SBR3L100 [FUTUREWAFER]

Surface Mount Schottky Barrier Rectifier;
SBR3L100
型号: SBR3L100
厂家: FutureWafer Tech Co.,Ltd    FutureWafer Tech Co.,Ltd
描述:

Surface Mount Schottky Barrier Rectifier

文件: 总16页 (文件大小:2083K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
1. Synopsis  
1-1. General Description  
These Devices Employ The Schottky Barrier Principle in a  
Metal−to−Silicon Power Rectifier. Features Epitaxial  
Construction With Oxide Passivation and Metal Overlay  
Contact. Ideally Suited For Low Voltage, High Frequency  
Switching Power Supplies; Free Wheeling Diodes and  
Polarity Protection Diodes.  
SOD123FL  
1-2. Feature List  
SOD123HE  
High Surge Current Capability  
Low Power Loss, High Efficiency  
Low Forward Voltage  
Ultra Low Leakage Current  
Soft, Fast Switching Capability  
High Operating Junction Temperature  
SMAJ  
SMAF  
1-3. Applications  
For Use In Low Voltage High Frequency  
Inverters, Freewheeling, DC/DC Converters,  
and Polarity Protection Applications.  
1-4. Benefits  
SMBJ  
Essentially No Switching Losses  
Higher Efficiency  
Reduction Of Heat Sink Requirements  
Parallel Devices Without Thermal Runaway  
Higher System Reliability Due To Lower Operating Temperatures  
1-5. Mechanical Characteristics  
SMBF  
Molded JEDEC Package:  
- SOD123FL / SOD123HE  
- SMAJ / SMAF  
Cathode  
Anode  
- SMBJ / SMBF  
Packing: Tape and Reel  
Flammability rating UL 94V-0  
Halogen Free  
JEDEC MSL Classification: Level 1  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
1/16  
 
 
 
 
 
 
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
2. Contents  
1. Synopsis.......................................................................................................................................................................................................1  
1-1. General Description........................................................................................................................................................................1  
1-2. Feature List......................................................................................................................................................................................1  
1-3. Applications.....................................................................................................................................................................................1  
1-4. Benefits ............................................................................................................................................................................................1  
1-5. Mechanical Characteristics ...........................................................................................................................................................1  
2. Contents .......................................................................................................................................................................................................2  
3. Electrical Property......................................................................................................................................................................................3  
3-1. Device Characteristics ...................................................................................................................................................................3  
3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)......................................................................................................4  
4. Soldering Parameters................................................................................................................................................................................5  
5. Package Information..................................................................................................................................................................................6  
5-1. Dimension-SOD123FL...................................................................................................................................................................6  
5-2. PCB Pad Layout Recommendation-SOD123FL ........................................................................................................................6  
5-3. Dimension-SOD123HE..................................................................................................................................................................7  
5-4. PCB Pad Layout Recommendation-SOD123HE .......................................................................................................................7  
5-5. Dimension-SMAJ............................................................................................................................................................................8  
5-6. PCB Pad Layout Recommendation-SMAJ .................................................................................................................................8  
5-7. Dimension-SMAF ...........................................................................................................................................................................9  
5-8. PCB Pad Layout Recommendation-SMAF.................................................................................................................................9  
5-9. Dimension-SMBJ..........................................................................................................................................................................10  
5-10. PCB Pad Layout Recommendation-SMBJ .............................................................................................................................10  
5-11. Dimension-SMBF .......................................................................................................................................................................11  
5-12. PCB Pad Layout Recommendation-SMBF.............................................................................................................................11  
6. Packing .......................................................................................................................................................................................................12  
6-1. Taping and Reel Specification-SOD123FL & SOD123HE......................................................................................................12  
6-2. Embossed Carrier Tape Specification-SOD123FL & SOD123HE.........................................................................................12  
6-3. Surface Mount Reel Specification-SOD123FL & SOD123HE................................................................................................13  
6-4. Tape Leader and Trailer Specification-SOD123FL & SOD123HE........................................................................................13  
6-5. Taping and Reel Specification-SMAJ & SMAF & SMBJ & SMBF .........................................................................................14  
6-6. Embossed Carrier Tape Specification-SMAJ & SMAF & SMBJ & SMBF ............................................................................14  
6-7. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF ...................................................................................15  
6-8. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF............................................................................15  
7. Ordering Information...............................................................................................................................................................................16  
8. Version........................................................................................................................................................................................................16  
8-1. History ............................................................................................................................................................................................16  
8-2. Company Profile ...........................................................................................................................................................................16  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
2/16  
 
 
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
3. Electrical Property  
3-1. Device Characteristics  
www.futurewafer.com.tw  
Document No.: F41810S  
13-DEC-2021 V 2.1  
FQE-001-04  
3/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
3-2. Ratings and Characteristics Curve (TA=25°C unless otherwise noted)  
Fig 1. Maximum Forward Current Derating Curve  
Fig 2. Typical Instantaneous Forward Characteristics  
T J = 125°C  
T J = 100°C  
T J = 25°C  
TM measured at cathode  
terminal mount typical values  
T M - Mount Temperature (°C)  
Instantaneous Forward Voltage, V F (V)  
Fig 4. Typical Junction Capacitance  
Fig 3. Typical Reverse Current Characteristics  
T J = 25 °C  
f = 1.0 MHz  
T J = 150°C  
V sig = 50 mVp-p  
T J = 125°C  
T J = 100°C  
T J = 25°C  
Reverse Voltage, V R (V)  
Reverse Voltage, V R (V)  
Fig 5. Maximum Non-repetitive Forward Surge Current  
Number of Cycles at 60Hz  
Document No.: F41810S  
www.futurewafer.com.tw  
FQE-001-04  
13-DEC-2021 V 2.1  
4/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
4. Soldering Parameters  
www.futurewafer.com.tw  
Document No.: F41810S  
13-DEC-2021 V 2.1  
FQE-001-04  
5/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5. Package Information  
5-1. Dimension-SOD123FL  
5-2. PCB Pad Layout Recommendation-SOD123FL  
Unit: mm(inch)  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
6/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5-3. Dimension-SOD123HE  
5-4. PCB Pad Layout Recommendation-SOD123HE  
Unit: mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
7/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5-5. Dimension-SMAJ  
Unit:mm  
5-6. PCB Pad Layout Recommendation-SMAJ  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
8/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5-7. Dimension-SMAF  
Unit:mm  
5-8. PCB Pad Layout Recommendation-SMAF  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
9/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5-9. Dimension-SMBJ  
Unit:mm  
5-10. PCB Pad Layout Recommendation-SMBJ  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
10/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
5-11. Dimension-SMBF  
Unit:mm  
5-12. PCB Pad Layout Recommendation-SMBF  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
11/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
6. Packing  
6-1. Taping and Reel Specification-SOD123FL & SOD123HE  
Taping Width  
Tape Orientation  
8mm  
Direction Of Feed  
6-2. Embossed Carrier Tape Specification-SOD123FL & SOD123HE  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
12/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
6-3. Surface Mount Reel Specification-SOD123FL & SOD123HE  
Unit:mm  
6-4. Tape Leader and Trailer Specification-SOD123FL & SOD123HE  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
13/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
6-5. Taping and Reel Specification-SMAJ & SMAF & SMBJ & SMBF  
Taping Width  
Tape Orientation  
12mm  
Direction Of Feed  
6-6. Embossed Carrier Tape Specification-SMAJ & SMAF & SMBJ & SMBF  
Unit:mm  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
14/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
6-7. Surface Mount Reel Specification-SMAJ & SMAF & SMBJ & SMBF  
Unit:mm  
6-8. Tape Leader and Trailer Specification-SMAJ & SMAF & SMBJ & SMBF  
www.futurewafer.com.tw  
FQE-001-04  
Document No.: F41810S  
13-DEC-2021 V 2.1  
15/16  
SBR3L100 Family  
Surface Mount Schottky Barrier Rectifier  
7. Ordering Information  
8. Version  
8-1. History  
8-2. Company Profile  
Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司  
TEL: +886-3-3350161 / FAX: +886-3-3350172  
cherry@futurewafer.com.tw  
No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan  
www.futurewafer.com.tw  
Document No.: F41810S  
13-DEC-2021 V 2.1  
FQE-001-04  
16/16  

相关型号:

SBR3L100A

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3L100AF

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3L100B

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3L100BF

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3L100DH

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3L100FL

Surface Mount Schottky Barrier Rectifier
FUTUREWAFER

SBR3M30P1

3.0A SBR Surface Mount Super Barrier Rectifier
DIODES

SBR3M30P1

42V, 2.5A, 2MHz Step-Down Switching Regulator with 2.7μA Quiescent Current
Linear

SBR3M30P1-7

3.0A SBR Surface Mount Super Barrier Rectifier
DIODES

SBR3U100LP

3A SBR㈢ SUPER BARRIER RECTIFER
DIODES

SBR3U100LP-7

3A SBR㈢ SUPER BARRIER RECTIFER
DIODES

SBR3U150LP-7

Rectifier Diode, 1 Phase, 1 Element, 3A, 150V V(RRM), Silicon, GREEN, PLASTIC, DFN3030-8, 8 PIN
DIODES