560VW6C [HB]
LED SPECIFICATION; LED规格
| 型号： | 560VW6C |
| 厂家： | 
HB ELECTRONIC COMPONENTS |
| 描述： | LED SPECIFICATION |
| 文件： | 总10页 (文件大小：779K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LED SPECIFICATION
560VW6C
ꢀ Features
ꢁ Single color
ꢁ High bright output
ꢁ Low power consumption
ꢁ High reliability and long life
ꢀ Descriptions：
ꢁ Dice material：InGaN CREE Chip
ꢁ Emitting Color：
Super Bright White
ꢁ Device Outline：
φ5mm Round Type/ 5mm
ꢁ Lens Type：
1. All dimensions are millimeters
2. Tolerance is +/-0.25mm unless otherwise noted
Water Clear
ꢀ Directivity：
0°
1.0
Ta=25° C
30°
IF=20mA
60°
0.5
90°
0
90°
60°
30°
0°
0.5
1.0
Radiation Angle
Page: 1
LED SPECIFICATION
Absolute maximum ratings（Ta = 25℃）
Value
Parameter
Symbol
Test Condition
Unit
Min.
5
Max.
--
Reverse Voltage
Forward Current
VR
IF
IR = 30μA
V
----
----
----
----
-20
-25
30
108
100
+85
+100
mA
Power Dissipation
Pulse Current
Pd
----
mW
Ipeak
Topr
Tstr
Duty=0.1mS，1kHz
mA
℃
Operating Temperature
Storage Temperature
----
----
℃
Electrical and optical characteristics （Ta = 25℃）
Value
Typ.
Parameter
Symbol
Test Condition
Unit
Min.
Max.
30
Forward Voltage
Reverse Current
VF
IR
IF = 20mA
VR = 5V
V10~V12
----
----
μA
Dominate Wavelength
Luminous Intensity
Viewing Angle
λd
IV
IF = 20mA
IF = 20mA
IF = 20mA
WA~ WD
T,U
2θ1/2
55
65
Deg.
Page: 2
BIN ranking for LEDs
BRIGHTNESS BIN
Bin Code IV(mcd)
Bin Code
IV(mcd) Bin Code
IV(mcd)
390-550
Bin Code IV(mcd)
A
B
C
D
E
F
0-5.0
H
J
K
L
M
N
P
37.2-52.0
52.0-72.8
72.8-102
102-145
145-200
200-280
280-390
Q
R
S
T
U
V
X
4180--5860
5860-8200
8-10cd
5.0-7.0
7.0-9.8
9.8-13.7
13.7-19.0
19.0-26.6
26.6-37.2
550-770
Y
770-1100
1100-1520
1520-2130
2130-3000
3000-4180
Z1
Z2
Z3
Z4
Z5
10-12cd
12-14cd
14-16cd
16-18cd
G
W
FOR WHITE COLOR BINS SEE PAGE 3B
PLACING OF WHITE COLOR BINS ON CIE TABLE
FORWARD VOLTAGE (VF) BIN
Bin Code
VF (V)
1.6-1.8
1.8-2.0
2.0-2.2
2.2-2.4
Bin Code
VF (V) Bin Code
VF (V)
3.2-3.4
3.4-3.6
3.6-3.8
3.8-4.0
Bin Code VF (V)
V1
V2
V3
V4
V5
V6
V7
V8
2.4-2.6
2.6-2.8
2.8-3.0
3.0-3.2
V9
V13
V14
V15
V16
4.0-4.2
4.2-4.4
4.4-4.6
4.6-4.8
V10
V11
V12
Page: 3A
Color ranking for white LEDs
Chromaticity Coordinates Ranks (IF=20mA Ta=25℃)
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
0.243
0.200
0.246
0.236
0.264
0.267
0.287
0.295
0.306
0.332
0.330
0.360
0.215
0.230
0.230
0.250
0.248
0.286
0.283
0.305
0.298
0.350
0.321
0.379
0.230
0.250
0.248
0.286
0.275
0.321
0.330
0.360
0.321
0.379
0.366
0.419
0.263
0.220
0.264
0.267
0.283
0.305
0.330
0.339
0.330
0.360
0.361
0.385
X
Y
X
Y
X
Y
X
Y
X
Y
X
Y
0.263
0.220
0.280
0.248
0.296
0.276
0.283
0.305
0.330
0.318
0.356
0.351
0.246
0.236
0.264
0.267
0.287
0.295
0.275
0.321
0.330
0.360
0.366
0.419
0.264
0.267
0.283
0.305
0.330
0.339
0.298
0.350
0.361
0.385
0.391
0.436
0.280
0.248
0.296
0.276
0.330
0.318
0.306
0.332
0.356
0.351
0.380
0.381
Wa1
Wa3
Wb2
Wc2
Wc4
Wd2
Wa2
Wb1
Wc1
Wc3
Wd1
Wf
Y
IF=20mA；Ta=25° C
Wf
Wd2
Wd1
Wc4
Wc3
Wb2
Wb1
Wa3
Wa2
Wa1
x
Page: 3B
LED SPECIFICATION
Typical electrical/optical characteristic curves：
FORWARD CURRENT Vs
FORWARD VOLTAGE
LUMINOUS INTENSITY Vs.
FORWARD CURRENT
50
40
2.5
2.0
1.5
1.0
30
20
10
0
0.5
0
2.0 2.4 2.8 3.2 3.6
Forward Voltage(V)
4.0
0
10
20
30
40
50
IF-Forward Current (mA)
LUMINOUS INTENSITY Vs.
AMBIENT TEMPERATURE
FORWARD CURRENT
DERATING CURVE
2.5
2.0
50
40
30
1.5
1.0
20
10
0.5
0
0
100
0
20
80
40
60
-40 -20
0
20
40
60
80
100
Ambient Temperature TA (℃)
Ambient Temperature TA (℃)
1.2
Ta=25℃
1.0
0.8
0.6
0.4
0.2
0
400
450
500
550
600
650
700
Wavelength (nm)
Page: 4
LED LAMP APPLICATION
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
DIP
Bath temperature: 260±5℃
SOLDERING
Immersion time: with 5 sec
y Using soldering flux,” RESIN FLUX”
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
emperature at tip of iron: 260℃ or lower (To prevent heat from being
Soldering time: within 5 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave a slight
clearance
(Fig.2)
Page : 5
LED LAMP APPLICATION
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to
avoid steering the leads (See Fig.3).
ꢀ
PC board
（Fig.）3
jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to
preserve the soldering conditions with irons stated above: select a best-suited method that
assures the least stress to the LED.
5) Lead cutting after soldering should be performed only after the LED temperature has returned to
normal temperature.
yLED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on
the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective
components including the LED should be taken into account especially when designing the
case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the
diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the
shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
Page : 6
LED LAMP APPLICATION
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.6
Fig.5
yFORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending
should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the hole on board, so that stress
against the LED is prevented. (Fig.8)
Page : 7
LED LAMP APPLICATION
yLEAD STRENGTH
1) Bend strength
Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature)
If the force is 1kg or less, there will be no problem. (Fig.10)
OK！
1Kg
Fig.10
yHANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care
when handling.
yCHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration.
2) When washing is required, refer to the following table for the proper chemical to be sued.
(Immersion time: within 3 minutes at room temperature.)
SOLVENT
ADAPTABILITY
Freon TE
Chlorothene
Isopropyl Alcohol
Thinner
Acetone
Trichloroethylene
⊙
╳
⊙
╳
╳
╳
NOTE: Influences of ultrasonic cleaning of the LED
resin body differ depending on such factors
as the oscillator output, size of the PC board
and the way in which the LED is mounted.
Therefore, ultrasonic cleaning should only be
performed after confirming there is no problem by
conducting a test under practical.
⊙--Usable
╳--Do not use.
Page : 8
LED LAMP PASSED TESTS
Experiment Item:
Test Condition
Item
Reference Standard
Lamp & IR
Ta： 25±5℃
IF= 20mA RH：＜=60%RH
DYNAMIC:100mA 1ms 1/10 duty
①
MIL-STD-750：1026
MIL-STD-883：1005
JIS C 7021：B-1
OPERATION LIFE
STATIC STATE: IF＝20mA
②
TEST TIME:
168HRS（-24HRS，+24HRS）
500HRS（-24HRS，+24HRS）
1000HRS（-24HRS，+72HRS）
HIGH
TEMPERATURE
HIGH HUMIDITY
STORAGE
Ta： 65℃±5℃
RH： 90〜95%RH
TEST TIME：240HRS±2HRS
MIL-STD-202：103B
JIS C 7021 ：B-1
MIL-STD-202：107D
MIL-STD-750：1051
MIL-STD-883：1010
JIS C 7021 ：A-4
105℃〜25℃〜-55℃〜25℃
TEMPERATURE
CYCLING
30min 5min
30min 5min
10CYCLES
105℃±5℃〜-55℃±5℃
10min 10min
10CYCLES
MIL-STD-202：107D
MIL-STD-750：1051
MIL-SYD-883：1011
THERMAL SHOCK
MIL-STD-202：210A
MIL-STD-750-2031
JIS C 7021：A-1
MIL-STD-202：208D
MIL-STD-750：2026
MIL-STD-883：2003
JIS C 7021 ：A-2
SOLDER
RESISTANCE
T，sol：260℃±5℃
DWELL TIME：10±lsec
SOLDERABILITY
T，sol：230℃±5℃
DWELL TIME：5±lsec
Drive Method
Circuit model A
Circuit model B
Page : 9
(A)Recommended circuit.
(B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED.
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