TBR03L080AF [FUTUREWAFER]
Trench MOS Barrier Schottky Rectifier;
| 型号： | TBR03L080AF |
| 厂家： | 
FutureWafer Tech Co.,Ltd |
| 描述： | Trench MOS Barrier Schottky Rectifier |
| 文件： | 总13页 (文件大小：1756K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
1. Synopsis
1-1. General Description
This TBR03L080 Series are Trench MOS Barrier Schottky Rectifier
(TBR) Provides Fast Switching Performance in a Compact
Thermally Efficient Package. Its Low Profile Makes it a Good
Option For Flat Panel Display and Other Applications With
Limited Vertical Clearance. The Device Offers Low Leakage
Over Temperature Making it a Good Match For Applications
Requiring Low Quiescent Current.
SMAJ
1-2. Feature List
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Trench MOS Barrier Schottky Technology
Low Forward Voltage Drop
80-Volts Reverse
SMAF
High Frequency Operation
1-3. Applications
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Switch Mode Power Supply
Power Factor Correction
Solar Inverter
Uninterruptible Power Supply
High Efficiency DC/DC Converters
Motor Drivers
SMBJ
1-4. Benefits
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Essentially No Switching Losses
Higher Efficiency
Reduction Of Heat Sink Requirements
Parallel Devices Without Thermal Runaway
Higher System Reliability Due To Lower Operating Temperatures
SMBF
1-5. Mechanical Characteristics
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Molded JEDEC Package:
- SMAJ
Cathode
Anode
- SMAF
- SMBJ
- SMBF
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Packing: Tape and Reel
Flammability rating UL 94V-0
Halogen Free
JEDEC MSL Classification: Level 1
Document Number: F22037S
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
2. Contents
1. Synopsis................................................................................................................................................................1
1-1. General Description ..................................................................................................................................1
1-2. Feature List ................................................................................................................................................1
1-3. Applications................................................................................................................................................1
1-4. Benefits.......................................................................................................................................................1
1-5. Mechanical Characteristics......................................................................................................................1
2. Contents ................................................................................................................................................................2
3. Electrical Property ..............................................................................................................................................3
3-1. Absolute Maximum Ratings.....................................................................................................................3
3-2. Electrical Characteristics..........................................................................................................................3
3-3. Thermal Characteristics ...........................................................................................................................3
3-4. Ratings and Characteristics Curve.........................................................................................................4
4. Soldering Parameters ........................................................................................................................................5
5. Package Information ..........................................................................................................................................6
5-1. Dimension-SMAJ.......................................................................................................................................6
5-2. PCB Pad Layout Recommendation-SMAJ............................................................................................6
5-3. Dimension-SMAF ......................................................................................................................................7
5-4. PCB Pad Layout Recommendation-SMAF ...........................................................................................7
5-5. Dimension-SMBJ.......................................................................................................................................8
5-6. PCB Pad Layout Recommendation-SMBJ............................................................................................8
5-7. Dimension-SMBF ......................................................................................................................................9
5-8. PCB Pad Layout Recommendation-SMBF ...........................................................................................9
6. Packing ................................................................................................................................................................10
6-1. Taping and Reel Specification-SMAJ & SMAF...................................................................................10
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF......................................................................10
6-3. Taping and Reel Specification-SMBJ & SMBF...................................................................................11
6-4. Embossed Carrier Tape Specification-SMBJ & SMBF......................................................................11
6-5. Surface Mount Reel Specification.........................................................................................................12
6-6. Tape Leader and Trailer Specification.................................................................................................12
7. Ordering Information........................................................................................................................................13
8. Version.................................................................................................................................................................13
8-1. History.......................................................................................................................................................13
8-2. Company Profile......................................................................................................................................13
Document Number: F22037S
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
3. Electrical Property
3-1. Absolute Maximum Ratings
Notes: (1) Measured on 8.3ms signal half sine wave or equivalent square wave, duty cycle=4 per minute maximum.
3-2. Electrical Characteristics
3-3. Thermal Characteristics
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
3-4. Ratings and Characteristics Curve
Fig 1. Maximum Forward Current Derating Curve
Fig 2. Typical Instantaneous Forward Characteristics
RthJM = 12°C/W
TJ=150°C
TJ=125°C
RthJA = 115°C/W
TJ=100°C
TJ=25°C
TM measured at cathode
terminal mount typical values
TM - Mount Temperature (°C)
Instantaneous Forward Voltage, VF (V)
Fig 4. Typical Junction Capacitance
Fig 3. Typical Reverse Current Characteristics
TJ = 25 °C
f = 1.0 MHz
TJ=150°C
Vsig = 50 mVp-p
TJ=125°C
TJ=100°C
TJ=25°C
Percent of Rated Peak Reverse Voltage, VR (%)
Fig 5. Forward Power Loss Characteristics
Reverse Voltage, VR (V)
Fig 6. Typical Transient Thermal Impedance
Junction To Ambient
D=0.8
D=0.5
D=0.3
D=0.2
D=1.0
D=0.1
Average Forward Current (A)
t - Pulse Duration (s)
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
4. Soldering Parameters
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
5. Package Information
5-1. Dimension-SMAJ
Unit:mm
5-2. PCB Pad Layout Recommendation-SMAJ
Unit:mm
Document Number: F22037S
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
5-3. Dimension-SMAF
Unit:mm
5-4. PCB Pad Layout Recommendation-SMAF
Unit:mm
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
5-5. Dimension-SMBJ
Unit:mm
5-6. PCB Pad Layout Recommendation-SMBJ
Unit:mm
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
5-7. Dimension-SMBF
Unit:mm
5-8. PCB Pad Layout Recommendation-SMBF
Unit:mm
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
6. Packing
6-1. Taping and Reel Specification-SMAJ & SMAF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-2. Embossed Carrier Tape Specification-SMAJ & SMAF
Unit:mm
Document Number: F22037S
www.futurewafer.com.tw
05-OCT-2021 V 2.1
10/13
TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
6-3. Taping and Reel Specification-SMBJ & SMBF
Taping Width
Tape Orientation
12mm
Direction Of Feed
6-4. Embossed Carrier Tape Specification-SMBJ & SMBF
Unit:mm
Document Number: F22037S
www.futurewafer.com.tw
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
6-5. Surface Mount Reel Specification
Unit:mm
6-6. Tape Leader and Trailer Specification
Document Number: F22037S
05-OCT-2021 V 2.1
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TBR03L080A/AF/B/BF
Trench MOS Barrier Schottky Rectifier
7. Ordering Information
8. Version
8-1. History
8-2. Company Profile
Futurewafer Technology Co.,Ltd 台灣未來芯科技股份有限公司
TEL: +886-3-3350161 / FAX: +886-3-3350172
cherry@futurewafer.com.tw
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan
Document Number: F22037S
05-OCT-2021 V 2.1
www.futurewafer.com.tw
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