2SK3203(L) [HITACHI]

0.028ohm, POWER, FET, LDPAK-3;
2SK3203(L)
型号: 2SK3203(L)
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

0.028ohm, POWER, FET, LDPAK-3

文件: 总12页 (文件大小:59K)
中文:  中文翻译
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2SK3203(L), 2SK3203(S)  
Silicon N Channel MOS FET  
High Speed Power Switching  
ADE-208-1384A (Z)  
2nd. Edition  
Jan. 2001  
Features  
Low on-resistance  
RDS(on) =11m typ.  
Low drive current  
5V gate drive device can be driven from 5V source  
Outline  
LDPAK  
4
4
D
1
2
3
1
G
2
3
1. Gate  
2. Drain  
3. Source  
4. Drain  
S
2SK3203(L), 2SK3203(S)  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VDSS  
Ratings  
Unit  
V
Drain to source voltage  
Gate to source voltage  
Drain current  
30  
VGSS  
±20  
V
ID  
45  
A
1
Drain peak current  
ID(pulse)  
*
180  
A
Body-drain diode reverse drain current ID R  
45  
A
Channel dissipation  
Channel temperature  
Storage temperature  
Pch*2  
50  
W
°C  
°C  
Tch  
150  
Tstg  
–55 to +150  
Note: 1. PW 10µs, duty cycle 1 %  
2. Value at Tc = 25°C  
3. Value at Tch = 25°C, Rg 50Ω  
2
2SK3203(L), 2SK3203(S)  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test Conditions  
Drain to source breakdown  
voltage  
V(BR)DSS  
30  
V
ID = 10mA, VGS = 0  
Gate to source leak current  
IGSS  
1.5  
13  
±0.1  
10  
3.0  
14  
28  
µA  
µA  
V
VGS = ±20V, VDS = 0  
VDS = 30 V, VGS = 0  
ID = 1mA, VDS = 10V*1  
ID = 20A, VGS = 10V*1  
ID = 20A, VGS = 5V*1  
ID = 20A, VDS = 10V*1  
VDS = 10V  
Zero gate voltege drain current IDSS  
Gate to source cutoff voltage VGS(off)  
Static drain to source on state RDS(on)  
resistance  
11  
mΩ  
mΩ  
S
18  
Forward transfer admittance  
Input capacitance  
|yfs|  
22  
Ciss  
Coss  
1200  
380  
200  
23  
pF  
pF  
pF  
nc  
nc  
nc  
ns  
ns  
ns  
ns  
V
Output capacitance  
VGS = 0  
Reverse transfer capacitance Crss  
f = 1MHz  
Total gate charge  
Gate to source charge  
Gate to drain charge  
Turn-on delay time  
Rise time  
Qg  
Qgs  
Qgd  
td(on)  
tr  
VDD = 10V  
4.0  
7.0  
17  
VGS = 10V  
ID = 45A  
VGS = 10V, ID = 20A  
RL = 0.5Ω  
300  
85  
Turn-off delay time  
Fall time  
td(off)  
tf  
65  
Body–drain diode forward  
voltage  
VDF  
1.15  
IF = 45A, VGS = 0  
Body–drain diode reverse  
recovery time  
trr  
60  
ns  
IF =45A, VGS = 0  
diF/ dt =20A/µs  
Note: 1. Pulse test  
3
2SK3203(L), 2SK3203(S)  
Main Characteristics  
Maximum Safe Operation Area  
Power vs. Temperature Derating  
80  
1000  
300  
100  
30  
10  
3
60  
40  
20  
Operation in  
this area is  
limited by R  
1
DS(on)  
0.3  
0.1  
Ta = 25°C  
3
30  
0
0.1 0.3  
1
10  
100  
50  
100  
150  
200  
Drain to Source Voltage  
V
(V)  
DS  
Case Temperature Tc (°C)  
Typical Output Characteristics  
Typical Transfer Characteristics  
= 10 V  
50  
40  
30  
20  
10  
50  
40  
30  
20  
10  
10V  
6 V  
5 V  
Pulse Test  
V
DS  
Pulse Test  
4.5 V  
4 V  
Tc = 75°C  
25°C  
V
= 3.5 V  
8
GS  
6
—25°C  
0
0
10  
2
4
6
8
2
4
10  
Gate to Source Voltage  
V
(V)  
GS  
Drain to Source Voltage  
V
(V)  
DS  
4
2SK3203(L), 2SK3203(S)  
Static Drain to Source on State Resistance  
vs. Drain Current  
Drain to Source Saturation Voltage vs.  
Gate to Source Voltage  
100  
0.5  
0.4  
0.3  
0.2  
0.1  
Pulse Test  
Pulse Test  
50  
20  
V
= 5 V  
GS  
10 V  
10  
5
I
= 10 A  
D
2
1
5 A  
2 A  
0.1  
0
4
8
12  
16  
20  
0.2 0.5 1  
2
5
10 20  
(A)  
100  
50  
Gate to Source Voltage  
V
(V)  
Drain Current  
I
GS  
D
Static Drain to Source on State Resistance  
vs. Temperature  
Forward Transfer Admittance vs.  
Drain Current  
50  
100  
30  
Pulse Test  
Tc = —25 °C  
40  
30  
20  
10  
10  
10 A  
25 °C  
3
1
5 V  
75 °C  
2A, 5 A  
I
= 2 A, 5 A, 10 A  
D
0.3  
0.1  
V
= 10 V  
40  
GS  
V
= 10 V  
DS  
Pulse Test  
0
—40  
0.1 0.3  
3
30  
10  
0
80  
120  
160  
1
100  
Case Temperature Tc (°C)  
Drain Current I (A)  
D
5
2SK3203(L), 2SK3203(S)  
Typical Capacitance vs.  
Drain to Source Voltage  
Body—Drain Diode Reverse  
Recovery Time  
10000  
1000  
500  
3000  
1000  
Ciss  
200  
100  
50  
Coss  
300  
100  
Crss  
20  
10  
30  
10  
di / dt = 20 A / µs  
= 0, Ta = 25°C  
V
= 0  
GS  
V
f = 1 MHz  
GS  
0.1 0.3  
1
3
10  
30  
(A)  
100  
0
10  
20  
30  
40 50  
Reverse Drain Current  
I
DR  
Drain to Source Voltage V  
(V)  
DS  
Dynamic Input Characteristics  
= 45A  
Switching Characteristics  
= 10 V , V = 10 V  
1000  
500  
50  
20  
I
V
GS  
DD  
D
RG = 50, duty < 1 %  
V
GS  
40  
30  
20  
10  
16  
12  
8
V
= 25 V  
10 V  
5 V  
DD  
200  
100  
50  
t
r
t
V
d(off)  
DS  
t
f
V
= 25 V  
10 V  
5 V  
4
0
DD  
20  
10  
t
d(on)  
0
0.1 0.2  
0.5  
1
2
5
10 20  
20  
40  
60  
80  
100  
Drain Current  
I
(A)  
Gate Charge Qg (nc)  
D
6
2SK3203(L), 2SK3203(S)  
Reverse Drain Current vs.  
Souece to Drain Voltage  
50  
40  
30  
20  
10  
10 V  
5 V  
V
= 0,-5V  
GS  
Pulse Test  
1.6 2.0  
0
0.4  
0.8  
1.2  
Source to Drain Voltage  
V
(V)  
SD  
Normalized Transient Thermal Impedance vs. Pulse Width  
3
1
Tc = 25°C  
D = 1  
0.5  
0.3  
0.1  
θ
θ
γ
θ
ch — c(t) = s (t) ¥ ch — c  
ch — c = 2.5°C/W, Tc = 25°C  
PW  
T
P
DM  
D =  
0.03  
0.01  
PW  
T
10  
100  
1 m  
10 m  
100 m  
1
10  
Pulse Width PW (S)  
7
2SK3203(L), 2SK3203(S)  
Switching Time Test Circuit  
Switching Time Waveform  
Vout  
Monitor  
Vin Monitor  
90%  
D.U.T.  
R
L
10%  
10%  
90%  
Vin  
V
DD  
Vin  
10V  
Vout  
10%  
50Ω  
= 10 V  
90%  
td(off)  
td(on)  
t
f
tr  
8
2SK3203(L), 2SK3203(S)  
Package Dimensions  
As of January, 2001  
Unit: mm  
4.44 ± 0.2  
1.3 ± 0.15  
10.2 ± 0.3  
2.59 ± 0.2  
1.2 ± 0.2  
1.27 ± 0.2  
+ 0.2  
– 0.1  
0.86  
0.76 ± 0.1  
2.54 ± 0.5  
0.4 ± 0.1  
2.54 ± 0.5  
Hitachi Code  
JEDEC  
LDPAK (L)  
EIAJ  
Mass (reference value)  
1.4 g  
9
2SK3203(L), 2SK3203(S)  
As of January, 2001  
Unit: mm  
4.44 ± 0.2  
7.8  
6.6  
10.2 ± 0.3  
1.3 ± 0.2  
+ 0.2  
– 0.1  
0.1  
2.2  
1.27 ± 0.2  
0.4 ± 0.1  
+ 0.2  
– 0.1  
1.2 ± 0.2  
0.86  
2.54 ± 0.5  
2.54 ± 0.5  
Hitachi Code  
JEDEC  
LDPAK (S)-(2)  
EIAJ  
Mass (reference value)  
1.35 g  
10  
2SK3203(L), 2SK3203(S)  
As of January, 2001  
Unit: mm  
4.44 ± 0.2  
7.8  
6.6  
10.2 ± 0.3  
1.3 ± 0.2  
+ 0.2  
– 0.1  
0.1  
2.2  
1.27 ± 0.2  
0.4 ± 0.1  
+ 0.2  
1.2 ± 0.2  
2.54 ± 0.5  
0.86  
– 0.1  
2.54 ± 0.5  
Hitachi Code  
LDPAK (S)-(2)  
JEDEC  
EIAJ  
Mass (reference value)  
1.35 g  
11  
2SK3203(L), 2SK3203(S)  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure  
rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that  
the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential  
damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
Asia  
: http://semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
: http://sicapac.hitachi-asia.com  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
179 East Tasman Drive, Dornacher Straβe 3  
Hitachi Europe GmbH  
Electronic Components Group  
Hitachi Asia Ltd.  
Hitachi Tower  
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Singapore 049318  
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7/F., North Tower,  
San Jose,CA 95134  
D-85622 Feldkirchen, Munich  
World Finance Centre,  
Tel: <1> (408) 433-1990 Germany  
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Hong Kong  
Tel : <852>-(2)-735-9218  
Fax : <852>-(2)-730-0281  
URL : http://www.hitachi.com.hk  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Hitachi Asia Ltd.  
(Taipei Branch Office)  
4/F, No. 167, Tun Hwa North Road,  
Hung-Kuo Building,  
Taipei (105), Taiwan  
Berkshire SL6 8YA, United Kingdom  
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Tel : <886>-(2)-2718-3666  
Fax : <886>-(2)-2718-8180  
Telex : 23222 HAS-TP  
URL : http://www.hitachi.com.tw  
Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.  
Colophon 2.0  
12  

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