GS88037BGT-333IT [GSI]
Cache SRAM, 256KX36, 2ns, CMOS, PQFP100, LEAD FREE, TQFP-100;型号: | GS88037BGT-333IT |
厂家: | GSI TECHNOLOGY |
描述: | Cache SRAM, 256KX36, 2ns, CMOS, PQFP100, LEAD FREE, TQFP-100 静态存储器 内存集成电路 |
文件: | 总19页 (文件大小:1000K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
GS88037BT-333/300/250/200
333 MHz–200 MHz
100-Pin TQFP
Commercial Temp
Industrial Temp
256K x 36
9Mb Sync Burst SRAM
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Burst mode, subsequent burst addresses are generated
internally and are controlled by ADV. The burst address
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
Features
• Single Cycle Deselect (SCD) operation
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
SCD Pipelined Reads
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
The GS88037BT is a SCD (Single Cycle Deselect) pipelined
synchronous SRAM. DCD (Dal Cycle Deselect) versions are
also available. SCD SRApipeline deselect commands one
stage less than read commands. SCD RAMs begin turning off
their outputs immediately after the deselect command has been
captured in the input registers.
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP package
• Pb-Free 100-lead TQFP package available
Functional Description
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
sign(Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Applications
The GS88037BT is a 9,437,184-bit (8,388,608-bit for x32
version) high performance synchronous SRAM with a
2-bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main
store to networking chip set support.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Controls
Addresses, data I/Os, chip enables (E1, E2, E3), address burst
control inputs (ADSP, ADSC, ADV), and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Core and Interface Voltages
The GS88037BT operates on a 2.5 V or 3.3 V power supply.
All input are 3.3 V and 2.5 V compatible. Separate output
power (V
) pins are used to decouple output noise from the
DDQ
internal circuits and are 3.3 V and 2.5 V compatible.
Parameter Synopsis
-333
-300
-250
-200
Unit
Pipeline
3-1-1-1
t
2.0
3.0
2.2
3.3
2.3
4.0
2.7
5.0
ns
ns
KQ
tCycle
3.3 V
2.5 V
Curr (x36)
Curr (x36)
435
435
395
395
330
330
270
270
mA
mA
Rev: 1.04 2/2005
1/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
GS88037B 100-Pin TQFP Pinout
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
DQPB
DQB
DQPC
DQC
1
2
3
4
5
6
7
8
9
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DQB
DQC
V
V
V
DDQ
DDQ
SS
V
SS
DQB
DQB
DQB
DQB
DQC
DQC
DQC
DQC
256K x 36
Top View
V
V
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
6
27
28
29
30
V
SS
DDQ
SS
V
DDQ
DQB
DQB
DQC
DQC
V
SS
V
/DNU
DDQ
NC
V
DD
V
ZZ
NC
DD
V
SS
DQA
DQA
DQD
DQD
V
V
V
DDQ
DDQ
SS
V
SS
DQA
DQA
DQA
DQA
DQD
DQD
DQD
DQD
V
V
SS
DDQ
SS
V
V
DDQ
DQA
DQD
DQA
DQ
DQPA
DQPD
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
Rev: 1.04 2/2005
2/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
TQFP Pin Description
Symbol
A0, A1
A
Type
Description
I
I
Address field LSBs and Address Counter preset Inputs
Address Inputs
DQA
DQB
DQC
DQD
I/O
Data Input and Output pins
NC
BW
—
I
No Connect
Byte Write—Writes all enabled bytes; ative low
Byte Write Enable for DQA, DQB Dats; active low
Byte Write Enable for DQC, DQD Data I/Os; active low
Clock Input Sigal; active high
BA, BB
BC, BD
CK
I
I
I
GW
I
Global Write Enable—Writes all bytes; active low
Chip Enable; active low
E1, E3
E2
I
I
Chip Enable; active high
G
I
Output Enable; active low
ADV
I
Burst address counter advance enable; active low
Address Strobe (Processor, Cache Controller); active low
Sleep Mode control; active high
ADSP, ADSC
ZZ
I
I
LBO
I
Linear Burst Order mode; active low
Core power supply
V
I
DD
V
I
I/O and Core Ground
SS
V
Output driver power supply
DDQ
V
or V (must be tied high)
DDQ
DD
V
/DNU
—
or
DDQ
Do Not Use (must be left floating)
Rev: 1.04 2/2005
3/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
GS88037B Block Diagram
RegisteQr
A0–An
D
A0
A0
A1
D0
D1
Counter
Load
Q0
A1
Q1
A
LBO
ADV
CK
Memory
Array
ADSC
ADSP
Q
D
Register
GW
BW
BA
D
Q
Register
36
36
D
Q
BB
BC
BD
4
Register
D
Q
Register
D
Q
Register
D
Q
Register
E1
E2
E3
D
Q
Register
D
Q
1
G
1
Power Down
Control
DQx1–DQx9
ZZ
Note: Only x36 version shown for simplicity.
Rev: 1.04 2/2005
4/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Mode Pin Functions
Mode Name
Pin
Name
State
Function
L
Linear Burst
Interleaved Burst
Active
Burst Order Control
LBO
H
L or NC
H
Power Down Control
ZZ
Standby, I = I
DD SB
Note:
There is a pull-down device on the ZZ pin, so this input pin can be unconnected and the chip will operate in the defat states as specified in the
above tables.
Burst Counter Sequences
Linear Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
Interleaved Burst Sequence
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
2nd address
3rd address
4th address
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
1st address
2nd address
3rd address
4th address
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Note:
The burst counter wraps to initial state on the 5th clock.
Note:
The burst counter wraps to initial state on the 5th clock.
BPR 1999.05.18
Rev: 1.04 2/2005
5/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Byte Write Truth Table
Function
Read
GW
BW
H
L
BA
X
BB
X
BC
X
BD
X
Notes
1
H
H
H
H
H
H
H
L
Read
H
L
H
H
L
H
H
H
L
H
H
H
H
L
1
Write byte a
Write byte b
Write byte c
Write byte d
Write all bytes
Write all bytes
L
2, 3
L
H
H
H
L
2, 3
L
H
H
L
2, 3, 4
2, , 4
2, 3, 4
L
H
L
L
L
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x32 and x36 versions.
Rev: 1.04 2/2005
6/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Synchronous Truth Table
Operation
State
Address
Used
2
3
4
Diagram
E1
ADSP ADSC ADV
E
W
DQ
5
Key
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Deselect Cycle, Power Down
Read Cycle, Begin Burst
None
None
X
X
H
L
X
X
L
L
X
L
X
X
X
X
X
L
X
X
X
X
F
T
F
F
T
T
F
F
T
T
High-Z
F
F
T
T
T
X
X
X
X
X
X
X
X
High-Z
None
X
L
L
H
L
High-Z
External
External
External
Next
R
X
L
Q
Q
D
Q
Q
D
D
Q
Q
D
D
Read Cycle, Begin Burst
Write Cycle, Begin Burst
Read Cycle, Continue Burst
Read Cycle, Continue Burst
Write Cycle, Continue Burst
Write Cycle, Continue Burst
Read Cycle, Suspend Burst
Read Cycle, Suspend Burst
Write Cycle, Suspend Burst
Write Cycle, Suspend Burst
R
L
L
X
H
X
H
X
H
X
H
H
H
H
X
H
X
H
X
H
X
W
CR
CR
CW
CW
H
H
H
H
H
H
H
H
Next
L
Next
L
Next
L
Current
Current
Current
Current
H
H
H
H
Notes:
1. X = Don’t Care, H = High, L = Low
2. E = T (True) if E2 = 1 and E3 = 0; E = F (False) if E2 = 0 or E3 = 1
3. W = T (True) and F (False) is defined in the Byte Write Truth Table preceding.
4. G is an asynchronous input. G can be driven high at any time to disable active output drivers. G low can only enable active drivers (shown
as “Q” in the Truth Table above).
5. All input combinations shown above are tested and supported. Input combinations shown in gray boxes need not be used to accomplish
basic synchronous or synchronous burst operations and may be avoided for simplicity.
6. Tying ADSP high and ADC low allows simple non-burst synchronous operations. See BOLD items above.
7. Tying ADSP high and ADV low while using ADSC to load new addresses allows simple burst operations. See ITALIC items above.
Rev: 1.04 2/2005
7/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Simplified State Diagram
X
Deselect
W
R
W
R
X
R
X
First Write
First Read
CW
CR
CR
W
R
R
X
Burst Write
X
Burst Read
CR
CW
CR
Notes:
1. The diagram shows only supported (tested) synchronous state transitions. The diagram presumes G is tied low.
2. The upper portion of the diagram assumes active use of only the Enable (E1, E2, and E3) and Write (BA, BB, BC, BD, BW, and GW)
control inputs, and that ADSP is tied high and ADSC is tied low.
3. The upper and lower portions of the diagram together assume active use of only the Enable, Write, and ADSC control inputs, and
assumes ADSP is tied high and ADV is tied low.
Rev: 1.04 2/2005
8/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Simplified State Diagram with G
X
Deselect
W
R
W
R
X
W
R
X
First Write
First Read
CR
CW
CW
CR
W
R
R
W
X
Burst Write
X
Burst Read
CR
CW
CW
CR
Notes:
1. The diagram shows supported (tested) synchronous state transitions plus supported transitions that depend upon the use of G.
2. Use of “Dummy Reads” (Read Cycles with G High) may be used to make the transition from Read cycles to Write cycles without passing
through a Deselect cycle. Dummy Read cycles increment the address counter just like normal read cycles.
3. Transitions shown in gray tone assume G has been pulsed high long enough to turn the RAM’s drivers off and for incoming data to meet
Data Input Set Up Time.
Rev: 1.04 2/2005
9/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Absolute Maximum Ratings
(All voltages reference to V
)
SS
Symbol
Description
Value
Unit
V
V
Voltage on V Pins
–0.5 to 4.6
DD
DD
V
Voltage in V
Pins
DDQ
–0.5 to 4.6
V
DDQ
V
Voltage on Clock Input Pin
Voltage on I/O Pins
–0.5 to 6
V
CK
V
–0.5 to V
+0.5 (≤ 4.6 V max.)
DDQ
V
I/O
V
–0.5 to V +0.5 (≤ 4.6 V max
Voltage on Other Input Pins
Input Current on Any Pin
Output Current on Any I/O Pin
Package Power Dissipation
Storage Temperature
V
IN
DD
I
+/–20
+/–20
mA
mA
W
IN
I
OUT
P
1.5
D
o
T
–55 to 125
–55 to 125
C
STG
o
T
Temperature Under Bias
C
BIAS
Note:
Permanent damage to the device may occur if the Absolute Maximum Ratings are exceeded. Operation should be restricted to Recommended
Operating Conditions. Exposure to conditions exceeding the Absolute Maximum atings, for an extended period of time, may affect reliability of
this component.
Power Supply Voltage Ranges
Parameter
Symbol
Min.
3.0
Typ.
3.3
Max.
3.6
Unit
Notes
V
3.3 V Supply Voltage
2.5 V Supply Voltage
V
V
V
V
DD3
V
2.3
2.5
2.7
DD2
3.3 V V
I/O Supply Voltage
V
3.0
3.3
3.6
DDQ
DDQ
DDQ3
2.5 V V
I/O Supply Voltage
V
2.3
2.5
2.7
DDQ2
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/oversot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
Rev: 1.04 2/2005
10/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
V
Range Logic Levels
Parameter
DDQ3
Symbol
Min.
2.0
Typ.
—
Max.
Unit
Notes
V
Input High Voltage
V
V
+ 0.3
DD
V
V
V
V
1
DD
IH
V
Input Low Voltage
V
–0.3
2.0
—
0.8
+ 0.3
1
DD
IL
V
I/O Input High Voltage
I/O Input Low Voltage
V
V
—
1,3
1,3
DDQ
IHQ
DDQ
V
V
–0.3
—
0.8
DDQ
ILQ
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, witulse width not to exceed 20% tKC.
DDn
3.
V
(max) is voltage on V
pins plus 0.3 V.
IHQ
DDQ
V
Range Logic Levels
Parameter
DDQ2
Symbol
Min.
Typ.
—
Max.
Unit
Notes
V
Input High Voltage
V
0.6*V
V
+ 0.3
DD
V
V
V
V
1
DD
IH
DD
V
Input Low Voltage
V
0.3*V
DD
–0.3
—
1
DD
IL
V
I/O Input High Voltage
I/O Input Low Voltage
V
0.6*V
V
+ 0.3
DDQ
—
1,3
1,3
DDQ
IH
DD
V
V
0.3*V
DD
–0.3
—
DDQ
LQ
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case n the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
3.
V
(max) is voltage on V
pins plus 0.3 V.
IHQ
DDQ
Recommended Operating Temperatures
Paameter
Symbol
Min.
0
Typ.
25
Max.
70
Unit
°C
Notes
T
Ambient Temperature (Commercial Range Versions)
2
2
A
T
Ambient Temperature (Industrial Range Versions)
–40
25
85
°C
A
Notes:
1. The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifica-
tions quoted are evaluated for worst case in the temperature range marked on the device.
2. Input Under/overshoot voltage must be –2 V > Vi < V +2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
DDn
Rev: 1.04 2/2005
11/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Undershoot Measurement and Timing
Overshoot Measurement and Timing
V
IH
20% tKC
V
+ 2.0 V
50%
DD
V
SS
50%
V
DD
V
– 2.0 V
SS
20% tKC
V
IL
Capacitance
o
(T = 25 C, f = 1 MHZ, V = 2.5 V)
A
DD
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
pF
C
V
= 0 V
Input Capacitance
4
6
5
7
IN
IN
C
V
OUT
= 0 V
Input/Output Capacitance
pF
I/O
Note:
These parameters are sample tested.
AC Test Conditions
Parameter
Conditions
V
– 0.2 V
Input high level
Input low level
DD
0.2
1 V/ns
/2
Input slew rate
V
Input reference level
DD
V
/2
Output reference level
Output load
DDQ
Fig. 1
Notes:
1. Include scope and jig cacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Device is deselected as defined by the Truth Table.
Output Load 1
DQ
*
50Ω
30pF
V
DDQ/2
* Distributed Test Jig Capacitance
Rev: 1.04 2/2005
12/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
DC Electrical Characteristics
Parameter
Symbol
Test Conditions
Min
Max
Input Leakage Current
(except mode pins)
I
V = 0 to V
IN DD
–1 uA
1 uA
IL
V
≥ V ≥ V
IN
–1 uA
–1 uA
1 uA
100 uA
DD
IH
IH
I
ZZ Input Current
Input Current
IN1
0 V ≤ V ≤ V
IN
V
≥ V ≥ V
IN
–100 uA
–1 uA
1 uA
1 uA
DD
IL
IL
I
IN2
0 V ≤ V ≤ V
IN
I
Output Disable, V
= 0 to V
DD
Output Leakage Current
Output High Voltage
Output High Voltage
Output Low Voltage
–1 uA
1.7 V
2.4 V
—
1 uA
—
OL
OUT
DDQ
DDQ
V
I
I
= –8 mA, V
= –8 mA, V
= 2.375 V
= 3.135
OH2
OH
OH
V
—
OH3
V
I
= 8 mA
OL
0.4 V
OL
Operating Currents
-333
-300
-250
-200
to
–40
0
to
–40
0
to
–40
0
to
–40
Parameter
Test Conditions
Mode
Symbol
Unit
to
to
to
to
70°C 85°C 70°C 85°C 70°C 85°C 70°C 85°C
Device Selected;
All other inputs
≥V or ≤ V
Operating
Current
I
380
55
390
55
345
50
355
50
290
40
300
40
240
30
250
30
DD
mA
mA
(x36) Pipeline
(x36) Pipeline
I
I
IH
IL
DDQ
3.3 V
Output open
Device Selected;
All other inputs
≥V or ≤ V
Operating
Current
I
380
55
390
55
345
05
355
50
290
40
300
40
240
30
250
30
DD
IH
IL
DDQ
2.5 V
Output op
Standby
Current
ZZ ≥ V – 0.2 V
I
mA
mA
—
—
Pipeline
Pipeline
40
85
50
90
40
80
50
85
40
85
50
90
40
75
50
80
DD
SB
Device Deselected;
All other inputs
≥ V or ≤ V
Deselect
Current
I
DD
IH
IL
Notes:
1.
I
and I
apply to any combination of V , V , V
, and V
operation.
DDQ2
DD
DDQ
DD3 DD2 DDQ3
2. All parameters listed are worst case scenario.
Rev: 1.04 2/2005
13/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
AC Electrical Characteristics
-333
-300
-250
-200
Parameter
Symbol
Unit
Min
3.0
—
1.0
1.0
1.0
0
Max
—
2.0
—
—
—
—
2.0
2.0
—
—
Min
3.3
—
Max
—
2.2
—
—
—
—
2.2
2.2
—
—
Min
4.0
—
Max
—
2.3
—
—
—
—
2.3
2.3
—
—
Min
5.0
—
Max
—
2.7
—
—
—
—
2.5
2.5
—
—
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
tKC
tKQ
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tKQX
1.0
1.0
1.1
0.1
—
1.0
1.0
1.2
0
—
1.0
1.0
1.4
0.4
—
1
Clock to Output in Low-Z
tLZ
Pipeline
Setup time
tS
tH
Hold time
G to Output Valid
G to output in High-Z
Clock HIGH Time
Clock LOW Time
tOE
—
—
1.3
1.5
1
—
—
—
tOHZ
tKH
tKL
1.3
1.5
1.3
1.5
1.3
1.5
Clock to Output in
High-Z
1
1.0
2.0
1.0
2.2
1.5
2.3
1.5
3.0
ns
tHZ
1
G to output in Low-Z
ZZ setup time
0
5
—
—
—
—
0
5
—
—
—
—
0
5
—
—
—
—
0
5
—
—
—
—
ns
ns
ns
ns
tOLZ
2
tZZS
2
ZZ hold time
1
1
1
1
tZZH
ZZ recovery
tZZR
20
20
20
20
Notes:
1. These parameters are sampled and anot 100% tested.
2. ZZ is an asynchronous signal. However, in order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Rev: 1.04 2/2005
14/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Pipeline Mode Timing (+1)
Begin
Read A Cont
Cont
Deselect Write B Read C Read C+1 Read C+2 Read C+3 Cont
Deselect
tKC
tKH tKL
CK
ADSP
tS
tS
ADSC initiated read
tH
ADSC
ADV
tS
tH
tH
A
B
C
A0–An
GW
tS
tS
tH
tH
BW
tS
Ba–Bd
E1
tS
tS
tS
Deselected with E1
tH
E2 and E3 only sampled with ADSC
tH
tH
E2
E3
G
tS
tKQ
tLZ
tKQX
tHZ
Q(C+2) Q(C+3)
tOE
tOHZ
Q(A)
tH
D(B)
Q(C)
Q(C+1)
DQa–DQd
Rev: 1.04 2/2005
15/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Sleep Mode
During normal operation, ZZ must be pulled low, either by the user or by its internal pull down resistor. When ZZ is pulled high,
the SRAM will enter a Power Sleep mode after 2 cycles. At this time, internal state of the SRAM is preserved. When ZZ returns to
low, the SRAM operates normally after ZZ recovery time.
Sleep mode is a low current, power-down mode in which the device is deselected and current is reduced to I 2. The duration of
SB
Sleep mode is dictated by the length of time the ZZ is in a High state. After entering Sleep mode, all inputs except ZZ become
disabled and all outputs go to High-Z The ZZ pin is an asynchronous, active high input that causes the device to enter Sleep mode.
When the ZZ pin is driven high, I 2 is guaranteed after the time tZZI is met. Because ZZ is an asynchronous input, pending
SB
operations or operations in progress may not be properly completed if ZZ is asserted. Therefore, Sleep mode must not be initiated
until valid pending operations are completed. Similarly, when exiting Sleep mode during tZZR, only a Delect or Read commands
may be applied while the SRAM is recovering from Sleep mode.
Sleep Mode Timing Diagram
tKH
tKC
tKL
CK
Setup
Hold
ADSP
ADSC
tZZR
tZZS
tZZH
ZZ
Application Tips
Single and Dual Cycle Deselect
SCD devices (like this one) force the use of “dummy read cycles” (read cycles that are launched normally but that are ended with
the output drivers inactive) ia fully synchronous environment. Dummy read cycles waste performance but their use usually
assures there will be no bus ontention in transitions from reads to writes or between banks of RAMs. DCD SRAMs do not waste
bandwidth on dummy cycles and are logically simpler to manage in a multiple bank application (wait states need not be inserted at
bank address boundary crossings) but greater care must be exercised to avoid excessive bus contention.
Rev: 1.04 2/2005
16/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
TQFP Package Drawing (Package T)
θ
L
c
L1
Symbol
Description
Standoff
Min. Nom. Max
A1
A2
b
0.05
1.35
0.20
0.09
0.10
1.40
0.30
—
0.15
1.45
0.40
0.20
22.1
20.1
16.1
14.1
—
Body Thickness
Lead Width
c
Lead Thickness
D
Terminal Dimension 21.9
Package Body 19.9
Terminal Dimension 15.9
22.0
20.0
16.0
14.0
0.65
0.60
1.00
e
D1
E
b
E1
e
Package Body
Lead Pitch
13.9
—
L
Foot Length
Lead Length
Coplanarity
Lead Angle
0.45
—
0.75
—
L1
Y
A1
A2
E1
E
0.10
7°
θ
0°
—
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protusion.
Rev: 1.04 2/2005
17/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
Ordering Information for GSI Synchronous Burst RAMs
2
Speed
3
1
Org
Type
Package
Status
T
Part Number
A
(MHz/ns)
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
256K x 36
GS88037BT-333
GS88037BT-300
GS88037BT-250
GS88037BT-200
GS88037BT-333I
GS88037BT-300I
GS88037BT-250I
GS88037BT-200I
GS88037BGT-333
GS88037BGT-300
GS88037BGT-250
GS88037BGT-200
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipeline
Pipelie
Pipeline
TQFP
TQFP
333
300
250
200
333
300
250
200
333
300
250
200
333
300
250
200
C
C
C
C
I
TQFP
TQFP
TQFP
TQFP
I
TQFP
I
TQFP
I
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
Pb-free TQFP
C
C
C
C
I
256K x 36 GS88037BGT-333I
256K x 36 GS88037BGT-300I
256K x 36 GS88037BGT-250I
I
I
256K x 36 GS88037BGT-200I
I
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS88037BT-200IT.
2. T = C = Commercial Temperature Range. T = I = Industrial Temperature Range.
A
A
3. GSI offers other versions this pe of device in many different configurations and with a variety of different features, only some of which are
covered in this data sheSee the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings.
Rev: 1.04 2/2005
18/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
GS88037BT-333/300/250/200
9Mb Sync SRAM Datasheet Revision History
DS/DateRev. Code: Old;
New
Types of Changes
Format or Content
Page;Revisions;Reason
• Creation of new datasheet
88037B_r1
• Corrected ordering information (incorrect speed bins
corrected)
88037B_r1; 88037B_r1_01
Content
• Updated format
88037B_r1_01;
88037B_r1_02
Content/Format
• Deleted unneeded speed bins (275 & 225 MHz)
• Added Pb-free information for TQFP
88037B_r1_02;
88037B_r1_03
Content/Format
Content
• Removed erroneous numeral from address pin (Pin 48)
88037B_r1_03;
88037B_r1_04
Rev: 1.04 2/2005
19/19
© 2002, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
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