2SJ471 [HITACHI]

Silicon P Channel DV-L MOS FET High Speed Power Switching; 硅P通道DV -L MOS FET高速电源开关
2SJ471
型号: 2SJ471
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Silicon P Channel DV-L MOS FET High Speed Power Switching
硅P通道DV -L MOS FET高速电源开关

开关 电源开关
文件: 总10页 (文件大小:49K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SJ471  
Silicon P Channel DV–L MOS FET  
High Speed Power Switching  
ADE-208-540  
1st. Edition  
Features  
Low on-resistance  
RDS(on) = 25 mtyp.  
4V gate drive devices.  
High speed switching  
Outline  
TO–220CFM  
D
G
1
2
3
1. Gate  
2. Drain  
3. Source  
S
2SJ471  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VDSS  
Ratings  
–30  
Unit  
V
Drain to source voltage  
Gate to source voltage  
Drain current  
VGSS  
ID  
±20  
V
–30  
A
Note1  
Drain peak current  
ID(pulse)  
–120  
–30  
A
Body to drain diode reverse drain current  
Channel dissipation  
Channel temperature  
Storage temperature  
IDR  
A
Pch Note2  
30  
W
°C  
°C  
Tch  
150  
Tstg  
–55 to +150  
Notes: 1. PW 10µs, duty cycle 1 %  
2. Value at Tc = 25°C  
2
2SJ471  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol  
Min  
Typ  
Max  
Unit  
Test Conditions  
Drain to source breakdown  
voltage  
V(BR)DSS  
–30  
V
ID = –10mA, VGS = 0  
IG = ±100µA, VDS = 0  
VDS = –30 V, VGS = 0  
Gate to source breakdown  
voltage  
V(BR)GSS  
IDSS  
±20  
V
Zero gate voltege drain  
current  
–10  
µA  
Gate to source leak current  
IGSS  
–1.0  
12  
±10  
–2.0  
35  
60  
µA  
V
VGS = ±16V, VDS = 0  
ID = –1mA, VDS = –10V  
ID = –15A, VGS = –10VNote3  
ID = –15A, VGS = –4VNote3  
ID = –15A, VDS = –10VNote3  
VDS = –10V  
Gate to source cutoff voltage VGS(off)  
Static drain to source on state RDS(on)  
25  
mΩ  
mΩ  
S
resistance  
RDS(on)  
40  
Forward transfer admittance |yfs|  
20  
Input capacitance  
Output capacitance  
Ciss  
1700  
950  
260  
20  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
V
Coss  
VGS = 0  
Reverse transfer capacitance Crss  
f = 1MHz  
Turn-on delay time  
Rise time  
td(on)  
tr  
td(off)  
tf  
VGS = –10V, ID = –15A  
RL = 0.67Ω  
290  
170  
130  
–1.1  
Turn-off delay time  
Fall time  
Body to drain diode forward  
voltage  
VDF  
IF = –30A, VGS = 0  
Body to drain diode reverse  
recovery time  
trr  
70  
ns  
IF = –30A, VGS = 0  
diF/ dt = 50A/µs  
Note: 3. Pulse test  
3
2SJ471  
Main Characteristics  
Power vs. Temperature Derating  
Maximun Safe Operation Area  
–500  
40  
30  
20  
10  
–200  
–100  
10 µs  
–50  
–20  
–10  
–5  
Operation in  
this area is  
–2  
–1  
limited by R  
DS(on)  
Ta = 25 °C  
–1  
–0.5  
0
–3  
–30  
50  
100  
150  
200  
–0.1 –0.3  
–10  
–100  
Drain to Source Voltage V  
(V)  
Case Temperature Tc (°C)  
DS  
Typical Output Characteristics  
Typical Transfer Characteristics  
–10 V –6 V  
–50  
–40  
–30  
–20  
–10  
–50  
–40  
–30  
–20  
–10  
–5 V  
–4.5 V  
–4 V  
Tc = –25°C  
75°C  
–3.5 V  
25°C  
–3 V  
V
GS  
= –2.5 V  
V
= –10 V  
DS  
Pulse Test  
Pulse Test  
–8 –10  
0
0
–1  
–2  
–3  
–4  
–5  
–2  
–4  
–6  
Gate to Source Voltage V  
(V)  
Drain to Source Voltage V  
(V)  
GS  
DS  
4
2SJ471  
Drain to Source Saturation Voltage  
vs. Gate to Source Voltage  
Static Drain to Source on State Resistance  
vs. Drain Current  
0.5  
–1.0  
–0.8  
–0.6  
–0.4  
–0.2  
Pulse Test  
Pulse Test  
0.2  
0.1  
I
= –20 A  
D
0.05  
V
GS  
= –4 V  
–10 V  
–10 A  
–5 A  
0.02  
0.01  
–8  
0
–4  
–12  
–16  
–20  
(V)  
–1  
–2  
–5  
–10 –20  
–50  
Drain Current I (A)  
D
Gate to Source Voltage V  
GS  
Static Drain to Source on State Resistance  
vs. Temperature  
0.10  
Foward Transfer Admittance vs.  
Drain Current  
50  
20  
10  
5
Tc = –25 °C  
0.08  
0.06  
0.04  
0.02  
I
= –20 A  
D
25 °C  
75 °C  
2
1
V
= –4 V  
GS  
–5, –10 A  
0.5  
–5, –10, –20 A  
Pulse Test  
–10 V  
V
= –10 V  
0.2  
0.1  
DS  
Pulse Test  
0
–0.5  
–40  
0
40  
80  
120  
160  
–0.2  
–0.1  
–1 –2 –5 –20  
–50  
–10  
Drain Current I (A)  
Cate Temperature Tc (°C)  
D
5
2SJ471  
Typical Capacitance vs.  
Drain to Source Voltage  
Body to Drain Diode Reverse  
Recovery Time  
10000  
5000  
1000  
500  
200  
100  
50  
2000  
1000  
Ciss  
Coss  
Crss  
–16  
500  
20  
200  
100  
di / dt = 50 A / µs  
10  
5
V
= 0  
GS  
V
= 0, Ta = 25 °C  
f = 1 MHz  
GS  
–0.5  
–0.2  
–0.1  
–1 –2 –5  
–20  
–50  
0
–4  
–8  
–12  
–20  
(V)  
–10  
Drain to Source Voltage V  
Reverse Drain Current I  
(A)  
DR  
DS  
Dynamic Input Characteristics  
Switching Characteristics  
1000  
500  
0
–10  
–20  
–30  
0
V
= –5 V  
–10 V  
–25 V  
DD  
–4  
t
d(off)  
200  
100  
V
–8  
GS  
t
f
t
r
V
I
50  
DS  
–12  
t
V
= –25 V  
–10 V  
–5 V  
d(on)  
DD  
20  
10  
–40  
–50  
–16  
–20  
V
= –10 V, V  
= –10 V  
DD  
GS  
= –30 A  
16  
duty < 1 %  
D
5
–0.1  
–0.5  
0
32  
48  
64  
80  
–0.2  
–1 –2 –5  
–20  
–50  
–10  
Drain Current I (A)  
Gate Charge Qg (nc)  
D
6
2SJ471  
Reverse Drain Current vs.  
Source to Drain Voltage  
–50  
–40  
–30  
–20  
–10  
Pulse Test  
–10 V  
–5 V  
V
= 0, 5 V  
GS  
0
–0.4  
–0.8 –1.2 –1.6  
–2.0  
(V)  
Source to Drain Voltage V  
SD  
Normalized Transient Thermal Impedance vs. Pulse Width  
3
1
Tc = 25°C  
D = 1  
0.5  
0.3  
0.1  
θ
θ
γ
θ
ch – c(t) = s (t) • ch – c  
ch – c = 4.17 °C/W, Tc = 25 °C  
PW  
T
P
DM  
D =  
0.03  
0.01  
PW  
T
10 µ  
100 µ  
1 m  
10 m  
Pulse Width PW (S)  
100 m  
1
10  
7
2SJ471  
Switching Timen Test Circuit  
Waveform  
Vout  
Monitor  
Vin Monitor  
Vin  
10%  
D.U.T.  
R
L
90%  
90%  
V
DD  
Vin  
10 V  
90%  
10%  
50Ω  
= –10 V  
10%  
Vout  
td(off)  
td(on)  
t
f
tr  
8
2SJ471  
Package Dimensions  
Unit: mm  
2.7 ± 0.2  
10.0 ± 0.3  
f
3.2 ± 0.2  
1.0 ± 0.2  
4.45 ± 0.3  
2.5 ± 0.2  
1.15 ± 0.2  
0.6 ± 0.1  
2.54 ± 0.5  
2.54 ± 0.5  
0.7 ± 0.1  
TO–220CFM  
Hitachi Code  
EIAJ  
JEDEC  
9
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

相关型号:

2SJ471-E

Silicon P Channel DV-L MOS FET
RENESAS

2SJ472-01L

Power MOSFET
FUJI

2SJ472-01L_06

P-CHANNEL SILICON POWER MOSFET
FUJI

2SJ472-01S

P-CHANNEL SILICON POWER MOSFET
FUJI

2SJ473-01L

Power MOSFET
FUJI

2SJ473-01L_06

P-CHANNEL SILICON POWER MOSFET
FUJI

2SJ473-01S

P-CHANNEL SILICON POWER MOSFET
FUJI

2SJ474-01L

Power MOSFET
FUJI

2SJ474-01L_05

P-CHANNEL SILICON POWER MOSFET
FUJI