2SK3527 [FUJI]

N-CHANNEL SILICON POWER MOSFET; N沟道硅功率MOSFET
2SK3527
型号: 2SK3527
厂家: FUJI ELECTRIC    FUJI ELECTRIC
描述:

N-CHANNEL SILICON POWER MOSFET
N沟道硅功率MOSFET

文件: 总4页 (文件大小:112K)
中文:  中文翻译
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2SK3527-01  
FUJI POWER MOSFET  
N-CHANNEL SILICON POWER MOSFET  
Outline Drawings  
Super FAP-G Series  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DCconverters  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
Ratings  
600  
Unit  
V
Drain-source voltage  
Equivalent circuit schematic  
V
VDSX *5  
ID  
600  
±17  
±68  
±30  
17  
A
Continuous drain current  
Pulsed drain current  
A
ID(puls]  
VGS  
Drain(D)  
V
Gate-source voltage  
A
Repetitive or non-repetitive  
Maximum Avalanche Energy  
Maximum Drain-Source dV/dt  
Peak Diode Recovery dV/dt  
Max. power dissipation  
IAR  
*2  
*1  
mJ  
kV/µs  
kV/µs  
W
EAS  
412  
20  
dVDS/dt *4  
dV/dt  
Gate(G)  
*3  
5
Source(S)  
°C  
°C  
PD Ta=25  
2.50  
Tc=25  
220  
+150  
-55 to +150  
Operating and storage  
temperature range  
Tch  
Tstg  
<
°C  
°C  
<
<
<
*3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C  
*1 L=2.62mH, Vcc=60V *2 Tch 150°C  
=
=
=
=
<
*4 VDS 600V *5 VGS=-30V  
=
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Symbol  
V(BR)DSS  
VGS(th)  
Test Conditions  
Item  
µ
ID= 250 A  
VGS=0V  
VDS=VGS  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
600  
µ
ID= 250 A  
V
3.0  
5.0  
25  
Tch=25°C  
µA  
VDS=600V VGS=0V  
VDS=480V VGS=0V  
VGS=±30V  
VDS=0V  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
250  
100  
IGSS  
RDS(on)  
gfs  
10  
nA  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
ID=8.5A VGS=10V  
0.29  
0.37  
10  
20  
2280  
290  
16  
S
ID=8.5A VDS=25V  
VDS=25V  
Ciss  
3420  
435  
24  
pF  
Coss  
Crss  
td(on)  
tr  
VGS=0V  
Output capacitance  
f=1MHz  
Reverse transfer capacitance  
Turn-on time ton  
ns  
VCC=300V ID=8.5A  
VGS=10V  
26  
39  
37  
56  
78  
117  
19  
td(off)  
tf  
Turn-off time toff  
RGS=10  
13  
54  
81  
QG  
VCC=300V  
ID=17A  
nC  
Total Gate Charge  
15  
23  
QGS  
QGD  
IAV  
Gate-Source Charge  
Gate-Drain Charge  
20  
30  
VGS=10V  
17  
L=2.62mH Tch=25°C  
A
Avalanche capability  
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
0.93  
1.50  
VSD  
trr  
Qrr  
IF=17A VGS=0V Tch=25°C  
IF=17A VGS=0V  
-di/dt=100A/µs  
V
0.7  
µs  
µC  
10.0  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.568  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
50.0  
°C/W  
1
2SK3527-01  
FUJI POWER MOSFET  
Characteristics  
Allowable Power Dissipation  
PD=f(Tc)  
Typical Output Characteristics  
ID=f(VDS):80µs Pulse test,Tch=25°C  
45  
40  
35  
30  
25  
20  
15  
10  
5
260  
240  
220  
200  
180  
160  
140  
120  
100  
80  
20V  
10V  
8V  
7.0V  
6.5V  
6.0V  
60  
40  
VGS=5.5V  
20  
0
0
0
2
4
6
8
10 12 14 16 18 20  
VDS [V]  
0
25  
50  
75  
100  
125  
150  
Tc [°C]  
Typical Transfer Characteristic  
ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°C  
Typical Transconductance  
gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C  
100  
10  
1
100  
10  
1
0.1  
0.1  
0.1  
0
1
2
3
4
5
6
7
8
9
10  
1
10  
100  
VGS[V]  
ID [A]  
Typical Drain-Source on-state Resistance  
RDS(on)=f(ID):80µs Pulse test, Tch=25°C  
Drain-Source On-state Resistance  
RDS(on)=f(Tch):ID=8.5A,VGS=10V  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
VGS=  
5.5V  
6.0V  
6.5V  
7.0V  
8V  
10V  
20V  
max.  
typ.  
-50  
-25  
0
25  
50  
75  
100 125 150  
0
5
10  
15  
20  
25  
30  
35  
40  
45  
Tch [°C]  
ID [A]  
2
2SK3527-01  
FUJI POWER MOSFET  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=17A, Tch=25°C  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=250µA  
24  
22  
20  
18  
16  
14  
12  
10  
8
7.0  
6.5  
6.0  
5.5  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Vcc= 300V  
max.  
Vcc= 120V  
Vcc= 480V  
min.  
6
4
2
0
-50  
-25  
0
25  
50  
75  
100 125 150  
0
20  
40  
60  
Qg [nC]  
80  
100  
120  
Tch [°C]  
Typical Forward Characteristics of Reverse Diode  
Typical Capacitance  
100 IF=f(VSD):80µs Pulse test,Tch=25°C  
C=f(VDS):VGS=0V,f=1MHz  
101  
100  
Ciss  
10  
10-1  
10-2  
10-3  
Coss  
Crss  
1
0.1  
10-1  
100  
101  
102  
103  
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00  
VDS [V]  
VSD [V]  
Maximum Avalanche Energy vs. starting Tch  
Typical Switching Characteristics vs. ID  
E(AV)=f(starting Tch):Vcc=60V,I(AV)<=17A  
t=f(ID):Vcc=300V, VGS=10V, RG=10  
103  
102  
101  
100  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
td(off)  
td(on)  
tr  
tf  
0
10-1  
100  
101  
102  
0
25  
50  
75  
100  
125  
150  
starting Tch [°C]  
ID [A]  
3
2SK3527-01  
FUJI POWER MOSFET  
Transient Thermal Impedance  
Zth(ch-c)=f(t):D=t/T,D=0  
101  
100  
10-1  
10-2  
10-3  
10-6  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
t [sec]  
Maximum Avalanche Current Pulsewidth  
IAV=f(tAV):starting Tch=25°C. Vcc=60V  
102  
101  
100  
10-1  
10-2  
Single Pulse  
10-8  
10-7  
10-6  
10-5  
tAV [sec]  
10-4  
10-3  
10-2  
4

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