3SK290ZJ-UR [HITACHI]
RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, CMPAK-4;![3SK290ZJ-UR](http://pdffile.icpdf.com/pdf1/p00056/img/icpdf/3SK290_295403_icpdf.jpg)
型号: | 3SK290ZJ-UR |
厂家: | ![]() |
描述: | RF Small Signal Field-Effect Transistor, 1-Element, Ultra High Frequency Band, Silicon, N-Channel, Metal-oxide Semiconductor FET, CMPAK-4 晶体 小信号场效应晶体管 射频小信号场效应晶体管 光电二极管 栅 放大器 |
文件: | 总9页 (文件大小:92K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
3SK290
Silicon N-Channel Dual Gate MOS FET
ADE-208-271
1st. Edition
Application
UHF RF amplifier
Features
·
Low noise figure.
NF = 2.3 dB Typ. at f = 900 MHz
High gain.
·
PG = 19.3 dB Typ. at f = 900 MHz
Outline
CMPAK–4
2
3
1
1. Source
2. Gate1
3. Gate2
4. Drain
4
3SK290
Absolute Maximum Ratings (Ta = 25¡C)
Item
Symbol
VDS
Ratings
Unit
V
Drain to source voltage
Gate 1 to source voltage
Gate 2 to source voltage
Drain current
12
VG1S
VG2S
ID
±8
V
±8
V
25
mA
mW
°C
°C
Channel power dissipation
Channel temperature
Storage temperature
Pch
Tch
100
125
Tstg
–55 to +125
Attention: This device is very sensitive to electro static discharge.
It is recommended to adopt appropriate cautions when handling this transistor.
2
3SK290
Electrical Characteristics (Ta = 25¡C)
Item
Symbol Min
V(BR)DSX 12
Typ
Max
Unit
Test conditions
ID = 200 mA, VG1S = –3 V,
G2S = –3 V
Drain to source breakdown
voltage
—
—
V
V
Gate 1 to source breakdown
voltage
V(BR)G1SS ±8
V(BR)G2SS ±8
—
—
—
—
V
V
IG1 = ±10 mA, VG2S = VDS = 0
Gate 2 to source breakdown
voltage
IG2 = ±10 mA, VG1S = VDS = 0
Gate 1 cutoff current
Gate 2 cutoff current
Drain current
IG1SS
IG2SS
IDS(on)
—
—
—
—
±100
±100
10
nA
nA
mA
VG1S = ±6 V, VG2S = VDS = 0
VG2S = ±6 V, VG1S = VDS = 0
VDS = 6 V, VG1S = 0.5 V,
—
0.5
V
G2S = 3 V
Gate 1 to source cutoff voltage VG1S(off)
Gate 2 to source cutoff voltage VG2S(off)
–0.6
0
—
+0.5
+1.0
—
V
VDS = 10 V, VG2S = 3 V,
ID = 100 mA
—
V
VDS = 10 V, VG1S = 3 V,
ID = 100 mA
Forward transfer admittance
Input capacitance
|yfs|
16
22
1.8
mS
pF
VDS = 6 V, VG2S = 3 V,
ID = 10 mA, f = 1 kHz
Ciss
Coss
1.2
2.2
VDS = 6 V, VG2S = 3V,
ID = 10 mA, f = 1 MHz
Output capacitance
0.7
—
1.2
1.4
0.03
—
pF
pF
dB
Reverse transfer capacitance Crss
0.02
19.3
Power gain
PG
17
VDS = 4 V, VG2S = 3 V,
ID = 10 mA, f = 900 MHz
Noise figure
NF
—
2.3
2.8
dB
Note: Marking is “ZJ–”.
3
3SK290
Maximum Channel Power
Dissipation Curve
Typical Output Characteristics
= 3 V
20
16
12
8
200
150
100
50
V
G2S
1.2 V
1.0 V
0.8 V
0.6 V
0.4 V
= 0.2V
4
V
G1S
0
50
100
150
200
0
2
4
6
8
10
Drain to Source Voltage V
(V)
Ambient Temperature Ta (¡C)
DS
Drain Current vs.
Gate 1 to Source Voltage
Drain Current vs.
Gate 2 to Source Voltage
20
16
12
8
20
16
12
8
V
= 6 V
V
= 6 V
DS
1.5 V
DS
3.0 V
2.0 V
3.0 V
1.0 V
2.5 V
2.5 V
2.0 V
1.5 V
V
G1S
= 0.5 V
V
= 1.0 V
2.4
G2S
4
4
0
0
0.8
1.6
3.2
4.0
(V)
0.8
1.6
2.4
3.2
4.0
Gate 1 to Source Voltage V
Gate 2 to Source Voltage V
(V)
G2S
G1S
4
3SK290
Forward Transfer Admittance
vs. Gate 1 to Source Voltage
Power Gain vs. Drain Current
30
24
18
12
6
20
16
12
8
V
= 6 V
DS
f = 1 kHz
V
= 3.0 V
G2S
2.5 V
2.0 V
1.5 V
1.0 V
V
= 4 V
DS
4
V
G2S
= 3 V
f = 900 MHz
0
2.0
(V)
0
4
8
12
I
16 20
–0.5
0
0.5
1.0
1.5
Gate1 to Source Voltage V
Drain Current
(mA)
G1S
D
Noise Figure vs. Drain Current
5
4
3
2
1
V
V
= 4 V
DS
= 3 V
G2S
f = 900 MHz
0
4
8
12
16
(mA)
20
Drain Current
I
D
5
3SK290
S21 Parameter vs. Frequency
S11 Parameter vs. Frequency
Scale: 1 / div.
1
90¡
.8
1.5
60¡
.6
120¡
2
.4
3
30¡
150¡
4
.2
5
10
.2
.4 .6 .8 1.0 1.5 2 3 4 5 10
180¡
0
0¡
–10
–5
–4
–.2
–30¡
–150¡
–3
–.4
–2
–60¡
–120¡
–.6
–1.5
–.8
–90¡
–1
Condition: V = 4 V , V
= 3 V
Condition: V = 4 V , V
= 3 V
G2S
DS
G2S
DS
I
= 10 mA , Zo = 50 W
I
= 10 mA , Zo = 50 W
D
D
50 to 1000 MHz (50 MHz step)
50 to 1000 MHz (50 MHz step)
S22 Parameter vs. Frequency
S12 Parameter vs. Frequency
1
.8
Scale: 0.002 / div.
90¡
1.5
.6
60¡
120¡
2
.4
3
4
5
30¡
150¡
.2
10
.2
.4 .6 .8 1.0 1.5 2 3 4 5 10
0
180¡
0¡
–10
–5
–4
–.2
–30¡
–150¡
–3
–.4
–2
–.6
–60¡
–1.5
–120¡
–.8
–1
–90¡
Condition: V = 4 V , V
= 3 V
G2S
= 10 mA , Zo = 50 W
DS
Condition: V = 4 V , V
= 3 V
G2S
= 10 mA , Zo = 50 W
DS
I
D
I
D
50 to 1000 MHz (50 MHz step)
50 to 1000 MHz (50 MHz step)
6
3SK290
S Parameter (VDS = 4 V, VG2S = 3 V, ID = 10 mA, ZO = 50 ½)
Freq.
(MHz)
50
S11
S21
S12
S22
MAG.
0.998
0.994
0.997
0.991
0.993
0.980
0.976
0.971
0.962
0.955
0.945
0.939
0.927
0.925
0.911
0.901
0.893
0.881
0.876
0.869
ANG.
–3.3
MAG.
2.17
2.20
2.19
2.17
2.16
2.12
2.10
2.08
2.05
2.03
1.99
1.96
1.93
1.90
1.87
1.84
1.81
1.78
1.75
1.71
ANG.
176
172
168
163
159
155
151
146
142
139
135
131
127
123
120
116
112
108
105
102
MAG.
0.001
0.001
0.002
0.003
0.004
0.004
0.005
0.005
0.006
0.006
0.006
0.006
0.006
0.006
0.006
0.006
0.005
0.005
0.005
0.005
ANG.
41.3
88.9
74.4
81.6
79.7
72.6
66.9
70.9
67.7
63.9
64.1
63.9
59.9
60.0
58.3
60.3
62.0
61.2
65.0
68.8
MAG.
0.971
0.971
0.970
0.969
0.967
0.965
0.962
0.959
0.956
0.953
0.950
0.946
0.942
0.939
0.933
0.930
0.925
0.921
0.917
0.913
ANG.
–1.9
100
150
200
250
300
350
400
450
500
550
600
650
700
750
800
850
900
950
1000
–6.7
–4.5
–10.2
–13.5
–16.9
–20.8
–23.7
–27.0
–30.7
–33.7
–36.9
–40.2
–43.3
–46.5
–49.4
–52.3
–55.9
–59.0
–61.5
–64.3
–7.1
–9.8
–12.1
–14.8
–17.3
–19.7
–22.1
–24.8
–27.2
–29.5
–32.1
–34.6
–36.7
–39.1
–41.5
–43.8
–46.1
–48.4
7
Unit: mm
2.95 ± 0.2
1.9 ± 0.2
0.95 0.95
+ 0.1
– 0.06
+ 0.1
– 0.05
+ 0.1
– 0.05
0.16
0.4
0.4
0 – 0.1
+ 0.1
– 0.05
+ 0.1
– 0.05
0.4
0.6
0.85
0.95
1.8 ± 0.2
Hitachi Code
JEDEC
MPAK-4
—
EIAJ
Conforms
Weight (reference value) 0.013 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
Asia (Taiwan)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
相关型号:
©2020 ICPDF网 联系我们和版权申明