454ST89E [HITTITE]
InGaP HBT WATT HIGH IP3 AMPLIFIER, 0.4 - 2.5 GHz; 的InGaP HBT ？ WATT高IP3放大器， 0.4 - 2.5 GHz的
| 型号： | 454ST89E |
| 厂家： | 
HITTITE MICROWAVE CORPORATION |
| 描述： | InGaP HBT WATT HIGH IP3 AMPLIFIER, 0.4 - 2.5 GHz |
| 文件： | 总12页 (文件大小：406K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Typical Applications
The HMC454ST89 / HMC454ST89E is ideal for appli-
cations requiring a high dynamic range amplifier:
Features
Output IP3: +40 to +42 dBm
Gain: 12.5 dB @ 2150 MHz
• GSM, GPRS & EDGE
• CDMA & W-CDMA
• CATV/Cable Modem
• Fixed Wireless & WLL
50% PAE @ +28 dBm Pout
+17.5 dBm W-CDMA Channel Power@ -45 dBc ACP
Single +5V Supply
Industry Standard SOT89 Package
Included in the HMC-DK002 Designer’s Kit
Functional Diagram
General Description
TheHMC454ST89&HMC454ST89Earehighdynamic
range GaAs InGaP Heterojunction Bipolar Transistor
(HBT) ½ watt MMIC amplifiers operating between 0.4
and 2.5 GHz. Packaged in a low cost industry standard
SOT89, the amplifier gain is typically 17.8 dB from 0.8
to 1.0 GHz and 12.5 dB from 1.8 to 2.2 GHz. Utilizing a
minimum number of external components and a single
+5V supply, the amplifier output IP3 can be optimized
to +40 dBm at 0.9 GHz or +42 dBm at 2.0 GHz. The
high output IP3 and PAE makes the HMC454ST89 an
ideal driver amplifier for Cellular/PCS/3G, WLL, ISM
and Fixed Wireless applications.
Electrical Specifications, TA = +25°C, Vs= +5V [1]
Parameter
Min.
Typ.
824 - 960
17.8
0.008
9
Max.
Min.
11
Typ.
Max.
Min.
11
Typ.
2000 - 2200
12.5
Max.
Units
MHz
dB
Frequency Range
1800 - 2000
Gain
16
12.5
0.008
7
Gain Variation Over Temperature
Input Return Loss
0.016
0.016
0.008
12
0.016
dB / °C
dB
Output Return Loss
13
21
19
dB
Output Power for 1dB Compression (P1dB)
Saturated Output Power (Psat)
22
37
24.5
25.5
40
24
38
27
24
38
27.5
dBm
dBm
dBm
dB
28.5
41
28.5
42
[2]
Output Third Order Intercept (IP3)
Noise Figure
8
6.5
150
5.2
Supply Current (Icq)
150
175
175
150
175
mA
[1] Specifications and data reflect HMC454ST89 measured using the respective application circuits for each designated frequency band found
herein. Contact the HMC Applications Group for assistance in optimizing performance for your application.
[2] Two-tone input power of 0 dBm per tone, 1 MHz spacing.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 220
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
Broadband Gain
9
Gain vs. Temperature @ 900 MHz
& Return Loss @ 900 MHz
25
20
19
18
17
16
15
14
20
15
10
S21
S11
5
0
S22
-5
13
12
11
10
+25 C
+85 C
-40 C
-10
-15
-20
0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4
0.7
0.8
0.9
1
1.1
1.2
1.2
1.2
FREQUENCY (GHz)
FREQUENCY (GHz)
Input Return Loss
Output Return Loss
vs. Temperature @ 900 MHz
vs. Temperature @ 900 MHz
0
0
+25 C
+85 C
-40 C
-5
-5
-10
-15
-20
-10
-15
+25 C
+85 C
-40 C
-20
-25
0.7
0.8
0.9
1
1.1
1.2
0.7
0.8
0.9
1
1.1
FREQUENCY (GHz)
FREQUENCY (GHz)
P1dB vs. Temperature @ 900 MHz
Psat vs. Temperature @ 900 MHz
30
30
29
28
27
26
25
29
28
27
26
25
24
23
22
21
20
+25 C
+85 C
-40 C
24
23
22
21
20
+25 C
+85 C
-40 C
0.7
0.8
0.9
1
1.1
1.2
0.7
0.8
0.9
1
1.1
FREQUENCY (GHz)
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 221
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Output IP3 vs. Temperature @ 900 MHz
Noise Figure vs. Temperature @ 900 MHz
15
14
13
44
43
42
41
40
39
38
12
+25 C
+85 C
-40 C
11
10
9
8
37
36
35
34
+25 C
+85 C
-40 C
7
6
5
0.7
0.8
0.9
1
1.1
1.2
0.7
0.8
0.9
1
1.1
1.2
FREQUENCY (GHz)
FREQUENCY (GHz)
Reverse Isolation
Gain, Power & Output IP3
vs. Temperature @ 900 MHz
vs. Supply Voltage @ 900 MHz
45
0
40
35
30
25
20
15
-5
-10
-15
-20
-25
-30
-35
-40
+25 C
+85 C
-40 C
GAIN
P1dB
PSAT
IP3
10
5
4.5
4.75
5
5.25
5.5
0.7
0.8
0.9
1
1.1
1.2
Vs (V)
FREQUENCY (GHz)
ACPR vs. Supply Voltage @ 880 MHz
CDMA IS95, 9 Channels Forward
-30
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
CDMA IS95
Frequency : 880 MHz
Integration BW: 1.228 MHz
Forward Link, 9 Channels
4.5V
5.0V
5.5V
Source ACPR
7
8
9
10 11 12 13 14 15 16 17 18 19
Channel Output Power (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 222
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
Broadband Gain
& Return Loss @ 1960 MHz
9
Gain vs.Temperature @ 1960 MHz
25
20
15
10
15
14
13
12
11
10
5
0
S21
S11
S22
-5
9
8
7
6
5
+25 C
+85 C
-40 C
-10
-15
-20
-25
1
1.2 1.4 1.6 1.8
2
2.2 2.4 2.6 2.8
3
1.7
1.8
1.9
2
2.1
2.2
2.2
2.2
FREQUENCY (GHz)
FREQUENCY (GHz)
Input Return Loss
vs.Temperature @ 1960 MHz
Output Return Loss
vs.Temperature @ 1960 MHz
0
0
-5
-5
+25 C
+85 C
-40 C
-10
-15
-20
-25
-10
+25 C
+85 C
-40 C
-15
-20
1.7
1.8
1.9
2
2.1
2.2
1.7
1.8
1.9
2
2.1
FREQUENCY (GHz)
FREQUENCY (GHz)
P1dB vs.Temperature @ 1960 MHz
Psat vs.Temperature @ 1960 MHz
32
32
31
30
29
28
27
31
30
29
28
27
26
25
24
23
22
+25 C
+85 C
-40 C
26
25
24
23
22
+25 C
+85 C
-40 C
1.7
1.8
1.9
2
2.1
2.2
1.7
1.8
1.9
2
2.1
FREQUENCY (GHz)
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 223
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
Noise Figure
vs. Temperature @ 1960 MHz
9
Output IP3 vs. Temperature @ 1960 MHz
10
44
43
42
41
40
39
9
8
7
6
5
4
38
+25 C
+25 C
+85 C
+85 C
3
2
1
0
-40 C
37
36
35
34
-40 C
1.7
1.8
1.9
2
2.1
2.2
5.5
20
1.7
1.8
1.9
2
2.1
2.2
FREQUENCY (GHz)
FREQUENCY (GHz)
Reverse Isolation
vs. Temperature @ 1960 MHz
Gain, Power & Output IP3
vs. Supply Voltage @ 1960 MHz
45
0
40
35
30
25
-5
+25 C
+85 C
-40 C
-10
GAIN
P1dB
PSAT
IP3
-15
-20
-25
20
15
10
5
4.5
4.75
5
5.25
1.7
1.8
1.9
2
2.1
2.2
Vs (V)
FREQUENCY (GHz)
ACPR vs. Supply Voltage @ 1.96 GHz
CDMA 2000, 9 Channels Forward
ACPR vs. Supply Voltage @ 2.14 GHz
W-CDMA, 64 DPCH
-40
-30
-45
-50
-55
-60
-65
-70
-75
-80
-85
CDMA2000 Rev. 8
Frequency : 1.96 GHz
Integration BW: 1.228 MHz
Forward Link, SRI, 9 CHANNELS
WCDMA
-35
-40
-45
-50
-55
-60
-65
-70
Frequency : 2.14 GHz
Integration BW: 3.84 MHz
64 DPCH
4.5V
5.0V
4.5V
5.0V
5.5V
5.5V
Source ACPR
Source ACPR
2
4
6
8
10
12
14
16
18
20
22
0
2
4
6
8
10
12
14
16
18
Channel Output Power (dBm)
Channel Output Power (dBm)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 224
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Absolute Maximum Ratings
Collector Bias Voltage (Vcc)
+6.0 Vdc
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
RF Input Power (RFIN)(Vs = +5.0
Vdc)
+25 dBm
150 °C
Junction Temperature
Continuous Pdiss (T = 85 °C)
(derate 13.6 mW/°C above 85 °C)
0.890 W
Thermal Resistance
(junction to ground paddle)
73 °C/W
Storage Temperature
Operating Temperature
-65 to +150 °C
-40 to +85 °C
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS].
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finish
MSL Rating
MSL1 [1]
Package Marking [3]
H454
XXXX
HMC454ST89
Low Stress Injection Molded Plastic
Sn/Pb Solder
H454
XXXX
MSL1 [2]
HMC454ST89E
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 225
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Pin Descriptions
Pin Number
Function
Description
This pin is AC coupled.
Interface Schematic
1
RFIN
RFOUT
GND
Off chip matching components are required.
See Application Circuit herein.
RF output and DC Bias input for the output amplifier stage.
Off chip matching components are required.
See Application Circuit herein.
3
These pins & package bottom must be connected to
RF/DC ground.
2,4
900 MHz Application Circuit, Compact Layout
This circuit was used to specify the performance for 894-960 MHz operation. This circuit will satisfy many applications
from 700 to 1200 MHz. Contact the HMC Applications Group for assistance in optimizing performance for your
application.
Recommended Component Values
TL1
50 Ohm
0.050”
2.5°
L1, L2
L3
1 nH
36 nH
Impedance
Physical Length
Electrical Length
R1
5.1 Ohms
8 pF
C1
PCB Material: 10 mil Rogers 4350,
Er = 3.48
C2
22 pF
C3
2.7 pF
100 pF
2.2 μF
C4, C6
C5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 226
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
900 MHz Evaluation PCB
List of Materials for Evaluation PCB 107755 [1]
The circuit board used in this application should use
RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown.
A sufficient number of via holes should be used to
connect the top and bottom ground planes. The
evaluation board should be mounted to an appro-
priate heat sink. The evaluation circuit board shown
is available from Hittite upon request.
Item
J1 - J2
J3 -J4
C1
Description
PCB Mount SMA Connector
DC Pins
8 pF Capacitor, 0402 Pkg.
22 pF Capacitor, 0402 Pkg.
2.7 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
2.2 μF Capacitor, Tantalum
1 nH Inductor, 0402 Pkg.
36 nH Inductor, 0402 Pkg.
5.1 Ohms
C2
C3
C4, C6
C5
L1, L2
L3
R1
HMC454ST89 / HMC454ST89E
Linear Amp
U1
[2]
PCB
107753 Evaluation PCB, 10 mils
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350, Er = 3.48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 227
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
1960 & 2140 MHz Application Circuit
This circuit was used to specify the performance for 1800-2000 and 2000-2200 MHz operation. This circuit will
satisfy many applications from 1700 to 2500 MHz. Contact the HMC Applications Group for assistance in optimizing
performance for your application.
Recommended Component Values
TL1
50 Ohm
0.32”
34°
TL2
50 Ohm
0.10”
T3
50 Ohm
0.07”
8°
TL4
50 Ohm
0.17”
L1
C1
C2
C3
C4
C5
8.2 nH
1 pF
Impedance
Physical Length
Electrical Length
1.2 pF
3 pF
11°
18.5°
PCB Material: 10 mil Rogers 4350, Er = 3.48
100 pF
2.2 μF
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 228
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
1960 & 2140 MHz Evaluation PCB
List of Materials for Evaluation PCB 107749 [1]
The circuit board used in this application should use
RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown.
A sufficient number of via holes should be used to
connect the top and bottom ground planes. The
evaluation board should be mounted to an appro-
priate heat sink. The evaluation circuit board shown
is available from Hittite upon request.
Item
J1 - J2
J3 - J4
C1
Description
PCB Mount SMA Connector
DC Pins
1.0 pF Capacitor, 0402 Pkg.
1.2 pF Capacitor, 0402 Pkg.
3.0 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg.
2.2 μF Capacitor, Tantalum
8.2 nH Inductor, 0402 Pkg.
HMC454ST89 / HMC454ST89E
107747 Evaluation PCB, 10 mils
C2
C3
C4
C5
L1
U1
[2]
PCB
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350, Er = 3.48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 229
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Alternative 900 MHz Application Circuit, Optimal OIP3 Layout
This alternate application circuit for 900 MHz applications features a resonating I/O structure on the PCB that, while
using more PCB area, will improve output IP3 from +40 dBm to +42 dBm. This circuit will satisfy many applications
from 700 to 1200 MHz as the typical performance below demonstrates. Contact the HMC Applications Group for
assistance in optimizing performance for your application.
Recommended Component Values
L1
C1
18 nH
4 pF
TL1
50 Ohm
0.35”
18°
TL2
50 Ohm
0.05”
TL3
50 Ohm
0.53”
27°
Impedance
C2, C6
C3
10 pF
3 pF
Physical Length
Electrical Length
2.5°
C4
100 pF
2.2 μF
PCB Material: 10 mil Rogers 4350, Er = 3.48
C5
Broadband Gain & Return Loss
Output IP3 & P1dB
25
50
20
15
45
40
35
30
25
20
10
S21
S11
S22
IP3
P1dB
5
0
-5
-10
-15
0.4 0.5 0.6 0.7 0.8 0.9
1
1.1 1.2 1.3 1.4
0.7
0.8
0.9
1
1.1
1.2
FREQUENCY (GHz)
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 230
HMC454ST89 / 454ST89E
v04.0907
InGaP HBT ½ WATT HIGH IP3
AMPLIFIER, 0.4 - 2.5 GHz
9
Alternate 900 MHz Evaluation PCB
List of Materials
The circuit board used in this application should use
RF circuit design techniques. Signal lines should
have 50 ohm impedance while the package ground
leads and exposed paddle should be connected
directly to the ground plane similar to that shown.
A sufficient number of via holes should be used to
connect the top and bottom ground planes. The
evaluation board should be mounted to an appro-
priate heat sink. The evaluation circuit board shown
is available from Hittite upon request.
Item
J1 - J2
J3 - J4
C1
Description
PCB Mount SMA Connector
DC Pins
4 pF Capacitor, 0402 Pkg.
10 pF Capacitor, 0402 Pkg.
3.0 pF Capacitor, 0402 Pkg.
100 pF Capacitor, 0402 Pkg
18 nH Inductor, 0402 Pkg.
HMC454ST89 / HMC454ST89E
107750 Evaluation PCB, 10 mils
C2, C6
C3
C4
L1
U1
PCB*
* Circuit Board Material: Rogers 4350, Er = 3.48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
9 - 231
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