2SB649A [HITACHI]

Silicon PNP Epitaxial; PNP硅外延
2SB649A
型号: 2SB649A
厂家: HITACHI SEMICONDUCTOR    HITACHI SEMICONDUCTOR
描述:

Silicon PNP Epitaxial
PNP硅外延

文件: 总8页 (文件大小:38K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2SB649, 2SB649A  
Silicon PNP Epitaxial  
Application  
Low frequency power amplifier complementary pair with 2SD669/A  
Outline  
TO-126 MOD  
1. Emitter  
2. Collector  
3. Base  
1
2
3
2SB649, 2SB649A  
Absolute Maximum Ratings (Ta = 25°C)  
Ratings  
2SB649  
–180  
–120  
–5  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
2SB649A  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
–180  
–160  
V
–5  
V
–1.5  
–1.5  
A
Collector peak current  
Collector power dissipation  
IC(peak)  
–3  
–3  
A
PC  
1
1
W
W
°C  
°C  
PC*1  
Tj  
20  
20  
Junction temperature  
150  
150  
Storage temperature  
Tstg  
–55 to +150  
–55 to +150  
Note: 1. Value at TC = 25°C  
2
2SB649, 2SB649A  
Electrical Characteristics (Ta = 25°C)  
2SB649  
2SB649A  
Item  
Symbol Min Typ Max Min Typ Max Unit Test conditions  
Collector to base  
breakdown voltage  
V(BR)CBO  
V(BR)CEO  
V(BR)EBO  
–180  
–120  
–5  
–180  
–160  
–5  
V
IC = –1 mA, IE = 0  
IC = –10 mA, RBE = ∞  
IE = –1 mA, IC = 0  
VCB = –160 V, IE = 0  
Collector to emitter  
breakdown voltage  
V
Emitter to base  
breakdown voltage  
V
Collector cutoff current ICBO  
DC current transfer ratio hFE1  
–10  
320  
–10  
200  
µA  
1
*
60  
60  
VCE = –5 V,  
IC = –150 mA  
hFE2  
30  
30  
VCE = –5 V,  
IC = –500 mA*2  
Collector to emitter  
saturation voltage  
VCE(sat)  
–1  
–1.5  
–1  
–1.5  
V
V
IC = –500 mA,  
IB = –50 mA  
Base to emitter voltage VBE  
VCE = –5 V,  
IC = –150 mA  
Gain bandwidth product fT  
140  
27  
140  
27  
MHz VCE = –5 V,  
IC = –150 mA  
Collector output  
capacitance  
Cob  
pF  
VCB = –10 V, IE = 0,  
f = 1 MHz  
Notes: 1. The 2SB649 and 2SB649A are grouped by hFE1 as follows.  
2. Pulse test  
B
C
D
2SB649  
60 to 120  
60 to 120  
100 to 200  
100 to 200  
160 to 320  
2SB649A  
3
2SB649, 2SB649A  
Maximum Collector Dissipation  
Curve  
Area of Safe Operation  
(–13.3 V, –1.5 A)  
30  
20  
10  
–3  
ICmax  
–1.0  
(–40 V, –0.5 A)  
–0.3  
–0.1  
DC Operation (TC = 25°C)  
(–120 V, –0.038 A)  
–0.03  
–0.01  
(–160 V, –0.02 A)  
2SB649A  
2SB649  
0
50  
100  
150  
–1  
–3  
–10  
–30 –100 –300  
Collector to emitter voltage VCE (V)  
Case temperature TC (°C)  
Typical Transfer Characteristics  
–500  
Typical Output Characteristics  
TC = 25°C  
–1.0  
–0.8  
–0.6  
–0.4  
–0.2  
VCE = –5 V  
–100  
–10  
–1  
IB = 0  
–30  
0
–10  
–20  
–40  
–50  
0
–0.2 –0.4 –0.6 –0.8 –1.0  
Base to emitter voltage VBE (V)  
Collector to emitter voltage VCE (V)  
4
2SB649, 2SB649A  
DC Current Transfer Ratio  
vs. Collector Current  
Collector to Emitter Saturation  
Voltage vs. Collector Current  
–1.2  
–1.0  
–0.8  
–0.6  
–0.4  
–0.2  
–0  
350  
350  
250  
200  
150  
100  
50  
VCE = –5V  
IC = 10 IB  
–25  
25  
0
–1  
–10  
–100  
–1,000  
–1  
–10  
–100  
–1,000  
Collector current IC (mA)  
Collector current IC (mA)  
Gain Bandwidth Product  
vs. Collector Current  
Base to Emitter Saturation Voltage  
vs. Collector Current  
240  
200  
160  
120  
80  
–1.2  
–1.0  
–0.8  
–0.6  
–0.4  
–0.2  
–0  
VCE = –5 V  
IC = 10 IB  
40  
0
–1  
–10  
–100  
–1,000  
–10  
–30  
–100  
–300  
–1,000  
Collector current IC (mA)  
Collector current IC (mA)  
5
2SB649, 2SB649A  
Collector Output Capacitance vs.  
Collector to Base Voltage  
200  
100  
50  
f = 1 MHz  
I
E = 0  
20  
10  
5
2
–1  
–3  
–10  
–30  
–100  
Collector to base voltage VCB (V)  
6
Unit: mm  
8.0 ± 0.5  
2.7 ± 0.4  
+0.15  
φ
3.1–0.1  
120°  
1.1  
0.8  
2.29 ± 0.5  
2.29 ± 0.5 0.55  
1.2  
Hitachi Code  
JEDEC  
EIAJ  
TO-126 Mod  
Weight (reference value) 0.67 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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