HIP2500IP1 [HARRIS]
Half Bridge 500VDC Driver; 半桥驱动器500VDC
| 型号： | HIP2500IP1 |
| 厂家： | 
HARRIS CORPORATION |
| 描述： | Half Bridge 500VDC Driver |
| 文件： | 总9页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Semiconductor
HIP2500
Half Bridge 500VDC Driver
July 1998
Features
Description
• Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . 500V
The HIP2500 is a high voltage integrated circuit (HVIC) optimized
to drive N-Channel MOS gated power devices in half bridge topol-
ogies. It provides the necessary control for PWM motor drive,
power supply, and UPS applications. The SD pin allows external
shutdown of gate drive to both upper and lower gate outputs. Und-
ervoltage lockout will not allow gating when the bias voltage is too
low to drive the external switches into saturation.
• Ability to Interface and Drive N-Channel Power
Devices
• Floating Bootstrap Power Supply for Upper Rail
Drive
• CMOS Schmitt-Triggered Inputs with Hysteresis
and Pull-Down
The HIP2500IP is pin and function compatible to the Interna-
tional Rectifier IR2110. The HIP2500 has superior ability to
accept negative voltages from the VS pin to the COM pin due to
forward recovery of the lower flyback diode.
• Up to 400kHz Operation
• Single Low Current Bias Supply
• Latch-Up Immune CMOS Logic
• Peak Drive. . . . . . . . . . . . . . . . . . . . . . . . . .Up to 2.0A
• Gate Drive Rise Time (+125oC). . . . . . . < 25ns (Typ)
The HIP2500IB is a SOIC or small outline IC form of the
HIP2500. The HIP2500IB drives high side and low side refer-
enced power switches just like the HIP2500IP.
The HIP2500IP1 is a 16 lead Plastic DIP form of the HIP2500.
Pins 4 and 5 removed from lead frame to provide extra creep-
age and strike distances in high voltage applications.
Applications
• High Frequency Switch-Mode Power Supply
• Induction Heating and Welding
• Switch Mode Amplifiers
Please see Application Note AN9010 for more information.
• AC and DC Motor Drives
Functional Block Diagram
• Electronic Lamp Ballasts
• Battery Chargers
HIP2500
VB
• UPS Inverters
S
LEVEL
SHIFT
• Noise Cancellation in Amplifier Systems
UV
DRIVER
HO
VS
LATCH
VDD
HIN
R
Ordering Information
PART
NUMBER
TEMP.
RANGE ( C)
o
PACKAGE
PKG NO.
E14.3
SD
VCC
LO
LOGIC
HIP2500IP
HIP2500IP1
HIP2500IB
-40 to +85 14 Ld PDIP
-40 to +85 16 Ld PDIP
-40 to +85 16 Ld SOIC (W)
E16.3
LIN
VSS
DRIVER
UV
M16.3
COM
Pinouts
HIP2500 (PDIP)
HIP2500 (SOIC)
HIP2500 (PDIP)
TOP VIEW
TOP VIEW
TOP VIEW
LO
COM
VCC
1
2
3
16 NC
15 VSS
14 LIN
13 SD
12 HIN
11 VDD
10 NC
LO
1
2
3
16 NC
15 VSS
14 LIN
13 SD
12 HIN
11 VDD
10 NC
LO
COM
VCC
1
14 NC
VSS
13
COM
VCC
2
3
4
5
6
7
12 LIN
11 SD
10 HIN
4
5
6
7
8
NC
NC
NC
VS
VB
VS
VB
VS
VB
6
7
8
9
8
VDD
NC
HO
9
NC
9
NC
HO
HO
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper I.C. Handling Procedures.
File Number 2801.9
Copyright © Harris Corporation 1997
1
HIP2500
Absolute Maximum Ratings Full Temperature Range Unless
Thermal Information
Otherwise Noted, All Voltages Referenced to V Unless Otherwise Noted.
SS
Floating Supply Voltage, V . . . . . . . . . . . . . . .V -0.5V to V +18.0V
(Positive Terminal)
Thermal Resistance (Note 1, Typical)
θ
JA
B
S
S
o
HIP2500IP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HIP2500IP1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HIP2500IB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75 C/W
o
Floating Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
80 C/W
S
o
(Common Terminal)
90 C/W
High Side Channel Output Voltage, V
. . . . . . . .-0.5V to V +0.5V
See Maximum Power Dissipation vs Temperature Curve
HO
B
o
o
Fixed Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . -0.5V to 18.0V Junction Temperature Range . . . . . . . . . . . . . . . . .-40 C to +125 C
CC
o
o
Low Side Channel Output Voltage, V . . . . . . . .-0.5V to V +0.5V
Storage Temperature Range, T . . . . . . . . . . . . . . .-40 C to +150 C
LO
CC
S
o
o
Logic Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . -0.5V to 18.0V
Operating Ambient Temperature Range, T . . . . . . .-40 C to +85 C
A
DD
Logic Input Voltage, V . . . . . . . . . . . . . . . . . . . .-0.5V to V +0.5V
IN
DD
[HIN, LIN & SD (Shutdown)]
V
to COM and V to V Voltage. . . . . . . . . . . . . -0.5V to 18.0V
CC SS
DD
NOTE:
1. θ is measured with the component mounted on an evaluation PC board in free air.
JA
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Recommended DC Operating Conditions
Floating Supply Voltage, V . . . . . . . . . . . . . . . . V +10V to V +15V Low Side Channel Output Voltage, V
. . . . . . . . . . . . . . 0V to V
B
S
S
LO
CC
CC
(Floating Terminal)
High Side Channel Output Voltage, V
Logic Supply Voltage, V
Floating Supply Voltage, V . . . . . . . . . . . . . . . . . . . . -4.0V to 500V
. . . . . . . . . . . . . . . . . . . . . . . . 4V to V
DD
. . . . . . . . . . . . . .10V to V
HO
B
S
(With Respect to V )
(Common Terminal)
S
Fixed Supply Voltage, V . . . . . . . . . . . . . . . . . . . . . . . .10V to 15V
V
and COM potentials to be equal.
SS
CC
Electrical Specifications V = (V - V ) = V = 15V, COM = V = 0, Unless Otherwise Noted
CC
B
S
DD
SS
o
o
o
T = +25 C
T = -40 C TO +125 C
J
J
PARAMETER
DC CHARACTERISTICS
Quiescent V Current
SYMBOL
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
I
-
-
-
-
-
1.5
300
0.1
0.4
12
1.9
400
1
-
-
-
-
-
-
2.0
435
1.8
-
mA
µA
µA
µA
µA
CC
QCC
Quiescent V Current
I
300
BS
QBS
QDD
Quiescent V Current
I
-
-
-
DD
Quiescent Leakage Current
I
(500V)
IN+
3.0
20
S
Logic Input Pulldown Current, V = V
22
IN
DD
(HIN, LIN, SD)
Logic Input Leakage Current, V = V
IN-
-
0
1
-
0
1
µA
IN
SS
(HIN, LIN, SD)
Logic Input Positive Going Threshold (Note 2)
V
+
7.5
5.5
8.0
5.9
9.35
9.05
-
8.5
6.3
9.99
9.69
450
450
-
7.5
5.5
8.0
5.9
-
8.6
6.4
9.99
9.69
530
530
-
V
V
TH
Logic Input Negative Going Threshold (Note 2)
Undervoltage Positive Going Threshold
Undervoltage Negative Going Threshold
V
-
TH
UV+
UV-
8.0
7.8
V
7.7
7.5
-
V
Undervoltage Hysteresis (V
Undervoltage Hysteresis (V
)
UVHYS (V
)
CC
250
250
14.95
-
170
170
14.95
-
-
mV
mV
V
CC
)
UVHYS (V
)
BS
-
-
BS
Output High Open Circuit Voltage (HO, LO)
Output Low Open Circuit Voltage (HO, LO)
Output High Short Circuit Current (Sourcing)
Output Low Short Circuit Current (Sinking)
NOTE:
V
+
15
-
15
-
OUT
V
-
0.05
-
0.05
-
V
OUT
I
+
1.65
1.85
2.1
2.3
1.15
1.35
1.6
1.7
A
OUT
I
-
-
-
A
OUT
2. See Figure 8 for logic supply voltages other than 15.0V.
2
HIP2500
Switching Specifications
o
o
o
T = +25 C
T = -40 C TO +125 C
J
J
PARAMETER
SYMBOL
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
HIGH SIDE CHANNEL WITH 500V OFFSET, C = 1000pF
L
High Side Turn-On Propagation Delay
High Side Turn-Off Propagation Delay
High Side Rise Time
t
320
420
385
25
525
450
50
230
-
725
625
50
ns
ns
ns
ns
ON
t
260
190
-
OFF
t
-
-
-
-
25
25
R
High Side Turn-Off Fall Time
t
25
50
50
F
LOW SIDE CHANNEL, C = 1000pF
L
Low Side Turn-On Propagation Delay
Low Side Turn-Off Propagation Delay
Low Side Turn-On Rise Time
t
250
365
295
25
450
370
50
190
-
600
475
50
ns
ns
ns
ns
ON
t
175
125
-
OFF
t
-
-
-
-
30
30
R
Low Side Turn-Off Fall Time
t
25
50
50
F
Shutdown Propagation Delay
High Side Shutdown
t
300
175
400
320
490
400
200
125
-
-
650
500
ns
ns
SDHO
Low Side Shutdown
t
SDLO
HIGH SIDE CHANNEL WITH 500V OFFSET, C = 1000pF
L
Turn-On Propagation Delay Matching
(Between HO and LO)
M
0
-
125
0
-
185
ns
t
Minimum On Output Pulse Width (HO, LO)
Minimum Off Output Pulse Width (HO, LO)
Minimum On Input Pulse Width (HIN, LIN)
Minimum Off Input Pulse Width (HIN, LIN)
Deadtime LO Turn-Off to HO Turn-On
Deadtime HO Turn-Off to LO Turn-On
MAXIMUM TRANSIENT CONDITIONS
Offset Supply Operating Transient
PW
-
35
50
640
145
200
-
-
35
55
650
175
220
-
ns
ns
ns
ns
ns
ns
OUT(MIN)
PW
PW
275
440
100
110
125
-20
250
440
100
110
125
-20
OUTMIN
ON(MIN)
OFF(MIN)
-
-
-
-
-
-
-
-
PW
DHt
ON
ON
DLt
-
-
dV /dt
-
-
50
-
-
50
V/ns
S
Logic Truth Table
HIN
0
LIN
0
UV
0
UV
0
SD
0
HO
LO
COMMENTS
H
L
0
0
1
1
0
0
0
1
0
1
0
1
0
0
1
0
Normal Off
Lower On
Upper On
Both On
0
1
0
0
0
1
0
0
0
0
1
1
0
0
0
X
X
X
1
X
X
1
X
1
X
1
1
Chip Disabled
X
0
V
V
V
UV Lockout and V Lockout
CC
BS
CC
BS
1
0
UV Lockout
UV Lockout
X
0
1
0
3
HIP2500
Typical Performance Curves
2.5
1.0
0.1
VBIAS = 15V
CL = 100pF
T
HIP2500-IP
2.25
VS = 400V
S = 300V
VS = 200V
S = 100V
HIP2500-IP1
A = +25oC
V
2
HIP2500-IB
1.75
1.5
1.25
1
V
0.01
0.75
0.5
0.25
0
0.001
10
100
1000
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90 100110120130
AMBIENT TEMPERATURE (oC)
SWITCHING FREQUENCY (kHz)
FIGURE 2. HIGH VOLTAGE POWER DISSIPATION vs
SWITCHING FREQUENCY
FIGURE 1. MAXIMUM POWER DISSIPATION vs TEMPERATURE
10
6
VS = VSS = COM
V
BS = VCC = 15VDC
MAX VSS OFFSET
4
TA = +25oC
1.0
0.1
2
0
2100pF
907pF
100pF
-2
MIN VSS OFFSET
-4
0.01
10
100
SWITCHING FREQUENCY (kHz)
1000
10
12
14
16
SUPPLY VOLTAGE (V)
NOTE: All switching losses assumed to be in IC.
FIGURE 3. LOW VOLTAGE POWER DISSIPATION vs
FREQUENCY
FIGURE 4. V OFFSET vs V SUPPLY VOLTAGE
SS
CC
10
9
10
VCC = 15V AND 12V
TJ = +25oC
200V
100V
8
500V
400V
300V
7
VCC = 15V
1.0
6
VCC = 12V
5
4
3
0.1
2
10
11
12
13
14
15
16
17
18
0
20
40
60
80
100
120
140
TEMPERATURE (oC)
BOOTSTRAP SUPPLY VOLTAGE
FIGURE 5. OFFSET SUPPLY LEAKAGE vs TEMPERATURE
FIGURE6. MAXIMUMNEGATIVEV OFFSETVOLTAGEvsV
S
BS
VOLTAGE
4
HIP2500
Typical Performance Curves (Continued)
9.35
9.3
10
8
TJ = -40oC TO +125oC
9.25
VCC UV+
9.2
VTH+
9.15
6
VBS UV+
VCC UV-
9.1
9.05
9.0
VTH-
14
4
VBS UV-
8.95
8.9
2
-40 -20
0
20
40
60
80
100 120 140
5
6
8
10
12
16
18
TEMPERATURE (oC)
LOGIC SUPPLY VOLTAGE (V)
(VDD TO VSS
)
FIGURE 7. UNDERVOLTAGE LOCKOUT vs TEMPERATURE
FIGURE 8. INPUT LOGIC THRESHOLD vs SUPPLY VOLTS
120
100
80
450
18V IQBS1
18V IQBS0
400
350
300
250
200
150
14V IQBS1
14V IQBS0
60
40
20
tR
10V IQBS1
10V IQBS0
tF
0
100
1000
1E4
-50
0
50
100
150
JUNCTION TEMPERATURE (oC)
LOAD CAPACITANCE (pF)
FIGURE 10. RISE AND FALL TIME vs LOAD CAPACITANCE
FIGURE 9. QUIESCENT V SUPPLY CURRENT vs
BS
TEMPERATURE
30
28
3.0
-40
tF
0
2.5
25
26
125
2.0
24
22
20
18
16
14
12
10
tR
1.5
1.0
0.5
0
-40
10
0
25
125
SOURCE DRIVER
SINK DRIVER
-50
0
50
100
150
0
2
4
6
8
12
14
16
TEMPERATURE (oC)
SOURCE/SINK DRAIN-SOURCE VOLTAGE
FIGURE 11. DRIVER SINK/SOURCE V-I CHARACTERISTIC
FIGURE 12. RISE AND FALL TIME vs TEMPERATURE
5
HIP2500
Typical Performance Curves (Continued)
30
28
460
440
420
400
380
360
340
320
300
HtON
26
24
22
20
18
16
14
12
10
tF
HtOFF
tR
LtON
LtOFF
10
11
12
13
14
15
16
10
11
12
13
14
15
16
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 13. RISE AND FALL TIME vs SUPPLY VOLTAGE
FIGURE 14. PROPAGATION DELAY vs SUPPLY VOLTAGE
700
600
500
400
300
200
HtON
HtOFF
LtON
LtOFF
-50
0
50
100
150
JUNCTION TEMPERATURE (oC)
FIGURE 15. PROPAGATION DELAYS AT V = 15V
CC
Typical Application Diagram
HV
RG
VB
HIP2500
S
R
HO
VS
LEVEL
SHIFT
UV
DRIVER
LATCH
VDD
HIN
DF
TO
LOAD
CF
SD
VCC
VCC
LO
LOGIC
LIN
VSS
DRIVER
UV
COM
RG
6
HIP2500
Dual-In-Line Plastic Packages (PDIP)
E14.3 (JEDEC MS-001-AA ISSUE D)
14 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INDEX
AREA
INCHES MILLIMETERS
1 2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
-C-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-
SEATING
PLANE
B1
C
8
L
C
L
D1
B1
-
eA
A1
A
D1
e
D
5
C
eC
B
D1
E
5
eB
0.010 (0.25)
C
B
S
M
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
e
6
A
B
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
-
0.430
0.150
-
10.92
3.81
7
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
L
0.115
2.93
4
9
N
14
14
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
e
6. E and
pendicular to datum
7. e and e are measured at the lead tips with the leads uncon-
are measured with the leads constrained to be per-
A
-C-
.
B
C
strained. e must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
7
HIP2500
Dual-In-Line Plastic Packages (PDIP)
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
N
E1
INDEX
AREA
INCHES MILLIMETERS
1 2
3
N/2
SYMBOL
MIN
MAX
0.210
-
MIN
-
MAX
5.33
-
NOTES
-B-
-C-
A
A1
A2
B
-
4
-A-
0.015
0.115
0.014
0.045
0.008
0.735
0.005
0.300
0.240
0.39
2.93
0.356
1.15
0.204
18.66
0.13
7.62
6.10
4
D
E
BASE
PLANE
0.195
0.022
0.070
0.014
0.775
-
4.95
0.558
1.77
0.355
19.68
-
-
A2
A
-
SEATING
PLANE
B1
C
8, 10
L
C
L
D1
B1
-
eA
A1
A
D1
e
D
5
C
eC
B
D1
E
5
eB
0.010 (0.25)
C
B
S
M
0.325
0.280
8.25
7.11
6
NOTES:
E1
e
5
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
0.100 BSC
0.300 BSC
2.54 BSC
7.62 BSC
-
e
e
6
A
B
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
-
0.430
0.150
-
10.92
3.81
7
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
L
0.115
2.93
4
9
N
16
16
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
Rev. 0 12/93
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
e
6. E and
pendicular to datum
7. e and e are measured at the lead tips with the leads uncon-
are measured with the leads constrained to be per-
A
-C-
.
B
C
strained. e must be zero or greater.
C
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
8
HIP2500
Small Outline Plastic Packages (SOIC)
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
M
M
B
0.25(0.010)
H
INCHES MILLIMETERS
E
SYMBOL
MIN
MAX
MIN
2.35
0.10
0.33
0.23
MAX
2.65
NOTES
-B-
A
A1
B
C
D
E
e
0.0926
0.0040
0.013
0.1043
0.0118
0.0200
0.0125
-
0.30
-
1
2
3
L
0.51
9
SEATING PLANE
A
0.0091
0.3977
0.2914
0.32
-
-A-
0.4133 10.10
10.50
7.60
3
D
h x 45o
0.2992
7.40
4
-C-
0.050 BSC
1.27 BSC
-
α
H
h
0.394
0.010
0.016
0.419
0.029
0.050
10.00
0.25
0.40
10.65
0.75
1.27
-
e
A1
C
5
B
0.10(0.004)
L
6
M
M
S
B
0.25(0.010)
C
A
N
α
16
16
7
o
o
o
o
0
8
0
8
-
NOTES:
Rev. 0 12/93
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
9
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