38.0
24.5
31.5
17.4
23.4
26.4
31.2
37.6
24.0
31.0
17.4
23.4
26.4
31.2
37.6
24.0
31.0
18.35
24.35
27.35
32.25
38.65
25.55
32.15
0.3
0.3
0.3
0.4
0.4
0.5
0.5
0.6
0.6
0.6
0.8
0.8
1.0
1.0
NOTE: Embossed tape reel packaging (1,000 pieces/reel).
Order by number of reels.
69
BRecommended PCB layout and metal mask dimensions
B 0.05
Q 0.05
C 0.05
R 0.05
W (PCB)
X (Metal mask)
Mark side
R 0.05
W (PCB)
X (Metal mask)
D 0.05
* Recommended metal mask thickness: t=0.15
BFPC recommended dimensions
+0.04
_0.03
0.1 0.05
0.07 0.07
0.3
0.1 0.05
Q 0.02
R 0.02
2
0.3 0.05
+0.04
0.3
_0.03
B 0.03
S 0.07
S 0.07
F 0.05
G 0.1
H 0.1
1 * Forced film material shall be polyamide + thermal hardened additives.
2
Conductor width shall be 0.1 0.05 if FPC has plating bars.
Unit: mm
X
FPC, Land, Metal Mask Dimension Table
Number of
FPC
Part Number
CL No.
B
C
D
F
G
H
Q
R
S
W
contacts Contact Pitch
FH16-60S-0.3SHW 586-0620-2
FH16-80S-0.3SHW 586-0613-7
FH16-90S-0.3SHW 586-0697-7
FH16M-80S-0.4SHW 586-0675-4
FH16M-96S-0.4SHW 586-0715-7
FH16H-50S-0.5SHW 586-0676-7
FH16P-64S-0.5SHW 586-0649-4
60
80
90
80
96
50
64
0.3
0.3
0.3
0.4
0.4
0.5
0.5
17.7 17.4 17.4 18.3 18.8 20.3 0.3 0.6 0.3 0.3 0.03 0.25 0.03
23.7 23.4 23.4 24.3 24.8 26.3 0.3 0.6 0.3 0.3 0.03 0.25 0.03
26.7 26.4 26.4 27.3 27.8 29.3 0.3 0.6 0.3 0.3 0.03 0.25 0.03
31.6 31.2 31.2 32.2 32.7 34.2 0.4 0.8 0.3 0.3 0.03 0.25 0.03
38.0 37.6 37.6 38.6 39.1 40.6 0.4 0.8 0.3 0.3 0.03 0.25 0.03
24.5 24.0 24.0 25.5 25.5 27.5 0.5 1.0 0.5 0.6 0.10 00.5 0.05
31.5 31.0 31.0 32.1 32.6 34.1 0.5 1.0 0.3 0.6 0.10 00.5 0.05
70
BPackaging Specification
Embossed Carrier Tape Dimensions
ꢀ
4
2
12
6.8
0.5
Flat surface for placement
with Automatic equipment
1.5
4.9
7
Unreeling direction
Unit: mm
Number of
Contacts
Inserted Connector
J
K
L
M
T
FH16-60S-0.3SHW
FH16-80S-0.3SHW
FH16-90S-0.3SHW
FH16M-80S-0.4SHW
FH16M-96S-0.4SHW
FH16H-50S-0.5SHW
60
80
90
80
96
50
64
44
44
44
56
56
44
56
40.4
40.4
40.4
52.4
52.4
40.4
52.4
20.2
20.2
20.2
26.2
26.2
20.2
26.2
22.3
28.3
31.3
36.6
43.0
29.9
36.6
44.5
44.5
44.5
56.5
56.5
44.5
56.5
FH16P-64S-0.5SHW
NOTE: 1,000 pieces per reel.
2
T
ꢀ
Reel Dimensions
End portion
Mounting portion
Lead portion (400mm min.)
Blank portion
Blank portion
Top cover tape
Embossed carrier tape
(10 pocket min.)
(10 pocket min.)
71
Recommended Temperature Profile
B
5 sec. max.
HRS test conditions
250
200
150
100
50
Solder method
:Reflow, IR/hot air
240ç
200ç
(Nihon Den-netsu Co., Ltd.’s
Part Number: SENSBY NR-2)
:Room air
Environment
Solder composition :Paste, 63%Sn/37%Pb
(Senju Metal Industry, Co., Ltd.’s
160ç
150ç
Part Number: OZ63-201C-50-9)
Test board
Land dimensions
:
Glass epoxy 45mm∞80mm∞1.6mm thick
:Contact Pitch 0.3mm, 0.4mm
0.3mm∞1.7mm
Contact Pitch 0.5mm
0.6mm∞1.7mm
Metal mask
:Contact Pitch 0.3mm, 0.4mm
0.25mm∞1.7mm∞0.15mm thick
Contact Pitch 0.5mm
(
30 sec.)
25ç
(20 to 30 sec.)
(60 sec.)
60 to 90 sec.
0
0.5mm∞1.7mm∞0.15mm thick
Start
60
Preheating 120
Time (sec.)
Soldering 180
This temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and board
size/thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
72
BFH16 Series FPC Construction (Recommended Specifications)
1. Using Single-Sided FPC
Material Name
Covering layer film
Cover adhesive
Surface treatment
Copper foil
Material
Thickness (µm)
Polyamide 1 mil
25
25
Tin-lead plating
5
Cu
1oz
35
Base adhesive
Base film
25
Polyamide 1 mil
25
Reinforcement material adhesive Heat-hardened adhesive
30
Stiffener
Polyamide 7 mil
Total
175
295
2. Using Double-Sided FPC
Material Name
Material
Thickness (µm)
Covering layer film
Cover adhesive
Surface treatment
Through hole copper
Copper foil
Polyamide 1 mil
25
25
5
Tin-lead plating
Cu
15
18
18
25
18
18
25
25
50
100
299
Cu
1/2 oz
Base adhesive
Base film
Polyamide 1 mil
Base adhesive
Copper foil
Cu
1/2 oz
Cover adhesive
Cover layer film
Polyamide 1 mil
Reinforcement material adhesive Heat-hardened adhesive
Stiffener
Polyamide 1 mil
Total
Note : To prevent release of the lock due to FPC bending, please do not use copper foil on the rear side.
3. Precautions
1. This specification is a recommendation for the construction of the FH16 Series FPC (t=0.3 0.05).
2. The FH16 Series are connectors for thin FPC which is beginning to be used in cameras and other miniature equipment.
Stiffener is not required for double-sided FPC which will be reflected in FPC cost reduction.
Please note that in the case of single-sided FPC, stiffener is required, but the thickness dimension can be created easily.
For details about the construction, please contact the FPC manufacturer.
FPC Manufactures' Contact List
Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division
5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan
TEL:+81 3 5462 4191
FAX:+81 3 5462 4882
Fujikura Ltd. Electronics Global Marketing Department
1-5-1, Kiba, Koto-ku, Tokyo, Japan
TEL:+81 3 5606 1165
FAX:+81 3 5606 1530
NOK Corporation Sales Division Overseas Business Department
1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan
TEL:+81 3 3432 6976/8415
FAX:+81 3 3432 3919
73
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