SK32-SMC [HDSEMI]
SMC Plastic-Encapsulate Diodes;
| 型号： | SK32-SMC |
| 厂家： | 
Jiangsu High diode Semiconductor Co., Ltd |
| 描述： | SMC Plastic-Encapsulate Diodes |
| 文件： | 总4页 (文件大小：890K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SK32 THRU SK320
HD CK55
SMC Plastic-Encapsulate Diodes
Schottky Rectifier
Features
SMC
●I
3A
o
●VRRM
20V-200V
●High surge current capability
●
Polarity: Color band denotes cathode
Applications
●Rectifier
Marking
● SK 3X
:
X From 2 To 20
Limiting Values (Absolute Maximum Rating)
SK 3
Item
Symbol Unit
Test Conditions
2
3
4
5
6
8
10
15
20
Repetitive Peak Reverse Voltage
VRRM
V
V
20 30 40 50 60 80 100 150 200
14 21
28 35 42 56
70
105 140
MaximumRMS Voltage
V
RMS
60HZ Half-sine wave, Resistance
load, TL(Fig.1)
Average Forward Current
IF(AV)
A
A
3.0
Surge(Non-repetitive)Forward
Current
60Hz Half-sine wave ,1 cycle ,
Ta =25℃
IFSM
100
Junction Temperature
Storage Temperature
TJ
℃
℃
-55~+125
-55~+150
TSTG
-55 ~ +150
Electrical Characteristics (T =25℃ Unless otherwise specified）
a
SK 3
6
Item
Symbol Unit
Test Condition
2
3
4
5
8
10
15 20
VF
IF =3.0A
V
0.55
0.7
0.85
0.95
Peak Forward Voltage
Peak Reverse Current
IRRM1
IRRM2
T =25℃
0.5
0.1
a
mA
VRM=VRRM
T =100℃
10
5.0
a
551)
171)
Rθ
Between junction and ambient
Between junction and terminal
J-A
Thermal
Resistance(Typical)
℃/
W
Rθ
J-L
Notes:
Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.6" x 0.6" (16 mm x 16 mm) copper
pad areas
1
H
igh Diode Semiconductor
Typical Characteristics
FIG.1: FORWARD CURRENT DERATING CURVE
FIG.2: MAXIMUM NON-REPETITIVE FORWARD URGE CURRENT
120
110
100
90
3.0
2.5
2.0
1.5
1.0
0.5
0
SK 32-SK 36
SK 38-SK 320
8.3ms Single Half Sine Wave
JEDEC Method
80
Resistive or Inductive Load
P.C.B. Mounted on 0.6"×0.6"
(16mm×16mm)Copper Pad Areas
70
0
1
2
10
20
100
25
50
75
100
125
150
TL(℃)
Number of Cycles
FIG.4：TYPICAL REVERSE CHARACTERISTICS
FIG.3: TYPICAL FORWARD CHARACTERISTICS
TJ=25℃
Pulse width=300us
1% Duty Cycle
100
100
SK 32-SK 36
SK 38-SK 320
10
1.0
10
Tj=125℃
1.0
0.1
0.01
Tj=75℃
0.1
SK 32-SK 34
SK 35-SK 36
SK 38-SK 310
SK 315-SK 320
0.01
Tj=25℃
0.001
0
20
40
60
80
100
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
VF(V)
Voltage(%)
2
H
igh Diode Semiconductor
SMC Package Outline Dimensions
0.217(5.50)
0.240(6.10)
0.108 (2.75)
0.123 (3.25)
0.256(6.50)
0.280(7.10)
0.007(0.17)
0.012(0.30)
0.087(2.2)
0.106(2.7)
0.035(0.90)
0.055(1.40)
0.008(0.203)MAX.
0.291(7.40)
0.331(8.40)
Dimensions in inches and (millimeters)
SMC Suggested Pad Layout
6.5
1.8
JSHD
JSHD
3
H
igh Diode Semiconductor
Reel Taping Specifications For Surface Mount Devices-SMC
4
H
igh Diode Semiconductor
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