2SA1122CDUR

更新时间:2024-09-18 13:02:05
品牌:HITACHI
描述:Small Signal Bipolar Transistor, 0.1A I(C), 55V V(BR)CEO, 1-Element, PNP, Silicon, MPAK-3

2SA1122CDUR 概述

Small Signal Bipolar Transistor, 0.1A I(C), 55V V(BR)CEO, 1-Element, PNP, Silicon, MPAK-3

2SA1122CDUR 数据手册

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2SA1122  
Silicon PNP Epitaxial  
Application  
Low frequency amplifier  
Outline  
MPAK  
3
1
1. Emitter  
2. Base  
3. Collector  
2
2SA1122  
Absolute Maximum Ratings (Ta = 25°C)  
Item  
Symbol  
VCBO  
VCEO  
VEBO  
IC  
Ratings  
–55  
Unit  
V
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Collector current  
–55  
V
–5  
V
–100  
150  
mA  
mW  
°C  
°C  
Collector power dissipation  
Junction temperature  
Storage temperature  
PC  
Tj  
150  
Tstg  
–55 to +150  
Electrical Characteristics (Ta = 25°C)  
Item  
Symbol Min  
Typ  
Max  
Unit  
Test conditions  
Collector to base breakdown  
voltage  
V(BR)CBO  
–55  
–55  
–5  
V
IC = –10 µA, IE = 0  
Collector to emitter breakdown V(BR)CEO  
voltage  
V
V
IC = –1 mA, RBE = ∞  
IE = –10 µA, IC = 0  
Emitter to base breakdown  
voltage  
V(BR)EBO  
Collector cutoff current  
Emitter cutoff current  
DC current transfer ratio  
ICBO  
IEBO  
hFE*1  
–0.5  
–0.5  
800  
µA  
µA  
VCB = –30 V, IE = 0  
VEB = –2 V, IC = 0  
160  
VCE = –12 V, IC = –2 mA  
IC = –10 mA, IB = –1 mA  
Collector to emitter saturation VCE(sat)  
voltage  
–0.5  
V
V
Base to emitter voltage  
VBE  
–0.75  
VCE = –12 V, IC = –2 mA  
Note: 1. The 2SA1122 is grouped by hFE as follows.  
Grade  
Mark  
hFE  
B
C
D
CC  
CD  
CE  
160 to 320  
250 to 500  
400 to 800  
See characteristic curves of 2SA836.  
2
2SA1122  
Maximum Collector Dissipation Curve  
150  
100  
50  
0
50  
100  
150  
Ambient Temperature Ta (°C)  
3
Unit: mm  
+ 0.10  
– 0.06  
+ 0.10  
– 0.05  
0.16  
3 – 0.4  
0 – 0.1  
0.95  
0.95  
1.9 ± 0.2  
2.95 ± 0.2  
Hitachi Code  
JEDEC  
MPAK  
EIAJ  
Conforms  
Weight (reference value) 0.011 g  
Cautions  
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,  
copyright, trademark, or other intellectual property rights for information contained in this document.  
Hitachi bears no responsibility for problems that may arise with third party’s rights, including  
intellectual property rights, in connection with use of the information contained in this document.  
2. Products and product specifications may be subject to change without notice. Confirm that you have  
received the latest product standards or specifications before final design, purchase or use.  
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,  
contact Hitachi’s sales office before using the product in an application that demands especially high  
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk  
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,  
traffic, safety equipment or medical equipment for life support.  
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly  
for maximum rating, operating supply voltage range, heat radiation characteristics, installation  
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used  
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable  
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-  
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other  
consequential damage due to operation of the Hitachi product.  
5. This product is not designed to be radiation resistant.  
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without  
written approval from Hitachi.  
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor  
products.  
Hitachi, Ltd.  
Semiconductor & Integrated Circuits.  
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109  
URL  
NorthAmerica  
Europe  
: http:semiconductor.hitachi.com/  
: http://www.hitachi-eu.com/hel/ecg  
Asia (Singapore)  
Asia (Taiwan)  
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm  
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm  
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm  
Japan  
: http://www.hitachi.co.jp/Sicd/indx.htm  
For further information write to:  
Hitachi Semiconductor  
(America) Inc.  
Hitachi Europe GmbH  
Hitachi Asia (Hong Kong) Ltd.  
Group III (Electronic Components)  
7/F., North Tower, World Finance Centre,  
Harbour City, Canton Road, Tsim Sha Tsui,  
Kowloon, Hong Kong  
Tel: <852> (2) 735 9218  
Fax: <852> (2) 730 0281  
Hitachi Asia Pte. Ltd.  
16 Collyer Quay #20-00  
Hitachi Tower  
Singapore 049318  
Tel: 535-2100  
Electronic components Group  
Dornacher Stra§e 3  
D-85622 Feldkirchen, Munich  
Germany  
Tel: <49> (89) 9 9180-0  
Fax: <49> (89) 9 29 30 00  
179 East Tasman Drive,  
San Jose,CA 95134  
Tel: <1> (408) 433-1990  
Fax: <1>(408) 433-0223  
Fax: 535-1533  
Hitachi Asia Ltd.  
Taipei Branch Office  
3F, Hung Kuo Building. No.167,  
Tun-Hwa North Road, Taipei (105)  
Tel: <886> (2) 2718-3666  
Fax: <886> (2) 2718-8180  
Telex: 40815 HITEC HX  
Hitachi Europe Ltd.  
Electronic Components Group.  
Whitebrook Park  
Lower Cookham Road  
Maidenhead  
Berkshire SL6 8YA, United Kingdom  
Tel: <44> (1628) 585000  
Fax: <44> (1628) 778322  
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.  

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