1S2075(K)RE 概述
Rectifier Diode, 1 Element, 0.1A, Silicon, DO-35
1S2075(K)RE 数据手册
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PDF下载1S2075(K)
Silicon Epitaxial Planar Diode for High Speed Switching
ADE-208-144A (Z)
Rev. 1
Aug. 1995
Features
•
•
•
Low capacitance. (C = 3.5pF max)
Short reverse recovery time. (trr = 8.0ns max)
High reliability with glass seal.
Ordering Information
Type No.
Cathode band
Green
Mark
Package Code
DO-35
1S2075(K)
H
Outline
2
1
Cathode band
1. Cathode
2. Anode
1S2075(K)
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Value
35
Unit
V
Peak reverse voltage
Reverse voltage
VRM
VR
IFM
IFSM
IO
30
V
Peak forward current
Non-Repetitive peak forward surge current
Average forward current
Power dissipation
450
mA
mA
mA
mW
°C
*
600
100
Pd
Tj
250
Junction temperature
Storage temperature
175
Tstg
–65 to +175
°C
Note: Within 1s forward surge current.
Electrical Characteristics (Ta = 25°C)
Item
Symbol Min
Typ
—
Max
Unit
V
Test Condition
IF = 10mA
Forward voltage
Reverse current
Capacitance
VF
IR
—
—
—
—
0.8
0.1
3.5
8.0
—
µA
pF
ns
VR = 30V
C
—
VR = 1V, f = 1MHz
Reverse recovery time trr*
—
IF = IR = 10mA, Irr = 1mA
Note: Reverse recovery time test circuit
DC
Supply
3kΩ
0.1µF
Sampling
Oscilloscope
Ro = 50Ω Pulse
Rin = 50Ω
Generator
Trigger
2
1S2075(K)
10–1
10–2
10–3
10–4
0.6
Forward voltage VF (V)
0
0.2
0.4
0.8
1.0 1.2
Fig.1 Forward current Vs. Forward voltage
10–4
Ta = 125°C
10–5
Ta = 75°C
10–6
10–7
Ta = 25°C
10–8
10–9
30
Reverse voltage VR (V)
0
10
20
40
50
Fig.2 Reverse current Vs. Reverse voltage
3
1S2075(K)
f = 1MHz
10
1.0
10–1
102
1.0
10
Reverse voltage VR (V)
Fig.3 Capacitance Vs. Reverse voltage
4
1S2075(K)
Package Dimensions
Unit: mm
26.0 Min
26.0 Min
4.2 Max
1
2
1 Cathode
2 Anode
Cathode band (Green)
HITACHI Code
JEDEC Code
EIAJ Code
DO-35
DO-35
SC-48
0.13
Weight (g)
5
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
Europe
: http:semiconductor.hitachi.com/
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore)
Asia (Taiwan)
: http://www.has.hitachi.com.sg/grp3/sicd/index.htm
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
Hitachi Europe GmbH
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Hitachi Asia Pte. Ltd.
16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Electronic components Group
Dornacher Stra§e 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Telex: 40815 HITEC HX
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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