HMS29N65 [HMSEMI]

N-Channel Super Junction Power MOSFET Ⅲ;
HMS29N65
型号: HMS29N65
厂家: H&M Semiconductor    H&M Semiconductor
描述:

N-Channel Super Junction Power MOSFET Ⅲ

文件: 总9页 (文件大小:1010K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HMS29N65/HMS29N65D/HMS29N65F  
N-Channel Super Junction Power MOSFET   
General Description  
The series of devices use advanced trench gate super  
junction technology and design to provide excellent RDS(ON)  
with low gate charge. This super junction MOSFET fits the  
industry’s AC-DC SMPS requirements for PFC, AC/DC  
power conversion, and industrial power applications.  
VDS  
650  
96  
V
mΩ  
A
RDS(ON)TYP  
ID  
29  
Features  
Optimized body diode reverse recovery performance  
Low on-resistance and low conduction losses  
Small package  
Ultra Low Gate Charge cause lower driving requirements  
100% Avalanche Tested  
ROHS compliant  
Application  
Schematic diagram  
Power factor correctionPFC)  
Switched mode power supplies(SMPS)  
Uninterruptible Power SupplyUPS)  
LLC Half-bridge  
Intrinsic fast-recovery body diode  
Package Marking And Ordering Information  
Device  
Device Package  
TO-263  
Marking  
HMS29N65D  
HMS29N65  
HMS29N65F  
HMS29N65D  
HMS29N65  
HMS29N65F  
TO-220  
TO-220F  
TO-263  
TO-220  
TO-220F  
Table 1. Absolute Maximum Ratings (TC=25)  
HMS29N65D  
Parameter  
Symbol  
HMS29N65F  
Unit  
HMS29N65  
650  
V
V
Drain-Source Voltage (VGS=0V)  
VDS  
VGS  
±30  
Gate-Source Voltage (VDS=0V) AC (f>1 Hz)  
Continuous Drain Current at Tc=25°C  
Continuous Drain Current at Tc=100°C  
29  
20  
29*  
20*  
A
ID (DC)  
ID (DC)  
IDM (pluse)  
PD  
A
(Note 1)  
87  
87*  
A
Pulsed drain current  
Maximum Power Dissipation(Tc=25)  
260  
2.08  
35  
W
Derate above 25°C  
0.28  
W/°C  
mJ  
A
(Note 2)  
676  
5.2  
EAS  
IAR  
Single pulse avalanche energy  
(Note 1)  
Avalanche current  
Repetitive Avalanche energy tAR limited by Tjmax  
(Note 1)  
3.2  
EAR  
mJ  
HMS29N65/HMS29N65D/HMS29N65F  
HMS29N65D  
Parameter  
Symbol  
HMS29N65F  
Unit  
HMS29N65  
Drain Source voltage slope, VDS 480 V,  
Reverse diode dv/dtVDS 480 V,ISD<ID  
Operating Junction and Storage Temperature Range  
* limited by maximum junction temperature  
50  
50  
dv/dt  
dv/dt  
V/ns  
V/ns  
°C  
-55...+150  
TJ,TSTG  
Table 2. Thermal Characteristic  
Parameter  
HMS29N65D  
Symbol  
HMS29N65F  
Unit  
HMS29N65  
Thermal ResistanceJunction-to-CaseMaximum)  
Thermal ResistanceJunction-to-Ambient Maximum)  
RthJC  
RthJA  
0.48  
62  
3.57  
80  
°C /W  
°C /W  
Table 3. Electrical Characteristics (TA=25unless otherwise noted)  
Parameter  
Symbol  
Condition  
Min Typ Max Unit  
On/off states  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current(Tc=25)  
Zero Gate Voltage Drain Current(Tc=125)  
Gate-Body Leakage Current  
BVDSS  
IDSS  
VGS=0V ID=250μA  
VDS=650V,VGS=0V  
VDS=650V,VGS=0V  
VGS=±20V,VDS=0V  
VDS=VGS,ID=250μA  
VGS=10V, ID=14A  
650  
V
μA  
μA  
nA  
V
3
IDSS  
100  
±100  
4.0  
IGSS  
Gate Threshold Voltage  
VGS(th)  
RDS(ON)  
2.0  
Drain-Source On-State Resistance  
Dynamic Characteristics  
96  
110  
mΩ  
Input Capacitance  
Clss  
Coss  
Co(er)  
2070  
120  
60  
pF  
pF  
pF  
VDS=50V,VGS=0V,  
F=1.0MHz  
Output Capacitance  
Effective output capacitance, energy related  
VGS=0 V,VDS=0...480 V  
ID=constant, VGS=0 V  
Effective output capacitance, time related  
Co(tr)  
311  
pF  
VDS=0...480V  
Total Gate Charge  
Qg  
Qgs  
Qgd  
37.5  
13  
nC  
nC  
nC  
VDS=480V,ID=29A,  
Gate-Source Charge  
VGS=10V  
Gate-Drain Charge  
11.5  
Switching times  
Turn-on Delay Time  
td(on)  
tr  
td(off)  
tf  
14  
12  
65  
11  
nS  
nS  
nS  
nS  
Turn-on Rise Time  
VDD=380V,ID=14A,  
RG=2.3Ω,VGS=10V  
Turn-Off Delay Time  
Turn-Off Fall Time  
Source- Drain Diode Characteristics  
Source-drain current(Body Diode)  
Pulsed Source-drain current(Body Diode)  
Forward On Voltage  
ISD  
ISDM  
VSD  
trr  
29  
87  
A
A
TC=25°C  
Tj=25°C,ISD=29A,VGS=0V  
0.9  
190  
2
1.2  
V
Reverse Recovery Time  
Reverse Recovery Charge  
Peak Reverse Recovery Current  
nS  
uC  
A
Qrr  
Tj=25°C,IF=14A,di/dt=100A/μs  
Irrm  
21  
Notes 1.Repetitive Rating: Pulse width limited by maximum junction temperature  
2. Tj=25,VDD=50V,VG=10V, RG=25Ω  
HMS29N65/HMS29N65D/HMS29N65F  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS (curves)  
Figure1. Safe operating area  
Figure2. Safe operating area for TO-220F  
Figure3. Source-Drain Diode Forward Voltage  
Figure4. Output characteristics  
Figure5. Transfer characteristics  
Figure6. Static drain-source on resistance  
HMS29N65/HMS29N65D/HMS29N65F  
Figure7. RDS(ON) vs Junction Temperature  
Figure8. BVDSS vs Junction Temperature  
Figure9. Maximum ID vs Junction Temperature  
Figure10. Gate charge waveforms  
Figure11. Capacitance  
Figure12. Transient Thermal Impedance  
HMS29N65/HMS29N65D/HMS29N65F  
Figure13. Transient Thermal Impedance for TO-220F  
HMS29N65/HMS29N65D/HMS29N65F  
Test circuit  
1Gate charge test circuit & Waveform  
2Switch Time Test Circuit:  
3Unclamped Inductive Switching Test Circuit & Waveforms  
HMS29N65/HMS29N65D/HMS29N65F  
TO-263-3L Package Information  
Dimensions In Millimeters  
Min.  
Dimensions In Inches  
Min.  
Symbol  
Max.  
4.57  
0.25  
0.94  
1.40  
0.61  
1.40  
9.40  
8.23  
10.28  
8.08  
Max.  
0.180  
0.010  
0.037  
0.055  
0.024  
0.055  
0.370  
0.324  
0.405  
0.318  
A
A1  
b
4.32  
-
0.170  
0.71  
1.15  
0.46  
1.22  
8.89  
8.01  
10.04  
7.88  
0.028  
0.045  
0.018  
0.048  
0.350  
0.315  
0.395  
0.310  
b2  
c
c2  
D
D1  
E
E1  
e
2.54 BSC  
0.100 BSC  
L
14.73  
2.29  
1.15  
1.27  
15.75  
2.79  
1.39  
1.77  
0.580  
0.090  
0.045  
0.050  
0.620  
0.110  
0.055  
0.070  
L1  
L2  
L3  
HMS29N65/HMS29N65D/HMS29N65F  
TO-220-3L-C Package Information  
Dimensions In Millimeters  
Min.  
Dimensions In Inches  
Min.  
Symbol  
Max.  
4.600  
2.550  
0.910  
1.370  
0.650  
1.400  
10.250  
9.750  
12.950  
Max.  
0.181  
0.100  
0.036  
0.054  
0.026  
0.055  
0.404  
0.384  
0.510  
A
A1  
b
4.400  
2.250  
0.710  
1.170  
0.330  
1.200  
9.910  
8.9500  
12.650  
0.173  
0.089  
0.028  
0.046  
0.013  
0.047  
0.390  
0.352  
0.498  
b1  
c
c1  
D
E
E1  
e
2.540 TYP.  
0.100 TYP.  
e1  
F
4.980  
2.650  
7.900  
0.000  
12.900  
2.850  
5.180  
2.950  
8.100  
0.300  
13.400  
3.250  
0.196  
0.104  
0.311  
0.000  
0.508  
0.112  
0.204  
0.116  
0.319  
0.012  
0.528  
0.128  
H
h
L
L1  
V
7.500 REF.  
0.295 REF.  
Φ
3.400  
3.800  
0.134  
0.150  
HMS29N65/HMS29N65D/HMS29N65F  
TO-220F Package Information  
Symbol  
Dimensions In Millimeters  
Min.  
Dimensions In Inches  
Min.  
Max.  
4.900  
2.740  
2.960  
0.900  
1.580  
0.600  
10.360  
15.970  
6.900  
16.100  
Max.  
0.193  
0.108  
0.117  
0.035  
0.062  
0.024  
0.408  
0.629  
0.272  
0.634  
A
A1  
A2  
b1  
b2  
c
4.500  
2.340  
2.560  
0.700  
1.180  
0.400  
9.960  
15.670  
6.500  
15.500  
0.177  
0.092  
0.101  
0.028  
0.046  
0.016  
0.392  
0.617  
0.256  
0.610  
D
E
E1  
E2  
e
2.540 TYP  
0.100 TYP  
Φ
3.080  
12.640  
3.030  
3.280  
13.240  
3.430  
0.121  
0.498  
0.119  
0.129  
0.521  
0.135  
L
L1  

相关型号:

HMS29N65D

N-Channel Super Junction Power MOSFET Ⅲ
HMSEMI

HMS29N65F

N-Channel Super Junction Power MOSFET Ⅲ
HMSEMI

HMS2M32M16G

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16G-10

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16G-12

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16G-15

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16G-17

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16G-20

SRAM MODULE 8Mbyte (2M x 32-Bit)
HANBIT

HMS2M32M16V

SRAM MODULE 8Mbyte (2M x 32-Bit), 3.3V 72-Pin SIMM Design
HANBIT

HMS2M32Z16V

SRAM MODULE 8Mbyte (2M x 32-Bit), 3.3V 72-Pin SIMM Design
HANBIT

HMS30C2000

[Application Specific Solution Product]
ETC

HMS30C7080

Mobile Phone Camera Back-End Processor
ETC