EOB1UV6411-60TG-S [FUJITSU]

EDO DRAM Module, 1MX64, 60ns, CMOS, PDMA144;
EOB1UV6411-60TG-S
型号: EOB1UV6411-60TG-S
厂家: FUJITSU    FUJITSU
描述:

EDO DRAM Module, 1MX64, 60ns, CMOS, PDMA144

动态存储器 光电二极管 内存集成电路
文件: 总8页 (文件大小:133K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 1996  
Revision 1.0  
DATA SHEET  
EOB1UV641(1/4)-(60/70)TG-S  
8MByte (1M x 64) CMOS EDO DRAM Module - 3.3V  
General Description  
The EOB1UV641(1/4)-(60/70)TG-S is a high performance, EDO (Extended Data Out) 8-megabyte dynamic RAM module orga-  
nized as 1M words by 64 bits, in a 144-pins, small outline dual-in-line (SO DIMM) memory modules.  
The module utilizes four, Fujitsu MB81V1(8/6)165A-(60/70) (FN) CMOS 1Mx16 EDO dynamic RAMs in a surface mount package  
on an epoxy laminate substrate. Each device is accompanied by a decoupling capacitor for improved noise immunity.  
Control lines provided are such that byte control is possible. Serial PD on the module is provided by using 128 byte serial EEPROM.  
Features  
• High Density:8MByte  
• Fast Access Time of 60/70 ns (max.)  
• Low Power: 2.6/2.4 W (max.) - Active (60/70 ns) - 1KR  
1.3/1.1 W (max.) - Active (60/70 ns) - 4KR  
29mW (max.)  
14mW (max.)  
- Standby (LVTTL)  
- Standby (CMOS)  
• LVTTL-compatible inputs and outputs  
• Separate power and ground planes to improve noise immunity  
• Single power supply of 3.3V±0.3V  
• Height: 1.00 inch  
ABSOLUTE MAXIMUM RATINGS  
Item  
Symbol  
Ratings  
-0.5 to +4.6  
4
Unit  
V
Voltage on any pin relative to V  
V
P
SS  
T
Power Dissipation  
W
T
T
Operating Temperature  
Storage Temperate  
0 to +70  
-55 to +125  
50  
°C  
°C  
mA  
opr  
T
stg  
OS  
I
Short Circuit Output Current  
RECOMMENDED DC OPERATING CONDITIONS  
(TA = 0 to +70 °C)  
Symbol  
Parameter  
Supply Voltage  
Min  
Typ  
Max  
3.6  
0
Unit  
V
V
V
V
3.0  
0
3.3  
V
V
V
V
CC  
SS  
IH  
Ground  
0
-
V
+0.3  
Input High voltage  
Input Low voltage  
2.0  
-0.3  
CC  
-
0.8  
IL  
Fujitsu Microelectronics, Inc.  
1
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
Functional Diagram  
CAS7*  
CAS6*  
CAS5*  
CAS4*  
CAS3*  
CAS2*  
CAS1*  
CAS0*  
1Mx16  
1Mx16  
EDO  
1Mx16  
EDO  
1Mx16  
EDO  
RAS0*  
EDO  
WE*  
DRAM  
DRAM  
DRAM  
DRAM  
OE*  
DQ0~DQ15  
DQ16~DQ31  
DQ62~DQ47  
DQ48~DQ63  
DQ0~DQ63  
SERIAL PD EEPROM  
V
V
SS  
CC  
SCL  
SCL  
SDA  
SDA  
Decoupling capacitors  
to all devices  
(All specifications of the device are subject to change without notice.)  
Notes:  
1. signifies active low signal.  
2. Addresses A0 ~ A11 are connected to all DRAMs. (A10 & A11 are NC for the 1K refresh module.)  
3. A0~A2 of the Serial PD EEPROM device are grounded.  
Fujitsu Microelectronics, Inc.  
2
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
Pin Name  
A0~A9  
A0~A11  
A0~A7  
Row and Column Addresses for 1K Refresh  
OE*  
SCL  
SDA  
VCC  
VSS  
NC  
Output Enable Input  
Serial PD Clock  
Serial PD Data Input/Output  
Power Supply  
Ground  
No Connection  
Row Addresses for 4K Refresh  
Column Addresses for 4K Refresh  
Data Inputs/Outputs  
DQ0~DQ63  
RAS0*  
CAS0*~CAS7* Column Address Strobes  
WE* Write Enable Input  
Row Address Strobes  
Pin No.  
Pin Designation  
Pin No.  
Pin Designation  
Pin No.  
Pin Designation  
OE*  
Pin No.  
Pin Designation  
V
V
SS  
1
2
73  
74  
NC  
V
SS  
V
3
5
7
9
DQ0  
DQ1  
DQ2  
DQ3  
4
6
DQ32  
DQ33  
DQ34  
DQ35  
75  
77  
79  
81  
76  
78  
80  
82  
SS  
SS  
NC  
NC  
V
NC  
NC  
V
8
10  
CC  
CC  
V
V
11  
13  
15  
17  
19  
12  
14  
16  
18  
20  
83  
85  
87  
89  
91  
DQ16  
DQ17  
DQ18  
DQ19  
84  
86  
88  
90  
92  
DQ48  
DQ49  
DQ50  
DQ51  
CC  
CC  
DQ4  
DQ5  
DQ6  
DQ7  
DQ36  
DQ37  
DQ38  
DQ39  
V
V
SS  
SS  
V
V
21  
23  
25  
27  
22  
24  
26  
28  
93  
95  
97  
99  
DQ20  
DQ21  
DQ22  
DQ23  
94  
96  
DQ52  
DQ53  
DQ54  
DQ55  
SS  
SS  
CAS0*  
CAS1*  
CAS4*  
CAS5*  
98  
V
V
100  
CC  
CC  
V
V
29  
31  
33  
35  
37  
39  
41  
43  
45  
A0  
A1  
A2  
30  
32  
34  
36  
38  
40  
42  
44  
46  
A3  
A4  
A5  
101  
103  
105  
107  
109  
111  
113  
115  
117  
102  
104  
106  
108  
110  
112  
114  
116  
118  
CC  
CC  
A6  
A8  
A7  
A11 (Note)  
V
V
V
V
SS  
SS  
SS  
SS  
DQ8  
DQ40  
DQ41  
DQ42  
DQ43  
A9  
NC  
NC  
DQ9  
A10 (Note)  
V
V
DQ10  
DQ11  
CC  
SS  
CAS2*  
CAS3*  
CAS6*  
CAS7*  
V
V
CC  
CC  
V
V
47  
49  
51  
53  
55  
DQ12  
DQ13  
DQ14  
DQ15  
48  
50  
52  
54  
56  
DQ44  
DQ45  
DQ46  
DQ47  
119  
121  
123  
125  
127  
120  
122  
124  
126  
128  
SS  
CC  
DQ24  
DQ25  
DQ26  
DQ27  
DQ56  
DQ57  
DQ58  
DQ59  
V
V
SS  
SS  
V
V
57  
59  
61  
63  
65  
67  
69  
71  
NC  
NC  
NC  
58  
60  
62  
64  
66  
68  
70  
72  
NC  
NC  
NC  
129  
131  
133  
135  
137  
139  
141  
143  
130  
132  
134  
136  
138  
140  
142  
144  
CC  
CC  
DQ28  
DQ29  
DQ30  
DQ31  
DQ60  
DQ61  
DQ62  
DQ63  
V
V
CC  
CC  
NC  
NC  
NC  
NC  
NC  
V
V
WE*  
RAS0*  
NC  
SS  
SS  
SDA  
SCL  
V
V
CC  
CC  
Note: Address A10 and A11 are NC for the 1K refresh module but are used for the 4K refresh module.  
Fujitsu Microelectronics, Inc.  
3
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
DC CHARACTERISTICS  
(VCC = 3.3V±0.3V, VSS = 0V, TA = 0 to +70 °C)  
60  
70  
Parameter  
Symbol  
Test Condition  
Unit  
Note  
Min.  
Max.  
720  
Min.  
Max.  
680  
1KR  
4KR  
-
-
-
-
I
RAS*, CAS* cycling; t = min.  
Operating Current  
mA  
1, 2  
CC1  
RC  
360  
320  
LVTTL Interface  
RAS*, CAS* V  
I
-
-
8
4
-
-
8
4
mA  
mA  
IH  
CC2  
D
= HIgh-Z  
out  
Standby current  
CMOS Interface  
RAS*, CAS* V - 0.2V  
cc  
D
= HIgh-Z  
out  
1KR  
4KR  
1KR  
4KR  
1KR  
4KR  
-
720  
360  
680  
360  
480  
440  
40  
-
680  
320  
640  
320  
440  
400  
40  
CAS* V ; RAS*, Address  
RAS* -only Refresh  
Current  
IH  
I
mA  
mA  
2
CC3  
cycling @ t = min.  
RC  
-
-
-
-
RAS*, CAS* cycling @  
CAS*-before-RAS*  
Refresh Current  
I
CC4  
t
= min.  
RC  
-
-
-
-
RAS* V ; CAS*, Address  
Hyper Page Mode  
Current  
IL  
I
mA  
µA  
µA  
1, 3  
CC5  
cycling @ t = min.  
PC  
-
-
I
0V Vin V + 0.3V  
Input Leakage Current  
Output Leakage Current  
-40  
-40  
LI  
CC  
0V Vout V  
CC  
I
-10  
10  
-10  
10  
LO  
D
= Disable  
out  
V
High I = -2mA  
Output High Voltage  
Output Low Voltage  
2.4  
0
-
2.4  
0
-
V
V
OH  
out  
V
Low I = 2 mA  
0.4  
0.4  
OL  
out  
Notes:  
1. Values depend on output load condition when the device is selected. Maximum Values are specified at the output open condition.  
2. Address can be changed once or less while RAS* = V .  
IL  
3. Address can be changed once or less while CAS* = V  
.
IH  
CAPACITANCE  
(TA =+25°C, VCC = 3.3V±0.3V)  
Parameter  
Symbol  
Max.  
25  
Unit  
pF  
Note  
1
C
Input Capacitance (Address)  
I1  
C
Input Capacitance (RAS*, OE*, WE*)  
Input Capacitance (CAS0*~CAS7*)  
Input/Output Capacitance (DQ0~DQ63)  
33  
pF  
1
I2  
C
12  
pF  
1
I3  
C
12  
pF  
1, 2  
I/O  
Notes:  
1. Capacitance is measured with Boonton Meter or effective capacitance method.  
2. CAS* - V to disable D  
.
out  
IH  
Fujitsu Microelectronics, Inc.  
4
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
AC CHARACTERISTICS  
(TA = 0 to +70°C, VCC = 3.3V±0.3V, VSS = 0V)  
60  
70  
Parameter  
Symbol  
Unit  
Notes  
Min  
110  
-
Max  
Min  
130  
-
Max  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Random read/write cycle time  
Access time from RAS*  
-
-
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
60  
70  
3, 4  
3, 4, 5  
3, 10  
2
RAC  
CAC  
AA  
Access time from CAS*  
-
15  
-
20  
Access time from column address  
Transition time (rise and fall)  
RAS* precharge time  
-
30  
-
35  
2
50  
2
50  
T
40  
60  
15  
45  
10  
20  
15  
5
-
50  
70  
20  
50  
15  
20  
15  
5
-
RP  
RAS* pulse width  
10000  
10000  
RAS  
RSH  
CSH  
CAS  
RCD  
RAD  
CRP  
ASR  
RAH  
ASC  
CAH  
RAL  
RCS  
RCH  
RRH  
WCH  
WP  
RAS* hold time  
-
-
CAS* hold time  
-
-
CAS* pulse width  
10000  
10000  
RAS* to CAS* delay time  
RAS* to column address delay time  
CAS* to RAS* precharge time  
Row address set-up time  
Row address hold time  
45  
30  
-
50  
35  
-
4
10  
0
-
0
-
10  
0
-
10  
0
-
Column address set-up time  
Column address hold time  
Column address to RAS* lead time  
Read command set-up time  
Read command hold time to CAS*  
Read command hold time to RAS*  
Write command hold time  
Write command pulse width  
Write command to RAS* lead time  
Write command to CAS* lead time  
Data-in set-up time  
-
-
10  
30  
0
-
15  
35  
0
-
-
-
-
-
0
-
0
-
8
0
-
0
-
10  
10  
15  
10  
0
-
15  
15  
17  
15  
0
-
-
-
-
-
RWL  
CWL  
DS  
-
-
-
-
9
9
Data-in hold time  
10  
-
-
15  
-
-
DH  
1KR  
16  
64  
-
16  
64  
-
t
Refresh period  
4KR  
ms  
REF  
-
-
t
t
t
t
t
t
t
t
Write command set-up time  
CAS* set-up time (CBR refresh)  
CAS* hold time (CBR refresh)  
RAS* precharge to CAS* hold time  
Access time from CAS* precharge  
Hyper page mode cycle time  
0
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
7
1
1
WCS  
CSR  
CHR  
RPC  
CPA  
HPC  
CP  
10  
10  
5
-
10  
15  
5
-
-
-
-
-
-
35  
-
40  
3, 11  
12  
25  
10  
60  
-
30  
10  
70  
-
CAS* precharge time (Hyper page)  
RAS* pulse width (Hyper page)  
Fujitsu Microelectronics, Inc.  
-
-
100000  
100000  
RASP  
5
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
Notes:  
1. An initial pulse of at least 200µs is required after power-up followed by a minimum of eight RAS* cycles before device operation  
is achieved.  
2.  
V
(min.) and V (max.) are reference levels for measuring timing of input signals. Transition times are measured between V  
IH IL IH  
(min.) and V (max.) and are assumed to be 5 ns for all inputs.  
IL  
3. Measure with a load equivalent to 2 TTL loads and 100pF.  
4. Operation within the t (max.) limit ensures that t (max.) limit can be met; t (max.) is specified as a reference point  
RCD  
RCD  
RAC  
only. If t  
is greater than the specified t  
(max) limit, then access time is controlled exclusively by t  
.
RCD  
RCD  
CAC  
5. Assumes that tRCD t  
(max.).  
RAD  
6. This parameter defines the time at which the output achieves open circuit condition and is not referenced to V or V  
.
OH  
OL  
7.  
t
is non restrictive operating parameter. It is included in the data sheet as an electrical characteristic only. If tWCS t  
(min.)  
WCS  
WCS  
the cycle is an early write cycle and the data out pin will remain at high impedance for the duration of the cycle.  
8. Either t or t must be satisfied for a read cycle.  
RCH  
RRH  
9. These parameters are referenced to the CAS* leading edge in early write cycles.  
10. Operation within the t (max.) limit ensures that t (max.) limit can be met. t (max.) is specified as a reference point only.  
RAD  
RAD  
RAC  
If t  
is greater than the specified t  
(max.) limit, then access time is controlled by t  
.
RAD  
RAD  
AA  
11. Access time is determined by the longer of t , t  
, or t  
.
AA CAC  
ACP  
12.  
t
defines RAS* pulse width in fast page mode cycles.  
RASC  
Physical Dimensions  
144-pin 3.4V SODIMM  
Front View  
0.160  
(max.)  
2.661  
2.503  
0.158x2  
070x2  
1
59  
61  
143  
0.913  
1.291  
0.181  
0.098  
0.083  
0.130  
0.145  
0.040  
± 0.004  
0.031  
2
60  
62  
144  
Back View  
( All dimensions are in inches with 0.005" tolerance unless otherwise specified)  
Fujitsu Microelectronics, Inc.  
6
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
All Rights Reserved.  
Circuit diagrams using fujitsu products are included to illustrate typical semiconductor applications.  
Information sufficient for construction purpose may not be shown.  
The information contained in this document has been carefully checked and is believed to be reliable.  
However, Fujitsu Microelectronics, Inc. assumes no responsibility for inaccuracies.  
The information conveyed in this document does not convey any license under the copyrights, patent  
rights or trademarks claimed and owned by Fujitsu Limited, its subsidiaries, or Fujitsu  
Microelectronics, Inc.  
Fujitsu Microelectronics, Inc. reserves the right to change products or specifications without notice.  
No part of the publication may be copied or reproduced in any form or by any means, or transferred  
to any third party without prior written consent of Fujitsu Microelectronics, Inc.  
7
September 1996  
Revision 1.0  
EOB1UV641(1/4)-(60/70)TG-S  
Visit our web site for the latest information:  
http://www.fujitsumicro.com  
Fujitsu Microelectronics, Inc.  
Customer Response Center:  
For semiconductor products, flat panel displays, and PC cards in the U.S., Canada and Mexico,  
please contact the Fujitsu Microelectronics Customer Response Center (CRC). The CRC  
provides a single point of contact for resolving customer issues and answering technical  
questions.  
Web:  
Tel:  
Click on Tech Support in the FMI home page, then submit our form  
Telephone: 1-800-866-8608 Monday through Friday, 7 to 5 PST  
Outside U.S., Canada & Mexico call: 010-1-408-922-9000 and ask  
for the Customer Response Center. (Note: Country Code may vary)  
Fax:  
(408) 922-9179  
E-Mail:  
fmicrc@fmi.fujitsu.com  
MP-DRAMM-DS-20393-9/96  
8

相关型号:

EOB1UV6411-70TG-S

EDO DRAM Module, 1MX64, 70ns, CMOS, PDMA144
FUJITSU

EOB1UV6414-70TG-S

EDO DRAM Module, 1MX64, 70ns, CMOS, PDMA144
FUJITSU

EOB2UV6482-60TG-S

EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA144
FUJITSU

EOB2UV6482-70TG-S

EDO DRAM Module, 2MX64, 70ns, CMOS, PDMA144
FUJITSU

EOB2UV6482B-60TG-S

EDO DRAM Module, 2MX64, 60ns, CMOS, PDMA144
FUJITSU

EOC-20HD100

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HD200

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HD50

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HR100

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HR200

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HR50

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC

EOC-20HSD100

HIGH-POWER CHIPLED - EOC - 20 SERIES
ETC