MP3H6115A_09 [FREESCALE]
High Temperature Accuracy Integrated Silicon Pressure Sensor; 高温度精度集成硅压力传感器
| 型号： | MP3H6115A_09 |
| 厂家： | 
Freescale |
| 描述： | High Temperature Accuracy Integrated Silicon Pressure Sensor |
| 文件： | 总12页 (文件大小：173K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MP3H6115A
Rev 4, 10/2009
Freescale Semiconductor
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3H6115A
Series
15 to 115 kPa (2.2 to 16.7 psi)
0.12 to 2.8 V Output
Application Examples
Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The small form factor and high reliability of on-
chip integration make the Freescale pressure sensor a logical and
economical choice for the system designer.
The MP3H6115A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
• Weather Station and Weather
Reporting Device Barometers
Features
• Improved Accuracy at High Temperature
• Available in Super Small Outline Package
• 1.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from -40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
# of Ports
Single
Pressure Type
Differential
Packaging
Options
Device
Marking
Device Name
Case No.
None
Dual
Gauge
Absolute
Super Small Outline Package (MP3H6115A Series)
MP3H6115A6U
MP3H6115A6T1
MP3H6115AC6U
MP3H6115AC6T1
Rail
1317
1317
•
•
•
•
•
•
MP3H6115A
MP3H6115A
MP3H6115A
MP3H6115A
Tape & Reel
Rail
1317A
1317A
•
•
Tape & Reel
SUPER SMALL OUTLINE PACKAGES
MP3H6115AC6U/T1
CASE 1317A-04
MP3H6115A6U/T1
CASE 1317-04
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Pressure Range
Symbol
POP
VS
Min
15
Typ
—
Max
115
Unit
kPa
Supply Voltage(1)
2.7
3.0
4.0
0.12
3.3
Vdc
Supply Current
Io
—
8.0
mAdc
Vdc
Minimum Pressure Offset(2)
@ VS = 3.0 Volts
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
(0 to 85°C)
Voff
0.079
0.161
Full Scale Output(3)
@ VS = 3.0 Volts
VFSO
VFSS
2.780
2.660
2.82
2.70
2.861
2.741
Vdc
Vdc
Full Scale Span(4)
@ VS = 3.0 Volts
Accuracy
—
V/P
tR
—
—
—
—
—
—
27
±1.5
—
%VFSS
mV/kPa
ms
Sensitivity
Response Time(5)
Warm-Up Time(6)
Offset Stability(7)
1.0
—
—
20
—
ms
—
±0.25
—
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MP3H6115A
Sensors
2
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Parametrics
Symbol
Pmax
Tstg
TA
Value
400
Units
kPa
Maximum Pressure (P1 > P2)
Storage Temperature
-40° to +125°
-40° to +125°
0.5
°C
Operating Temperature
°C
Output Source Current @ Full Scale Output(2)
Output Sink Current @ Minimum Pressure Offset(2)
Io+
mAdc
mAdc
Io-
-0.5
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Gain Stage #2
and Ground
Reference
Shift
4
Sensing
Element
VOUT
Circuitry
3
Pins 1, 5, 6, 7, and 8 are No Connects
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MP3H6115A
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3H6115A
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
Fluoro Silicone
Gel Die Coat
Stainless Steel
Die
Cap
P1
Thermoplastic
Case
Wire Bond
Lead frame
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
+3 V
VS Pin 2
MP3H6115A
100 nF
VOUT Pin 4
to ADC
47 pF
51 K
GND Pin 3
GND
Figure 3. Typical Application Circuit
(Output Source Current Operation)
3.0
Transfer Function:
2.75
2.5
Max
V
OUT = VS x (.009xP–.095) ± Error
VS = 3.0 VDC
Temp = 0 to 85°C
2.25
2.0
Typ
1.75
1.5
1.25
1.0
0.75
0.5
Min
0.25
0
Pressure (Reference to Sealed Vacuum) in kPa
Figure 4. Output versus Absolute Pressure
MP3H6115A
Sensors
4
Freescale Semiconductor
Pressure
Transfer Function (MP3H6115A)
VOUT = VS x (0.009 x P – 0.095)
Normal Transfer Value:
± (Pressure Error x Temp. Factor x 0.009 x VS)
VS = 3.0 ± 0.3 VDC
Temperature Error Band
MP3H6115A Series
4.0
Break Points
Multiplier
Temp
3.0
-40
3
0 to 85
125
1
1.75
Temperature
2.0
Error
Factor
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in C°
NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C
Pressure Error Band
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure (in kPa)
80
60
120
40
100
20
-1.0
-2.0
Pressure
Error (Max)
- 3.0
15 to 115 (kPa) ±1.5 (kPa)
MP3H6115A
Sensors
Freescale Semiconductor
5
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.050
1.27
TYP
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MP3H6115A
Sensors
6
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MP3H6115A
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MP3H6115A
Sensors
Freescale Semiconductor
8
Pressure
PACKAGE DIMENSIONS
PAGE 3 OF 3
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MP3H6115A
Sensors
Freescale Semiconductor
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Pressure
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MP3H6115A
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MP3H6115A
Sensors
Freescale Semiconductor
11
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© Freescale Semiconductor, Inc. 2009. All rights reserved.
MP3H6115A
Rev.4
10/2009
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