HA16116 [HITACHI]
Switching Regulator for Chopper Type DC/DC Converter; 开关稳压器型DC / DC转换器型号: | HA16116 |
厂家: | HITACHI SEMICONDUCTOR |
描述: | Switching Regulator for Chopper Type DC/DC Converter |
文件: | 总34页 (文件大小:249K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
HA16116FP/FPJ, HA16121FP/FPJ
Switching Regulator for Chopper Type DC/DC Converter
Description
HA16116FP/FPJ and HA16121FP/FPJ are dual-channel PWM switching regulator controller ICs for use in
chopper-type DC/DC converters.
This IC series incorporates totem pole gate drive circuits to allow direct driving of a power MOS FET. The
output logic is preset for booster, step-down, or inverting control in a DC/DC converter. This logic
assumes use of an N-channel power MOS FET for booster control, and a P-channel power MOS FET for
step-down or inverting control.
HA16116 includes a built-in logic circuit for step-down control only, and one for use in both step-down
and inverting control. HA16121 has a logic circuit for booster control only and one for both step-down and
inverting control.
Both ICs have a pulse-by-pulse current limiter, which limits PWM pulse width per pulse as a means of
protecting against overcurrent, and which uses an on/off timer for intermittent operation. Unlike
conventional methods that use a latch timer for shutdown, when the pulse-by-pulse current limiter
continues operation beyond the time set in the timer, the IC is made to operate intermittently (flickering
operation), resulting in sharp vertical setting characteristics. When the overcurrent condition subsides, the
output is automatically restored to normal.
The dual control circuits in the IC output identical triangle waveforms, for completely synchronous
configuring a compact, high efficiency dual-channel DC/DC converter, with fewer external components
than were necessary previously.
Functions
•
•
•
•
•
•
•
•
2.5 V reference voltage (Vref) regulator
Triangle wave form oscillator
Dual overcurrent detector
Dual totem pole output driver
UVL (under voltage lock out) system
Dual error amplifier
Vref overvoltage detector
Dual PWM comparator
HA16116FP/FPJ, HA16121FP/FPJ
Features
•
•
•
•
Wide operating supply voltage range* (3.9 V to 40.0 V)
Wide operating frequency range (600 kHz maximum operation)
Direct power MOS FET driving (output current ±1 A peak in maximum rating)
Pulse-by-pulse overcurrent protection circuit with intermittent operation function (When overcurrent
state continues beyond time set in timer, the IC operates intermittently to prevent excessive output
current.)
•
Grounding the ON/OFF pin turns the IC off, saving power dissipation. (HA16116: IOFF = 10 µA max.;
HA16121: IOFF = 150 µA max.)
•
•
Built-in UVL circuit (UVL voltage can be varied with external resistance.)
Built-in soft start and quick shutoff functions
Note: The reference voltage 2.5 V is under the condition of VIN ≥ 4.5 V.
Ordering Information
Hitachi Control ICs for Chopper-Type DC/DC Converters
Product
Channel Control Functions
Overcurrent
Channels Number
No.
Step-Up
Step-Down
Inverting
Output Circuits
Protection
Dual
HA17451
Ch 1
Ch 2
—
❍
❍
—
❍
—
—
—
❍
❍
❍
❍
—
❍
❍
❍
—
❍
❍
❍
—
❍
—
❍
—
Open collector
SCP with timer (latch)
Single
Dual
HA16114
HA16120
HA16116
Totem pole
Pulse-by-pulse
—
power MOS FET current limiter and
Ch 1
Ch 2
Ch 1
Ch 2
driver
intermittent operation
by on/off timer
HA16121
2
HA16116FP/FPJ, HA16121FP/FPJ
Pin Arrangement
*2
S.GND*1
CT
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
S.VIN
Vref
RT
TIM
IN(+)1
IN(−)1
E/O1
ON/OFF
IN(−)2
E/O2
Channel 1
Channel 2
DB1
CL1
DB2
CL2
OUT1
P.GND*1
OUT2
*2
P.V IN
(top view)
1. Pins S.GND (pin 1) and P.GND (pin 10) have no direct internal interconnection.
Both pins must be connected to ground.
Notes:
2. Pins S.V (pin 20) and P.VIN (pin 11) have no direct internal interconnection.
IN
Both pins must be connected to VIN.
3
HA16116FP/FPJ, HA16121FP/FPJ
Pin Functions
Pin No.
Symbol
S.GND
CT
Function
Signal circuitry*1 ground
1
2
Timing capacitance (triangle wave oscillator output)
Timing resistance (for bias current synchronization)
Error amp. noninverting input (1)
Error amp. inverting input (1)
Error amp. output (1)
3
RT
4
IN(+)1
IN(–)1
E/O1
DB1
Channel 1
5
6
7
Dead band timer off period adjustment input (1)
Overcurrent detection input (1)
PWM pulse output (1)
Output stage*1 ground
Output stage*1 power supply input
8
CL1
9
OUT1
P.GND
P.VIN
OUT2
CL2
10
11
12
13
14
15
16
17
18
PWM pulse output (2)
Channel 2
Overcurrent detection input (2)
Dead band timer off period adjustment input (2)
Error amp. output (2)
DB2
E/O2
IN(–)2
ON/OFF
TIM
Error amp. inverting input (2)*2
IC on/off switch input (off when grounded)
Setting of intermittent operation timing when overcurrent is detected
(collector input of timer transistor)
19
20
Vref
2.5 V reference voltage output
Signal circuitry*1 power supply input
S.VIN
Notes: 1. Here “output stage” refers to the power MOS FET driver circuits, and “signal circuitry” refers to all
other circuits on the IC. Note that this IC is not protected against reverse insertion, which can
cause breakdown of the IC between VIN and GND. Be careful to insert the IC correctly.
2. Noninverting input of the channel 2 error amp is connected internally to Vref.
4
HA16116FP/FPJ, HA16121FP/FPJ
Block Diagram
5
HA16116FP/FPJ, HA16121FP/FPJ
Function and Timing Chart
Relation between triangle wave and PWM output (in steady-state operation)
CT triangle wave
1.6 V typ
1.0 V typ
Dead band
voltage
E/O Error amp output
VIN (on)
This pulse
Booster
channel
output
(HA16121-
Ch 2) only
is for
N-channel
power MOS
FET gate
driving.
tON
tOFF
GND (off)
PWM
pulse
output
T
Step-down
or inverting
output
(HA16116-
Ch 1, Ch 2/
HA16121-Ch 1)
This pulse
is for
P-channel
power MOS
FET gate
driving.
VIN (off)
GND (on)
Note: On duty = tON/T, where T = 1/f OSC
.
6
HA16116FP/FPJ, HA16121FP/FPJ
Determining External Component Constants (pin usage)
Constant settings are explained for the following items.
S.GND
CT
1
2
3
4
5
6
7
8
9
20 S.VIN
19 Vref
Vref UVL and
OVP
5.
6.
Oscillator
frequency
(fOSC) setting
1.
Setting of inter-
mittent operation
timing when
overcurrent is
detected
RT
18 TIM
IN(+)1
IN(−)1
E/O1
DB1
17 ON/OFF
16 IN(−)2
15 E/O2
14 DB2
DC/DC converter
output voltage
setting and
2.
3.
4.
error amp usage
ON/OFF pin
usage
7.
8.
Channel 1
Channel 2
Dead band duty
and soft start
setting
Overcurrent
detection value
setting
CL1
13 CL2
Output stage
circuit and
power MOS FET
driving method
OUT1
12 OUT2
11 P.V IN
P.GND 10
1. Oscillator Frequency (fOSC) Setting
Figure 1.1 shows an equivalent circuit for the triangle wave oscillator.
VH
(3.3 V
IC internal circuits)
Vref (2.5 V)
1.6 V typ
VL
1.0 V typ
CT charging
IO
RA
t1
t2
Comparator
RC
IO
Discharging
RB
CT
(external)
CT
1 : 2
1.1 V
RT
RT
(external)
Inside the IC
Figure 1.1 Equivalent Circuit for the Triangle Wave Oscillator
7
HA16116FP/FPJ, HA16121FP/FPJ
The triangle wave is a voltage waveform used as a reference in creating a PWM pulse. This block operates
according to the following principles. A constant current IO, determined by an external timing resistor RT,
is made to flow continuously to external timing capacitor CT. When the CT pin voltage exceeds the
comparator threshold voltage VH, the comparator output causes a switch to operate, discharging a current IO
from CT. Next, when the CT pin voltage drops below threshold voltage VL, the comparator output again
causes the switch to operate, stopping the IO discharge. The triangle wave is generated by this repeated
operation.
Note that IO = 1.1 V/RT. Since the IO current mirror circuit has a very limited current producing ability, RT
should be set to ≥ 5 kΩ (IO ≥ 220 µA).
With this IC series, VH and VL of the triangle wave are fixed internally at about 1.6 V and 1.0 V by the
internal resistors RA, RB, and RC. The oscillator frequency can be calculated as follows.
1
fOSC
Here,
=
t1 + t2 + t3
CT (VH − VL)
CT RT (VH − VL)
t1 =
=
1.1 V/RT
1.1 V
CT (VH − VL)
(2 − 1) × 1.1 V/RT
CT RT (VH − VL)
t2 =
=
= t1
1.1 V
V
H − VL = 0.6 V
0.6
t1 = t2 =
1.1
CT RT
t3 ≈ 0.8 µs (comparator delay time in the oscillator)
Accordingly,
1
1
fOSC
≈
[Hz]
≈
2t1 + t3
1.1 CT RT + 0.8 µs
Note that the value of fOSC may differ slightly from the above calculation depending on the amount of delay
in the comparator circuit. Also, at high frequencies this comparator delay can cause triangle wave
overshoot or undershoot, skewing the dead band threshold. Confirm the actual value in implementation
and adjust the constants accordingly.
8
HA16116FP/FPJ, HA16121FP/FPJ
2. DC/DC Converter Output Voltage Setting and Error Amp Usage
2.1 Positive Voltage Booster (VO > VIN) or Step-Down (VIN > VO > Vref)
R1 + R2
Use VO
=
Vref (V)
R2
Booster output is possible only at channel 2 of HA16121. For step-down output, both channels of
HA16116 or channel 1 of HA16121 are used.
VO
Error amp.
R1
IN(−)1
−
CH1
IN(+)1 +
R2
VO
R1
IN(−)2
−
CH2
R2
+
Vref
2.5 V
Vref pin
(internal connection)
Figure 2.1
2.2 Negative Voltage (VO < Vref) for Inverting Output
R1
R1 + R2
R3 + R4
R3
Use VO = −Vref
− 1 (V)
Channel 1 is used for inverting output on both ICs.
Vref pin
Vref 2.5 V
R1
IN(−)1
−
CH1
R
R2
3
+
IN(+)2
R4
Error amp
VO
Figure 2.1 Inverting Output
9
HA16116FP/FPJ, HA16121FP/FPJ
2.3 Error Amplifier
Figure 2.3 shows an equivalent circuit of the error amplifier. The error amplifier on these ICs is configured
of a simple NPN transistor differential input amplifier and the output circuit of a constant-current driver.
This amplifier features wide bandwidth (fT = 4 MHz) with open loop gain kept to 50 dB, allowing stable
feedback to be applied when the power supply is designed. Phase compensation is also easy.
Both HA16116 and HA16121 have a noninverting input (IN(+)) pin, in order to allow use of the channel 1
error amplifier for inverting control. The channel 2 error amplifier, on the other hand, is used for step-
down control in HA16116 and booster control in HA16121; so the channel 2 noninverting input is
connected internally to Vref.
IC internal VIN
IN(−)
E/O
IN(+)
To internal PWM
comparator
80 µA
40 µA
Figure 2.3 Error Amplifier Equivalent Circuit
3. Dead Band (DB) Duty and Soft Start Setting (common to both channels)
3.1 Dead Band Duty Setting
Dead band duty is set by adjusting the DB pin input voltage (VDB). A convenient means of doing this is to
connect two external resistors to the Vref of this IC so as to divide VDB (see figure 3.1).
R2
R1 + R2
VDB = Vref
Duty (DB) =
Here, T =
×
(V)
V
V
TH − VDB
TH − VTL
× 100 (%)
This applies when VDB > VTL
.
If VDB < VTL, there is no PWM output.
1
fOSC
Note: VTH: 1.6 V (Typ)
VTL: 1.0 V (Typ)
Vref is typically 2.5 V. Select R1 and R2 so that 1.0 V ≤ VDB ≤ 1.6 V.
10
HA16116FP/FPJ, HA16121FP/FPJ
VTH
VE/O
VDB
1.6 V typ
To Vref
R1
PWM
CT
VTL
1.0 V typ
VIN
VIN
comparator
−
+
+
E/O
On
tON
VDB
Booster
channel
tOFF
DB
Off
Off
5k
GND
VIN
PWM
pulse
output
From UVL
CST
0.8V
R2
Step-down/
inverting
channel
On
GND
T
Figure 3.1 Dead Band Duty Setting
3.2 Soft Start (SST) Setting (each channel)
When the power is turned on, the soft start function gradually raises VDB (refer to section 3.1), and the
PWM output pulse width gradually widens. This function is realized by adding a capacitor CST to the DB
pin. The function is realized as follows.
In the figure 3.2, the DB pin is clamped internally at approximately 0.8 V, which is 0.2 V lower than the
triangle wave VTL = 1.0 V typ.
tA: Standby time until PWM pulse starts widening.
tB: Time during which SST is in effect.
During soft start, the DB pin voltage in the figure below is as expressed in the following equation.
−t − t0.8
VSST = VDB
Here,
t0.8 = −T ln
tSST = tA + tB
T
1 − e
,
0.8
T = CST (R1 // R2)
1 −
,
VDB
How to select values: If the soft start time tSST is too short, the DC/DC converter output voltage will tend to
overshoot. To prevent this, set tSST to a few tens of ms or above.
11
HA16116FP/FPJ, HA16121FP/FPJ
V
(voltage)
VSST
Triangle wave
VTH
1.6 V
1.0 V
VTL
Starts from clamp
voltage of 0.8 V
PWM output
pulse starts to
widen
Steady-state
operation
0 V
VIN
t0.8
tA
tB
Booster
channel
0 V
VIN
PWM pulse
output
Step-down/
inverting
channel
0 V
VO
DC/DC converter output
(positive in this example)
0 V
t = 0 (here IC is on)
t = tSST
Figure 3.2 Soft Start (SST) Setting
12
HA16116FP/FPJ, HA16121FP/FPJ
4. Totem Pole Output Stage Circuit and Power MOS FET Driving Method
The output stage of this IC series is configured of totem pole circuits, allowing direct connection to a power
MOS FET as an external switching device, so long as VIN is below the gate breakdown voltage.
If there is a possibility that VIN will exceed the gate breakdown voltage of the power MOS FET, a Zener
diode circuit like that shown figure 4.1 or other protective measures should be used. The figure 4.1 shows
an example using a P-channel power MOS FET.
P.V IN
E.g.: VIN = 18 V
Zener diode for
gate protection
Bias
circuit
OUT
Gate
protection
resistor
VO
+
−
Drive circuit
Schottky
barrier diode
Figure 4.1 P-channel Power MOS FET (example)
5. Vref Undervoltage Error Prevention (UVL) and Overvoltage Protection (OVP) Functions
5.1 Operation Principles
The reference voltage circuit is equipped with UVL and OVP functions.
•
UVL
In normal operation the Vref output voltage is fixed at 2.5 V. If VIN is lower than normal, the UVL
circuit detects the Vref output voltage with a hysteresis of 1.7 V and 2.0 V, and shuts off the PWM
output if Vref falls below this level, in order to prevent malfunction.
•
OVP
The OVP circuit protects the IC from inadvertent application of a high voltage from outside, such as if
VIN is shorted. A Zener diode (5.6 V) and resistor are used between Vref and GND for overvoltage
detection. PWM output is shut off if Vref exceeds approximately 7.0 V.
Note that the PWM output pulse logic and the precision of the switching regulator output voltage are not
guaranteed at an applied voltage of 2.5 V to 7 V.
13
HA16116FP/FPJ, HA16121FP/FPJ
5.2 Quick Shutoff
When the UVL circuit goes into operation, a sink transistor is switched on as in the figure below, drawing
off the excess current. This transistor also functions when the IC is turned off, drawing off current from the
CT, E/O, and DB pins and enabling quick shutoff.
PWM
output
PWM
output
off
PWM output on
PWM
output off
On
Off
Vref (V)
1.7 2.0 2.5
5.0
7.0
When VIN is
low
Abnormal voltage
applied to Vref
Relation of Vref to UVL and OVP
Vref
VIN
Vref
2.0 V and
1.7 V
detection
Vref
generation
circuit
Internal
pulse
signal
line
ZD
5.6 V
UVL
OUT
OUT
R
Sink
transistor
10 kΩ
OVP
To other circuitry
Figure 5.1 Quick Shutoff
14
HA16116FP/FPJ, HA16121FP/FPJ
6. Setting of Intermittent Operation Timing when Overcurrent is Detected
6.1 Operation Principles
The current limiter on this IC detects overcurrent in each output pulse, providing pulse-by-pulse
overcurrent protection by limiting pulse output whenever an overcurrent is detected. If the overcurrent
state continues, the TIM pin and ON/OFF pin can be used to operate the IC intermittently. As a result, a
power supply with sharp vertical characteristics can be configured.
The ON/OFF timing for intermittent operation makes use of the hysteresis in the ON/OFF pin threshold
voltage VON and VOFF, such that VON – VOFF = VBE. Setting method is performed as described on the
following pages. VBE is based-emitter voltage of internal transistor.
Note: When an overcurrent is detected in one channel of this IC but not the other, the pulse-by-pulse
current limiter still goes into operation on both channels. Also, when the intermittent operation
feature is not used, the TIM pin should be set to open state and the ON/OFF pin pulled up to high
level (above VON).
VIN
RA
Current
Latch limiter
390 kΩ
CL
S
R
TM
Q
4.7 kΩ
2.2 µF
RB
Vref
generation
circuit
ON/OFF
+
CON/OFF
−
Figure 6.1 Connection Diagram (example)
6.2 Intermittent Operation Timing Chart (VON/OFF only)
*1
4VBE
c
c
3VBE
2VBE
VBE
VON/OFF
On
On
Off
IC is on
IC is off
a
b
0 V
t
TON
2TON
a. Continuous overcurrent detected
TOFF
b. Intermittent operation starts (IC is off)
c. Overcurrent cleared (dotted line)
1.VBE is the base-emitter voltage in transistors on the IC, and is approximately 0.7 V
(see the figure 7.1).
Note:
For details, see the overall waveform timing diagram.
Figure 6.2 Intermittent Operation Timing Chart
15
HA16116FP/FPJ, HA16121FP/FPJ
6.3 Calculating Intermittent Operation Timing
Intermittent operation timing is calculated as follows.
(1) TON time (the time until the IC is shut off when continuous overcurrent occurs)
3VBE
2VBE
1
TON = CON/OFF × RB × ln
×
1 − On duty*
1
1
= CON/OFF × RB × ln1.5 ×
0.4
C
R
× ×
B
≈
×
ON/OFF
1 − On duty*
1 − On duty*
(2) TOFF time (when the IC is off, the time until it next goes on)
V
V
IN − 2VBE
IN − 3VBE
TOFF = CON/OFF (R + R )
×
× ln
A
B
Where, VBE ≈ 0.7 V
Note: 1. On duty is the percent of time the IC is on during one PWM cycle when the pulse-by-pulse
current limiter is operating.
From the first equation (1) above, it is seen that the shorter the time TON when the pulse-by-pulse current
limiter goes into effect (resulting in a larger overload), the smaller the value TON becomes.
As seen in the second equation (2), TOFF is a function of VIN. Further, according to this setting, when V is
IN
switched on, the IC goes on only after TOFF has elapsed.
Dead band voltage
Triangle wave
Point at which current
limiter operate
PWM output
(step-down channel)
tON
tON
On duty =
T
Where T = 1/fOSC
T
On duty is the percent of time the IC is on during one PWM cycle when
the pulse-by-pulse current limiter is operating.
Note:
Figure 6.3
16
HA16116FP/FPJ, HA16121FP/FPJ
6.4 Examples of Intermittent Operation Timing (calculated values)
4
3
2
1
0
(1) TON
TON = T1 × CON/OFF × RB
Here, coefficient
1
T1 = 0.4 ×
1 − On duty
from section 6.3 (1) previously.
T1
Example: If CON/OFF = 2.2 µF,
R = 4.7 k , and the on duty
Ω
B
of the current limiter is 75%,
then TON = 16 ms.
0
20
40
60
80
100
(PWM) ON Duty (%)
Figure 6.4 Examples of Intermittent Operation Timing (1)
(2) TOFF
TOFF= T2 × CON/OFF × (RA + RB)
0.1
Here, coefficient
V
V
IN − 2VBE
IN − 3VBE
T2 = ln
T2
0.05
from section 6.3 (2) previously.
Example: If CON/OFF = 2.2 µF, RB = 4.7 kΩ,
RA = 390 kΩ, V = 12 V,
IN
0
then TOFF= 60 ms.
0
10
20
VIN (V)
30
40
Figure 6.5 Examples of Intermittent Operation Timing (2)
17
HA16116FP/FPJ, HA16121FP/FPJ
Triangle wave VCT
Dead band VDB
Example of step-up circuit
VIN
CF
RF
RCS
Error output VE/O
PWM pulse output
(In case of HA16120)
CL
Inductor
L
IC
OUT
VOUT
Power MOS FET
drain current (ID)
(dotted line shows
inductor current)
ID
F.B.
VIN
Determined by L and VIN
Determined by RCS and RF
Current limiter
pin (CL)
V
TH (CL)
V
IN − 0.2 V
Figure 6.6
7. ON/OFF Pin Usage
7.1 IC Shutoff by the ON/OFF Pin
As shown in the figure 7.1, these ICs can be turned off safely by lowering the voltage at the ON/OFF pin to
below 2VBE. This feature is used to conserve the power in the power supply system. In off state the IC
current consumption (IOFF) is 10 µA (Max) for HA16116 and 150 µA (Max) for HA16121.
The ON/OFF pin can also be used to drive logic ICs such as TTL or CMOS with a sink current of 50 µA
(Typ) at an applied voltage of 5 V. When it is desired to employ this feature along with intermittent
operation, an open collector or open drain logic IC should be used.
VIN
IIN
RA
S.VIN
P.V IN
TIM
External logic IC
To output
stage
To latch
To other circuitry
Vref
Off On
Switch
RB
Q1
Vref
generation
circuit
50 kΩ
output
ON/OFF
Q2
Q3
+
4 VBE
−
CON/OFF
Q4
GND
HA16116,
HA16121
On/off hysteresis circuit
Figure 7.1 IC Shutoff by the ON/OFF Pin
18
HA16116FP/FPJ, HA16121FP/FPJ
7.2 Adjusting UVL Voltage (when intermittent operation is not used)
The UVL voltage setting in this IC series can be adjusted externally as shown below.
Using the relationships shown in the figure, the UVL voltage in relation to VIN can be adjusted by changing
the relative values of VTH and VTL.
When the IC is operating, transistor Q4 is off, so VON = 3VBE ≈ 2.1 V. Accordingly, by connecting resistors
RC and RD, the voltage at which UVL is cancelled is as follows.
RC + RD
VIN = 2.1 V ×
RD
This VIN is simply the supply voltage at which the UVL stops functioning, so in this state Vref is still below
2.5 V. In order to restore Vref to 2.5 V, a VIN of approximately 4.3 V should be applied.
With this IC series, VON/OFF makes use of the VBE of internal transistors, so when designing a power supply
system it should be noted that VON has a temperature dependency of around –6 mV/°C.
VIN
P.VIN
S.VIN
To output
stage
To other circuitry
Vref output
TIM
(open)
RC
To latch
ON/OFF
Q1
Vref
generation
circuit
50 kΩ
RD
Q2
Q3
Q4
On/off hysteresis circuit
GND
2.5 V
3
VIN ≥ 4.5 V
2
1
0
Vref
VOFF
1.4 V
VON
2.1 V
0
1
2
3
4
5
VON/OFF
Figure 7.2 Adjusting UVL Voltage
19
HA16116FP/FPJ, HA16121FP/FPJ
Overcurrent Detection Value Setting
The overcurrent detection value VTH for this IC series is 0.2 V (Typ) and the bias current is 200 µA (Typ)
The power MOS FET peak current value before the current limiter goes into operation is derived from the
following equation.
V
TCL − (RF + RCS) IBCL
ID =
RCS
Here VTH = VIN – VCL = 0.2 V, VCL is a voltage referd on GND.
Note that CF and RCS form a low-pass filter, determined by their time constants, that prevents malfunctions
from current spikes when the power MOS FET is turned on or off.
CF 1800 PF
IBCL
S.VIN
RCS
0.05 Ω
VIN
VCL
To other
circuitry
CL
RF
240 Ω
This circuit is an example
for step-down output use.
1 k
G
OUT
S
D
200 A
VO
Detection
output
(internal)
+
− +
−
IN(—)
Figure 8.1 Example for Step-Down Use
The sample values given in this figure are calculated from the following equation.
0.2 V − (240 Ω + 0.05 Ω) × 200 µA
ID =
0.05 Ω
= 3.04 [A]
The filter cutoff frequency is calculated as follows.
1
1
fC =
=
= 370 [kHz]
2π CF RF
6.28 × 1800 pF × 240 Ω
20
HA16116FP/FPJ, HA16121FP/FPJ
Absolute Maximum Ratings (Ta = 25°C)
Rating
HA16116FP,
HA16116FPJ,
HA16121FPJ
Item
Symbol
VIN
HA16121FP
Unit
V
Supply voltage
40
40
Output current (DC)
Output current (peak)
Current limiter pin voltage
Error amp input voltage
E/O input voltage
IO
±0.1
±0.1
A
IO peak
VCL
±1.0
±1.0
A
VIN
VIN
V
VIEA
VIN
VIN
V
VIE/O
IRT
Vref
Vref
V
RT pin source current
TIM pin sink current
Power dissipation*1
Operation temperature range
Junction temperature
Storage temperature range
500
500
µA
mA
mW
°C
°C
°C
ITM
20
20
PT
680*1,*2
–20 to +85
125
680*1,*2
–40 to +85
125
Topr
TjMax
Tstg
–55 to +125
–55 to +125
Note: 1. This value is based on actual measurements on a 40 × 40 × 1.6 mm glass epoxy circuit board.
At a wiring density of 10%, it is the permissible value up to Ta = 45°C, but at higher temperatures
this value should be derated by 8.3 mW/°C. At a wiring density of 30% it is the permissible value
up to Ta = 64°C, but at higher temperatures it should be derated by 11.1 mW/°C.
2. For the DILP package.
This value applies up to Ta = 45°C; at temperatures above this, 8.3 mW/°C derating should be
applied.
800
10% wiring density
680 mW
30% wiring density
600
447 mW
400
348 mW
200
45°C
64°C
85°C
125°C
0
−20
0
20
40
60
80
100
120
140
Operating ambient temperature Ta (°C)
21
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz)
Item
Symbol
Vref
Min
Typ Max Unit
Test Conditions
IO = 1 mA
Reference
voltage
block
Output voltage
Line regulation
Load regulation
2.45 2.50 2.55
V
Line
—
—
10
30
30
25
60
60
—
mV
mV
mA
4.5 V ≤ VIN ≤ 40 V
0 ≤ IO ≤ 10 mA
Vref = 0 V
Load
IOS
Output shorting
current
Vref OVP voltage
Vrovp
6.2
6.8
7.0
—
V
Output voltage
temperature
dependence
∆Vref/∆Ta —
100
ppm/°C
Triangle
wave
Maximum oscillator
frequency
fOSCmax
600
—
—
±1
±5
—
1
kHz
Hz
%
oscillator
block
Minimum oscillator
frequency
fOSCmin
—
Oscillator frequency
input voltage stability
∆fOSC/∆VIN
∆fOSC/∆Ta
—
±3
—
4.5 V ≤ VIN ≤ 40 V
–20°C ≤ Ta ≤ 85°C
Oscillator frequency
temperature stability
—
%
Oscillator frequency
fOSC
270
300 330 kHz
CT = 220 pF, RT = 10 kΩ)
Dead band Low-level threshold
adjust block voltage
VTLDB
0.87 0.97 1.07
1.48 1.65 1.82
0.55 0.65 0.75
V
V
V
Output on duty 0%
High-level threshold
voltage
VTHDB
Output on duty 100%
Threshold differential ∆VTDB
voltage
∆VTH = VTH – VTL
Output source current IOsource (DB)
Low-level threshold VTLCMP
comparator voltage
block High-level threshold
oltage
100
150 200 µA
DB pin = 0 V
PWM
0.87 0.97 1.07
1.48 1.65 1.82
0.55 0.65 0.75
V
V
V
%
Output on duty = 0%
VTHCMP
Output on duty = 100%
∆VTH = VTH – VTL
Threshold differential ∆VTCMP
voltage
Dead band precision DBdev
–5
0
+5
Deviation when
V
EO = (VTL + VTH)/2,
duty = 50 %
22
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz) (cont)
Item
Error amp Input offset voltage VIOEA
block Input bias current IBEA
Symbol Min
Typ
2
Max
10
2
Unit Test Conditions
—
—
mV
0.8
40
µA
Output sink current IOsink (EA) 28
52
µA
In open loop,
VI = 3 V, VO = 2 V
Output source
current
IOsource (EA) 28
40
52
µA
In open loop,
VI = 2 V, VO = 1 V
Voltage gain
AV
40
3
50
4
—
—
dB
f = 10 kHz
Unity gain band-
width
BW
MHz
High-level output VOHEA
voltage
2.2
—
3.0
0.2
—
V
V
IO = 10 µA
IO = 10 µA
Low-level output
voltage
VOLEA
0.5
Overcurrent Threshold voltage VTCL
VIN –0.22 VIN –0.2 VIN –0.18
V
detection
block
CL bias current
Operating time
IBCL
150
—
200
200
500
250
300
600
µA
ns
ns
CL = VIN
tOFFCL
CL = VIN –0.3 V
—
Applies only to ch 2
of HA16121
Output
stage
Output low voltage VOL1
—
—
—
—
0.7
1.6
1.0
1.6
2.2
1.9
1.3
1.9
V
V
V
V
IOsink = 10 mA
Applies only to HA16116
IOsink = 10 mA
Applies only to HA16121
IOsink = 0 mA
Applies only to HA16121
Off state low
voltage
VOL2
IOsink = 1 mA
ON/OFF pin = 0 V
Applies only to ch 2
of HA16121
—
1.0
1.3
V
IOsink = 0 mA
ON/OFF = 0 V
Applies only to ch 2
of HA16121
Output high
voltage
VOH1
VIN –1.9 VIN –1.6 —
VIN –1.3 VIN –1.0 —
VIN –1.9 VIN –1.6 —
V
V
V
IOsource = 10 mA
IOsource = 0 A
Off state high
voltage
VOH2
IOsource = 1 mA
ON/OFF pin = 0 V
VIN –1.3 VIN –1.0 —
V
IOsource = 0 A
ON/OFF pin = 0 V
23
HA16116FP/FPJ, HA16121FP/FPJ
Electrical Characteristics (Ta = 25°C, VIN = 12 V, fOSC = 300 kHz) (cont)
Item
Symbol
Min Typ Max Unit Test Conditions
Output
stage
Rise time
Fall time
tr
—
70
70
3.6
130 ns
130 ns
CL = 1000 pF (to VIN) *1, *2
CL = 1000 pF (to VIN) *1, *2
tf
—
UVL
block
VIN high-level threshold
voltage
VTUH1
3.3
3.9
3.6
0.5
2.3
2.0
0.5
V
V
V
V
V
V
VIN low-level threshold
voltage
VTUL1
∆VTU1
VTUH2
VTUL2
∆VTU2
3.0
0.1
1.7
1.4
0.1
3.3
0.3
2.0
1.7
0.3
VIN threshold differential
voltage
∆VTU1 = VTUH1 – VTUL1
Vref high-level threshold
voltage
Vref low-level threshold
voltage
Vref threshold differential
voltage
∆VTU2 = VTUH2 – VTUL2
ON/OFF pin = 5 V
ON/OFF
block
ON/OFF pin sink current
IC on-state voltage
IC off-state voltage
ION/OFF
VON
—
35
50
µA
V
1.8
1.1
0.5
2.1
1.4
0.7
2.4
1.7
0.9
VOFF
V
ON/OFF threshold
differential voltage
∆VON/OFF
V
TIM
block
TIM pin sink current in
steady state
ITIM1
ITIM2
IIN
0
—
10
20
µA
CL pin = VIN
VTIM = 0.3 V
TIM pin sink current at
overcurrent detection
10
15
8.5
mA
CL pin = VIN – 0.3 V
VTIM = 0.3 V
Common Operating current
block
6.0
8.5
11.1 mA
CL = 0 pF (to VIN) *1, *2
CL = 500 pF (to VIN) *1, *2
CL = 1000 pF (to VIN) *1, *2
HA16116FP ON/OFF
HA16121FP pin = 0 V
12.1 15.7 mA
11.0 15.7 20.5 mA
Off current
IOFF
0
0
—
10
µA
120
150 µA
Notes: 1. CL is load capacitor for Power MOS FET’s gate, and CL = 1000 pF to GND in the case of
HA16121 – ch 2.
2. CL in channel 2 of HA16121 is connected to GND.
24
HA16116FP/FPJ, HA16121FP/FPJ
Characteristic Curves
•
Reference Voltage Block (Vref)
Reference Voltage vs. Power Supply Input Voltage
Vref Temperature Characteristics
2.54
3
Ta = 25°C
VIN = 12 V
R
A = 390 kΩ
2.5 V
I
O (Vref) = 1 mA
(Between the VIN
and ON/OFF pins)
2.52
2.50
2.48
2.46
2
1
UVL release: 3.6 V
UVL operate: 3.3 V
3.3 3.6 4.3
85
−20
0
20
40
60
80
100
0
1
2
3
4
5
40
Ambient temperature Ta (°C)
Power supply input voltage VIN (V)
Vref Load Regulation
3.0
2.5
2.0
1.50
0
Short
circuit
current
10
20
30
Output current IO sink (mA)
•
UVL (Low Input Voltage Malfunction Prevention) Block
Hysteresis Voltage Temperature Characteristics
4.5
High threshold voltage
Hysteresis
4.0
3.5
3.0
2.5
Low threshold voltage
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
25
HA16116FP/FPJ, HA16121FP/FPJ
•
Triangle Wave Oscillator Block
RT pin Output Current Characteristics
1.1
Sawtooth Wave Amplitude vs. Oscillator Frequency
2.0
VTH
1.5
1.0
0.9
Sawtooth wave
amplitude
VTL
1.0
Note: Due to these characteristics, the dead
band and PWM comparator threshold
voltages change at high frequencies.
Reccomended
usage range
0.5
10 (RT ≈ 100 kΩ)
330 (RT ≈ 3 kΩ)
300 400 500
0.8
0
100
200
IRT (µA)
0
100
200
300
400
500
600
(DC)
fOSC (kHz) (linear scale)
CT, RT Values (VIN = 12V) vs. Oscillator Frequency
100
70
50
30
20
600 kHz
10
7
5
3
10
20
30
50
70 100
200 300
500 700 1 M
Oscillator frequency fOSC (kHz)
Oscillator Frequency Temperature Stability
+10
+5
0
VIN = 12 V
A: fOSC = 300 kHz
B: fOSC = 600 kHz
B
A
A
B
−5
85
−10
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
26
HA16116FP/FPJ, HA16121FP/FPJ
•
Error Amplifier Block
Open Loop Gain Characteristics
60
AVO
40
20
0
φ
45
90
135
180
BW
3 M
0
1 k
3 k
10 k
30 k
100 k
300 k
1 M
10 M
Error amplifier input frequency fIN (Hz)
Common Mode Input Characteristics
+100
0
−+EA
V
−
O
−100
−200
−300
+
VI
Vref
0
1
2
3
4
Input voltage VI (V)
•
On Duty Characteristics
On Duty Characteristics
On Duty Characteristics
100
80
60
40
20
0
100
80
60
40
20
0
Boost PWM output
(HA16121-2 ch)
Step-down
PWM output
(HA16116-1, 2ch
HA16121-1ch)
0.8
1.0
1.2
1.4
1.6
1.8
0.8
1.0
1.2
1.4
1.6
1.8
VDB or VE/O (V)
VDB or VE/O (V)
Notes: 1. The percentage of a single timing cycle
during which the output is low.
2. The percentage of a single timing cycle
during which the output is high.
27
HA16116FP/FPJ, HA16121FP/FPJ
•
Other Characteristics
Current Limiter Level Temperature Characteristics IC On Voltage and Off Voltage Temperature Characteristics
4
3
2
1
0
220
210
200
190
180
VON on voltage (about −6mV/°C)
85°C
85°C
VOFF off voltage
(about −4mV/°C)
−20
0
20
40
60
80
100
−20
0
20
40
60
80
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
IIN vs. VIN Characteristics
Output pin (Output Resistor) Characteristics
12
40
30
20
10
VGS
(P-channel
Power
fOSC = 300 kHz
On duty: 50%
Ta = 25°C
Output high voltage when on
11
10
9
MOS FET)
Maximum
rating at
Output high voltage
when off (channels 1
and 2 in the HA16116
and channel 1 in the
HA16121)
Ta = 25°C:
680 mW
Load capacitance:
1000 pF/ch
500 pF/ch
3
2
1
No load
Output low voltage when on
Output low voltage
when off (channels 1
and 2 in the HA16121)
VGS
(N-channel
Power
MOS FET)
10
20
30
40
2
4
6
8
10
0
0
Power supply voltage VIN (V)
IO sink or IO source (mA)
Output Drive Circuit Power MOS FET
Direct Drive ability Data
Gate Drive Waveforms for the 2SJ214
800
600
400
200
0
VIN = 12 V
fOSC = 130 kHz
2SJ216
2SJ176
2SJ214
Drive voltage:
5 V/div
*
Drive current:
200 mA/div
1000
2000
3000
4000
Ciss (pF)
650 nsec/div
Note: The solid line is data measured with discrete
capacitances (for each channel of HA16116).
Note: * Measured using a current probe.
(The boost channel (channel 2 in the HA16121)
load is with respect to ground, and has
almost identical characteristics.)
28
HA16116FP/FPJ, HA16121FP/FPJ
Application Examples (1)
29
HA16116FP/FPJ, HA16121FP/FPJ
Overall Waveform Timing Diagram (for Application Examples (1))
12 V
V
IN
0 V
VTIM
,
2.8 V
2.1 V
VON/OFF
VTIM
VON/OFF
,
2.1 V
1.4 V
0 V
On
On
(V)
3.0
On
On
On
VE/O
Off Off Off Off
Off
VCT
triangle wave
2.0
1.0
0.0
VE/O
VCT
VDB
,
,
VDB
12 V
VCL
11.8 V
0 V
Pulse-by-pulse
current limiter
operates
12 V
0 V
VOUT*1
PWM
pulse
DC/DC output
(example for
positive
voltage)
Soft start
Steady-state
operation
Overcurrent
detected;
Overcurrent Quick
cleared;
shut-off
IC operation
states
intermittent
operation
steady-state
operation
Power
supply on
IC on
Power supply off,
IC off
Note: 1.This PWM pulse is on the step-down/inverting control channel.
The booster control channel output consists of alternating L and H of the IC on cycle.
30
HA16116FP/FPJ, HA16121FP/FPJ
Application Examples (2) (Some Pointers on Use)
1. Inductor, Power MOS FET, and Diode Connections
1. Booster specification
VIN
2. Step-down specification
VIN
CF
CF
RCS Applicable to
HA16116FP and
to channel 1
RCS Applicable only
RF
VIN
RF
VIN
to channel 2
of HA16121FP
CL
CL
of HA16121FP
OUT
VO
VO
OUT
GND
GND
FB
FB
3. Inverting specification
CF
4. Negative booster specification (Flyback transformer)
CF
RCS
RCS
Applicable only
to channel 1
Applicable only
to channel 1
RF
RF
VIN
VIN
CL
CL
OUT
OUT
VO
GND
GND
FB
FB
Vref
2. Turning Output On and Off while the IC is On
1. To turn only one channel off, ground the DB pin
or the E/O pin. In the case of E/O, however,
there will be no soft start when the output is
turned back on.
2. When only one channel is to be used,
the channel not used should be connected
as follows.
VIN
DB
CL
Connect CL to VIN.
+
Ground IN(+) and IN(−).
Leave other pins open.
IN
E/O
−
IN
GND
OFF
31
HA16116FP/FPJ, HA16121FP/FPJ
Application Examples (3)
32
HA16116FP/FPJ, HA16121FP/FPJ
Package Dimensions
Unit: mm
12.6
13 Max
11
10
20
1
+ 0.20
7.80
– 0.30
0.80 Max
1.15
0° – 8°
1.27
0.70 ± 0.20
*0.42 ± 0.08
0.40 ± 0.06
0.15
0.12 M
Hitachi Code
JEDEC
FP-20DA
—
EIAJ
Conforms
0.31 g
*Dimension including the plating thickness
Base material dimension
Mass (reference value)
33
HA16116FP/FPJ, HA16121FP/FPJ
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
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Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
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7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
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Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
34
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