C7460 [HAMAMATSU]

Multiband Plasma-Process Monitor; 多波段等离子工艺监控
C7460
型号: C7460
厂家: HAMAMATSU CORPORATION    HAMAMATSU CORPORATION
描述:

Multiband Plasma-Process Monitor
多波段等离子工艺监控

监控
文件: 总8页 (文件大小:525K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Multiband Plasma-Process Monitor  
Model C7460  
The Multiband Plasma-Process Monitor  
Simultaneous measurement  
(MPM) is a system specifically designed for  
from 200 to 950 nm  
monitoring the optical plasma emissions that  
Easy measurement using  
are created during the various manufacturing  
optical fiber input  
processes of semiconductors including  
High levels of accuracy and  
reliability  
etching, sputtering, cleaning, and CVD.  
The MPM can handle multi-channel recording  
in real-time.  
Software for measurement,  
analysis and factory integration  
Real-Time Plasma Monitoring  
BACKGROUND  
Up to 60 percent of the time that a piece of semi-  
conductor manufacturing equipment spends in oper-  
ation is generally for non productive jobs like plas-  
ma cleanup, chamber stabilization (seasoning) and  
system diagnosis. Typical approaches for reducing  
down-time and repetitive processes like these are to  
utilize Advanced Process Control (APC) and Sensor  
Based Process Control (SBPC) technologies with  
factory LAN services. The MPM allows you to gain  
full control over processes using information provi-  
ded by the MPM regarding plasma spectra, etching  
end-point detection status, plasma fault status, etc.  
The MPM opens the possibility of significantly in-  
CONFIGURATION OFAPC WITH MPM (EXAMPLE)  
creasing the efficiency of manufacturing equipment.  
FEATURES  
Ethernet  
HUB  
Ethernet  
Highly Accurate and Reliable  
The MPM employs a high-resolution compact spec-  
Optical fiber  
trograph and a highly sensitive detector which diag-  
nose plasma with elevated levels of precision.  
Along with these superior photometric characteris-  
tics, the MPM is compact, sturdy and offers the high  
standards of reliability that are required in a manu-  
facturing environment.  
MPM  
C7460  
1
2
3
4
5
POWER  
RS-232C  
1
2
C7460  
1
2
3
4
5
POWER  
RS-232C  
1
2
C7460  
1
2
3
4
5
POWER  
RS-232C  
1
2
C7460  
1
2
3
4
5
POWER  
RS-232C  
1
2
Easy to Operate  
The MPM is equipped with a sturdy fiber optic bun-  
dle, which can conveniently be combined with the  
plasma chamber. Due to this, and due to its easy-to  
use software, the MPM is easy to setup and operate.  
Script output (end point, plasma fault status, etc)  
Intelligent Sensor System  
The MPM is not just a spectrograph. It also contains in-  
ternal data processing capabilities which allow to ex-  
tract and compress the relevant infomation from the  
data.  
Easy Fab Integration  
The MPM is equipped with several interfaces in-  
cluding Ethernet and a TCP/IP protocol stack. To-  
gether with its very verstile software framework this  
allows the easy integration into existing fab IT infra-  
structure.  
STANDARD CONFIGURATION  
MPM Standard Configuration  
C7460  
1
2
3
4
5
POWER  
Ethernet (TCP/IP)  
RS-232C  
1
2
Main unit  
Computer  
Fiber input optics  
U9046 Plasma Process Data Aquisition Software  
Windows 98, NT, 2000  
2
Simultaneous Measurement  
from 200 nm to 950nm  
from 200 nm to 950nm  
BENEFITS (EXAMPLES)  
Easy Plasma Status Settings  
Real-time monitoring of the plasma process supports easy to  
make settings for the volume of introduced gas and plasma power.  
Product yield is increased through improved processing stability,  
and the early discovery of abnormalities.  
Advanced Endpoint Detection  
Powerful scripts can be defined as recipes for each endpoint  
detection. It is possible to use the information in the whole  
spectrum by means of the unique spectral patterns method.  
This allows for advanced endpoint control with unprecedented  
specificity and precision.  
Higher Efficiency through Automatic Cleaning Control  
APPLICATIONS OVERVIEW  
Particularly with CVD, in which the chamber must be cleaned  
each time a wafer is processed, cleaning time has a major effect  
on actual operating efficiency. The automatic control features  
greatly improved throughput, increased productivity, and reduced  
costs.  
Due to the high versatility of the hardware and the soft-  
ware framework, the MPM is suitable for various different  
applications, without any compromise in performance or  
convenience. These applications can be grouped into the  
following categories:  
Monitoring of Impurities and Abnormal Discharges  
Monitoring of the emission band, which does not occur in normal  
processes, provides warning of impurities and abnormal dis-  
charges before they occur, and thus improves yield.  
Engineering Tasks  
Such as process optimization, comparison and matching;  
trouble-shooting; etc.  
Endpoint Control  
Advanced, highly specific and sensitive end point control.  
Fault Detection  
Highly selective automatic fault detection.  
APC Sensor  
Automatic extraction of highly specific APC key numbers.  
(Under development)  
3-d display of plasma emission of CVD Cleaning (C4F, O2, Ar) of SiN  
SYSTEM STRUCTURE  
Network  
Plasma equipment  
EPD signal  
Driver Software  
control  
process data  
Plasma  
Emission  
control  
U9046  
Plasma Process  
Data Acquisition Software  
MPM(C7460)  
(Hardware)  
spectrum  
data  
formula for  
end-point detection  
Standard  
Optional  
Database  
spectrum data  
with process data  
U8851  
End-point Synthesis Tool  
3
Easy Measurement using Optical Fiber  
FUNCTIONS OF HARDWARE  
Measurement Parameter Setting  
Measurement interval  
Exposure time: 20 to 32767 ms  
Data accumulation: 1 to 32767 spectra  
Sensor sensitivity: 3 settings (1x, 2x, 5x)  
Wavelength smoothing: on/off  
Width for wavelength smoothing: any integer value within 1 to 50 nm  
Time smoothing (rolling average): on/off  
Filter for time smoothing: any value within 0 to 100 %  
Trigger : measurement start trigger  
Measurement Script  
Scripts contain measurement conditions as well as formula and  
judgments applied to the data. Results of script processing can be  
output via the software and via the analog BNC terminal in real-  
time. Each etch process will be treated by a tailored script.  
The maximum number of scripts the MPM can store internally is  
100, and one of them is selected as the active one. Each script can  
contain the definition of up to 32 formulas. All script processing is  
perfomed inside the MPM and in real-time.  
SPECIFICATIONS  
Bundle diameter inner: 1 mm; outer: 7 mm  
Fiber input optics  
Fiber aperture (N.A.) 0.2  
Bundle length 3 m  
200 to 950 nm (Measuring range)  
235 to 950 nm (Sensitivity-corrected range)  
< 2 nm  
16 bit  
Script Formula  
Script fomula can be defined to perform math operations between  
spectral intensities. Besides the four basic algebraic functions, it is  
also possible to compute smoothing, differentials as well as the  
special spectral patterns applied for endpoint and fault detection  
(see section on U8851 in this brochure).  
Wavelength range  
Wavelength resolution  
A/D resolution  
2 outputs  
BNC; 0 to 10 V  
Analog signal output result  
of formula calculation  
Judgments  
Judgments are used to detect endpoint or fault conditions. They  
are defined by thresholds applied to formula, and they can be  
chained and combined by logical operators.  
Script output result of  
judgment calculation  
Busy output  
5 outputs (3 outputs for External Trigger)  
BNC; TTL; High impedance  
BNC; TTL; High impedance  
Start input  
BNC; TTL; High impedance; pulse width: min. 40 ms  
IEEE 802.3 (10BaseT); 10 Mbit/s  
RJ45 modular connector  
Ethernet  
Interfaces  
RS-232  
Serial  
Interface protocol  
Line voltage  
TCP/IP (for Ethernet only)  
AC 100 / 117 / 220 / 240 V ± 10%; 50 / 60 Hz  
90 VA  
Power consumption  
DIMENSIONAL OUTLINE (Unit: mm)  
Fiber Input Optics (weight: approx.100g)  
Main Unit (weight: approx.7kg)  
3000  
C7460  
40  
50  
1
2
3
4
5
POWER  
RS-232C  
1
2
0.95  
3±0.5  
325±1  
383±1  
Input side  
To main unit  
200±1  
262±1  
25±1  
4
S
                                                
                                                 
                                                   
                                                     
                                                       
                                                         
                                                           
S
                                                                
                                                                  
                                                                   
                                                                    
                                                                       
                                                                          
                                                                           
        
          
            
              
                
Plasma Process Data Acquisition Software  
Standard Software  
U9046  
SOFTWARE ARCHITECTURE  
Drivers  
Watchdog  
Communication Layer  
Control Station  
Logging  
Database  
MPM C7460  
U9046 consists of several software components to perform the  
measurement in real time with great flexibility.  
OUTLINE  
Control Station  
Control Station allows to control C7460s and observe the  
spectrum data. The measurement can be triggered by the trigger  
signal from the plasma chamber and also by the optical trigger.  
The measurement can be repeated automatically during the  
several wafers' process.  
The U9046 is a software which allows to control up to 4 units  
of C7460 multiband plasma process monitor simultaneously  
and observe the spectrum of plasma emission during plasma  
processes. The observed spectrum data are stored in the  
database automatically and can be analyzed. The highly  
sensitive end-point detection software U8851 is an option. And  
also the fault detection software for Advanced Process Control  
will be available.  
Database  
The spectrum data observed by the Control Station are stored into  
the SQL compatible Database.  
Watchdog  
The Watchdog software component always monitors the condition  
of the software, and an error will be reported by an e-mail.  
FEATURES  
Logging  
The Logging component records the history of the software jobs in  
a file.  
Up to 4 units of C7460 can be controlled simultaneously,  
and all of the spectrum data during plasma process can be  
observed.  
Drivers for the Plasma Chambers  
The Drivers software can be provided to make communication to  
the plasma chambers or factory network. The Drivers can obtain  
the information about the process like Process ID and Lot No. and  
so on. Such information can be stored with the observed spectrum  
data into the Database. Such a driver is needed typically for  
endpoint and automatic fault detection installations.  
Database oriented data storage is available and a fast SQL  
based data access is allowed.  
The various ways to trigger the measurement are prepared.  
Easy Graphical User Interfaces  
The drivers to communicate to the plasma chambers or  
factory network can be optionally provided.  
The graphical user interfaces (GUIs) used by the process  
engineer and by the operators are different and dedicated to their  
respective tasks. Specifically, the operators' GUI is very easy to  
use, minimizing the risk of human errors.  
5
End-point Synthesis Tool U8851  
End-point SyntheOsipstioTnoaol lSoUf8tw8a5re1  
Optional Software  
FEATURES  
End-point detection in small aperture process  
Simultaneous analysis of several wafers  
Stability evaluation of a process  
OPERATIONAL OUTLINE  
Fig. 2 Analysis pattern  
Measurement data D (λ,t)  
D (l, t) = Average spectrum + S1 (l) × T1 (t) + S2 (l)× T2 (t) + S3 (l) × T3 (t)  
OUTLINE  
The U8851 is an optional software application that is utilized  
with the Multiband Plasma-Process Monitor C7460 for end-  
point detection in plasma etching.  
With the U8851, highly sensitive end-point detection of the  
conventionally difficult small aperture process has been  
made possible.  
T1 (t)  
S
1
(
λ
)
In addition, since the process data of several wafers can be  
analyzed simultaneously, the reliability of the operation  
formula that performs an end-point detection is improved,  
the verification of an end-point detection is performed easily,  
and the stability evaluation of a process can be performed as  
well.  
COMPARISON  
S2 (λ)  
T2 (t)  
Conventional method  
U8851  
T3 (t)  
S3 (λ)  
End point  
Fig. 1 Comparison of U8851 with conventional method  
An example of an end-point detection of oxidization film  
etching (1% or less of aperture ratio) is shown in Fig. 1.  
Although it was difficult to detect the end-point of a process  
from the time changes in spectrum intensity by using the  
conventional method, detection with sufficient accuracy is  
possible with the U8851.  
6
End-point Synthesis Tool U8851  
End-point SyntheOsipstioTnoaol lSoUf8tw8a5re1  
Optional Software  
Fig. 3 Example of an analysis display  
1The data recorded by the Multiband Plasma-Process Monitor  
C7460 of the changes in the passage of time of the spectrum is  
loaded onto the End-point Synthesis Tool U8851.  
2With the analysis function of the U8851, the spectrum data,  
which constantly changes, analyzes what kinds of spectrum  
patterns are shown by addition, and how each spectrum pattern  
is carrying out time changes.  
In Fig. 1 the measured data D (l, t) shows that three spectrum  
patterns (S1 [l] to S3 [l]) are mainly shown with the superposition  
of data which carried out time changes like T1 (t) to T3 (t),  
respectively focusing on the average spectrum.  
(a)  
(b)  
3The U8851 can perform end-point detection of a process from  
spectrum pattern changes obtained in the analysis of 2 with  
changes in the passage of time.  
(c)  
It specifies which spectrum pattern can be utilized for end-point  
detection with changes in the passage of time and smoothes and  
differentiates waveforms according to changes in the passage of  
time to detect an end-point.  
(a) : An operation formula is set up.  
(b) : An operation result is displayed.  
(c) : Graph of wafer number pair terminal point time is displayed.  
Moreover, analysis of 2 and 3 can be simultaneously  
performed on two or more wafers, and the detected end-point  
time is displayed on a graph.  
While verifying an end-point detection with these functions, the  
stability of a process can also be evaluated. (Fig.3)  
4The detection operation formula of the acquired end points as  
mentioned above, can be saved in a file and downloaded into the  
C7460 as well.  
In the C7460, end-point detection like in 3 is performed in real  
time.  
Optical Attenuator C8066  
Optical AtteOnputiaotnoalrHCar8d0w6ar6e  
Optional Hardware  
OUTLINE  
The C8066 is an optical attenuator for the Multiband Plasma-  
Process Monitor C7460. It is possible to change the light  
intensity in five steps (1, 1/10, 1/100, 1/1000, 1/10000) by the  
button on the front panel or via RS-232C interface.  
The optimum light intensity for monitoring the plasma  
emission can thus be obtained.  
7
Optical Attenuator C8066  
Optical AtteOnputiaotnoalrHCar8d0w6ar6e  
Optional Hardware  
SPECIFICATIONS  
FEATURES  
Light Intensity Change in Five Steps  
With attenuated filter, the light intensity can be changed in  
five steps (1 to 1/10000).  
Functions/  
1, 1/10, 1/100, 1/1000, 1/10000  
200nm to 1000nm  
Remote operation /Local operation  
Attenuated ratio  
Wavelength region  
Operation  
Performance  
RS-232C  
High-speed and Highly Precise Changing  
Filter changing time  
Baud rate  
0.2sec/STEP  
38400bps  
8bit  
The stepping motor is adopted and a high-speed and  
highly precise filter change of 0.2 s / step is possible.  
Data bit  
Parity  
None  
1bit  
D-sub 9pin  
Easy Operation  
Stop bit  
The filter can be easily changed via a button on the front  
panel, or via RS-232C interface.  
Connector  
Line voltage  
AC100 to 120V / 220 to 240V , 50/60Hz  
50VA max  
EMC  
Other  
Power comsumption  
Conformity specification  
Wide Wavelength Region  
EN55011:1991 Group1,ClassA  
EN50082-2:1995  
The wide wavelength region from ultraviolet to near-infrared  
(200 to 1000nm) is covered.  
Safety EN61010-1:1993+A.2:1995  
0 to + 40°C  
+10 to + 50°C  
Ambient operation temperature  
Ambient strage temperature  
SYSTEM CONFIGURATION  
C8066 Standard Configuration  
Computer  
Main unit  
MPM C7460  
Fiber input optics  
(Including C7460)  
OPTICAL ATTENUATOR  
C8066  
C7460  
Source light  
Fiber input optics  
ATTENUATOR CONTROL  
OD2  
OD0  
OD1  
OD3  
OD4  
LOCAL  
1
2
3
4
5
POWER  
POWER  
RS-232C  
RS-232C  
1
2
RS-232C  
DIMENSIONAL OUTLINE (Unit: mm)  
Main Unit (weight: approx.3.0kg)  
Fiber Input Optics (weight: approx.100g)  
3000  
OPTICAL ATTENUATOR  
C8066  
50  
40  
ATTENUATOR CONTROL  
OD2  
OD0  
OD1  
OD3  
OD4  
LOCAL  
POWER  
RS-232C  
Input  
to Main unit  
φ 0.95  
170 ±1  
232 ±1  
175 ±1  
233 ±1  
3
±0.5  
25 ±1  
ISO 9001  
Certificate: 09 105 79045  
Windows is a trademark of Microsoft Corporation in the U.S.A.  
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.  
Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult with our sales office..  
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.  
Specifications and external appearance are subject to change without notice.  
© 2002 Hamamatsu Photonics K.K.  
Homepage Address http://www.hamamatsu.com  
HAMAMATSU PHOTONICS K.K., Systems Division  
812 Joko-cho, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-435-1574, E-mail:export@sys.hpk.co.jp  
U.S.A. and Canada: Hamamatsu Photonic Systems: 360 Foothill Road, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1)908-231-1116, Fax: (1)908-231-0852, E-mail: usa@hamamatsu.com  
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-2658, E-mail: info@hamamatsu.de  
France: Hamamatsu Photonics France S.A.R.L.: 8, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10, E-mail: infos@hamamatsu.fr  
United Kingdom: Hamamatsu Photonics UK Limited: 2HowardCourt,10TewinRoad,WelwynGardenCity,Hertfordshire, AL71BW, U.K., Telephone: (44) 1707-294888, Fax: (44) 1707-325777, E-mail: info@hamamatsu.co.uk  
North Europe: Hamamatsu Photonics Norden AB: Smidesvägen 12, SE-171-41 Solna, Sweden, Telephone: (46)8-509-031-00, Fax: (46)8-509-031-01, E-mail: info@hamamatsu.se  
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Mois, 1/E 20020 Arese (Milano), Italy, Telephone: (39)02-935 81 733, Fax: (39)02-935 81 741, E-mail: info@hamamatsu.it  
Cat. No. SSIS1027E04  
AUG/2002 HPK  
Created in Japan (PDF)  

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