MB3789 [FUJITSU]
Switching Regulator Controller (Supporting External Synchronization); 开关稳压器控制器(支持外部同步)型号: | MB3789 |
厂家: | FUJITSU |
描述: | Switching Regulator Controller (Supporting External Synchronization) |
文件: | 总28页 (文件大小:205K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-27211-3E
ASSP For Power Supply Applications
BIPOLAR
Switching Regulator Controller
(Supporting External Synchronization)
MB3789
■ DESCRIPTION
The MB3789 is a PWM (pulse width modulation) switching regulator controller supporting an external sync signal.
The MB3789 incorporates two error amplifiers which can be used respectively for voltage control and current
control, allowing the IC to serve as a DC/DC converter with current regulating functions.
The MB3789 is the ideal IC for supplying power to the back-lighting fluorescent tube for a liquid crystal display
(LCD) device such as a camera-integrated VTR.
■ FEATURES
• Wide range of operating power supply voltages: 3 V to 18 V
• Low current consumption: 1.5 mA (Typ.)
• Wide input voltage range of error amplifier: –0.2 V to VCC – 1.8 V
• Built-in two error amplifier
• Oscillator capable of operating with an external sync signal
• Built-in timer latch short protection circuit
• Variable dead time provides control over total operating range
• Output supporting a power MOSFET
• 16-pin SSOP package mountable at high density
■ PACKAGE
16-pin Plastic SSOP
(FPT-16P-M05)
MB3789
■ PIN ASSIGNMENT
(TOP VIEW)
VCC1
VREF
C T
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
GND
OUT
VCC2
CB
SYNC
SCP
DTC
FB1*1
FB2 *2
−IN2*2
+IN2*2
−IN1*1
+IN1*1
(FPT-16P-M05)
*1: Pins on error amplifier 1
*2: Pins on error amplifier 2
2
MB3789
■ PIN DESCRIPTION
Pin no.
Pin symbol
I/O
Function
Error amplifier 1 inverting input pin
7
8
–IN1
+IN1
FB1
I
I
Error amplifier 1 noninverting input pin
Error amplifier 1 output pin
6
O
I
10
9
–IN2
+IN2
FB2
Error amplifier 2 inverting input pin
Error amplifier 2 noninverting input pin
Error amplifier 2 output pin
I
11
O
Output bootstrap pin.
Connect a capacitor between the CB and OUT pins to bootstrap the
output transistor.
13
CB
—
5
SCP
DTC
OUT
—
I
Capacitor connection pin for short-circuit protection circuit
Dead time control pin
12
15
O
Totem-pole output pin
Sawtooth waveform frequency setting capacitor/resistor connection
pin
3
4
CT
—
I
SYNC
External sync signal input pin
1
14
2
VCC1
VCC2
VREF
—
—
O
Reference power supply, control circuit power-supply pin
Output circuit power-supply pin
Reference voltage output pin
16
GND
—
Ground pin
3
MB3789
■ BLOCK DIAGRAM
CB
13
14
Error amp. 1
PWM comparator
+IN1
−IN1
FB1
8
7
6
VCC2
OUT
15
Error amp. 2
10 kΩ
+IN2
−IN2
9
10
FB2 11
12
DTC
−0.9 V
−0.3 V
8 µA
4 µA
SCP comparator 1
1.25 V
SCP comparator 3
1.25 V
2 µA
VREF
SCP comparator 2
1
2
VCC1
1.1 V
1.8 V
Under voltage
Lock-out
protection
circuit
Reference Power
Sawtooth
wave
oscillator
SR latch
voltage
supply
ON/OFF
circuit
VREF
16
5
4
3
GND
SCP
SYNC
CT
External sync signal
4
MB3789
■ FUNCTIONAL DESCRIPTION
1. Switching Regulator Functions
(1) Reference voltage generator
The reference voltage generator uses the voltage supplied from the power supply pin (pin 1) to generate a
temperature-compensated, referencevoltage(about2.50V)asthereferencesupplyvoltagefortheIC’sinternal
circuitry.
The reference voltage can be output, up to 50 µA, to an external device through the VREF pin (pin 2).
This regulated reference voltage can be used as the reference voltage for the switching regulator and also
used for setting the dead time.
(2) Sawtooth waveform oscillator
With a timing capacitor and a timing resistor connected to the CT pin (pin 3), the sawtooth waveform oscillator
generates a sawtooth wave which remains stable even with supply voltage variations or temperature changes.
The sawtooth wave is input to the PWM comparator. The amplitude of oscillating waveform is 0.3 V to 0.9 V.
In addition, the oscillator can be used for external synchronization, where it generates a sawtooth waveform
synchronous to the input signal from the SYNC pin (pin 4).
(3) Error amplifiers
The error amplifiers detect the output voltage from the switching regulator and outputs the PWM control signal.
Since they support a wide range of in-phase input voltages from –0.2 V to “VCC – 1.8 V”, they can be set easily
from an external power supply.
An arbitrary loop gain can be set by connecting a feedback resistor and capacitor from the error amplifier output
pin to the inverting input pin, enabling stable phase compensation to the system.
The MB3789 can make a current-regulated DC/DC converter using the two internal error amplifiers respectively
for voltage control and current control.
(4) PWM comparator
The PWM comparator is a voltage comparator with one inverting input and three noninverting inputs, serving
as a voltage-pulse width converter for controlling the output duty depending on the input voltage.
The PWM comparator turns on the output transistor during the interval in which the sawtooth wave voltage
level is lower than the voltage levels at all of the error amplifier output pins, the SCP pin (pin 5), and at the
DTC pin (pin 12).
(5) Output circuit
The output circuit is a power MOSFET driven, output circuit in a totem-pole configuration. It can drive the gate
voltage up to near the supply voltage with a bootstrap capacitor connected between the OUT pin (pin 15) and
CB pin (pin 13). (See “■ SETTING THE BOOTSTRAP CAPACITOR (CBS).”)
2. Protection Functions
(1) Timer-latch short-circuit protection circuit
SCP comparator 1 detects the output voltage levels of error amplifiers 1 and 2. When the output voltage level
of either (or both) of the two error amplifiers reaches 1.25 V, the timer circuit is actuated to start charging the
external protection-enable capacitor connected to the SCP pin (pin 5).
If the error amplifier output is not restored to the normal voltage level before the capacitor voltage reaches
1.8 V, the latch circuit is actuated to turn off the output transistor while making the dead time 100%.
To reset the actuated protection circuit, turn the power supply on back. (See “■ SETTING THE SOFT START/
SHORT-CIRCUIT DETECTION TIME.”)
5
MB3789
(2) Low input voltage malfunction preventive circuit
The transient state or a momentary decrease in supply voltage, which occurs when the power supply is turned
on, may cause errors in the control IC, resulting in breakdown or degradation of the system. The low input
voltagemalfunctionpreventivecircuitdetectstheinternalreferencevoltagelevelaccordingtothesupplyvoltage
level and, if the input voltage is low, turn off the output transistor and maintains the SCP pin (pin 5) at 0 V while
making the dead time 100%.
The circuit restores voltage supply when the supply voltage reaches its threshold voltage.
6
MB3789
■ ABSOLUTE MAXIMUM RATINGS
(Ta = +25°C)
Rating
Parameter
Symbol
Condition
Unit
Min.
—
Max.
20
Power supply voltage
Power dissipation
VCC
PD
—
V
mW
°C
—
440*
+85
Ta +25°C
Operating temperature
Storage temperature
Top
Tstg
—
—
–30
–55
+125
°C
* : When mounted on a 10 cm-square double-side epoxy board.
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
(Ta = +25°C)
Value
Typ.
5.0
Parameter
Symbol
Condition
Unit
Min.
3.0
—
Max.
18
VCC1
VCC2
—
V
V
Power supply voltage
6.0
18
Reference voltage output
current
IOR
—
–50
–30
—
µA
Error amp. input voltage
VI
—
–0.2
–70
—
VCC – 1.8
—
V
IO+
–40
mA
CB = 4700 pF, t 2 µs
Output current
IO–
RT
—
10
40
39
70
200
6800
200
+85
mA
kΩ
pF
CB = 4700 pF, t 2 µs
Timing resistance
—
—
—
—
Timing capacitance
Oscillation frequency
Operating temperature
CT
470
1
1000
20
fOSC
TOP
kHz
°C
–30
+25
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
7
MB3789
■ ELECTRICAL CHARACTERISTICS
(VCC1 = 5 V, VCC2 = 6 V, Ta = +25°C)
Value
Unit
Parameter
Symbol
Condition
IOR = 0 µA
Min.
Typ.
Max.
Output voltage
VREF
2.400
2.500
2.600
V
Output voltage
temperature
variation
∆VREF/VREF Ta = –30°C to +85°C*
—
0.2
2
%
Reference
voltage block
Input stability
Line
Load
IOS
VCC = 3.0 V to 18 V
—
—
1
10
10
mV
mV
µA
V
Load stability
IOR = 0 µA to –50 µA
2
Short output current
VREF = 0 V
–700
—
–450
2.15
1.90
250
1.4
–300
2.62
—
VTH
VTL
—
Under
Threshold voltage
voltage
lockout
protection
circuit
—
1.62
80
V
Hysteresis width
Reset voltage (VCC)
Charge current
VHYS
VR
—
—
—
mV
V
1.0
—
ICHG
VT0
VSCP 0.9 V
Duty cycle = 0%
Duty cycle = 100%
—
–2.8
0.2
–2.0
0.3
–1.2
0.4
1.0
1.90
µA
V
Soft start
block
Threshold voltage
Threshold voltage
VT100
VTH
0.8
0.9
V
1.70
1.80
V
Input standby
voltage
Short circuit
detection
block
VSTB
—
1.15
1.25
1.35
mV
Input latch voltage
Input source current
VI
II
—
—
50
100
mV
VSCP = 1.5 V
–8.4
–6.0
–3.6
µA
CT = 1000 pF,
RT = 39 kΩ
Oscillator frequency
fOSC
17
—
20
1
23
10
kHz
%
Frequency voltage
variation
∆f/fdv
VCC = 3 V to 18 V
Triangular
waveform
oscillator
block
Frequency
temperature
variation
∆f/fdT
Ta = –30°C to +85°C*
—
3
—
%
Synchronous pin
input current
ISYNC
VTHSY = 5 V
—
0.9
1.3
2.2
mA
V
Synchronous pin
threshold voltage
VTHSY
0.65
0.75
0.85
* : Standard design value
(Continued)
8
MB3789
(Continued)
(VCC1 = 5 V, VCC2 = 6 V, Ta = +25°C)
Value
Unit
Parameter
Symbol
Condition
VFB = 0.6 V
Min.
—
Typ.
—
Max.
10
Input offset voltage
Input offset current
Input bias current
VIO
IIO
IB
mV
nA
nA
VFB = 0.6 V
VFB = 0.6 V
—
—
100
—
–200
–30
Common mode
input voltage range
VCM
—
–0.2
—
VCC – 0.8
V
Common mode
rejection ratio
CMRR
AV
—
—
60
60
—
100
100
800
—
—
—
dB
dB
Error
amplifier
Voltage gain
Frequency
bandwidth
BW
AV = 0 dB*
kHz
VOM+
VOM–
IOM+
—
—
VREF – 0.3
2.4
0.05
60
—
0.3
—
V
V
Maximum output
voltage range
—
Output sink current
VFB = 0.6 V
30
µA
Output source
current
IOM–
VFB = 0.6 V
—
–2
–0.6
mA
VT0
VT100
Dtr
Duty cycle = 0%
Duty cycle = 100%
Vdt = VREF/4.2
—
0.2
0.8
45
0.3
0.9
55
0.4
1.0
65
V
V
Threshold voltage
Dead time
control block
ON duty cycle
%
Input bias current
IIbdt
–500
0.2
0.8
30
–100
0.3
0.9
60
—
nA
V
VT0
Duty cycle = 0%
Duty cycle = 100%
—
0.4
1.0
—
Threshold voltage
PWM
comparator
block
VT100
IIN+
V
Input sink current
µA
mA
Input source current
IIN–
—
—
–2
–0.6
CL = 2000 pF,
CB = 4700 pF
VOH
VOL
5.5
—
6.0
1.1
—
V
V
Output block Output voltage
Power supply
CL = 2000 pF,
CB = 4700 pF
1.4
ICC1
ICC2
—
—
—
—
1.15
350
1.65
500
mA
General
current when output
off
µA
* : Standard design value
9
MB3789
■ TYPICAL CHARACTERISTICS
Power supply current vs.
power supply voltage characteristics
2.4
Output power supply current vs.
power supply voltage characteristics
500
400
300
200
100
0
VCC1 = 5 V
VCC2 = 6 V
Ta = +25°C
2.0
Ta = +25°C
1.6
1.2
0.8
0.4
0
0
4
8
12
16
20
0
4
8
12
16
20
Power supply voltage VCC1 (V)
Power supply voltage VCC2 (V)
Reference voltage vs.
power supply voltage characteristics
Reference voltage vs.
ambient temperature characteristics
2.56
2.54
2.52
2.50
2.48
2.46
2.44
5.0
4.0
3.0
2.0
1.0
0
VCC1 = 5 V
VCC2 = 6 V
IOR = 0 µA
VCC2 = 6 V
IOR = 0 µA
Ta = +25°C
0
4
8
12
16
20
−40 −20
0
20
40
60
80
100
Power supply voltage VCC1 (V)
Ambient temperature Ta (°C)
Sawtooth waveform maximum amplitude voltage vs.
timing capacitance characteristics
Sawtooth wave frequency vs.
timing resistance characteristics
(With CT/RT oscillation)
(With CT/RT oscillation)
500 k
1.4
VCC1 = 5 V
VCC2 = 6 V
VCC1 = 5 V
VCC2 = 6 V
SYNC = GND
Ta = +25°C
1.2
RT = 39 kΩ
100 k
50 k
SYNC = GND
Ta = +25°C
1.0
0.8
0.6
0.4
0.2
0
10 k
5 k
CT = 470 pF
1 k
CT = 1500 pF
CT = 4700 pF
500
CT = 6800 pF
100
2 k
102
5 × 102 103 5 × 103 104
5 × 104
5 k 10 k
50 k 100 k
500 k 1 M
Timing capacitance CT (pF)
Timing resistance RT (Ω)
(Continued)
10
MB3789
Sawtooth waveform period vs.
timing capacitance characteristics
(With CT/RT oscillation)
Duty vs. sawtooth wave
frequency characteristics
(With CT/RT oscillation)
100
500
VCC1 = 5 V
VCC2 = 6 V
VDT = 0.6 V
CT = Variable
RT = 39 kΩ
SYNC = GND
Ta = −25°C
80
60
40
20
VCC1 = 5 V
VCC2 = 6 V
RT = 39 kΩ
SYNC = GND
Ta = +25°C
100
50
10
5
2
0
2 × 10 5 × 10 102 5 × 102 103
5 × 103 104
5 × 104
200 500 1 k
5 k 10 k
50 k 100 k
500 k
Timing capacitance CT (pF)
Sawtooth wave frequency f (Hz)
Sawtooth wave frequency vs.
ambient temperature characteristics
(With CT/RT oscillation)
Sawtooth wave frequency vs.
ambient temperature characteristics
(In external synchronization)
VCC1 = 5 V
VCC2 = 6 V
CT = 1500pF
RT = 39 kΩ
VCC1 = 5 V
VCC2 = 6 V
CT = 1500pF
RT = 43 kΩ
+10
+5
0
+10
+5
0
SYNC = GND
fSYNC = 15.0 kHz
−5
10
−5
−10
−40
−20
0
20
40
60
80
100
−40 −20
0
20
40
60
80
100
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Gain vs. frequency and phase vs.
frequency characteristics
Measurement circuit for gain-frequency
characteristics and phase-frequency characteristics
2.5 V 2.5 V
VCC1 = 5 V
VCC2 = 6 V
Ta = +25°C
40
20
180
90
240 kΩ
Av
4.7 kΩ
4.7 kΩ
0
0
OUT
10 µF
φ
Error amp.
IN
−20
−40
−90
−180
4.7 kΩ
4.7 kΩ
1 k
10 k
100 k
1 M
10 M
Frequency f (Hz)
(Continued)
11
MB3789
(Continued)
Duty vs. DTC pin voltage characteristics
Output pin (OUT) voltage and current waveforms
VCC1 = 5 V,
VCC2 = 6 V
100
80
60
40
20
0
VCC1 = 5 V
VCC2 = 6 V
CT = 1500 pF
RT = 39 kΩ
SYNC = GND
6
4
2
100
0
50
0
−50
−100
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1
DTC pin voltage Vdt (V)
0
4
8
12
16
20
Time t (µs)
Power comsumption vs.
ambient temperature characteristics
500
440
400
300
200
100
0
−30 −20
0
20
40
60
80
100
Ambient temperature Ta (°C)
12
MB3789
■ SETTING THE OUTPUT VOLTAGE
Set the output voltage by connecting the input pins (+IN, –IN) and output pin (FB) of error amplifiers 1 and 2 as
shown in Figures 1 and 2.
VREF
+
VOUT
VREF
+
VOUT
=
(R1 + R2)
R
R
R1
R2
2 × R2
RNF
Figure 1 Setting the output voltage (positive output voltage (VOUT))
VREF
VREF
R1
R2
R
R
−
VOUT = −
(R1 + R2) + VREF
2 × R1
RNF
−
VOUT
Figure 2 Setting the output voltage (negative output voltage (VOUT))
13
MB3789
■ CONNECTION FOR OUTPUT CONTROL WITH ONE ERROR AMPLIFIER
The MB3789 can make up a system using only one of the two error amplifiers. In this case, connect the +IN and
–IN pins of the unused error amplifier to the VREF and GND pins, respectively, and leave the FB pin open.
When VCC – 1.8 V < VREF, divide the VREF voltage using a resistor and apply the voltage to the +IN pin.
VREF
2
+IN1
8
−IN1
7
FB1
6
“Open”
Figure 1 Connection without using error amplifier 1
VREF
2
+IN2
9
−IN2
10
FB2
11
“Open”
Figure 2 Connection without using error amplifier 2
14
MB3789
■ CONNECTING THE SAWTOOTH WAVEFORM OSCILLATOR
1. Connection for internal oscillation
For internal oscillation, connect the frequency setting capacitor (CT) and resistor (RT) to the CT pin (pin 3) and
leave the SYNC pin (pin 4) open or connect it to GND.
The oscillation frequency can be set with the CT and RT constants.
CT
SYNC
4
3
CT
RT
Leave “open” or connect to GND
Figure 5 Connection for internal oscillation
2. Connection for external synchronous oscillation
For external synchronous oscillation, connect the frequency setting capacitor (CT) and resistor (RT) to the CT pin
(pin 3) and connect the external sync signal to the SYNC pin (pin 4).
In this case, select the CT and RT conditions so that the oscillation frequency is 5% to 10% lower than the
frequency of the external sync signal excluding the setting error of the oscillation frequency.
CT
SYNC
4
3
External sync signal
CT
RT
Figure 6 Connection for external synchronous oscillation
15
MB3789
■ SETTING THE DEAD TIME
When the device is set for step-up inverting output based on the flyback method, the output transistor is fixed
to a full-ON state (ON duty = 100%) when the power supply is turned on. To prevent this problem, you may
determine the voltage at the DTC pin (pin 12) from the VREF voltage so you can set the output transistor’s dead
time (maximum ON-duty period) as shown in Figure 7 below.
1. Setting the dead time
When setting the dead time, use resistors as shown in Figure 7 to connect the VREF and DTC pins to GND. When
the voltage at the DTC pin (pin 12) is lower than the sawtooth wave output voltage from the oscillator, the output
transistor is turned off.
To set the dead time, see “Duty vs. DTC pin voltage” (in “■ STANDARD CHARACTERISTIC CURVES”).
R2
R1 + R2
Vdt =
× VREF
2. Connection without setting the dead time
If you do not set the dead time, connect the VREF and DTC pins as shown in Figure 8.
VREF
DTC
2
R1
R2
12
Vdt
Figure 7 Connection for setting the dead time
VREF
DTC
2
12
Figure 8 Connection without setting the dead time
16
MB3789
■ SETTING THE SOFT START/SHORT-CIRCUIT DETECTION TIME
Connecting capacitor CPE to the SCP pin (pin 5) as shown in Figure 9 enables a soft start and short-circuit
protection.
8 µA
4 µA
SCP comparator 1
1.25 V
Output OFF
SCP comparator 3
1.25 V
SCP comparator 2
2 µA
VREF
1.1 V
1.8 V
Low input
voltage
protection
circuit
SR latch
5
SCP
CPE
Figure 9 Soft start/short-circuit detection circuit
2
1
0
1.8 V
1.25 V
Output short-circuit
tPE
Output short-circuit
100%
50%
ts
0%
Soft start
Time t (s)
Figure 10 SCP pin operating waveform
17
MB3789
1. Soft Start
To prevent surge currents when the IC is turned on, you can set a soft start by connecting capacitor CPE to the
SCP pin (pin 5).
~
• Softstart time(ts): Time required up to duty cycle 50% with output on
~
tS (s) 0.15 × CPE (µF)
2. Protection from short circuit
SCP comparator 1 always compares the output voltage levels at error amplifiers 1 and 2 with the 1.25 V
reference voltage.
When the load conditions for the switching regulator are stable, the outputs from error amplifiers 1 and 2 do
not vary and thus short-circuit protection control remains balanced. In this case, the SCP pin (pin 5) is held at
the soft start end voltage (about 1.25 V).
If the load conditions change rapidly and the output voltage of error amplifier 1 or 2 reaches 1.25 V, for example,
because of a short-circuit of a load, capacitor CPE is charged further. When capacitor CPE is charged up to about
1.8 V, the SR latch is set and the output drive transistor is turned off. At this time, the dead time is set to 100%,
~
capacitor CPE is discharged, and the SCP pin becomes 50 mV.
• Short-circuit detection time (tPE)
~
tPE (s) 0.09 × CPE (µF)
3. Connection without using short-circuit protection
Add a clamp circuit as shown in Figure 11 so that the clamp voltage (VCRP) falls within the following range when
a short-circuit is detected: 1.0 V < VCRP < 1.7 V
Clamp circuit
5
SCP
VCRP
CPE
Figure 11 Connection without using short-circuit protection
18
MB3789
■ SETTING THE BOOTSTRAP CAPACITOR
When a bootstrap capacitor is connected, it raises the output-ON voltage (at the OUT pin (pin 15) when the
~
external MOS FET is turned “ON”) to the VCC2 level. It can therefore drive the MOS FET at a higher threshold
voltage (Vth).
1. Connecting the bootstrap capacitor
Connect the bootstrap capacitor between the CB pin (pin 13) and OUT pin (pin 15).
VCC2
VCBS
id
CB
13
14
VCC2
VCC1
CBS
iC
External
MOS FET
I
15
OUT
10 kΩ
VOUT
: Charge current ic
: Discharge current id
Figure 12 Circuit with a bootstrap capacitor connected and current flow
• Calculation of bootstrap capacitance
500 × 106
VCC2 – 2.6
CBS
× tON (max) [pF]
tON (max): Maximum ON duty time
19
MB3789
2. Connection with no bootstrap capacitor
Connect the CB pin (pin 13) and VCC2 pin (pin 14) as shown in Figure 13.
VCC2
CB
13
14
15
VCC2
External
MOS FET
OUT
Note: Under a condition of “VCC2 − Vth < 1.1 V”, bootstrap capacitor CBS should be connected because
the external MOS FET cannot be driven sufficiently.
Vth: External MOS FET threshold voltage
Figure 13 Connection with no bootstrap capacitor connected
20
MB3789
3. Operation of the Bootstrap Capacitor
When voltage VOUT at the OUT pin (pin 15) is “L” level, the voltages (VC1) at both ends of the bootstrap capacitor
CBS is charged up to the VCC2 voltage level by charge current (iC).
~
When VOUT changes from “L” level to “H” level, the CB pin (pin 13) voltage VCBS rises to 2 × VCC2 and VOUT
reaches almost the VCC2 level.
The charge accumulated at CBS at this time is released by discharge current id (output unit supply current).
See Figure 12 for circuit operation.
(VCC1 = 5 V, VCC2 = 6 V, CBS = 4700 pF)
2 V
12
*2
10
8
*1
VCBS
6
4
2
0
6
4
2
0
VOUT
2 V
10 µs
0
20
40
60
80
100
tON
tOFF
Time t (µs)
*1: Use the device with a setting of VCBS 18 V.
*2: The slant of VCBS is determined by the value of discharge current id (output unit supply current).
Figure 14 Bootstrap operating waveform
21
MB3789
■ EQUIVALENT SERIES RESISTANCE OF SMOOTHING CAPACITOR AND SYSTEM
STABILITY
The equivalent series resistance (ESR) value of a smoothing capacitor for the DC/DC converter largely affects
the loop phase characteristic.
Depending on the ESR value, the phase characteristic causes the ideal capacitor in a high-frequency domain
advance the loop phase (as shown in Figures 16 and 17) and thus the system is improved in stability. In contrast,
using a smoothing capacitor with low ESR lowers system stability. Use meticulous care when a semiconductor
electrolytic capacitor with low ESR (such as an OS capacitor) or a tantalum capacitor is used. (The next page
gives an example of reduction in phase margin when an OS capacitor is used.)
L
Tr
RC
VIN
D
RL
C
Figure 15 Basic circuit of step-down DC/DC converter
20
0
0
(2)
−90
−20
−40
−60
(2)
(1) : RC = 0 Ω
(1)
(1) : RC = 0 Ω
(2) : RC = 31 mΩ
(2) : RC = 31 mΩ
(1)
−180
10
100
1 k
Frequency f (Hz)
10 k
100 k
10
100
1 k
Frequency f (Hz)
10 k
100 k
Figure 16 Gain vs. frequency
Figure 17 Phase vs. frequency
22
MB3789
(Reference data)
Changing the smoothing capacitor from an aluminum electrolytic capacitor (RC 1.0 Ω) to a low-ESR
~
~
semiconductor electrolytic capacitor (OS capacitor: RC 0.2 Ω) halves the phase margin. (See Figures 19 and
20.)
VOUT
+
VO
CNF
AV-phase characteristic
in this range
−IN
VIN
FB
+IN
R2
R1
VREF/2
Error amplifier
Figure 18 DC/DC converter Av vs. phase measurement diagram
AI electrolytic capacitor gain vs. frequency, phase vs. Frequency (DC/DC converter +5 V output)
60
VCC = 10 V
RL = 25 Ω
CP = 0.1 µF
40
20
180
90
AV
+
VO
φ
AI electrolytic capacit
220 µF (16 V)
RC 1.0 Ω: fOSC = 1 kHz
62°
0
0
−90
−180
−20
−40
GND
10
100
1 k
Frequency f (Hz)
10 k
100 k
Figure 19 Gain vs. frequency
23
MB3789
OS capacitor gain vs. frequency, phase vs. frequency (DC/DC converter +5 V output)
60
VCC = 10 V
RL = 25 Ω
AV
40
20
180
90
CP = 0.1 µF
+
VO
OS capacitor
22 µF (16 V)
φ
0
0
RC 0.2 Ω: fOSC = 1 kHz
27°
−90
−180
−20
−40
GND
10
100
1 k
10 k
100 k
Frequency f (Hz)
Figure 20 Phase vs. frequency characteristic curves
24
MB3789
■ APPLICATION EXAMPLE
10 µH
10 µF
VCC
(5 V)
2
1
VREF
VCC1
VCC2
100 kΩ
100 kΩ
14
13
8
+IN1
18 kΩ
CB
7
6
−IN1
2.7 kΩ
100 kΩ
FB1
4700 pF
150 kΩ
100 kΩ
+IN2
9
MB3789
Back
light
15
OUT
10
11
12
−IN2
10 kΩ
100 kΩ
FB2
150 kΩ
100 kΩ
10 µF
GND 16
DTC
SYNC
CT
3
SCP
5
4
1 µF
39 Ω
22 kΩ
33 pF
4.7 kΩ
1500 pF
4.7 µF
33 kΩ
Synchronous signal
25
MB3789
■ USAGE PRECAUTIONS
1. Do not input voltages greater than the maximum rating.
Inputting voltages greater than the maximum rating may damage the device.
2. Always use the device under recommended operating conditions.
If a voltage greater than the maximum value is input to the device, its electrical characteristics may not be
guaranteed. Similarly, inputting a voltage below the minimum value may cause device operation to become
unstable.
3. For grounding the printed circuit board, use as wide ground lines as possible to prevent
high-frequency noise.
Because the device uses high frequencies, it tends to generate high-frequency noise.
4. Take the following measures for protection against static charge:
• For containing semiconductor devices, use an antistatic or conductive container.
• When storing or transporting device-mounted circuit boards, use a conductive bag or container.
• Ground the workbenches, tools, and measuring equipment to earth.
• Make sure that operators wear wrist straps or other appropriate fittings grounded to earth via a resistance of
250 k to 1 MΩ placed in series between the human body and earth.
■ ORDERING INFORMATION
Part number
MB3789PFV
Package
Remarks
16-pin Plastic SSOP
(FPT-16P-M05)
26
MB3789
■ PACKAGE DIMENSION
16-pin Plastic SSOP
(FPT-16P-M05)
*: These dimensions do not include resin protrusion.
1.25–+00..1200
*
5.00±0.10(.197±.004)
(Mounting height)
.049+–..000048
0.10(.004)
INDEX
*
4.40±0.10
6.40±0.20
5.40(.213)
NOM
(.173±.004) (.252±.008)
"A"
0.22–+00..0150
.009–+..000024
0.15–+00..0025
Details of "A" part
0.65±0.12
(.0256±.0047)
.006–+..000012
0.10±0.10(.004±.004)
(STAND OFF)
0
10°
0.50±0.20
(.020±.008)
4.55(.179)REF
Dimensions in mm (inches)
C
1994 FUJITSU LIMITED F16013S-2C-4
27
MB3789
FUJITSU LIMITED
For further information please contact:
Japan
FUJITSU LIMITED
Corporate Global Business Support Division
Electronic Devices
KAWASAKI PLANT, 4-1-1, Kamikodanaka
Nakahara-ku, Kawasaki-shi
Kanagawa 211-8588, Japan
Tel: 81(44) 754-3763
All Rights Reserved.
The contents of this document are subject to change without
notice. Customers are advised to consult with FUJITSU sales
representatives before ordering.
Fax: 81(44) 754-3329
http://www.fujitsu.co.jp/
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications,
and are not intended to be incorporated in devices for actual use.
Also, FUJITSU is unable to assume responsibility for
infringement of any patent rights or other rights of third parties
arising from the use of this information or circuit diagrams.
North and South America
FUJITSU MICROELECTRONICS, INC.
Semiconductor Division
3545 North First Street
San Jose, CA 95134-1804, USA
Tel: (408) 922-9000
FUJITSU semiconductor devices are intended for use in
standard applications (computers, office automation and other
office equipment, industrial, communications, and
measurement equipment, personal or household devices, etc.).
CAUTION:
Customers considering the use of our products in special
applications where failure or abnormal operation may directly
affect human lives or cause physical injury or property damage,
or where extremely high levels of reliability are demanded (such
as aerospace systems, atomic energy controls, sea floor
repeaters, vehicle operating controls, medical devices for life
support, etc.) are requested to consult with FUJITSU sales
representatives before such use. The company will not be
responsible for damages arising from such use without prior
approval.
Fax: (408) 922-9179
Customer Response Center
Mon. - Fri.: 7 am - 5 pm (PST)
Tel: (800) 866-8608
Fax: (408) 922-9179
http://www.fujitsumicro.com/
Europe
FUJITSU MIKROELEKTRONIK GmbH
Am Siebenstein 6-10
D-63303 Dreieich-Buchschlag
Germany
Tel: (06103) 690-0
Fax: (06103) 690-122
Any semiconductor devices have an inherent chance of
failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your
facility and equipment such as redundancy, fire protection, and
prevention of over-current levels and other abnormal operating
conditions.
http://www.fujitsu-ede.com/
Asia Pacific
FUJITSU MICROELECTRONICS ASIA PTE LTD
#05-08, 151 Lorong Chuan
New Tech Park
Singapore 556741
Tel: (65) 281-0770
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for
export of those products from Japan.
Fax: (65) 281-0220
http://www.fmap.com.sg/
F9906
FUJITSU LIMITED Printed in Japan
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