HM8119B [HMSEMI]

Standoff 55V 500mA 850KHz Sync Step-Down Regulator;
HM8119B
型号: HM8119B
厂家: H&M Semiconductor    H&M Semiconductor
描述:

Standoff 55V 500mA 850KHz Sync Step-Down Regulator

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HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Features  
Wide 4.5V to 45V Operating Input Range  
Standoff Voltage: 55V  
500mΩ/300mΩ Low RDS(ON) Internal Power  
MOSFETs  
500mA Continuous Output Current  
850KHz Switching Frequency  
Short Protection with Foldback-Mode  
Built-in Over Current Limit  
Output Adjustable from 0.8/0.765/0.6V  
No Schottky Diode Required  
Integrated internal compensation  
Thermal Shutdown  
Built-in Over Voltage Protection  
PSM Mode for High Efficiency in Light Load  
Internal Soft-Start  
Available in SOT23-6 Package  
-40°C to +85°C Temperature Range  
Applications  
Battery-Powered Equipment  
Portable Media Players  
Industrial Distributed Power Applications  
Portable Hand-Held Instruments  
General Description  
The HM8119 device is high-efficiency, synchronous step-down DC/DC regulators. With a wide input range, it is  
suitable for a wide range of applications, such as power conditioning from unregulated sources. It features a low  
RDSON (500mΩ/300mΩ typical) internal switch for maximum efficiency (92% typical). Supports PSM mode, the  
operating frequency is fixed at 850kHz, allowing the use of small external components while still being able to have  
low output voltage ripple. With OVP function, the IC can stand off input voltage as high as 55V. The HM8119  
supports 600mA continuous output current, and it has a 0.8V nominal feedback voltage.  
Additional features include: thermal shutdown, VIN undervoltage lockout, and gate drive undervoltage lockout. The  
HM8119 is available in a low-profile SOT23-6 package.  
Typical Application Circuit  
C1  
BS  
L1  
VOUT  
VIN  
IN  
SW  
FB  
COUT  
R1  
CFF  
ON/  
OFF  
CIN  
EN  
GND  
R2  
Basic Application Circuit  
Page 1 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Pin Description  
Pin Configuration  
TOP VIEW  
BS  
GND  
FB  
SW  
IN  
EN  
SOT23-6  
HM8119A Top Marking: HMYLL (device code: HM, Y=year code, LL= lot number code)  
HM8119B Top Marking: HNYLL (device code: HN, Y=year code, LL= lot number code)  
HM8119C Top Marking: HSYLL (device code: HS, Y=year code, LL= lot number code)  
Pin Description  
Pin  
1
Name  
BS  
Function  
Bootstrap. A capacitor connected between SW and BST pins is required to form a  
floating supply across the high-side switch driver.  
2
GND  
FB  
Ground Pin  
Adjustable Version Feedback input. Connect FB to the center point of the external  
resistor divider  
3
Drive this pin to a logic-high to enable the IC. Drive to a logic-low to disable the  
IC and enter micro-power shutdown mode.  
4
EN  
5
6
IN  
Power Supply Pin  
Switching Pin  
SW  
Order Information (1)  
Marking  
Part No.  
Model  
Description  
Package  
T/R Qty  
HM8119 PSM SYN Buck, 4.5-45V,  
0.5A, 850KHz, VFB 0.8V, SOT23-6  
HMYLL  
70301620  
HM8119A  
SOT23-6  
3000PCS  
HM8119 PSM SYN Buck, 4.5-45V,  
0.5A, 850KHz, VFB 0.765V, SOT23-6  
HNYLL  
HSYLL  
70301621  
70301622  
HM8119B  
HM8119A  
SOT23-6  
SOT23-6  
3000PCS  
3000PCS  
HM8119 PSM SYN Buck, 4.5-45V,  
0.5A, 850KHz, VFB 0.6V, SOT23-6  
Page 2 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Specifications  
Absolute Maximum Ratings (1) (2)  
Item  
Min  
Max  
55  
55  
55  
7
Unit  
V
VIN voltage  
-0.3  
EN voltage  
–0.3 (VIN + 0.3 V)  
-0.3  
V
SW voltage  
V
BS voltage  
V
FB voltage  
–0.3  
6
V
Power dissipation (3)  
Operating junction temperature, TJ  
Storage temperature, Tstg  
Lead Temperature (Soldering, 10sec.)  
Internally Limited  
-40  
150  
150  
260  
°C  
°C  
°C  
–65  
Note (1): Exceeding these ratings may damage the device.  
Note (2): The device is not guaranteed to function outside of its operating conditions.  
Note (3): The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX)  
,
the junction-to-ambient thermal resistance, RθJA, and the ambient temperature, TA. The maximum allowable power  
dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/RθJA. Exceeding the maximum  
allowable power dissipation causes excessive die temperature, and the regulator goes into thermal shutdown.  
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at  
TJ=150°C (typical) and disengages at TJ= 130°C (typical).  
ESD Ratings  
Item  
Description  
Value  
Unit  
Human Body Model (HBM)  
ANSI/ESDA/JEDEC JS-001-2014  
Classification, Class: 2  
V(ESD-HBM)  
±2000  
V
Charged Device Mode (CDM)  
ANSI/ESDA/JEDEC JS-002-2014  
Classification, Class: C0b  
JEDEC STANDARD NO.78E APRIL 2016  
Temperature Classification,  
Class: I  
V(ESD-CDM)  
±200  
±150  
V
ILATCH-UP  
mA  
Recommended Operating Conditions  
Item  
Min  
–40  
-40  
4.5  
0
Max  
125  
85  
Unit  
°C  
°C  
V
Operating junction temperature (1)  
Operating temperature range  
Input voltage VIN  
45  
Output current  
0.5  
A
Note (1): All limits specified at room temperature (TA = 25°C) unless otherwise specified. All room temperature  
limits are 100% production tested. All limits at temperature extremes are ensured through correlation using standard  
Page 3 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).  
Thermal Information  
Item  
RθJA  
RθJC(top)  
RθJB  
ψJT  
Description  
Value  
105  
55  
Unit  
Junction-to-ambient thermal resistance (1)(2)  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
17.5  
3.5  
ψJB  
17.5  
Note (1): The package thermal impedance is calculated in accordance to JESD 51-7.  
Note (2): Thermal Resistances were simulated on a 4-layer, JEDEC board.  
Electrical Characteristics (1) (2)  
VIN=12V, TA=25°C, unless otherwise specified.  
Parameter  
Test Conditions  
Min  
Typ.  
Max  
45  
Unit  
V
Input Voltage Range  
Supply Current (Quiescent)  
Supply Current (Shutdown)  
4.5  
VEN =3.0V  
0.4  
0.8  
mA  
uA  
V
VEN =0 or EN = GND  
HM8119A  
10  
0.780  
0.746  
0.585  
0.800  
0.765  
0.600  
500  
0.820  
0.784  
0.615  
Feedback Voltage  
HM8119B  
V
HM8119C  
V
High-Side Switch On-Resistance  
Low-Side Switch On-Resistance  
Valley Switch Current Limit  
Over Voltage Protection Threshold  
Switching Frequency  
ISW=100mA  
ISW=-100mA  
mΩ  
mΩ  
A
300  
1
48  
850  
89  
V
KHz  
%
Maximum Duty Cycle  
VFB=90%  
Minimum On-Time  
83  
nS  
V
EN Rising Threshold  
1.2  
3.4  
EN Falling Threshold  
0.9  
4.4  
V
Wake up VIN Voltage  
Shutdown VIN Voltage  
Hysteresis VIN voltage  
4.2  
3.7  
500  
1
V
Under-Voltage Lockout Threshold  
V
mV  
mS  
Soft Start  
Thermal Shutdown  
Thermal Hysteresis  
150  
30  
Note (1): MOSFET on-resistance specifications are guaranteed by correlation to wafer level measurements.  
Note (2): Thermal shutdown specifications are guaranteed by correlation to the design and characteristics analysis.  
Page 4 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Typical Performance Characteristics (1) (2)  
Note (1): Performance waveforms are tested on the evaluation board.  
Note (2): VIN =12V, VOUT=3.3V, TA = +25ºC, unless otherwise noted.  
Efficiency vs Load Current  
Load Regulation  
Line Regulation  
VOUT=5V, 3.3V, 1.2V  
VOUT=5V, 3.3V, 1.2  
VOUT=3.3V  
Output Ripple Voltage  
Output Ripple Voltage  
Output Ripple Voltage  
VIN=12V, VOUT=3.3V, IOUT=0mA  
VIN=12V, VOUT=3.3V, IOUT=250mA  
VIN=12V, VOUT=3.3V, IOUT=500mA  
Loop Response  
Output Short  
Short Circuit Entry  
VIN=12V, VOUT=3.3V, IOUT=100mA-500mA  
VIN=12V, VOUT=3.3V  
VIN=12V, VOUT=3.3V  
Page 5 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Short Circuit Recovery  
Enable Startup at No Load  
Enable Shutdown at No Load  
VIN=12V, VOUT=3.3V  
VIN=12V, VOUT=3.3V, IOUT=0mA  
VIN=12V, VOUT=3.3V, IOUT=0mA  
Enable Startup at Full Load  
Enable Shutdown at Full Load  
Power Up at No Load  
VIN=12V, VOUT=3.3V, IOUT=500mA  
VIN=12V, VOUT=3.3V, IOUT=500mA  
VIN=12V, VOUT=3.3V, IOUT=0mA  
Power Up at Full Load  
VIN=12V, VOUT=3.3V, IOUT=500mA  
Page 6 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Functional Block Diagram  
IN  
Peak Curve  
Detection  
Regulator  
BS  
Bias&Ref  
EN  
0.8/2MHz  
Clock  
Slope  
Compensation  
Driver  
SW  
Comparator  
Error Amplifier  
FB  
Fault  
Detection  
Valley Curve  
Detection  
GND  
OTP  
Block Diagram  
Functions Description  
Internal Regulator  
The HM8119 is a current mode step down DC/DC converter that provides excellent transient response with no extra  
external compensation components. This device contains an internal, low resistance, high voltage power MOSFET,  
and operates at a high 850KHz operating frequency to ensure a compact, high efficiency design with excellent AC  
and DC performance.  
Under-Voltage Lockout (UVLO)  
Under-voltage lockout (UVLO) protects the chip from operating at an insufficient supply voltage. UVLO protection  
monitors the internal regulator voltage. When the voltage is lower than UVLO threshold voltage, the device is shut  
off. When the voltage is higher than UVLO threshold voltage, the device is enabled again.  
Thermal Shutdown  
Thermal shutdown prevents the chip from operating at exceedingly high temperatures. When the silicon die  
temperature exceeds 150°C, it shuts down the whole chip. When the temperature falls below its lower threshold  
(Typ. 130°C) the chip is enabled again.  
Internal Soft-Start  
The soft-start is implemented to prevent the converter output voltage from overshooting during startup. When the  
chip starts, the internal circuitry generates a soft-start voltage (SS) ramping up from 0V to VFB. When it is lower  
than the internal reference (REF), SS overrides REF so the error amplifier uses SS as the reference. When SS is  
higher than REF, REF regains control. The SS time is internally max to 1ms.  
Page 7 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Over Current Protection  
The HM8119 has cycle-by-cycle over current limit when the inductor current peak value exceeds the set current  
limit threshold. Meanwhile, output voltage starts to drop until FB is below the Under-Voltage (UV) threshold. Once  
a UV is triggered, the HM8119 enters hiccup mode to periodically restart the part. This protection mode is especially  
useful when the output is dead-short to ground. The average short circuit current is greatly reduced to alleviate the  
thermal issue and to protect the regulator. The HM8119 exits the foldback mode once the over current condition is  
removed.  
Startup and Shutdown  
If both VIN and EN are higher than their appropriate thresholds, the chip starts. The reference block starts first,  
generating stable reference voltage and currents, and then the internal regulator is enabled. The regulator provides  
stable supply for the remaining circuitries. Three events can shut down the chip: EN low, VIN low and thermal  
shutdown. In the shutdown procedure, the signaling path is first blocked to avoid any fault triggering. The comp  
voltage and the internal supply rail are then pulled down. The floating driver is not subject to this shutdown  
command.  
Page 8 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Applications Information  
Setting the Output Voltage  
HM8119 require an input capacitor, an output capacitor, and an inductor. These components are critical to the  
performance of the device. HM8119 integrates internal loop compensating resistors, so we do not recommend using  
a value of more than 50K for R1. The output voltage can be programmed by resistor divider.  
푅1 + 푅2  
푂푈푇 = 퐹퐵  
×
푅2  
Example for VFB=0.8V  
VOUT(V)  
1.0  
R1(KΩ)  
51  
R2(KΩ)  
204  
L1(μH)  
1.0  
C1(nF)  
100  
CIN(μF)  
22  
COUT(μF)  
22×2  
CFF (pF) Opt.  
CFF Chapter  
CFF Chapter  
CFF Chapter  
CFF Chapter  
CFF Chapter  
CFF Chapter  
CFF Chapter  
1.2  
51  
102  
1.5  
100  
22  
22×2  
1.5  
51  
58.29  
40.8  
2.2  
100  
22  
22×2  
1.8  
51  
2.2  
100  
22  
22×2  
2.5  
51  
24  
2.2  
100  
22  
22×2  
3.3  
51  
16.32  
9.71  
3.3  
100  
22  
22×2  
5.0  
51  
4.7  
100  
22  
22×2  
All the external components are the suggested values, the final values are based on the application testing results.  
Selecting the Inductor  
The recommended inductor values are shown in the Application Diagram. It is important to guarantee the inductor  
core does not saturate during any foreseeable operational situation. The inductor should be rated to handle the  
maximum inductor peak current: Care should be taken when reviewing the different saturation current ratings that  
are specified by different manufacturers. Saturation current ratings are typically specified at 25°C, so ratings at  
maximum ambient temperature of the application should be requested from the manufacturer. The inductor value  
can be calculated with:  
(
)
푂푈푇 × 퐼푁 푂푈푇  
퐿 =  
퐼푁 × ∆ꢀ× 푂푆퐶  
Where ΔIL is the inductor ripple current. Choose inductor ripple current to be approximately 30% to 40% of the  
maximum load current. The maximum inductor peak current can be estimated as:  
∆ꢀꢁ  
ꢁ(푀퐴푋) = ꢀꢁ푂퐴퐷  
+
2
Under light load conditions below 100mA, larger inductance is recommended for improved efficiency. Larger  
inductances lead to smaller ripple currents and voltages, but they also have larger physical dimensions, lower  
saturation currents and higher linear impedance. Therefore, the choice of inductance should be compromised  
according to the specific application.  
Page 9 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Selecting the Input Capacitor  
The input current to the step-down converter is discontinuous and therefore requires a capacitor to supply AC current  
to the step-down converter while maintaining the DC input voltage. For a better performance, use ceramic capacitors  
placed as close to VIN as possible and a 0.1µF input capacitor to filter out high frequency interference is  
recommended. Capacitors with X5R and X7R ceramic dielectrics are recommended because they are stable with  
temperature fluctuations.  
The capacitors must also have a ripple current rating greater than the maximum input ripple current of the converter.  
The input ripple current can be estimated with Equation:  
푂푈푇  
푂푈푇  
퐶퐼푁 = ꢀ푂푈푇 × √  
× ꢃ1 −  
퐼푁  
퐼푁  
From the above equation, it can be concluded that the input ripple current reaches its maximum at VIN=2VOUT where  
I퐶퐼푁  
=
ꢅꢆ. For simplification, choose an input capacitor with an RMS current rating greater than half of the  
maximum load current.  
The input capacitance value determines the input voltage ripple of the converter. If there is an input voltage ripple  
requirement in the system, choose the input capacitor that meets the specification. The input voltage ripple can be  
estimate with Equation:  
푂푈푇  
푂푈푇  
푂푈푇  
∆푉  
=
×
× ꢃ1 −  
퐼푁  
푂푆퐶 × ꢉ퐼푁  
퐼푁  
퐼푁  
4
ꢅꢆꢇ  
Similarly, when VIN=2VOUT, input voltage ripple reaches its maximum of ∆푉  
=
×
.
×퐶  
ꢍꢎ  
퐼푁  
ꢅꢋꢌ  
Selecting the Output Capacitor  
An output capacitor is required to maintain the DC output voltage. The output voltage ripple can be estimated with  
Equation:  
푂푈푇  
푂푈푇  
1
푂푈푇  
=
× ꢃ1 −  
ꢄ × ꢃ푅퐸푆ꢏ  
+
푂푆퐶 × 퐿  
퐼푁  
8 × 푂푆퐶 × ꢉ푂푈푇  
There are some differences between different types of capacitors. In the case of ceramic capacitors, the impedance  
at the switching frequency is dominated by the capacitance. The output voltage ripple is mainly caused by the  
capacitance. For simplification, the output voltage ripple can be estimated with Equation:  
푂푈푇  
푂푈푇  
푂푈푇  
=
× ꢃ1 −  
8 × 푂푆× 퐿 × ꢉ푂푈푇  
퐼푁  
A larger output capacitor can achieve a better load transient response, but the maximum output capacitor limitation  
should also be considered in the design application. If the output capacitor value is too high, the output voltage will  
not be able to reach the design value during the soft-start time and will fail to regulate. The maximum output  
capacitor value (COUT  
_
MAX) can be limited approximately with Equation:  
푂푈푇_푀퐴푋 = ꢐꢀꢁ퐼푀_퐴ꢑ퐺 − ꢀ푂푈ꢒ × ꢓ /푂푈푇  
푆푆  
Page 10 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Where LLIM_AVG is the average start-up current during the soft-start period, and TSS is the soft- start time.  
On the other hand, special attention should be paid when selecting these components. The DC bias of these  
capacitors can result in a capacitance value that falls below the minimum value given in the recommended capacitor  
specifications table.  
The ceramic capacitor’s actual capacitance can vary with temperature. The capacitor type X7R, which operates over  
a temperature range of −55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R  
has a similar tolerance over a reduced temperature range of −55°C to +85°C. Many large value ceramic capacitors,  
larger than 1uF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance can drop by more  
than 50% as the temperature varies from 25°C to 85°C. Therefore, X5R or X7R is recommended over Z5U and  
Y5V in applications where the ambient temperature will change significantly above or below 25°C.  
Feed-Forward Capacitor (CFF)  
HM8119 has internal loop compensation, so adding CFF is optional. Specifically, for specific applications, if  
necessary, consider whether to add feed-forward capacitors according to the situation.  
The use of a feed-forward capacitor (CFF) in the feedback network is to improve the transient response or higher  
phase margin. For optimizing the feed-forward capacitor, knowing the cross frequency is the first thing. The cross  
frequency (or the converter bandwidth) can be determined by using a network analyzer. When getting the cross  
frequency with no feed-forward capacitor identified, the value of feed-forward capacitor (CFF) can be calculated  
with the following Equation:  
1
1
1
1
퐹퐹  
=
×
× ꢃ  
+
2휋 × 퐶ꢏ푂푆푆  
푅1  
푅1 푅2  
Where FCROSS is the cross frequency.  
To reduce transient ripple, the feed-forward capacitor value can be increased to push the cross frequency to higher  
region. Although this can improve transient response, it also decreases phase margin and cause more ringing. In the  
other hand, if more phase margin is desired, the feed-forward capacitor value can be decreased to push the cross  
frequency to lower region.  
Page 11 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
PC Board Layout Consideration  
PCB layout is very important to achieve stable operation. It is highly recommended to duplicate EVB layout for  
optimum performance. If change is necessary, please follow these guidelines for reference.  
1. Keep the path of switching current short and minimize the loop area formed by Input capacitor, high-side  
MOSFET and low-side MOSFET.  
2. Bypass ceramic capacitors are suggested to be put close to the VIN Pin.  
3. Ensure all feedback connections are short and direct. Place the feedback resistors and compensation  
components as close to the chip as possible.  
4. VOUT, SW away from sensitive analog areas such as FB.  
5. Connect IN, SW, and especially GND respectively to a large copper area to cool the chip to improve thermal  
performance and long-term reliability.  
Top Layer  
Bottom Layer  
Sample Board Layout  
Page 12 / 13  
HM8119  
Standoff 55V 500mA 850KHz Sync Step-Down Regulator  
Package Description  
SOT23-6  
0.95  
BSC  
2.80  
3.00  
0.60  
TYP  
1.20  
TYP  
EXAMPLE  
TOP MARK  
1.50  
1.70  
2.60  
3.00  
2.60  
TYP  
AAAAA  
PIN 1  
TOP VIEW  
RECOMMENDED PAD LAYOUT  
GAUGE PLANE  
0.25 BSC  
0.90  
1.30  
1.45 MAX  
SEATING PLANE  
0.30  
0.50  
0.00  
0.15  
0.09  
0.20  
0.30  
0.55  
0.95 BSC  
0°~8°  
FRONT VIEW  
SIDE VIEW  
NOTE:  
1. CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS IN MILLIMETERS.  
2. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
3. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
4. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.004" INCHES MAX.  
5. DRAWING CONFORMS TO JEDEC MS-012, VARIATION BA.  
6. DRAWING IS NOT TO SCALE.  
Page 13 / 13  

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