APDS9002 [HP]
Miniature Surface-Mount Ambient Light Photo Sensor; 微型表面贴装环境亮度传感器
| 型号： | APDS9002 |
| 厂家： | 
HEWLETT-PACKARD |
| 描述： | Miniature Surface-Mount Ambient Light Photo Sensor |
| 文件： | 总16页 (文件大小：213K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent APDS-9002
Miniature Surface-Mount
Ambient Light Photo Sensor
Data Sheet
Features
• Excellent responsivity which
peaks in the human luminosity
curve
Close responsivity to the human eye
• Miniature chipLED lead-free
surface-mount package
Height – 0.80 mm
Width – 2.00 mm
Depth – 1.25 mm
• Good output linearity across wide
illumination range
Description
suitable for portable
applications with its ultra small
package design.
• Low sensitivity variation across
various light sources
The APDS-9002 is a low-cost
analog-output ambient light
photo sensor in lowest cost
miniature chipLED lead-free
surface mount package. It
consists of a spectrally suited
phototransistor, which peaks in
human luminosity curve. Hence,
it provides an excellent
responsivity that is close to the
response of human eyes, as
shown in Figure 2. It provides a
design-alternative to the
• Guaranteed temperature
performance
-40°C to 85°C
The APDS-9002 is ideal for
applications in which the
• V supply 2.4 to 5.5 V
CC
measurement of ambient light is
used to control display back-
lighting. Mobile appliances such
as the mobile phones and PDAs
that draw heavy current from
display backlighting will benefit
from incorporating these photo
sensor products in their designs
by reducing power consumption
significantly.
• Lead-free package
Applications
• Detection of ambient light to
control display backlighting
Mobile devices – mobile phones,
PDAs
Computing devices – notebooks,
webpads
HSDL-9000 digital-output
ambient light photo sensor is
Consumer devices – TVs, video
cameras, digital still cameras
• Automatic residential and
commercial lighting management
• Electronic signs and signals
• Daylight and artificial light
exposed devices
Application Support Information
The Application Engineering
Group is available to assist you
with the application design
associated with APDS-9002
ambient light photo sensor
module. You can contact them
through your local sales
representatives for additional
details.
Ordering Information
Part Number
Packaging Type
Package
Quantity
APDS-9002-021
Tape and Reel
4-pins Chipled package
2500
Typical Application Circuit
PIN 2: VCC
PIN 3: VCC
PIN 1: IOUT
APDS-9002
R
LOAD
PIN 4: NC
Figure 1. Typical application circuit for APDS-9002.
Figure 1 Table
Recommended Application
Circuit Components
Component
RLOAD
1 kW
I/ O Pins Configuration Table
Pin
1
Symbol
IOUT
VCC
Description
IOUT
2
V
CC
3
VCC
V
CC
4
NC
No Connect
2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
APDS-9002
SILICON
EYE RESPONSE
350 450 550 650 750 850 950 1050 1150 1250
WAVELENGTH (nm)
Figure 2. Relative spectral response vs. wavelength.
CAUTIONS: It is advised that normal static precautions be taken in handling and assembly of this
component to prevent damage and/or degradation which may be induced by ESD.
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is ≤ 50°C/ W
Parameter
Symbol
TS
Min.
-40
Max.
85
Units
°C
Storage Temperature
Operating Temperature
Supply Voltage
TA
-40
85
°C
V
CC
2.4
5.5
V
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
85
Units Conditions
Operating Temperature
Supply Voltage
TA
-40
2.4
°C
V
CC
5.5
V
3
Electrical & Optical Specifications (TA = 25°C)
Parameter
Symbol
I_PH1
Min.
Typ.
20
Max.
33
410
-
Units
µA
µA
µA
nA
-
Conditions
Photo Current (I)
Photo Current (II)
10
V = 3.0 V, Lux = 10[2]
CC
I_PH2
136
250
300
50
V = 3.0 V, Lux = 100[2]
CC
Photo Current (III) I_PH3
Dark Current I_DARK
Light Current Ratio I_PH3 / I_PH2
-
-
-
-
-
V = 3.0 V, Lux = 100[1]
CC
160
-
V = 3.0 V, Lux = 0
CC
1.2
-
Rise Time
Fall Time
Notes:
T_RISE
T_FALL
0.95
0.8
2
ms
ms
V = 3.0 V, Lux = 100, Rload = 1 kΩ[3]
CC
2
V = 3.0 V, Lux = 100, Rload = 1 kΩ[3]
CC
1. Illuminance by CIE standard light source (incandescent lamp).
2. Fluorescent light is used as light source. White LED is substituted in mass production.
3. White LED is used as light source.
Light Measurement Circuit and Waveforms
I_pulse
PIN 2: VCC PIN 3: VCC
I_pulse
PIN 1: IOUT
V
OUT
90%
10%
APDS-9002
R
GND
LOAD
tr
tf
PIN 4: NC
4
2.5
2.0
1.5
1.0
0.5
0
1.2
1.0
0.8
0.6
0.4
0.2
0
0.01
0.001
0.0001
Fluorescent
Normalized
Photocurrent
Incandescent
Normalized
Photocurrent
0.00001
10
100
1000
-80 -60 -40 -20
20 40 60 80
-50
0
50
100
0
LUX
ANGLE
TEMPERATURE (°C)
Figure 3. Photocurrent vs. luminence
Figure 4. Normalized photocurrent vs.
Figure 5. Normalized photocurrent vs. angle
(V = 3 V, T = 25°C).
(V = 3 V, T = 25°C).
temperature (V = 3 V, 100 LUX).
CC
A
CC
CC
A
10
1
1.4E-3
1.2E-3
1.8E-3
1.6E-3
1.4E-3
1.2E-3
1.0E-3
T
= 25°C
= 3 V
A
V
CC
LIGHT SOURCE: WHITE LED
1.0E-3
800.0E-6
600.0E-6
400.0E-6
200.0E-6
000.0E+0
0.1
800.0E-6
600.0E-6
400.0E-6
200.0E-6
000.0E+0
R = 1 kW
0.01
AVERAGE
2000
AVERAGE
2000
R = 5.1 kW
R = 11 kW
R = 51 kW
0.001
10
100
1000
0
500
1000
R
1500
2500
0
500
1000
R
1500
2500
LUMINANCE, Ev (LUX)
(W)
(W)
LOAD
LOAD
Figure 6. Output voltage vs. luminance at
different load resistor.
Figure 7. Fall time vs. R
.
Figure 8. Rise time vs. R
.
LOAD
LOAD
5
APDS-9002 Package Outline
1.25
0.35
MOLDING BODY (LENS)
R0.20
P1
P2
0.45
1.40
2.00
0.45
P3
P4
0.20
P.C. BOARD
0.45
UNITS: in mm
PIN 1: IOUT
PIN 2: VCC
PIN 3: VCC
TOLERANCE: ±0.2 mm
0.80
0.14
PIN 4: NC (NO CONNECT)
0.30
6
APDS-9002 Tape and Reel Dimensions
2.00 ± 0.05
1.25
4.00 ± 0.1
4.00 ± 0.1
P1
P2
0.20
1.56 ± 0.1
1.75 ± 0.1
3.50 ± 0.05
8 ± 0.1
2.00
ORIENTATION OF UNIT
IN TAPE AND REEL POCKETS
IN PROGRESSIVE DIRECTION
1.00 ± 0.1
1.96 ± 0.1
1.04 ± 0.1
P3
P4
0.20
1.04 ± 0.1
PROGRESSIVE DIRECTION
MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE
MATERIAL OF COVER TAPE: PVC
METHOD OF COVER: HEAT SENSITIVE ADHESIVE
EMPTY
PARTS MOUNTED
LEADER
(40 mm MIN.)
(400 mm MIN.)
"B" "C"
178 75
UNIT: mm
EMPTY
(40 mm MIN.)
18.4 (MAX.)
DETAIL A
2.0 ± 0.50
C
B
DIA. 13.0 ± 0.50
R1.0
LABEL
20.2 (MIN.)
DETAIL A
15.4 (MAX.)
7
Moisture Proof Packaging
All APDS-9002 options are
shipped in moisture proof
package. Once opened, moisture
absorption begins.
Baking Conditions
If the parts are not stored in dry
conditions, they must be baked
before reflow to prevent damage
to the parts.
This part is compliant to JEDEC
Level 4.
Package
In Reels
In Bulk
Temp.
60°C
Time
20 hours
5 hours
125°C
Baking should only be done
once.
UNITS IN A SEALED
MOISTURE-PROOF
PACKAGE
Recommended Storage Conditions
Storage Temperature
Relative Humidity
10°C to 30°C
Below
60% RH
PACKAGE IS
OPENED (UNSEALED)
Time from Unsealing to Soldering
After removal from the bag, the
parts should be soldered within
three days if stored at the
ENVIRONMENT
LESS THAN 30°C,
AND LESS THAN
60% RH
recommended storage
conditions. If times longer than
three days are needed, the parts
must be stored in a dry box.
YES
PACKAGE IS
OPENED LESS
THAN 72 HOURS
NO BAKING
IS NECESSARY
YES
NO
PERFORM RECOMMENDED
BAKING CONDITIONS
NO
8
Recommended Reflow Profile
MAX. 260°C
R3 R4
255
230
220
200
R2
180
60 sec.
MAX.
ABOVE
220°C
160
R1
R5
120
80
25
0
50
100
P2
150
200
250
300
t-TIME (SECONDS)
P1
HEAT
UP
P3
P4
SOLDER PASTE DRY
SOLDER
REFLOW
COOL
DOWN
Process Zone
Heat Up
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
DT
Maximum DT/ DTime
4°C/ s
25°C to 160°C
160°C to 200°C
Solder Paste Dry
0.5°C/ s
200°C to 255°C (260°C at 10 seconds max.)
255°C to 200°C
4°C/ s
Solder Reflow
Cool Down
-6°C/ s
200°C to 25°C
-6°C/ s
growth within the solder
Process zone P2 should be of
sufficient time duration (60 to 120
seconds) to dry the solder paste.
The temperature is raised to a
level just below the liquidus point
of the solder, usually 200°C
(392°F).
The reflow profile is a straight-
line representation of a nominal
temperature profile for a
connections becomes excessive,
resulting in the formation of weak
and unreliable connections. The
temperature is then rapidly
reduced to a point below the
solidus temperature of the solder,
usually 200°C (392°F), to allow
the solder within the connections
to freeze solid.
convective reflow solder process.
The temperature profile is divided
into four process zones, each with
different DT/Dtime temperature
change rates. The DT/Dtime rates
are detailed in the above table.
The temperatures are measured
at the component to printed
Process zone P3 is the solder
reflow zone. In zone P3, the
temperature is quickly raised
above the liquidus point of solder
to 255°C (491°F) for optimum
results. The dwell time above the
liquidus point of solder should be
between 20 and 60 seconds. It
usually takes about 20 seconds to
assure proper coalescing of the
solder balls into liquid solder and
the formation of good solder
Process zone P4 is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point
of the solder to 25°C (77°F)
should not exceed 6°C per second
maximum. This limitation is
necessary to allow the PC board
and APDS-9002 castellations to
change dimensions evenly,
putting minimal stresses on the
APDS-9002.
circuit board connections.
In process zone P1, the PC board
and APDS-9002 castellation pins
are heated to a temperature of
160°C to activate the flux in the
solder paste. The temperature
ramp up rate, R1, is limited to 4°C
per second to allow for even
heating of both the PC board and
APDS-9002 castellations.
connections. Beyond a dwell time
of 60 seconds, the intermetallic
9
Appendix A: SMT Assembly Application Note
Agilent APDS-9002: Miniature Surface-Mount Ambient Light Sensor
METAL STENCIL
FOR SOLDER PASTE
PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK
PCBA
Figure 9. Stencil and PCBA.
1.1 Recommended Land Pattern
0.55
0.55
0.45
0.55
1
0.55
10
1.2 Recommended Metal Solder
Stencil Aperture
APERTURE OPENING
0.1
It is recommended that a
0.10 mm (0.004 inches) thick
stencil be used for solder paste
printing. Aperture opening for
shield pad is 0.6 mm x 0.6 mm.
This is to ensure adequate
printed solder paste volume and
no shorting.
1.65
2.2
UNIT: mm
Figure 10. Solder stencil aperture.
2.65
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by the
unit relative to the land pattern.
There should be no other SMD
components within this area.
MOUNTING
CENTER
The minimum solder resist strip
width required to avoid solder
bridging adjacent pads is
0.2 mm.
3.2
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
UNIT: mm
0.2 MIN.
Figure 11. Adjacent land keepout and solder mask areas.
11
Appendix B: Optical Window Design
for APDS-9002
photo light sensor, so that it will
not affect the angular response of
the APDS-9002. This minimum
dimension that is recommended
will ensure at least a ±35° light
reception cone.
The thickness of the window
should be kept as minimum as
possible because there is a loss of
power in every optical window of
about 8% due to reflection (4% on
each side) and an additional loss
of energy in the plastic material.
2.0 Optical Window Dimensions
To ensure that the performance of
the APDS-9002 will not be affected
by improper window design, there
are some constraints on the
dimensions and design of the
window. There is a constraint on
the minimum size of the window,
which is placed in front of the
If a smaller window is required, a
light pipe or light guide can be
used. A light pipe or light guide is
a cylindrical piece of transparent
plastic, which makes use of total
internal reflection to focus the light.
Figures 12(a) and 12(b) illustrate
the two types of windows that we
have recommended which could
either be a flat window or a flat
window with light guide.
FLAT
PHOTO LIGHT SENSOR
Figure 12(a). Window size determination for flat window.
Figure 12(b). Window design of flat window with light guide.
12
Table 1 and Figure 13 below show
the recommended dimensions of
the window. These dimension
values are based on a window
thickness of 1.0 mm with a
refractive index 1.585.
The window should be placed
directly on top of the photo light
sensor to achieve better
window with a light pipe is used,
dimension D2 should be 1.5 mm
to optimize the performance of
APDS-9002.
performance and if a flat
D1
TOP VIEW
T
D1
L
Z
D1 WINDOW DIAMETER
T
L
Z
THICKNESS
PHOTO LIGHT SENSOR
LENGTH OF LIGHT PIPE
DISTANCE BETWEEN WINDOW REAR PANEL
AND APDS-9002
Figure 13. Recommended window dimensions.
Table 1: Recommended Dimension for Optical Window
All dimensions are in mm
Flat Window
Flat Window
(L = 0.0)
with Light Pipe
(D2 = 1.5; Z = 0.5)
WD
(T+L+Z)
Z
D1
D1
-
L
-
1.5
2.0
2.5
3.0
0.5
1.0
1.5
2.0
2.25
3.25
4.25
5.00
-
-
-
-
2.5
1.5
2.1 Optical Window Material
The material of the window is
Table 2: Recommended Plastic Materials
Material Number
recommended to be polycarbonate.
The surface finish of the plastic
should be smooth, without any
texture.
Visible Light Transmission
Refractive Index
1.587
Makrolon LQ2647
Makrolon LQ3147
Makrolon LQ3187
87%
87%
85%
1.587
1.587
The recommended plastic material
for use as a window is available
from Bayer AG and Bayer Antwerp
N. V. (Europe), Bayer Corp. (USA)
and Bayer Polymers Co., Ltd.
(Thailand), as shown in Table 2.
13
Appendix C: General Application
Guide for APDS-9002
The amount of converted voltage,
VOUT, is mainly dependant
Brightness is measured as “LUX”
unit, which describes how intense
a light source that our eyes
perceive. LUX meter is the
equipment for “LUX”
measurement. Light sources with
the same LUX level appear at the
same brightness to the human
eyes.
proportionally on the photo
current which is generated by the
brightness of the light shone on
the photo sensor and the load
resistor used, RL. Increasing the
brightness of the light and/or the
load resistor will increase the
output voltage.
The APDS-9002 is a low cost
analog-output ambient light photo
sensor which spectral response
closely emulates the human eyes.
APDS-9002 consists of a
phototransistor that enables the
photo sensor to produce a high
gain photo current to a sufficient
level that can be converted to
voltage with a standard value of
external resistor. APDS-9002 is
then easily integrated into
V
V
CC
CC
2
3
systems that use ADC input which
is available for sampling of the
external source, as shown in
Figure 14 below.
LIGHT
SOURCE
V
1
OUT
APDS-9002
A/ D
C
R
L
4
MICRO-
CONTROLLER
NC
Figure 14. Configuration of APDS-9002 being used directly.
10
Selection of the load resistor RL
will determine the amount of
current-to-voltage conversion in
the circuit. Based on Figure 14
and using white LED as the light
source, measurement has been
carried out by using different
load resistors to examine the
variation of the output voltage
towards the intense of LUX. The
result is shown in Graph 1.
APDS-9002 allows output
T = 25°C
A
V
= 3 V
CC
LIGHT SOURCE: WHITE LED
1
0.1
R = 1 kW
0.01
0.001
R = 5.1 kW
R = 11 kW
R = 51 kW
10
100
1000
voltage hits around 2.3 V, after
this it saturates.
LUMINANCE, Ev (LUX)
Light source, e.g., fluorescent
light, consists of ac noise about
100 Hz frequency. A capacitor of
10 µF, which acts as a low-pass
filter, is recommended to add in
parallel with resistor to by-pass
the ripples.
Graph 1. Output voltage vs. luminance at different load resistor.
14
Agilent has fabricated an
evaluation board based on the
configuration shown in Figure 14
for the designer to test the
ambient light sensor under
different lighting conditions. A
reference layout of a 2-layout
Agilent evaluation board for
APDS-9002 is shown in Figure 15
below.
Figure 15. Evaluation board layout.
15
www.agilent.com/ semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/ Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/ Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
May 10, 2005
5989-3051EN
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