S10227-10_15 [HAMAMATSU]

CMOS linear image sensor;
S10227-10_15
型号: S10227-10_15
厂家: HAMAMATSU CORPORATION    HAMAMATSU CORPORATION
描述:

CMOS linear image sensor

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CMOS linear image sensor  
S10227-10  
Small, resin-sealed CMOS image sensor  
The S10227-10 is a resin-sealed CMOS linear image sensor to offer compact size and high cost-performance compared to  
our previous product (S9227 series).  
Features  
Applications  
Compact and high cost-performance  
Barcode readers  
Surface mount type package: 4.4 × 9.1 × 1.6t mm  
Displacement meters  
Refractometers  
Pixel pitch: 12.5 μm  
Pixel height: 250 μm  
Interferometers  
512 pixels  
Miniature spectrometers  
Single 5 V power supply operation  
Video data rate: 5 MHz max.  
Simultaneous charge integration  
Shutter function  
High sensitivity, low dark current, low noise  
Built-in timing generator allows operation with only  
Start and Clock pulse inputs.  
Spectral response range: 400 to 1000 nm  
Structure  
Parameter  
Number of pixels  
Pixel pitch  
Pixel height  
Photosensitive area length  
Package  
Specication  
512  
Unit  
-
μm  
μm  
mm  
-
12.5  
250  
6.4  
Glass epoxy  
Silicone resin  
Seal material  
-
Absolute maximum ratings  
Parameter  
Supply voltage  
Symbol  
Vdd  
Condition  
Ta=25 °C  
Value  
-0.3 to +6  
Unit  
V
Clock pulse voltage  
Start pulse voltage  
Operating temperature*1  
Storage temperature*1  
Reow soldering conditions  
V(CLK) Ta=25 °C  
-0.3 to +6  
-0.3 to +6  
-25 to +85  
V
V
°C  
°C  
-
V(ST)  
Topr  
Tstg  
Ta=25 °C  
-25 to +85  
2
*
Tsol  
Peak temperature 260°C, 3 times (See P.6)  
*1: No condensation  
*2: JEDEC level 2a  
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the  
product within the absolute maximum ratings.  
1
www.hamamatsu.com  
CMOS linear image sensor  
S10227-10  
Recommended terminal voltage  
Parameter  
Supply voltage  
Symbol  
Vdd  
Min.  
4.75  
Typ.  
5
Max.  
5.25  
Unit  
V
High level  
Low level  
High level  
Low level  
Vdd - 0.25  
Vdd  
0
Vdd  
0
Vdd + 0.25  
V
V
V
V
Clock pulse voltage  
Start pulse voltage  
V(CLK)  
V(ST)  
-
-
Vdd - 0.25  
-
Vdd + 0.25  
-
Electrical characteristics [Ta=25 °C, Vdd=5 V, V(CLK)=V(ST)=5 V]  
Parameter  
Clock pulse frequency  
Video data rate  
Current consumption  
Conversion efciency  
Symbol  
f(CLK)  
VR  
I
CE  
Min.  
50 k  
-
20  
-
Typ.  
-
f(CLK)  
26  
Max.  
5 M  
-
32  
-
Unit  
Hz  
Hz  
mA  
μV/e  
-
1.6  
Electrical and optical characteristics [Ta=25 °C, Vdd=5 V, V(CLK)=V(ST)=5 V, f(CLK)=5 MHz]  
Parameter  
Spectral response range  
Symbol  
λ
Min.  
Typ.  
400 to 1000  
Max.  
Unit  
nm  
Peak sensitivity wavelength  
λp  
Vd  
Vsat  
Nr  
Vo  
-
-
4
-
0.4  
-
700  
1
4.3  
0.45  
0.6  
-
-
10  
-
1
0.9  
±8.5  
nm  
mV  
V
mV rms  
V
3
Dark output voltage  
Saturation output voltage  
*
4
*
Readout noise  
Output offset voltage  
Photoresponse nonuniformity*5 *6  
PRNU  
%
*3: Integration time=10 ms  
*4: Voltage difference from Vo  
*5: Photoresponse nonuniformity (PRNU) is the output nonuniformity that occurs when the entire photosensitive area is uniformly  
illuminated by light which is 50% of the saturation exposure level. PRNU is measured using 510 pixels excluding the pixels at both  
ends, and is dened as follows:  
PRNU= X/X × 100 (%)  
X: average output of 510 pixels excluding the pixels at both ends, X: difference between X and maximum or minimum output  
*6: Measured with a tungsten lamp of 2856 K  
Spectral response (typical example)  
Block diagram  
CLK  
8
ST  
7
GND  
1
Vdd  
4
(Ta=25 °C)  
100  
Timing  
generator  
80  
60  
40  
Shift register  
Hold circuit  
6
5
EOS  
Video  
Charge amp array  
Photodiode  
array  
1
2
3
4
511 512  
KMPDB0167EC  
20  
0
400 500 600 700 800 900 1000 1100 1200  
Wavelength (nm)  
KMPDB0258ED  
2
CMOS linear image sensor  
S10227-10  
Timing chart  
chart (S9227-03)  
Trigger  
1/f(CLK)  
1 2 3 4 5 6 7 8 9 101112131415  
CLK  
Integration time  
2.5 clocks  
8.5 clocks  
tlp(ST)  
ST  
thp(ST)  
tpi(ST)  
100 ns  
512  
14 clocks  
Video  
EOS  
tf(CLK)  
tr(CLK)  
CLK  
ST  
CLK  
1/f(CLK)  
tlp(ST)  
Video  
tr(ST)  
tf(ST)  
tvd1  
tvd2  
thp(ST)  
tpi(ST)  
KMPDC0166E  
KMPDC0166EF  
Parameter  
Start pulse interval  
Start pulse high period  
Start pulse low period  
Start pulse rise and fall times  
Clock pulse duty  
Clock pulse rise and fall times  
Video delay time 1  
Video delay time 2  
Symbol  
Min.  
530/f(CLK)  
8/f(CLK)  
15/f(CLK)  
Typ.  
-
-
Max.  
Unit  
s
s
tpi(ST)  
thp(ST)  
tlp(ST)  
1100 m  
1000 m  
100 m  
30  
55  
30  
-
s
tr(ST), tf(ST)  
-
tr(CLK), tf(CLK)  
tvd1  
0
45  
0
32  
40  
20  
50  
20  
40  
50  
ns  
%
ns  
ns  
ns  
48  
60  
tvd2  
Note: Dark output increases if the start pulse period or the start pulse high period is lengthened.  
The internal timing circuit starts operating at the rise of CLK pulse immediately after ST pulse sets to low.  
The integration time equals the high period of ST pulse plus 6 CLK cycles.  
The output from 1st channel appears 14 clocks plus 100 ns after the falling edge of ST pulse.  
The EOS pulse is output 39 ns after the falling edge of CLK pulse.  
The output voltage after reading the last pixel (512 ch) is indenite.  
Start pulse setting example (for setting the start pulse period to a minimum and the integration time to a maximum)  
Start pulse high period=515/f(CLK), Start pulse low period=15/f(CLK)  
3
CMOS linear image sensor  
S10227-10  
Dimensional outline (unit: mm)  
9.1  
1.35 0.2  
3.2  
Photosensitive area  
(6.4 × 0.25)  
[Top view]  
1 ch  
512 ch  
Photosensitive  
surface  
Silicone resin  
Top  
[Side view]  
Bottom  
Glass epoxy  
2.54 2.54 2.54  
[Bottom view]  
Tolerance unless otherwise  
noted: 0.1  
Values in parentheses indicate  
reference value.  
Electrode  
(8 ×) ϕ0.5  
Index mark  
KMPDA0316EB  
Pin connections  
Pin no.  
Symbol  
GND  
NC  
I/O  
-
-
-
I
O
O
I
Discription  
1
2
3
4
5
6
7
8
Ground  
No connection  
No connection  
Power supply voltage  
Video signal output  
End of scan  
NC  
Vdd  
Video  
EOS  
ST  
Start pulse  
Clock pulse  
CLK  
I
4
CMOS linear image sensor  
S10227-10  
Recommended land pattern (unit: mm)  
(8 ×) ɸ0.7  
2.54  
2.54  
2.54  
KMPDC0257EA  
Appearance inspection standards  
Parameter  
Foreign matter on photosensitive area  
Test criterion  
10 m max.  
Inspection method  
Automated camera  
Standard packing specications  
Reel (conforms to JEITA ET-7200)  
Dimensions  
330 mm  
Hub diameter  
100 mm  
Tape width  
16 mm  
Material  
PPE  
Electrostatic characteristic  
Conductive  
Embossed tape (unit: mm, material: polycarbonate resin, conductive)  
4.0 0.1  
ɸ1.5+-00.1  
2.0 0.05  
0.32 0.05  
ϕ1.5+-00.25  
1.89 0.1  
8.0 0.1  
1 ch  
Reel feed direction  
4.75 0.1  
KMPDC0450EA  
Packing quantity  
2000 pcs/reel  
Packing type  
Reel and desiccant in moisture-proof packing (vaccum-sealed)  
5
CMOS linear image sensor  
S10227-10  
Recommended temperature prole for reow soldering (typical example)  
300 °C  
Peak temperature  
260 °C max.  
Peak temperature - 5 °C  
30 s max.  
Cooling  
Heating  
3 °C/s max.  
6 °C/s max.  
217 °C  
200 °C  
150 °C  
Preheating  
60 to 120 s  
Soldering  
60 to 150 s  
25 °C to peak temperature  
8 m max.  
Time  
KMPDB0405EA  
This product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 30 °C or less and a  
humidity of 60% or less, and perform soldering within 4 weeks.  
The effect that the product receives during reow soldering varies depending on the circuit board and reow oven that are used.  
Before actual reow soldering, check for any problems by tesitng out the reow soldering methods in advance.  
When three or more months have passed or if the packing bag has not been stored in an environment described above, perform  
baking. For the baking method, see the related information “Resin sealed type CMOS linear image sensor / Precautions.”  
Precautions  
(1) Electrostatic countermeasures  
This device has a built-in protection circuit as a safeguard against static electrical charges. However, to prevent destroying the device  
with electrostatic charges, take countermeasures such as grounding yourself, the workbench and tools.  
Protect this device from surge voltages which might be caused by peripheral equipment.  
·
·
(2) Package handling  
The photosensitive area of this device is sealed and protected by transparent resin. When compared to a glass faceplate, the surface  
of transparent resin may be less uniform and is more likely to be scratched. Be very careful when handling this device and also when  
designing the optical systems.  
·
Dust or grime on the light input window might cause nonuniform sensitivity. To remove dust or grime, blow it off with compressed air.  
·
(3) Surface protective tape  
Protective tape is afxed to the surface of this product to protect the photosensitive area. After assembling the product, remove the  
·
tape before use.  
(4) Operating and storage environments  
Handle the device within the temperature range specied in the absolute maximum ratings. Operating or storing the device at an ex-  
·
cessively high temperature and humidity may cause variations in performance characteristics and must be avoided.  
(5) UV exposure  
This product is not designed to prevent deterioration of characteristics caused by UV exposure, so do not expose it to UV light.  
·
6
CMOS linear image sensor  
S10227-10  
Related information  
www.hamamatsu.com/sp/ssd/doc_en.html  
Precautions  
Disclaimer  
Image sensor / Precautions  
Resin-sealed CMOS linear image sensors / Precautions  
Information described in this material is current as of March 2015.  
Product specifications are subject to change without prior notice due to improvements or other reasons. This document has been carefully prepared and the  
information contained is believed to be accurate. In rare cases, however, there may be inaccuracies such as text errors. Before using these products, always  
contact us for the delivery specification sheet to check the latest specifications.  
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that  
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product use.  
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.  
www.hamamatsu.com  
HAMAMATSU PHOTONICS K.K., Solid State Division  
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184  
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, N.J. 08807, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218  
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8  
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10  
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777  
North Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01  
Italy: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39) 02-93581733, Fax: (39) 02-93581741  
China: Hamamatsu Photonics (China) Co., Ltd.: B1201, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866  
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Cat. No. KMPD1152E03 Mar. 2015 DN  

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