SSF3428 [GOOD-ARK]
30V N-Channel MOSFET;型号: | SSF3428 |
厂家: | GOOD-ARK ELECTRONICS |
描述: | 30V N-Channel MOSFET |
文件: | 总6页 (文件大小:658K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SSF3428
30V N-Channel MOSFET
DESCRIPTION
The SSF3428 uses advanced trench
technology to provide excellent RDS(ON)
and low gate charge .This device is
suitable for use as a load switch or in
PWM applications.
Schematic Diagram
GENERAL FEATURES
● VDS = 30V,ID =6A
R
DS(ON) < 51mΩ @ VGS=4.5V
RDS(ON) < 34mΩ @ VGS=10V
● High Power and current handing capability
● Lead free product
Marking and Pin Assignment
● Surface Mount Package
APPLICATIONS
●PWM applications
●Load switch
●Power management
TSOP-6 Top View
PACKAGE MARKING AND ORDERING INFORMATION
Device Marking
Device
Device Package
Reel Size
Tape Width
Quantity
SSF3428
SSF3428
-
-
-
TSOP-6
ABSOLUTE MAXIMUM RATINGS (TA=25℃unless otherwise noted)
Parameter
Symbol
VDS
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
30
V
V
±20
VGS
6
A
ID(25℃)
ID(70℃)
IDM
Drain Current-Continuous@ Current-Pulsed (Note 1)
4.8
A
30
2
A
Maximum Power Dissipation
W
℃
PD
Operating Junction and Storage Temperature Range
-55 To 150
TJ,TSTG
THERMAL CHARACTERISTICS
℃/W
Thermal Resistance,Junction-to-Ambient (Note 2)
RθJA
62.5
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Page 1 of 6
Rev.2.0
SSF3428
30V N-Channel MOSFET
ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min Typ
Max
Unit
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
BVDSS
IDSS
VGS=0V ID=250μA
VDS=30V,VGS=0V
30
V
1
μA
Gate-Body Leakage Current
ON CHARACTERISTICS (Note 3)
Gate Threshold Voltage
IGSS
VGS=±20V,VDS=0V
±100
nA
VGS(th)
RDS(ON)
gFS
VDS=VGS,ID=250μA
VGS=4.5V, ID=4.9A
VGS=10V, ID=6A
VDS=10V,ID=6A
1
3
V
40
28
12
51
34
mΩ
mΩ
S
Drain-Source On-State Resistance
Forward Transconductance
DYNAMIC CHARACTERISTICS (Note4)
Input Capacitance
Clss
Coss
Crss
250
50
PF
PF
PF
VDS=15V,VGS=0V,
F=1.0MHz
Output Capacitance
Reverse Transfer Capacitance
SWITCHING CHARACTERISTICS (Note 4)
Turn-on Delay Time
30
td(on)
tr
td(off)
tf
10
15
25
10
9
nS
nS
nS
nS
nC
nC
nC
nS
nC
Turn-on Rise Time
V
DS=15V,VGS=10V,RGEN=6Ω
ID=1A
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Qg
Qgs
Qgd
Trr
VDS=15V,ID=6A,VGS=10V
IF=1.7A, dI/dt=100A/µs
VGS=0V,IS=1.7A
Gate-Source Charge
1.8
1.5
20
12
Gate-Drain Charge
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
DRAIN-SOURCE DIODE CHARACTERISTICS
Diode Forward Voltage (Note 3)
Qrr
VSD
0.8
1.2
V
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on 1in2 FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production testing.
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Page 2 of 6
Rev.2.0
SSF3428
30V N-Channel MOSFET
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
ton
tr
toff
tf
Vdd
Rl
td(on)
VOUT
VIN
td(off)
90%
90%
Vin
INVERTED
D
Vout
10%
90%
10%
50%
Vgs
Rgen
G
50%
S
10%
PULSE WIDTH
Figure 1:Switching Test Circuit
Figure 2:Switching Waveforms
TJ-Junction Temperature(℃)
TJ-Junction Temperature(℃)
Figure 3 Power Dissipation
Figure 4 Drain Current
ID- Drain Current (A)
Vds Drain-Source Voltage (V)
Figure 5 Output CHARACTERISTICS
Figure 6 Drain-Source On-Resistance
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Page 3 of 6
Rev.2.0
SSF3428
30V N-Channel MOSFET
Vgs Gate-Source Voltage (V)
TJ-Junction Temperature(℃)
Figure 7 Transfer Characteristics
Figure 8 Drain-Source On-Resistance
Vgs Gate-Source Voltage (V)
Vds Drain-Source Voltage (V)
Figure 10 Capacitance vs Vds
Figure 9 Rdson vs Vgs
Qg Gate Charge (nC)
Vsd Source-Drain Voltage (V)
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Page 4 of 6
Rev.2.0
SSF3428
30V N-Channel MOSFET
Figure 11 Gate Charge
Figure 12 Source- Drain Diode Forward
Vds Drain-Source Voltage (V)
Figure 13 Safe Operation Area
Square Wave Pluse Duration(sec)
Figure 14 Normalized Maximum Transient Thermal Impedance
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Page 5 of 6
Rev.2.0
SSF3428
30V N-Channel MOSFET
TSOP-6 PACKAGE INFORMATION
Millimeters
SYMBOL
MIN
MAX
1.10
A
A1
b
0.90
0.10
0.30
0.08
2.70
2.60
1.40
0.50
0.20
3.10
3.00
1.80
c
D
E
E1
e
0.95 BSC
L
0.35
0.55
NOTES:
1. Dimensions are inclusive of plating
2. Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 6 mils.
3. Dimension L is measured in gauge plane.
4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
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Page 6 of 6
Rev.2.0
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