MCIMX538DZK1C_技术文档

Document Number: IMX53CEC

Rev. 2, 5/2011

Freescale Semiconductor

Data Sheet: Advance Information

MCIMX53xD

i.MX53xD Applications

Processors for Consumer

Products

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Case FC-PBGA PoP 12 x 12 mm

Ordering Information

See Table 1 on page 3

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17

4.2. Power Supplies Requirements and Restrictions . 25

4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28

4.4. Output Buffer Impedance Characteristics . . . . . . 35

4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39

4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 46

4.7. External Peripheral Interfaces Parameters . . . . . . 68

4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 146

5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 147

5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 147

5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 148

5.3. Power setup during Boot . . . . . . . . . . . . . . . . . . 149

6. Package Information and Contact Assignments . . . . . 150

6.1. 19x19 mm Package Information . . . . . . . . . . . . . 150

6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 169

6.3. PoP 12 x 12 mm Package on Package (PoP)

1 Introduction

The i.MX53xD multimedia application processor is

Freescale Semiconductor’s latest addition to a growing

family of multimedia-focused products offering high

performance processing optimized for lowest power

consumption.

The i.MX53xD processor features Freescale’s advanced

implementation of the ARM™ core, which operates at

clock speeds as high as 1 GHz and interfaces with

DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800

DRAM memories. This device is suitable for

applications such as the following:

•

Tablets, high-end mobile internet devices (MID)

Smart mobile devices

Thin clients

Internet monitors, media phones, high-end

portable media players (PMP) with HD video

capability

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173

7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201

•

Gaming consoles

The flexibility of the i.MX53xD architecture allows for

its use in a wide variety of applications. As the heart of

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

Introduction

the application chipset, the i.MX53xD processor provides all the interfaces for connecting peripherals,

such as WLAN, Bluetooth™, GPS, hard drive, camera sensors, and dual displays.

Features of the i.MX53xD processor include the following:

•

Applications processor—The i.MX53xD processors boost the capabilities of high-tier portable

applications by satisfying the ever increasing MIPS needs of operating systems and games.

Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction,

allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as

audio decode.

•

Multilevel memory system—The multilevel memory system of the i.MX53xD is based on the L1

instruction and data caches, L2 cache, internal and external memory. The i.MX53xD supports

many types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3,

NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed

NAND including eMMC up to rev 4.4.

•

Smart speed technology—The i.MX53xD device has power management throughout the IC that

enables the rich suite of multimedia features and peripherals to consume minimum power in both

active and various low power modes. Smart speed technology enables the designer to deliver a

feature-rich product requiring levels of power far lower than industry expectations.

Multimedia powerhouse—The multimedia performance of the i.MX53xD processor ARM core is

boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision

floating point support) and vector floating point coprocessors. The system is further enhanced by

a multistandard hardware video codec, autonomous image processing unit (IPU), SD and HD720p

triple video (TV) encoder with triple video DAC, and a programmable smart DMA (SDMA)

controller.

•

Powerful graphics acceleration—Graphics is the key to mobile game, navigation, web browsing,

and other applications. The i.MX53xD processors provide two independent, integrated graphics

processing units: an OpenGL ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s, and

®

800 Mpix/s z-plane performance) and an OpenVG™ 1.1 2D graphics accelerator (200 Mpix/s).

Interface flexibility—The i.MX53xD processor supports connection to a variety of interfaces,

including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go

with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed

MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces

2

(PATA, UART, I C, and I S serial audio, among others).

•

Advanced security—The i.MX53xD processors deliver hardware-enabled security features that

enable secure e-commerce, digital rights management (DRM), information encryption, secure

boot, and secure software downloads. For detailed information about the i.MX53xD security

features contact a Freescale representative.

The i.MX53xD application processor is a follow-on to the i.MX51, with improved performance, power

efficiency, and multimedia capabilities.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Introduction

1.1

Ordering Information

Table 1 provides ordering information.

Table 1. Ordering Information

Case

Tempera

ture

Range

⁽°C)

Part Number¹

Mask Set

Features

Package²

PCIMX535DVV1C

MCIMX535DVV1C

PCIMX538DZK1C

MCIMX538DZK1C

N78C

1 GHz, full feature set

-20 to 19 x 19 mm, 0.8 mm pitch BGA

+85 Case TEPBGA-2

-20 to 19 x 19 mm, 0.8 mm pitch BGA

+85

Case TEPBGA-2

-20 to

+85

12 x 12 mm PoP

-20 to

+85

12 x 12 mm PoP

1

2

Part numbers with a PC prefix indicate non production engineering parts.

Case TEPBGA-2 is RoHS compliant, lead-free MSL (moisture sensitivity level) 3.

1.2

Features

The i.MX53xD multimedia applications processor (AP) is based on the ARM Platform, which has the

following features:

•

MMU, L1 instruction and L1 data cache

Unified L2 cache

Target frequency of the core (including Neon, VFPv3 and L1 cache): 1 GHz

Neon coprocessor (SIMD media processing architecture) and vector floating point (VFP-Lite)

coprocessor supporting VFPv3

•

TrustZone

The memory system consists of the following components:

•

Level 1 cache:

— Instruction (32 Kbyte)

— Data (32 Kbyte)

•

Level 2 cache:

— Unified instruction and data (256 Kbyte)

Level 2 (internal) memory:

— Boot ROM, including HAB (64 Kbyte)

— Internal multimedia/shared, fast access RAM (128 Kbyte)

— Secure/non-secure RAM (16 Kbyte)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

3

Introduction

•

External memory interfaces:

— 16/32-bit DDR2-800, LV-DDR2-800 or DDR3-800 up to 2 Gbyte

— 32-bit LPDDR2

— 8/16-bit NAND SLC/MLC Flash, up to 66 MHz, 4/8/14/16-bit ECC

— 8/16-bit NOR Flash, PSRAM, and cellular RAM.

— 32-bit multiplexed mode NOR Flash, PSRAM & cellular RAM.

— 8-bit Asynchronous (DTACK mode) EIM interface.

— All EIM pins are muxed on other interfaces (data with NFC pins). I/O muxing logic selects EIM

port, as primary muxing at system boot.

— Samsung OneNAND™ and managed NAND including eMMC up to rev 4.4 (in muxed I/O

mode)

The i.MX53xD system is built around the following system on chip interfaces:

•

64-bit AMBA AXI v1.0 bus—used by ARM platform, multimedia accelerators (such as VPU, IPU,

GPU3D, GPU2D) and the external memory controller (EXTMC) operating at 200 MHz.

•

32-bit AMBA AHB 2.0 bus—used by the rest of the bus master peripherals operating at 133 MHz.

32-bit IP bus—peripheral bus used for control (and slow data traffic) of the most system peripheral

devices operating at 66 MHz.

The i.MX53xD makes use of dedicated hardware accelerators to achieve state-of-the-art multimedia

performance. The use of hardware accelerators provides both high performance and low power

consumption while freeing up the CPU core for other tasks.

The i.MX53xD incorporates the following hardware accelerators:

•

VPU, version 3—video processing unit

GPU3D—3D graphics processing unit, OpenGL ES 2.0, version 3, 33 Mtri/s, 200 Mpix/s, and

800 Mpix/s z-plane performance, 256 Kbyte RAM memory

•

GPU2D—2D graphics accelerator, OpenVG 1.1, version 1, 200 Mpix/s performance,

IPU, version 3M—image processing unit

ASRC—asynchronous sample rate converter

The i.MX53xD includes the following interfaces to external devices:

NOTE

Not all interfaces are available simultaneously, depending on I/O

multiplexer configuration.

•

Hard disk drives:

— PATA, up to U-DMA mode 5, 100 MByte/s

— SATA I, 1.5 Gbps

Displays:

— Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/s, 24 bpp. Up to two

interfaces may be active at once.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Introduction

— Two parallel 24-bit display ports. The primary port is up to 165 Mpix/s (for example,

UXGA at 60 Hz).

— LVDS serial ports: one dual channel port up to 165 Mpix/s or two independent single channel

ports up to 85 MP/s (for example, WXGA at 60 Hz) each.

— TV-out/VGA port up to 150 Mpix/s (for example, 1080p60).

Camera sensors:

•

— Two parallel 20-bit camera ports. Primary up to 180-MHz peak clock frequency, secondary up

to 120-MHz peak clock frequency.

Expansion cards:

— Four SD/MMC card ports: three supporting 416 Mbps (8-bit i/f) and one enhanced port

supporting 832 Mbps (8-bit, eMMC 4.4).

USB

— High-speed (HS) USB 2.0 OTG (up to 480 Mbps), with integrated HS USB PHY

— Three USB 2.0 (480 Mbps) hosts:

– High-speed host with integrated on-chip high-speed PHY

– Two high-speed hosts for external HS/FS transceivers through ULPI/serial, support IC-USB

Miscellaneous interfaces:

•

— One-wire (OWIRE) port

— Three I2S/SSI/AC97 ports, supporting up to 1.4 Mbps, each connected to audio multiplexer

(AUDMUX) providing four external ports.

— Five UART RS232 ports, up to 4.0 Mbps each. One supports 8-wire, the other four support

4-wire.

— Two high speed enhanced CSPI (ECSPI) ports plus one CSPI port

2

— Three I C ports, supporting 400 kbps

— Fast Ethernet controller, IEEE1588 V1 compliant, 10/100 Mbps

— Two controller area network (FlexCAN) interfaces, 1 Mbps each

— Sony Phillips Digital Interface (SPDIF), Rx and Tx

— Enhanced serial audio interface (ESAI), up to 1.4 Mbps each channel

— Key pad port (KPP)

— Two pulse-width modulators (PWM)

— GPIO with interrupt capabilities

The system supports efficient and smart power control and clocking:

•

Supporting DVFS (dynamic voltage and frequency scaling) technique for low power modes

Power gating SRPG (State Retention Power Gating) for ARM core and Neon

Support for various levels of system power modes

Flexible clock gating control scheme

On-chip temperature monitor

On-chip oscillator amplifier supporting 32.768 kHz external crystal

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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5

Introduction

•

On-chip LDO voltage regulators for PLLs

Security functions are enabled and accelerated by the following hardware:

•

ARM TrustZone including the TZ architecture (separation of interrupts, memory mapping, and so

on)

Secure JTAG controller (SJC)—Protecting JTAG from debug port attacks by regulating or blocking

the access to the system debug features

Secure real-time clock (SRTC)—Tamper resistant RTC with dedicated power domain and

mechanism to detect voltage and clock glitches

•

Real-time integrity checker, version 3 (RTICv3)—RTIC type1, enhanced with SHA-256 engine

SAHARAv4 Lite—Cryptographic accelerator that includes true random number generator

(TRNG)

•

Security controller, version 2 (SCCv2)—Improved SCC with AES engine, secure/non-secure

RAM and support for multiple keys as well as TZ/non-TZ separation

Central security unit (CSU)—Enhancement for the IIM (IC Identification Module). CSU is

configured during boot by e-fuses, and determines the security level operation mode as well as the

TrustZone (TZ) policy

•

Advanced High Assurance Boot (A-HAB)—HAB with the following embedded enhancements:

SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization

NOTE

The actual feature set depends on the part number as described in Table 1.

Functions such as video hardware acceleration with 2D and 3D hardware

graphics acceleration may not be enabled for specific part numbers.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Architectural Overview

2 Architectural Overview

The following subsections provide an architectural overview of the i.MX53xD processor system.

2.1

Block Diagram

Figure 1 shows the functional modules in the i.MX53xD processor system.

Composite CVBS/ S-Video

Component RGB, YCC

(HD TV-Out / VGA)

DDR2/DDR3/

LPDDR2

NOR/NAND Battery Ctrl

Flash Device

Camera

LVDS

LCD

(2)

(WSXGA+)

Display-1,2

Display (2)

(2)

Application Processor

Domain (AP)

Temperature

Sensor

External

Memory I/F

(EXTMC)

Digital

Audio

LDB

TV-Encoder

Internal

RAM

144 KB

Clock and Reset

Image Processing

Subsystem

(IPU)

PLL (4)

SATA /

P-ATA

HDD

CCM

GPC

SRC

Smart DMA

(SDMA)

Boot

ROM

64 KB

ARM Cortex A8

Platform

XTALOSC(2)

CAMP (2)

Debug

DAP

CAN i/f

GPS

ARM Cortex A8

Neon, VFPv3

L1 I/D cache

SPBA

AP Peripherals

TPIU

CTI (2)

SJC

ECSPI

L2 cache 256 KB

ETM, CTI0,1

CSPI

Shared Peripherals

UART (4)

AUDMUX

eSDHCv2 (3)

eSDHCv3

UART

SSI

ECSPI

ESAI

Security

2

Video

Proc. Unit

(VPU)

I C (3)

SAHARAv4

Lite

RF/IF

OWIRE

PWM (2)

IIM

SPDIF Rx/Tx

ASRC

P-ATA

RTICv3

SCCv2

SRTC

SATA

3D Graphics

Proc. Unit

(GPU3D)

+ Temp Mon

RF / IF

IC’s

IOMUXC

KPP

CSU

G-Memory

256 KB

TZIC

GPIOx32 (7)

SSI (2)

Audio,

Power

Mngmnt.

Fuse Box

2D Graphics

Proc. Unit

FIRI

FlexCAN (2)

FEC(IEEE1588)

(

GPU2D)

Timers

WDOG (2)

Ethernet

10/100

Mbps

USB PHY1

USB PHY2

GPT

USB OTG +

3 HS Ports

EPIT (2)

IrDA

XVR

JTAG

MMC/SD

USB OTG

(dev/host)

Access.

Conn.

Keypad

Bluetooth

WLAN

(IEEE1149.1) eMMC/eSD

Figure 1. i.MX53xD System Block Diagram

NOTE

The numbers in brackets indicate number of module instances. For example,

PWM (2) indicates two separate PWM peripherals.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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7

Modules List

3 Modules List

The i.MX53xD processor contains a variety of digital and analog modules. Table 2 describes these

modules in alphabetical order.

Table 2. i.MX53xD Digital and Analog Blocks

Block

Mnemonic

Block Name

Subsystem

ARM

Brief Description

ARM

ARM Platform

The ARM Cortex A8^TMPlatform consists of the ARM processor version

r2p5 (with TrustZone) and its essential sub-blocks. It contains the 32 Kbyte

L1 instruction cache, 32 Kbyte L1 data cache, Level 2 cache controller and

a 256 Kbyte L2 cache. The platform also contains an event monitor and

debug modules. It also has a NEON coprocessor with SIMD media

processing architecture, a register file with 32/64-bit general-purpose

registers, an integer execute pipeline (ALU, Shift, MAC), dual

single-precision floating point execute pipelines (FADD, FMUL), a

load/store and permute pipeline and a non-pipelined vector floating point

(VFP Lite) coprocessor supporting VFPv3.

ASRC

Asynchronous

Sample Rate

Converter

Multimedia

Peripherals

The asynchronous sample rate converter (ASRC) converts the sampling

rate of a signal associated to an input clock into a signal associated to a

different output clock. The ASRC supports concurrent sample rate

conversion of up to 10 channels of about –120 dB THD+N. The sample rate

conversion of each channel is associated to a pair of incoming and outgoing

sampling rates. The ASRC supports up to three sampling rate pairs.

AUDMUX

Digital Audio

Multiplexer

Multimedia

Peripherals

The AUDMUX is a programmable interconnect for voice, audio, and

synchronous data routing between host serial interfaces (for example,

SSI1, SSI2, and SSI3) and peripheral serial interfaces (audio and voice

codecs). The AUDMUX has seven ports (three internal and four external)

with identical functionality and programming models. A desired connectivity

is achieved by configuring two or more AUDMUX ports.

CAMP-1

CAMP-2

Clock Amplifier

Clocks,

Resets, and

Power Control

Clock amplifier

CCM

GPC

SRC

Clock Control

Module

Global Power

Controller

System Reset

Controller

Clocks,

Resets, and

Power Control The system includes four PLLs.

These modules are responsible for clock and reset distribution in the

system, as well as for system power management.

CSPI

ECSPI-1

ECSPI-2

Configurable

SPI, Enhanced

CSPI

Connectivity

Peripherals

Full-duplex enhanced synchronous serial interface, with data rates

16-60 Mbit/s. It is configurable to support master/slave modes. In Master

mode it supports four slave selects for multiple peripherals.

CSU

Central Security Security

Unit

The central security unit (CSU) is responsible for setting comprehensive

security policy within the i.MX53xD platform, and for sharing security

information between the various security modules. The security control

registers (SCR) of the CSU are set during boot time by the high assurance

boot (HAB) code and are locked to prevent further writing.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

DEBUG

Debug System

System

Control

The debug system provides real-time trace debug capability of both

instructions and data. It supports a trace protocol that is an integral part of

the ARM Real Time Debug solution (RealView).

Real-time tracing is controlled by specifying a set of triggering and filtering

resources, which include address and data comparators, three

cross-system triggers (CTI), counters, and sequencers.

debug access port (DAP) —The DAP provides real-time access for the

debugger without halting the core to system memory, peripheral register,

debug configuration registers and JTAG scan chains.

EXTMC

External Memory Connectivity

Controller Peripherals

The EXTMC is an external and internal memory interface. It performs

arbitration between multi-AXI masters to multi-memory controllers, divided

into four major channels, fast memories (DDR2/DDR3/LPDDR2) channel,

slow memories (NOR-FLASH / PSRAM / NAND-FLASH etc.) channel,

internal memory (RAM, ROM) channel and graphical memory (GMEM)

channel.

In order to increase the bandwidth performance, the EXTMC separates the

buffering and the arbitration between different channels so parallel

accesses can occur. By separating the channels, slow accesses do not

interfere with fast accesses.

EXTMC Features:

• 64-bit and 32-bit AXI ports

• Enhanced arbitration scheme for fast channel, including dynamic master

priority, and taking into account which pages are open or closed and

what type (read or write) was the last access

• Flexible bank interleaving

• Support 16/32-bit DDR2-800 or DDR3-800 or LPDDR2.

• Support up to 2 GByte DDR memories.

• Support NFC, EIM signal muxing scheme.

• Support 8/16/32-bit Nor-Flash/PSRAM memories (sync and async

operating modes), at slow frequency. (8-bit is not supported on

D[23]-D[16]).

• Support 4/8/14/16-bit ECC, page sizes of 512-B, 2-KB and 4-KB

Nand-Flash (including MLC)

• Multiple chip selects (up to 4).

• Enhanced DDR memory controller, supporting access latency hiding

• Support watermark for security (internal and external memories)

EPIT-1

EPIT-2

Enhanced

Periodic Interrupt Peripherals

Timer

Each EPIT is a 32-bit “set and forget” timer that starts counting after the

EPIT is enabled by software. It is capable of providing precise interrupts at

regular intervals with minimal processor intervention. It has a 12-bit

prescaler for division of input clock frequency to get the required time

setting for the interrupts to occur, and counter values can be programmed

on the fly.

ESAI

Enhanced Serial Connectivity

The enhanced serial audio interface (ESAI) provides a full-duplex serial port

for serial communication with a variety of serial devices, including

industry-standard codecs, SPDIF transceivers, and other processors.

The ESAI consists of independent transmitter and receiver sections, each

section with its own clock generator.

Audio Interface

Peripherals

The ESAI has 12 pins for data and clocking connection to external devices.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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9

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

ESDHCV3-3 Ultra-High-

Speed eMMC /

Connectivity

Peripherals

Ultra high-speed eMMC / SD host controller, enhanced to support eMMC

4.4 standard specification, for 832 MBps.

SD Host

Controller

• Port 3 is specifically enhanced to support eMMC 4.4 specification, for

double data rate (832 Mbps, 8-bit port).

ESDHCV3 is backward compatible to ESDHCV2 and supports all the

features of ESDHCV2 as described below.

ESDHCV2-1 Enhanced

ESDHCV2-2 Multi-Media Card

Enhanced multimedia card / secure digital host controller

• Ports 1, 2, and 4 are compatible with the “MMC System Specification”

version 4.3, full support and supporting 1, 4 or 8-bit data.

The generic features of the eSDHCv2 module, when serving as SD / MMC

host, include the following:

ESDHCv2-4

/

Secure Digital

Host Controller

• Can be configured either as SD / MMC controller

• Supports eSD and eMMC standard, for SD/MMC embedded type cards

• Conforms to SD Host Controller Standard Specification, version 2.0, full

support.

• Compatible with the SD Memory Card Specification, version 1.1

• Compatible with the SDIO Card Specification, version 1.2

• Designed to work with SD memory, miniSD memory, SDIO, miniSDIO,

SD Combo, MMC and MMC RS cards

• Configurable to work in one of the following modes:

- SD/SDIO 1-bit, 4-bit

- MMC 1-bit, 4-bit, 8-bit

• Full/high speed mode.

• Host clock frequency variable between 32 kHz to 52 MHz

• Up to 200 Mbps data transfer for SD/SDIO cards using 4 parallel data

lines

• Up to 416 Mbps data transfer for MMC cards using 8 parallel data lines

FEC

FIRI

Fast Ethernet

Controller

Connectivity

Peripherals

The Ethernet media access controller (MAC) is designed to support both

10 Mbps and 100 Mbps Ethernet/IEEE Std 802.3™ networks. An external

transceiver interface and transceiver function are required to complete the

interface to the media.

The i.MX53xD also consists of HW assist for IEEE1588™ standard. See,

TSU and CE_RTC (IEEE1588) section for more details.

Fast Infrared

Interface

Connectivity

Peripherals

Fast infrared interface

FLEXCAN-1 Flexible

FLEXCAN-2 Controller Area

Network

Connectivity

Peripherals

The controller area network (CAN) protocol was primarily, but not

exclusively, designed to be used as a vehicle serial data bus. Meets the

following specific requirements of this application: real-time processing,

reliable operation in the EXTMC environment of a vehicle,

cost-effectiveness and required bandwidth. The FLEXCAN is a full

implementation of the CAN protocol specification, Version 2.0 B (ISO

11898), which supports both standard and extended message frames at

1 Mbps.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block Name Subsystem Brief Description

General Purpose System

Block

Mnemonic

GPIO-1

GPIO-2

GPIO-3

GPIO-4

GPIO-5

GPIO-6

GPIO-7

These modules are used for general purpose input/output to external ICs.

Each GPIO module supports up to 32 bits of I/O.

I/O Modules

Control

Peripherals

GPT

General Purpose Timer

Each GPT is a 32-bit “free-running” or “set and forget” mode timer with a

programmable prescaler and compare and capture register. A timer counter

value can be captured using an external event, and can be configured to

trigger a capture event on either the leading or trailing edges of an input

pulse. When the timer is configured to operate in “set and forget” mode, it is

capable of providing precise interrupts at regular intervals with minimal

processor intervention. The counter has output compare logic to provide the

status and interrupt at comparison. This timer can be configured to run

either on an external clock or on an internal clock.

Timer

Peripherals

GPU3D

GPU2D

Graphics

Processing Unit Peripherals

Multimedia

The GPU, version 3, provides hardware acceleration for 2D and 3D

graphics algorithms with sufficient processor power to run desk-top quality

interactive graphics applications on displays up to HD1080 resolution. It

supports color representation up to 32 bits per pixel. GPU enables

high-performance mobile 3D and 2D vector graphics at rates up to 33

Mtriangles/s, 200 Mpix/s, 800 Mpix/s (z).

Graphics

Processing

Unit-2D

Multimedia

Peripherals

The GPU2D version 1, provides hardware acceleration for 2D graphic

algorithms with sufficient processor power to run desk-top quality

interactive graphics applications on displays up to HD1080 resolution.

I2C-1

I2C-2

I2C-3

I²C Controller

Connectivity

Peripherals

I²C provides serial interface for controlling peripheral devices. Data rates of

up to 400 kbps are supported.

IIM

IC Identification Security

Module

The IC identification module (IIM) provides an interface for reading,

programming, and/or overriding identification and control information stored

in on-chip fuse elements. The module supports electrically programmable

poly fuses (e-Fuses). The IIM also provides a set of volatile

software-accessible signals that can be used for software control of

hardware elements not requiring non-volatility. The IIM provides the primary

user-visible mechanism for interfacing with on-chip fuse elements. Among

the uses for the fuses are unique chip identifiers, mask revision numbers,

cryptographic keys, JTAG secure mode, boot characteristics, and various

control signals requiring permanent non-volatility. The IIM also provides up

to 28 volatile control signals. The IIM consists of a master controller, a

software fuse value shadow cache, and a set of registers to hold the values

of signals visible outside the module.

IIM interfaces to the electrical fuse array (split to banks). Enabled to set up

boot modes, security levels, security keys and many other system

parameters.

i.MX53xDA consists of 4 x 256-bit + 1x 128-bit fuse-banks (total 1152 bits)

through IIM interface.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

11

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

IOMUXC

IPU

IOMUX Control

System

Control

Peripherals

This module enables flexible I/O multiplexing. Each I/O pad has default as

well as several alternate functions. The alternate functions are software

configurable.

Image

Multimedia

Version 3M IPU enables connectivity to displays, relevant processing and

synchronization. It supports two display ports and two camera ports,

through the following interfaces:

Processing Unit Peripherals

• Legacy parallel interfaces

• Single/dual channel LVDS display interface

• Analog TV or VGA interfaces

The processing includes:

• Image enhancement—color adjustment and gamut mapping, gamma

correction and contrast enhancement

• Video/graphics combining

• Support for display backlight reduction

• Image conversion—resizing, rotation, inversion and color space

conversion

• Hardware de-interlacing support

• Synchronization and control capabilities, allowing autonomous

operation.

KPP

LDB

Keypad Port

Connectivity

Peripherals

The KPP supports an 8 × 8 external keypad matrix. The KPP features are

as follows:

• Open drain design

• Glitch suppression circuit design

• Multiple keys detection

• Standby key press detection

LVDS Display

Bridge

Connectivity

Peripherals

LVDS display bridge is used to connect the IPU (image processing unit) to

external LVDS display interface. LDB supports two channels; each channel

has following signals:

• 1 clock pair

• 4 data pairs

On-chip differential drivers are provided for each pair.

OWIRE

PATA

One-Wire

Interface

Connectivity

Peripherals

One-wire support provided for interfacing with an on-board EEPROM, and

smart battery interfaces, for example, Dallas DS2502.

Parallel ATA

Connectivity

Peripherals

The PATA block is a AT attachment host interface. Its main use is to interface

with hard disk drives and optical disc drives. It interfaces with the ATA-6

compliant device over a number of ATA signals. It is possible to connect a

bus buffer between the host side and the device side.

PWM-1

PWM-2

Pulse Width

Modulation

Connectivity

Peripherals

The pulse-width modulator (PWM) has a 16-bit counter and is optimized to

generate sound from stored sample audio images. It can also generate

tones. The PWM uses 16-bit resolution and a 4 x 16 data FIFO to generate

sound.

INTRAM

Internal RAM

Internal

Memory

Internal RAM, shared with VPU.

The on-chip memory controller (OCRAM) module, is an interface between

the system’s AXI bus, to the internal (on-chip) SRAM memory module. It is

used for controlling the 128 KB multimedia RAM, through a 64-bit AXI bus.

BOOTROM Boot ROM

Internal

Memory

Supports secure and regular boot modes.

The ROM controller supports ROM patching.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

12

Freescale Semiconductor

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

RTIC

Run-Time

Integrity Checker

Security

Protecting read only data from modification is one of the basic elements in

trusted platforms. The run-time integrity checker, version 3 (RTIC) block is

a data-monitoring device responsible for ensuring that the memory content

is not corrupted during program execution. The RTIC mechanism

periodically checks the integrity of code or data sections during normal OS

run-time execution without interfering with normal operation. The purpose

of the RTIC is to ensure the integrity of the peripheral memory contents,

protect against unauthorized external memory elements replacement and

assist with boot authentication.

SAHARA

Security

Accelerator

Security

SAHARA (symmetric/asymmetric hashing and random accelerator),

version 4, is a security coprocessor. It implements symmetric encryption

algorithms, (AES, DES, 3DES, RC4 and C2), public key algorithms (RSA

and ECC), hashing algorithms (MD5, SHA-1, SHA-224 and SHA-256), and

a hardware true random number generator. It has a slave IP Bus interface

for the host to write configuration and command information, and to read

status information. It also has a DMA controller, with an AHB bus interface,

to reduce the burden on the host to move the required data to and from

memory.

SATA

Serial ATA

Connectivity

Peripherals

SATA HDD interface, includes the SATA controller and the PHY. It is a

complete mixed-signal IP solution for SATA HDD connectivity.

SCCv2

Security

Controller, ver. 2

Security

The security controller is a security assurance hardware module designed

to safely hold sensitive data, such as encryption keys, digital right

management (DRM) keys, passwords and biometrics reference data. The

SCCv2 monitors the system’s alert signal to determine if the data paths to

and from it are secure, that is, it cannot be accessed from outside of the

defined security perimeter. If not, it erases all sensitive data on its internal

RAM. The SCCv2 also features a key encryption module (KEM) that allows

non-volatile (external memory) storage of any sensitive data that is

temporarily not in use. The KEM utilizes a device-specific hidden secret key

and a symmetric cryptographic algorithm to transform the sensitive data

into encrypted data.

SDMA

Smart Direct

Memory Access Control

Peripherals

System

The SDMA is multi-channel flexible DMA engine. It helps in maximizing

system performance by off loading various cores in dynamic data routing.

The SDMA features list is as follows:

• Powered by a 16-bit instruction-set micro-RISC engine

• Multi-channel DMA supports up to 32 time-division multiplexed DMA

channels

• 48 events with total flexibility to trigger any combination of channels

• Memory accesses including linear, FIFO, and 2D addressing

• Shared peripherals between ARM and SDMA

• Very fast context-switching with two-level priority-based preemptive

multi-tasking

• DMA units with auto-flush and prefetch capability

• Flexible address management for DMA transfers (increment, decrement,

and no address changes on source and destination address)

• DMA ports can handle unidirectional and bidirectional flows (copy mode)

• Up to 8-word buffer for configurable burst transfers to / from the EXTMC

• Support of byte swapping and CRC calculations

• A library of scripts and API is available

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

13

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Secure /

Subsystem

Brief Description

SECRAM

SJC

Internal

Secure / non-secure Internal RAM, controlled by SCC.

Non-secure RAM Memory

Secure JTAG

Interface

System

Control

Peripherals

JTAG manipulation is a known hacker’s method of executing unauthorized

program code, getting control over secure applications, and running code in

privileged modes. The JTAG port provides a debug access to several

hardware blocks including the ARM processor and the system bus.

The JTAG port must be accessible during platform initial laboratory

bring-up, manufacturing tests and troubleshooting, as well as for software

debugging by authorized entities. However, in order to properly secure the

system, unauthorized JTAG usage should be strictly forbidden.

In order to prevent JTAG manipulation while allowing access for

manufacturing tests and software debugging, the i.MX53xD processor

incorporates a mechanism for regulating JTAG access. SJC provides four

different JTAG security modes that can be selected through an e-fuse

configuration.

SPBA

SPDIF

SRTC

Shared

Peripheral Bus

Arbiter

System

Control

Peripherals

SPBA (shared peripheral bus arbiter) is a two-to-one IP bus interface (IP

bus) arbiter.

Sony Philips

Digital Interface Peripherals

Multimedia

A standard digital audio transmission protocol developed jointly by the Sony

and Philips corporations. Both transmitter and receiver functionalists are

supported.

Secure Real

Time Clock

Security

The SRTC incorporates a special system state retention register (SSRR)

that stores system parameters during system shutdown modes. This

register and all SRTC counters are powered by dedicated supply rail

NVCC_SRTC_POW. The NVCC_SRTC_POW can be energized

separately even if all other supply rails are shut down. This register is helpful

for storing warm boot parameters. The SSRR also stores the system

security state. In case of a security violation, the SSRR mark the event

(security violation indication).

SSI-1

SSI-2

SSI-3

I2S/SSI/AC97

Interface

Connectivity

Peripherals

The SSI is a full-duplex synchronous interface used on the i.MX53xDA

processor to provide connectivity with off-chip audio peripherals. The SSI

interfaces connect internally to the AUDMUX for mapping to external ports.

The SSI supports a wide variety of protocols (SSI normal, SSI network, I2S,

and AC-97), bit depths (up to 24 bits per word), and clock/frame sync

options.

Each SSI has two pairs of 8 x 24 FIFOs and hardware support for an

external DMA controller in order to minimize its impact on system

performance. The second pair of FIFOs provides hardware interleaving of

a second audio stream, which reduces CPU overhead in use cases where

two time slots are being used simultaneously.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

14

Freescale Semiconductor

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

IPTP

IEEE1588

Precision Time

Protocol

Connectivity

Peripherals

The IEEE 1588-2002 (version 1) standard defines a precision time protocol

(PTP) - which is a time-transfer protocol that enables synchronization of

networks (for example, Ethernet), to a high degree of accuracy and

precision.

The IEEE1588 hardware assist is composed of the two blocks: time stamp

unit and real time clock, which provide the timestamping protocol’s

functionality, generating and reading the needed timestamps.

The hardware-assisted implementation delivers more precise clock

synchronization at significantly lower CPU load compared to purely

software implementations.

Temperature

Monitor

(Part of SATA

Block)

System

Control

Peripherals

The temperature sensor is an internal module to the i.MX53xD that

monitors the die temperature. The monitor is capable in generating SW

interrupt, or trigger the CCM, to reduce the core operating frequency.

TVE

TV Encoder

Multimedia

The TV encoder, version 2.1 is implemented in conjunction with the image

processing unit (IPU) allowing handheld devices to display captured still

images and video directly on a TV or LCD projector. It supports composite

PAL/NTSC, VGA, S-video, and component up to HD1080p analog video

outputs.

TZIC

TrustZone Aware ARM/Control The TrustZone interrupt controller (TZIC) collects interrupt requests from all

Interrupt

Controller

i.MX53xD sources and routes them to the ARM core. Each interrupt can be

configured as a normal or a secure interrupt. Software Force Registers and

software Priority Masking are also supported.

UART-1

UART-2

UART-3

UART-4

UART-5

UART Interface

Connectivity

Peripherals

Each of the UART blocks supports the following serial data transmit/receive

protocols and configurations:

• 7 or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd,

or none)

• Programmable bit-rates up to 4 Mbps. This is a higher max baud rate

relative to the 1.875 Mbps, which is specified by the TIA/EIA-232-F

standard.

• 32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud

• IrDA 1.0 support (up to SIR speed of 115200 bps)

• Option to operate as 8-pins full UART, DCE, or DTE

USB

USB Controller

Connectivity

Peripherals

USB supports USB2.0 480 MHz, and contains:

• One high-speed OTG sub-block with integrated HS USB PHY

• One high-speed host sub-block with integrated HS USB PHY

• Two identical high-speed Host modules

The high-speed OTG module, which is internally connected to the HS USB

PHY, is equipped with transceiver-less logic to enable on-board USB

connectivity without USB transceivers

All the USB ports are equipped with standard digital interfaces (ULPI, HS

IC-USB) and transceiver-less logic to enable onboard USB connectivity

without USB transceivers.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

15

Modules List

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic

Block Name

Subsystem

Brief Description

VPU

VideoProcessing Multimedia

A high-performing video processing unit (VPU) version 3, which covers

many SD-level video decoders and SD-level encoders as a multi-standard

video codec engine as well as several important video processing such as

rotation and mirroring.

Unit

Peripherals

VPU Features:

• MPEG-2 decode, Mail-High profile, up to 1080i/p resolution, 40 Mbps bit

rate

• MPEG4/XviD decode, SP/ASP profile, up to 1080 i/p resolution, 40 Mbps

bit rate

• H.263 decode, P0/P3 profile, up to 16CIF resolution, 20 Mbps bit rate

• Sorenson H.263 decode, 4CIF resolution, 8 Mbps bit rate

• H.264 decode, BP/MP/HP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• VC1 decode, SP/MP/AP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• RV10 decode, 8/9/2010 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• DivX decode, 3/4/5/6 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• MJPEG decode, Baseline profile, up to 8192 x 8192 resolution,

40 Mpixel/s bit rate for 4:4:4 format

• MPEG2¹encode, Main-Main profile, up to D1 resolution, 15 Mbps bit

rate

• MPEG4 encode, Simple profile, up to 720p resolution, 12 Mbps bit rate²

• H.263 encode, P0/P3 profile, up to 4CIF resolution, 8 Mbps bit rate²

• H.264 encode, Baseline profile, up to 720p resolution, 14 Mbps bit rate²

• MJPEG encode, Baseline profile, up to 8192 x 8192 resolution,

80 Mpixel/s bit rate for 4:2:2 format

WDOG-1

Watch Dog

Timer

Peripherals

The watch dog timer supports two comparison points during each counting

period. Each of the comparison points is configurable to evoke an interrupt

to the ARM core, and a second point evokes an external event on the

WDOG line.

WDOG-2

(TZ)

Watch Dog

(TrustZone)

Timer

Peripherals

The TrustZone watchdog (TZ WDOG) timer module protects against

TrustZone starvation by providing a method of escaping normal mode and

forcing a switch to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. This situation should be

avoided, as it can compromise the system’s security. Once the TZ WDOG

module is activated, it must be serviced by TZ software on a periodic basis.

If servicing does not take place, the timer times out. Upon a time-out, the

TZ WDOG asserts a TZ mapped interrupt that forces switching to the TZ

mode. If it is still not served, the TZ WDOG asserts a security violation

signal to the CSU. The TZ WDOG module cannot be programmed or

deactivated by a normal mode SW.

XTALOSC

24 MHz Crystal

Oscillator

Clocking

Provides a crystal oscillator amplifier that supports a 24-MHz external

crystal

XTALOSC_ 32.768 KHz

32K Crystal Oscillator

I/F

Provides a crystal oscillator amplifier that supports a 32.768-kHz external

crystal.

1

2

Video partially performed in hardware accelerator (70%) and partially in software.

VPU can generate higher bit rate than the maximum specified by the corresponding standard.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

16

Freescale Semiconductor

Electrical Characteristics

3.1

Special Signal Considerations

The package contact assignments can be found in Section 6, “Package Information and Contact

Assignments.” Signal descriptions are defined in the i.MX53 Reference Manual. Special signal

considerations information is contained in Chapter 1 of i.MX53 System Development User's Guide.

Document number is MX53UG.

4 Electrical Characteristics

This section provides the device and module-level electrical characteristics for the i.MX53xD processor.

NOTE

This electrical specification is preliminary. These specifications are not fully

tested or guaranteed at this early stage of the product life cycle. Finalized

specifications will be published after thorough characterization and device

qualifications have been completed.

4.1

Chip-Level Conditions

This section provides the device-level electrical characteristics for the IC. See Table 3 for a quick reference

to the individual tables and sections.

Table 3. i.MX53xD Chip-Level Conditions

For these characteristics, …

Absolute Maximum Ratings

Topic appears …

Table 4 on page 18

Table 5 on page 18

Table 7 on page 20

Table 8 on page 22

Table 9 on page 23

Table 10 on page 25

TEPBGA-2 Package Thermal Resistance Data

i.MX53xD Operating Ranges

External Clock Sources

Maximal Supply Currents

USB Interface Current Consumption

4.1.1

Absolute Maximum Ratings

CAUTION

Stresses beyond those listed under Table 4 may cause permanent damage to

the device. These are stress ratings only. Functional operation of the device

at these or any other conditions beyond those indicated under Table 7 is not

implied. Exposure to absolute-maximum-rated conditions for extended

periods may affect device reliability.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

17

Electrical Characteristics

Table 4. Absolute Maximum Ratings

Symbol

Parameter Description

Min

Max

Unit

Peripheral Core Supply Voltage

ARM Core Supply Voltage

Supply Voltage UHVIO

Supply Voltage for non UHVIO

USB VBUS

VCC

VDDGP

–0.3

–0.5

—

1.35

3.6

V

Supplies denoted as I/O Supply

VBUS

3.3

5.25

3.63¹

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN

–0.3

Input/Output Voltage Range

ESD Damage Immunity:

V_in/V_out

V_esd

–0.5

OVDD +0.3²

V

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage Temperature Range

T_STORAGE

–40

150

^oC

1

USB_DN and USB_DP can tolerate 5 V for up to 24 hours.

2

The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 112 on page 154. The maximum range can be superseded by the DC tables.

4.1.2

Thermal Resistance

4.1.2.1

TEPBGA-2 Package Thermal Resistance

Table 5 provides the TEPBGA-2 package thermal resistance data.

Table 5. TEPBGA-2 Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)^{1, 2}

Single layer board

(1s)

R_θJA

28

°C/W

Junction to Ambient (natural convection)^{1, 2, 3}

Junction to Ambient (at 200 ft/min)^{1, 3}

Four layer board

(2s2p)

R_θJA

R_θJMA

16

21

13

°C/W

Single layer board

(1s)

Four layer board

(2s2p)

Junction to Board⁴

—

R_θJB

R_θJC

Ψ_JT

6

4

°C/W

Junction to Case⁵

Junction to Package Top (natural convection)⁶

1

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2

Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

18

Freescale Semiconductor

Electrical Characteristics

3

4

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5

6

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

4.1.2.2

PoP Package Thermal Resistance

Table 6 provides the PoP package thermal resistance data.

1

Table 6. PoP Package Thermal Resistance Data

Center

Array of

Pillars

used for

Ground

As

designed

Rating

Board

Symbol

Unit

Junction to Ambient (natural convection)^{2, 3}

Singlelayerboard

(1s)

R_θJA

R_θJMA

45

23

36

19

45

22

35

18

°C/W

Junction to Ambient (natural convection)^{2, 3, 4}Four layer board

(2s2p)

Junction to Ambient (at 200 ft/min)^{2, 4}

Singlelayerboard

(1s)

Junction to Ambient (at 200 ft/min)^{2, 4}

Four layer board

(2s2p)

Junction to Board⁵

—

R_θJB

R_θJC

Ψ_JT

8.4

<0.1

2

7.2

<0.1

2

°C/W

Junction to Case⁶

Junction to Package Top (natural convection)⁷

1

2

Calculated for just the i.MX53xD package, without the top mounted memory package.

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

3

4

5

Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

6

7

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

19

Electrical Characteristics

4.1.3

Operating Ranges

Table 7 provides the operating ranges of i.MX53xD processor.

Table 7. i.MX53xD Operating Ranges

Symbol

Parameter

ARM core supply voltage

f_ARM≤ 167 MHz

Minimum¹Nominal²Maximum¹Unit

0.85

0.9

0.95

1.1

0.95

1.05

1.15

1.3

V

ARM core supply voltage

f_ARM≤ 400 MHz

VDDGP³

ARM core supply voltage

f_ARM≤ 800 MHz

1.05

1.2

ARM core supply voltage

f_ARM≤ 1000 MHz

1.25

0.85

ARM core supply voltage

Stop mode

0.8

1.3

Peripheral supply voltage

1.25

0.9

1.3

1.35

V

Peripheral supply voltage—Stop mode

0.95

VCC

Memory arrays voltage

1.25

0.9

1.30

0.95

1.30

0.95

1.3

1.35

1.95

V

VDDA⁴

Memory arrays voltage—Stop mode

L1 Cache Memory arrays voltage

1.25

0.9

VDDAL1⁴

L1 Cache Memory arrays voltage—Stop mode

PLL Digital supplies—external regulator option

PLL Analog supplies—external regulator option

VDD_DIG_PLL⁵

VDD_ANA_PLL⁶

1.25

1.75

1.65

1.8

ESD protection of the CKIH pins, FUSE read Supply

and 1.8V bias for the UHVIO pads

1.8

NVCC_CKIH

NVCC_LCD

NVCC_JTAG

GPIO digital power supplies

1.65

1.8 or

2.775

3.1

V

NVCC_LVDS

LVDS interface Supply

2.25

1.7

2.5

1.8

1.2

1.55

1.5

—

2.75

1.9

V

NVCC_LVDS_BG

LVDS Band Gap Supply

DDR Supply DDR2 range

DDR Supply LPDDR2 range

1.14

1.47

1.42

3.0

1.3

NVCC_EMI_DRAM

VDD_FUSE⁷

1.63

1.58

3.3

V

DDR Supply LV-DDR2 range

DDR Supply DDR3 range

Fusebox Program Supply (Write Only)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

20

Freescale Semiconductor

Electrical Characteristics

Table 7. i.MX53xD Operating Ranges (continued)

Symbol

Parameter

Minimum¹Nominal²Maximum¹Unit

NVCC_NANDF

NVCC_SD1

NVCC_SD2

Ultra High voltage I/O (UHVIO) supplies:

• UHVIO_L

1.65

2.5

1.8

1.95

3.1

NVCC_PATA

• UHVIO_H

2.775

NVCC_KEYPAD

NVCC_GPIO

NVCC_FEC

V

• UHVIO_UH

3.0

3.3

3.6

2.91

3.1

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_CSI

TVE digital and analog power supply, TVE-to-DAC

level shifter supply, cable detector supply, analog

power supply to RGB channel

2.69

1.65

2.75

V

TVDAC_DHVDD⁸

TVDAC_AHVDDRGB⁸

For GPIO use only, when TVE is not in use

1.8 or

2.775

NVCC_SRTC_POW

NVCC_RESET

SRTC Core and slow I/O Supply (GPIO)⁹

LVIO

1.25

1.65

1.3

1.35

3.1

V

1.8 or

2.775

USB_H1_VDDA25

USB_OTG_VDDA25

NVCC_XTAL

USB_PHY analog supply, oscillator amplifier analog

supply¹⁰

2.25

3.0

2.5

2.75

3.6

V

USB_H1_VDDA33

USB PHY I/O analog supply

3.3

USB_OTG_VDDA33

See Table 4 on page 18 and Table 105 on page 146

for details. Note that this is not a power supply.

VBUS

—

V

VDD_REG¹¹

Power supply input for the integrated linear

regulators

2.37

2.5

2.63

VP

VPH

Tj

SATA PHY core power supply

SATA PHY I/O supply voltage

Junction Temperature

1.25

2.25

–20

1.3

2.5

1.35

2.75

105

V

95¹²

^oC

1

2

3

Voltage at the package power supply contact must be maintained between the minimum and maximum voltages. The design

must allow for supply tolerances and system voltage drops.

The nominal values for the supplies indicate the target setpoint for a tolerance no tighter than 50 mV. Use of supplies with a

tighter tolerance allows reduction of the setpoint with commensurate power savings.

A voltage transition is allowed for the required supply ramp up to the nominal value prior to achieving a clock speed increase.

Similarly, to accommodate a frequency reduction, a voltage transition is allowed for a supply ramp down to the nominal value

after the frequency is decreased.

4

5

VDDA and VDDAL1 can be driven by the VDD_DIG_PLL internal regulator using external connections. When operating in this

configuration, the regulator is still operating at the default 1.2 V, as bootup start. During bootup initialization, software should

increase this regulator voltage to match VCC (1.3 V nominal) in order to reduce internal leakage current.

By default, VDD_DIG_PLL is driven from internal on-die 1.2 V linear regulator (LDO). In this case, there is no need driving this

supply externally. LDO output to VDD_DIG_PLL should be configured by software after power-up to 1.3 V output. A bypass

capacitor of minimal value 22 μF should be connected to this pad in any case whether it is driven internally or externally. Use

of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.

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21

Electrical Characteristics

6

By default, the VDD_ANA_PLL is driven from internal on-die 1.8 V linear regulator (LDO). In this case there is no need driving

this supply externally. A bypass capacitor of minimal value 22 μF should be connected to this pad in any case whether it is

driven internally or externally. Use of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.

7

After fuses are programmed, Freescale strongly recommends the best practice of reading the fuses to verify that they are

written correctly. In Read mode, VDD_FUSE should be floated or grounded. Tying VDD_FUSE to a positive supply (3.0 V–3.3

V) increases the possibility of inadvertently blowing fuses and is not recommended in read mode.

8

If not using TVE module or other pads in this power domain for the product, the TVDAC_DHVDD and TVDAC_AHVDDRGB

can remain floating.

9

GPIO pad operational at low frequency

¹⁰The analog supplies should be isolated in the application design. Use of series inductors is recommended.

¹¹VDD_REG is power supply input for the integrated linear regulators of VDD_ANA_PLL and VDD_DIG_PLL when they are

configured to the internal supply option. VDDR_REG still has to be tied to 2.5 V supply when VDD_ANA_PLL and

VDD_DIG_PLL are configured for external power supply mode although in this case it is not used as supply source.

¹²Lifetime of 21,900 hours based on 95 C junction temperature at nominal supply voltages.

4.1.4

External Clock Sources

The i.MX53xD device has four external input system clocks, a low frequency (CKIL), a high frequency

(XTAL), and two general purpose CKIH1 and CKIH2 clocks.

The CKIL is used for low-frequency functions. It supplies the clock for wake-up circuit, power-down real

time clock operation, and slow system and watch-dog counters. The clock input can be connected to either

external oscillator or a crystal using internal oscillator amplifier.

The system clock input XTAL is used to generate the main system clock. It supplies the PLLs and other

peripherals. The system clock input can be connected to either external oscillator or a crystal using internal

oscillator amplifier.

CKIH1 and CKIH2 provide additional clock source option for peripherals that require specific and

accurate frequencies.

Table 8 shows the interface frequency requirements. Refer to Chapter 1 of the i.MX53 System

Development User's Guide for additional clock and oscillator information. Document number is

MX53UG.

Table 8. External Input Clock Frequency

Parameter Description

CKIL Oscillator¹

Symbol

Min

Typ

Max

Unit

f_ckil

—

32.768²/32.0

—

kHz

CKIH1, CKIH2 Operating

Frequency

f_ckih1

f_ckih2

,

See Table 33, "CAMP Electrical Parameters (CKIH1,

CKIH2)," on page 47

MHz

XTAL Oscillator

f_xtal

22

24

27

MHz

1

External oscillator or a crystal with internal oscillator amplifier.

Recommended nominal frequency 32.768 kHz.

2

4.1.5

Maximal Supply Currents

Table 9 represents the maximal momentary current transients on power lines, and should be used for power

supply selection. Maximal currents higher by far than the average power consumption of typical use cases.

For typical power consumption information, refer to i.MX53xD power consumption application note.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Electrical Characteristics

Unit

Table 9. Maximal Supply Currents

Power Line

Conditions

Max Current

VDDGP

VCC

1000 MHz ARM clock.

1700

800

100

10

mA

VDDA+VDDAL1

VDD_DIG_PLL

VP

20

VDD_ANA_PLL

MVCC_XTAL

VDD_REG

10

25

325

120

VDD_FUSE

Fuse Write Mode

operation

1.8v (DDR2)

1.5v (DDR3)

1.2v (LPDDR2)

800

650

250

200

<1

mA

NVCC_EMI_DRAM

TVDAC_DHVDD + TVDAC_AHVDDRGB

NVCC_SRTC_POW

USB_H1_VDDA25 +

USB_OTG_VDDA25

50

USB_H1_VDDA33 +

USB_OTG_VDDA33

20

mA

VPH

60

NVCC_CKIH

Use maximal IO Eq¹, N=4

NVCC_CSI

Use maximal IO Eq¹, N=20

Use maximal IO Eq¹, N=39

Use maximal IO Eq¹, N=16

Use maximal IO Eq¹, N=78

Use maximal IO Eq¹, N=11

Use maximal IO Eq¹, N=13

Use maximal IO Eq¹, N=6

Use maximal IO Eq¹, N=11

Use maximal IO Eq¹, N=29

Use maximal IO Eq¹, N=20

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_EMI_DRAM

NVCC_FEC

NVCC_GPIO

NVCC_JTAG

NVCC_KPAD

NVCC_LCD

NVCC_LVDS

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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23

Electrical Characteristics

Table 9. Maximal Supply Currents (continued)

Conditions Max Current

Power Line

Unit

NVCC_LVDS_BG

NVCC_NANDF

NVCC_PATA

NVCC_REST

NVCC_SD1

Use maximal IO Eq¹, N=1

Use maximal IO Eq¹, N=8

Use maximal IO Eq¹, N=29

Use maximal IO Eq¹, N=5

Use maximal IO Eq¹, N=6

Use maximal IO Eq¹, N=2

NVCC_SD2

NVCC_XTAL

1

General Equation for estimated, maximal power consumption of an IO power supply:

Imax = N * C * V * (0.5 * F)

Where:

N - Number of IO pins supplies by the power line

C - Equivalent external capacitive load

V - IO voltage

(0.5 * F) - Data change rate. Up to 0.5 of the clock rate (F).

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Electrical Characteristics

4.1.6

USB-OH-3 (OTG + 3 Host ports) Module and the Two USB PHY (OTG

and H1) Current Consumption

Table 10 shows the USB interface current consumption.

Table 10. USB Interface Current Consumption

Parameter

Conditions

Typical at 25 °C

Max

Unit

RX

TX

RX

TX

RX

TX

RX

TX

RX

TX

RX

TX

5.5

7

6

8

Full Speed

Analog Supply 3.3 V

USB_H1_VDDA33

USB_OTG_VDDA33

mA

5

6

High Speed

Full Speed

High Speed

Full Speed

High Speed

5

6

6.5

12

21

8

7

Analog Supply 2.5 V

USB_H1_VDDA25

USB_OTG_VDDA25

7

mA

13

22

—

8

Digital Supply

VCC (1.2 V)

8

4.2

Power Supplies Requirements and Restrictions

The system design must comply with power-up sequence, power-down sequence and steady state

guidelines as described in this section to guarantee the reliable operation of the device. Any deviation from

these sequences may result in the following situations:

•

Excessive current during power-up phase

Prevention of the device from booting

Irreversible damage to the i.MX53xD processor (worst-case scenario)

4.2.1

Power-Up Sequence

The following observations should be considered:

•The consequent steps in power up sequence should not start before the previous step supplies have

been stabilized within 90-110% of their nominal voltage, unless stated otherwise.

•NVCC_SRTC_POW should remain powered ON continuously, to maintain internal real-time

clock status. Otherwise, it has to be powered ON together with VCC, or preceding VCC.

•The VCC should be powered ON together, or any time after NVCC_SRTC_POW.

•NVCC_CKIH should be powered ON after VCC is stable and before other IO supplies

(NVCC_xxx) are powered ON.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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25

Electrical Characteristics

•IO Supplies (NVCC_xxx) below or equal to 2.8 V nom./3.1 V max. should not precede

NVCC_CKIH. They can start powering ON during NVCC_CKIH ramp-up, before it is

stabilized. Within this group, the supplies can be powered-up in any order.

•IO Supplies (NVCC_xxx) above 2.8 V nom./3.1 V max. should be powered ON only after

NVCC_CKIH is stable.

•In case VDD_DIG_PLL and VDD_ANA_PLL are powered ON from internal voltage regulator

(default case for i.MX53xD), there are no related restrictions on VDD_REG, as it is used as their

internal regulators power source.

If VDD_DIG_PLL and VDD_ANA_PLL are powered on externally, to reduce current leakage

during the power-up, it is recommended to activate the VDD_REG before or at the same time

with VDD_DIG_PLL and VDD_ANA_PLL. If this sequencing is not possible, make sure that

the 2.5 V VDD_REG supply shut-off output impedance is higher than 1 kΩ when it is inactive.

•VDD_REG supply is required to be powered ON to enable DDR operation. It must be powered

on after VCC and before NVCC_EMI_DRAM. The sequence should be:

VCC →VDD_REG →NVCC_EMI_DRAM

•NVCC_EIM_DRAM_2P5 PoP additional power line timing is the same as DVV_REG

•VDDA and VDDAL1 can be powered ON anytime before POR_B, regardless of any other power

signal.

•VDDGP can be powered ON anytime before POR_B, regardless of any other power signal.

•VP and VPH can be powered up together, or anytime after, the VCC. VP and VPH should come

before POR.

•TVDAC_DHVDD and TVDAC_AHVDDRGB should be powered from the same regulator. This

is due to ESD diode protection circuit, that may cause current leakage if one of the supplies is

powered ON before the other.

NOTE

The POR_B input must be immediately asserted at power-up and remain

asserted until after the last power rail reaches its working voltage.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Electrical Characteristics

Figure 2 shows the power-up sequence diagram.

NVCC_SRTC_POW

90%

(may remain ON)

VCC

90%

Δt > 0

NVCC_CKIH

90%

Δt > 0

IO Supplies below or equal to

2.8 V nom./3.1 V max.

90%

(in any order, after NVCC_CKIH

ramp up start, if needed)

Δt > 0

IO Supplies above 2.8 V nom./3.1 V max

(in any order, if needed)

Δt > 0

90%

VDD_REG

Δt > 0

90%

NVCC_EMI_DRAM

Δt > 0

VP, VPH

(in any order)

90%

Δt > 0

VDDA,VDDAL1,VDDGP

(in any order)

90%

POR_B

1

Figure 2. Power Up Detailed Sequence

NOTE

Need to ensure that there is no back voltage (leakage) from any supply on

the board towards the 3.3 V supply (for example, from the parts that use

both 1.8 V and the 3.3 V supply).

1. If fuse writing is required, VDD_FUSE should be powered ON after NVCC_CKIH is stable.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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27

Electrical Characteristics

4.2.2

Power-Down Sequence

Power-down sequence should follow one of the following two options:

Option 1: Switch all supplies down simultaneously with further free discharge. A deviation of few

microseconds of actual power-down of the different power rails is acceptable.

Option 2: Switch down supplies, in any order, keeping the following rules:

•

NVCC_CKIH must be powered down at the same time or after the UHVIO IO cell supplies (for

full supply list, refer to Table 7^,Ultra High voltage I/O (UHVIO) supplies). A deviation of few

microseconds of actual power-down of the different power rails is acceptable.

•

VDD_REG must be powered down at the same time or after NVCC_EMI_DRAM supply. A

deviation of few microseconds of actual power-down of the different power rails is acceptable.

If all of the following conditions are met:

— 1. VDD_REG is powered down to 0V (Not Hi-Z)

— 2. VDD_DIG_PLL and VDD_ANA_PLL are provided externally,

— 3. VDD_REG is powered down before VDD_DIG_PLL and VDD_ANA_PLL

Then the following rule should be kept: VDD_REG output impedance must be higher than 1 kΩ,

when inactive.

4.2.3

Power Supplies Usage

•

All IO pins should not be externally driven while the IO power supply for the pin (NVCC_xxx) is

off. This can cause internal latch-up and malfunctions due to reverse current flows. For information

about IO power supply of each pin refer to “Power Rail” columns in pin list tables of Section 6,

“Package Information and Contact Assignments.”

•

If not using SATA interface and the embedded thermal sensor, the VP and VPH should be

grounded. In particular, keeping VPH turned OFF while the VP is powered ON is not

recommended and might lead to excessive power consumption.

•

When internal clock source is used for SATA temperature monitor the USB_PHY supplies and

PLL need to be active because they are providing the clock.

If not using TVE the module, the TVDAC_DHVDD and TVDAC_AHVDDRGB can remain

floating. If only the GPIO pads in TVDAC_AHVDDRGB domain are in use, the supplies can be

set to GPIO pad voltage range (1.65 V to 3.1 V).

4.3

I/O DC Parameters

This section includes the DC parameters of the following I/O types:

•

General Purpose I/O (GPIO)

Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2 and DDR3 modes

Low Voltage I/O (LVIO)

Ultra High Voltage I/O (UHVIO)

LVDS I/O

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Electrical Characteristics

NOTE

The term ‘OVDD’ in this section refers to the associated supply rail of an

input or output. The association is shown in Table 112.

Figure 3. Circuit for Parameters Voh and Vol for IO Cells

4.3.1

General Purpose I/O (GPIO) DC Parameters

The parameters in Table 11 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

Table 11 shows DC parameters for GPIO pads, operating at two supply ranges:

•

1.1 V to 1.3 V

1.65 V to 3.1 V

Table 11. GPIO I/O DC Electrical Characteristics

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

High-level output voltage¹

Voh

Iout = –1 mA

Iout= specified Ioh Drive

OVDD – 0.15

0.8*OVDD

—

V

Low-level output voltage¹

Vol

Ioh

Iout = 1 mA

Iout= specified Iol Drive

—

0.15

^0.2× OVDD

V

High-level output current

(1.1-1.3V OVDD)

Vout = 0.8×OVDD

Low drive

–0.85

–1.7

–2.5

–3.4

Medium drive

High drive

Max drive

—

mA

Low-level output current

(1.1-1.3V OVDD)

Iol

^{Vout = 0.2}×OVDD

Low drive

0.9

1.9

2.9

3.8

Medium drive

High drive

Max drive

—

mA

High-level output current

(1.65-3.1V OVDD)

Ioh

^{Vout = 0.8}×OVDD

Low drive

–2.1

–4.2

–6.3

–8.4

Medium drive

High drive

Max drive

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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29

Electrical Characteristics

Parameter

Table 11. GPIO I/O DC Electrical Characteristics (continued)

Symbol

Test Conditions

Min

Typ

Max

Unit

Low-level output current

(1.65-3.1V OVDD)

Iol

Vout = 0.2×OVDD

Low drive

2.1

4.2

6.3

8.4

Medium drive

High drive

Max drive

—

mA

High-Level DC input voltage^{1, 2}

Low-Level DC input voltage^{1, 2}

Input Hysteresis

VIH

VIL

—

0.7 × OVDD

—

OVDD

0.3 × OVDD

—

V

0

VHYS

OVDD = 1.875 V

OVDD = 2.775 V

0.25

0.34

0.45

Schmitt trigger VT+^{2, 3}

VT+

VT–

Iin

—

0.5 × OVDD

—

V

Schmitt trigger VT–^{2, 3}

—

0.5 × OVDD

Input current (no pull-up/down)

Input current (22 kΩ Pull-up)

Vin = OVDD or 0

2

μA

Iin

Vin = 0 V

Vin = OVDD

161

2

μA

Input current (47 kΩ Pull-up)

Input current (100 kΩ Pull-up)

Input current (100 kΩ Pull-down)

Iin

Vin = 0 V

Vin = OVDD

—

76

2

Vin = 0 V

Vin= OVDD

36

2

Vin = 0 V

Vin = OVDD

—

2

36

μA

kΩ

Keeper Circuit Resistance

130⁴

—

1

Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must be

controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

2

To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s.

3

4

Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

4.3.2

LPDDR2 I/O DC Parameters

The LPDDR2 I/O pads support DDR2/LVDDR2, LPDDR2, and DDR3 operational modes.

4.3.2.1 DDR2 Mode I/O DC Parameters

The DDR2 interface fully complies with JESD79-2E DDR2 JEDEC standard release April, 2008. The

parameters in Table 12 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

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Electrical Characteristics

1

Table 12. DDR2 I/O DC Electrical Parameters

Parameters

Symbol Test Conditions

Min

Typ

Max

Unit

High-level output voltage²

Low-level output voltage

Voh

Vol

Ioh

—

0.9*OVDD

—

0.1*OVDD

—

V

Output minimum Source Current³

OVDD=1.7 V,

Vout=1.42 V

–13.4

mA

Output min Sink Current⁴

Iol

OVDD=1.7 V,

Vout=280 mV

13.4

—

mA

V

Input Reference Voltage

Vref

0.49*OVDD

Vref+0.125V

0.5*OVDD

—

0.51*OVDD

OVDD+0.3

DC input High Voltage (data pins)

Vihd

(dc)

—

DC input Low Voltage (data pins)

Vild (dc)

Vin (dc)

—

–0.3

—

Vref-0.125V

OVDD+0.3

V

DC Input voltage range of each

differential input⁵

DC Differential input voltage required for Vid (dc)

switching ⁶

—

0.25

—

OVDD+0.6

V

Termination Voltage

Vtt

Iin

Vtt

Vref – 0.04

Vref

Vref + 0.04

V

Input current (no pull-up/down)

Vin = 0 V

Vin=OVDD

—

1

μA

Keeper Circuit Resistance

—

130⁷

—

kΩ

1

Note that the JEDEC SSTL_18 specification (JESD8-15a) for a SSTL interface for class II operation supersedes any

specification in this document.

2

3

4

5

6

OVDD is the I/O power supply (1.7 V–1.9 V for DDR2)

(Vout - OVDD) / Ioh must be less than 21 Ω for values of Vout between OVDD and OVDD-0.28 V.

Vout / Iol must be less than 21 Ω for values of Vout between 0 V and 280 mV.

Vin(dc) specifies the allowable DC voltage exertion of each differential input.

Vid(dc) specifies the input differential voltage |Vtr-Vcp| required for switching, where Vtr is the “true” input level and Vcp is the

“complementary” input level. The minimum value is equal to Vih(dc) -Vil(dc).

7

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

4.3.2.2

LPDDR2 Mode I/O DC Parameters

The LPDDR2 interface fully complies with JESD209-2B LPDDR2 JEDEC standard release June, 2009.

1

Table 13. LPDDR2 I/O DC Electrical Parameters

Parameters

Symbol Test Conditions

Min

Typ

Max

Unit

High-level output voltage

Low-level output voltage

Input Reference Voltage

DC input High Voltage

DC input Low Voltage

Voh

—

0.9*OVDD

—

V

Vol

—

0.5*OVDD

—

0.1*OVDD

0.51*OVDD

OVDD

Vref

0.49*OVDD

Vref+0.13V

OVSS

Vih(dc)

Vil(dc)

—

V

—

Vref-0.13V

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Electrical Characteristics

1

Table 13. LPDDR2 I/O DC Electrical Parameters (continued)

Differential Input Logic High

Vih(diff)

0.26

See Note²

-0.26

Differential Input Logic Low

Vil(diff)

Iin

See Note²

Input current (no pull-up/down)

Vin = 0 V

Vin=OVDD

—

1

μA

Pull-up/Pull-down impedance Mismatch

-15

+15

%

240 Ohm unit calibration resolution

Keeper Circuit Resistance

10

—

Ohm

—

140³

kΩ

1

Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

2

3

The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

4.3.2.3

DDR3 Mode I/O DC Parameters

The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008. The

parameters in Table 14 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

Table 14. DDR3 I/O DC Electrical Parameters

Parameters

Symbol

Test Conditions

Min

Typ

Max

Unit

High-level output voltage

Low-level output voltage

DC input Logic High

Voh

Vol

—

0.8*OVDD¹

—

0.2*OVDD

OVDD

Vref-0.1

See Note³

-0.2

V

VIH(dc)

VIL(dc)

VIH(diff)

VIL(diff)

Vpeak

Varea

Vref²+0.1

OVSS

0.2

DC input Logic Low

Differential input Logic High

Differential input Logic Low

Over/undershoot peak

See Note³

—

0.4

Over/undershoot area

(above OVDD or below OVSS)

—

0.67

V x

nS

Termination Voltage

Vtt

Iin

Vtt tracking OVDD/2

0.49*OVDD

Vref

0.51*OVDD

V

Input current (no pull-up/down)

VI = 0 V

VI=OVDD

—

1

μA

Pull-up/Pull-down impedance mismatch

—

Minimum impedance

configuration

—

3

Ω

240 Ω unit calibration resolution

—

10

—

Ω

Keeper Circuit Resistance

130⁴

kΩ

1

OVDD – I/O power supply (1.425 V–1.575 V for DDR3)

2

Vref – DDR3 external reference voltage

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Electrical Characteristics

3

4

The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

4.3.3

Low Voltage I/O (LVIO) DC Parameters

The parameters in Table 15 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

The LVIO pads operate only as inputs.

Table 15. LVIO DC Electrical Characteristics

DC Electrical Characteristics

Symbol

Test Conditions

Min

Typ

Max

Unit

High-Level DC input voltage^{1, 2}

Low-Level DC input voltage^{1, 2}

Input Hysteresis

Vih

Vil

—

0.7 × OVDD

—

OVDD

0.3 × OVDD

—

V

0

Vhys

OVDD = 1.875 V

OVDD = 2.775 V

0.35

0.62

1.27

Schmitt trigger VT+^{2, 3}

VT+

VT–

Iin

—

0.5 × OVDD

—

0.5 × OVDD

1

V

Schmitt trigger VT–^{2, 3}

—

Input current (no pull-up/down)

Input current (22 kΩ Pull-up)

Vin = OVDD or 0 V

μA

Iin

Vin = 0 V

Vin = OVDD

161

1

μA

Input current (47 kΩ Pull-up)

Input current (100 kΩ Pull-up)

Input current (100 kΩ Pull-down)

Keeper Circuit Resistance

Iin

—

Vin = 0 V

Vin = OVDD

—

76

1

Vin = 0 V

Vin = OVDD

36

1

Vin = 0 V

Vin = OVDD

—

1

36

μA

kΩ

130⁴

—

1

Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/undershoot must be

controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

2

To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. VIL and VIH do not apply

when hysteresis is enabled.

3

4

Hysteresis of 350 mV is guaranteed over all operating conditions when hysteresis is enabled.

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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33

Electrical Characteristics

4.3.4

Ultra-High Voltage I/O (UHVIO) DC Parameters

The parameters in Table 16 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

Table 16. UHVIO DC Electrical Characteristics

DC Electrical Characteristics

Symbol

Test Conditions

Min

Typ

Max

Unit

High-level output voltage¹

Voh

Iout = –1mA

Iout= specified Ioh

Drive

OVDD–0.15

0.8 * OVDD

—

V

Low-level output voltage¹

Vol

Iout = 1mA

Iout= specified Ioh

Drive

—

0.15

0.2 * OVDD

V

High-level output current, low voltage mode

Vout = 0.8 × OVDD

Low Drive

–2.2

–4.4

–6.6

Ioh_lv

Ioh_hv

Iol_lv

—

mA

Medium Drive

High Drive

High-level output current, high voltage

mode

Vout = 0.8 × OVDD

Low Drive

–5.1

–10.2

–15.3

Medium Drive

High Drive

Low-level output current, low voltage mode

Low-level output current, high voltage mode

Vout = 0.2 × OVDD

Low Drive

2.2

4.4

6.6

Medium Drive

High Drive

Vout = 0.2 × OVDD

Low Drive

5.1

10.2

15.3

Iol_hv

Medium Drive

High Drive

High-Level DC input voltage^{1, 2}

Low-Level DC input voltage^{1, 2}

Input Hysteresis

VIH

VIL

—

0.7 × OVDD

—

OVDD

V

0

0.3 × OVDD

VHYS

low voltage mode

high voltage mode

0.38

0.95

0.43

1.33

V

Schmitt trigger VT+^{2, 3}

VT+

VT–

Iin

—

0.5 × OVDD

—

0.5 × OVDD

1

V

Schmitt trigger VT–^{2, 3}

—

Input current (no pull-up/down)

Input current (22 kΩ Pull-up)

Vin = OVDD or 0 V

μA

Iin

Vin = 0

Vin = OVDD

202

1

μA

Input current (75 kΩ Pull-up)

Input current (100 kΩ Pull-up)

Input current (360 kΩ Pull-down)

Keeper Circuit Resistance

Iin

—

Vin = 0

Vin = OVDD

—

61

1

Vin = 0

Vin = OVDD

47

1

Vin = 0

Vin = OVDD

—

1

5.7

μA

kΩ

—

130⁴

—

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Electrical Characteristics

1

2

Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/undershoot must

be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

To maintain a valid level, the transitioning edge of the input must sustain a constant slew rate (monotonic) from the current

DC level to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. VIL and VIH do not apply

when hysteresis is enabled.

3

4

Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

4.3.5

LVDS I/O DC Parameters

The LVDS interface complies with TIA/EIA 644-A standard. See TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

Table 17 shows the Low Voltage Differential Signaling (LVDS) DC electrical characteristics.

Table 17. LVDS DC Electrical Characteristics

DC Electrical Characteristics

Symbol

Test Conditions

Min

Typ

Max

Unit

Output Differential Voltage

Output High Voltage

Output Low Voltage

Offset Voltage

V_OD

V_OH

V_OL

V_OS

Rload=100Ω

padP, –padN

250

1.25

0.9

350

1.375

1.025

1.2

450

1.6

mV

1.25

1.375

V

1.125

4.4

Output Buffer Impedance Characteristics

This section defines the I/O Impedance parameters of the i.MX53xD processor for the following I/O

types:

•

General Purpose I/O (GPIO)

Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2, and DDR3 modes

Ultra High Voltage I/O (UHVIO)

LVDS I/O

NOTE

Output driver impedance is measured with “long” transmission line of

impedance Ztl attached to I/O pad and incident wave launched into

transmission lime. Rpu/Rpd and Ztl form a voltage divider that defines

specific voltage of incident wave relative to OVDD. Output driver

impedance is calculated from this voltage divider (see Figure 4).

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

35

Electrical Characteristics

OVDD

PMOS (Rpu)

Ztl Ω, L = 20 inches

ipp_do

pad

predriver

Cload = 1p

NMOS (Rpd)

OVSS

U,(V)

VDD

(do)

Vin

t,(ns)

0

U,(V)

Vout (pad)

OVDD

Vref2

Vref1

Vref

t,(ns)

0

Vovdd – Vref1

Vref1

Rpu =

× Ztl

Vref2

Rpd =

Vovdd – Vref2

Figure 4. Impedance Matching Load for Measurement

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Electrical Characteristics

4.4.1

GPIO Output Buffer Impedance

Table 18 shows the GPIO output buffer impedance.

Table 18. GPIO Output Buffer Impedance

Typ

Parameter

Symbol

Test Conditions

Min

Max

Unit

OVDD 2.775 V OVDD 1.875 V

Output Driver

Impedance

Rpu

Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

Max Drive Strength, Ztl = 37.5 Ω

80

40

27

20

104

52

35

150

75

51

250

125

83

Ω

26

38

62

Output Driver

Impedance

Rpd

Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

Max Drive Strength, Ztl = 37.5 Ω

64

32

21

16

88

44

30

22

134

66

44

243

122

81

Ω

34

61

4.4.2

DDR Output Driver Average Impedance

The DDR2/LVDDR2 interface fully complies with JESD79-2E DDR2 JEDEC standard release April,

2008. The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

37

Electrical Characteristics

Table 19 shows DDR output driver average impedance of the i.MX53 processor.

1

Table 19. DDR Output Driver Average Impedance

Drive strength (DSE)

Parameter Symbol

Test Conditions

Unit

000

001

010

011

100

101

110

111

LPDDR1/DDR2 mode

NVCC_DRAM = 1.8 V

DDR_SEL = 00

Hi-Z

300

150

100

75

60

50

43

Calibration resistance = 300 Ω³

DDR2 mode

Hi-Z

180

200

140

160

240

160

240

90

100

70

60

66

46

53

80

53

80

45

50

35

40

60

40

60

36

40

28

32

48

32

48

30

33

23

27

40

27

48

26

28

20

23

34

23

34

NVCC_DRAM = 1.8 V

DDR_SEL = 01

Calibration resistance = 180 Ω³

DDR2 mode

NVCC_DRAM = 1.8 V

DDR_SEL = 10

Calibration resistance = 200 Ω³

DDR2 mode

NVCC_DRAM= 1.8 V

DDR_SEL = 11

Calibration resistance = 140 Ω³

Output

Driver

Ω

Rdrv²

LPDDR2 mode

80

Impedance

NVCC_DRAM= 1.2 V

DDR_SEL = 01⁴

Calibration resistance = 160 Ω³

LPDDR2 mode

120

80

NVCC_DRAM = 1.2 V

DDR_SEL = 10

Calibration resistance = 240 Ω³

LPDDR2 mode

NVCC_DRAM = 1.2 V

DDR_SEL = 11⁴

Calibration resistance = 160 Ω³

DDR3 mode

120

NVCC_DRAM = 1.5 V

DDR_SEL = 00

Calibration resistance = 200 Ω³

1

Output driver impedance is controlled across PVTs (process, voltages, and temperatures) using calibration procedure and

pu_*cal, pd_*cal input pins.

2

3

Output driver impedance deviation (calibration accuracy) is 5% (max/min impedance) across PVTs.

Calibration is done against external reference resistor. Value of the resistor should be varied depending on DDR mode and

DDR_SEL setting.

4

If DDR_SEL = ‘01’ or DDR_SEL = ‘11’ are selected with NVCC_DRAM = 1.2 V for LPDDR2 operation, the external reference

resistor value must be 160 Ω for a correct ZQ calibration. In any case, reference resistors attached to the DDR memory devices

should be kept to 240 Ω per the JEDEC standard.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Electrical Characteristics

4.4.3

UHVIO Output Buffer Impedance

Table 20 shows the UHVIO output buffer impedance.

Table 20. UHVIO Output Buffer Impedance

Min

Typ

Max

Unit

Parameter Symbol

Test Conditions

OVDD OVDD OVDD

1.95 V 3.0 V 1.875 V 3.3 V

1.65 V 3.6 V

Output Driver

Impedance

Rpu

Rpd

Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

98

49

32

114

57

38

124

62

41

135

67

45

198

99

66

206

103

69

Ω

Output Driver

Impedance

Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

97

49

32

118

59

40

126

63

42

154

77

51

179

89

60

217

109

72

4.4.4

LVDS I/O Output Buffer Impedance

The LVDS interface complies with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

4.5

I/O AC Parameters

This section includes the AC parameters of the following I/O types:

•

General Purpose I/O (GPIO)

Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2 and DDR3 modes

Low Voltage I/O (LVIO)

Ultra High Voltage I/O (UHVIO)

LVDS I/O

The load circuit and output transition time waveforms are shown in Figure 5 and Figure 6.

From Output

Under Test

Test Point

CL

CL includes package, probe and fixture capacitance

Figure 5. Load Circuit for Output

OVDD

0 V

80%

20%

80%

20%

Output (at pad)

tf

tr

Figure 6. Output Transition Time Waveform

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

39

Electrical Characteristics

4.5.1

GPIO I/O AC Electrical Characteristics

AC electrical characteristics for GPIO I/O in slow and fast modes are presented in the Table 21 and

Table 22, respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bit

in the IOMUXC control registers.

Table 21. GPIO I/O AC Parameters Slow Mode

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Output Pad Transition Times (Max Drive)

tr, tf

tps

15 pF

35 pF

1.91/1.52

3.07/2.65

ns

—

Output Pad Transition Times (High Drive)

Output Pad Transition Times (Medium Drive)

Output Pad Transition Times (Low Drive)

Output Pad Slew Rate (Max Drive)¹

Output Pad Slew Rate (High Drive)¹

Output Pad Slew Rate (Medium Drive)¹

Output Pad Slew Rate (Low Drive)¹

15 pF

35 pF

2.22/1.81

3.81/3.42

ns

—

15 pF

35 pF

2.88/2.42

5.43/5.02

15 pF

35 pF

4.94/4.50

10.55/9.70

15 pF

35 pF

0.5/0.65

0.32/0.37

—

tps

15 pF

35 pF

0.43/0.54

0.26/0.41

V/ns

tps

15 pF

35 pF

0.34/0.41

0.18/0.2

tps

15 pF

35 pF

0.20/0.22

0.09/0.1

Output Pad di/dt (Max Drive)

Output Pad di/dt (High Drive)

Output Pad di/dt (Medium drive)

Output Pad di/dt (Low drive)

Input Transition Times²

tdit

trm

—

30

23

15

7

mA/ns

ns

25

1

tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

2

Table 22. GPIO I/O AC Parameters Fast Mode

Test

Parameter

Symbol

Min

Typ

Max

Unit

Condition

Output Pad Transition Times (Max Drive)

Output Pad Transition Times (High Drive)

tr, tf

15 pF

35 pF

—

1.45/1.24

2.76/2.54

ns

tr, tf

15 pF

35 pF

—

1.81/1.59

3.57/3.33

ns

Output Pad Transition Times (Medium

Drive)

15 pF

35 pF

2.54/2.29

5.25/5.01

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Electrical Characteristics

Table 22. GPIO I/O AC Parameters Fast Mode (continued)

Test

Parameter

Symbol

Min

Typ

Max

Unit

Condition

Output Pad Transition Times (Low Drive)

tr, tf

15 pF

35 pF

4.82/4.5

10.54/9.95

ns

—

Output Pad Slew Rate (Max Drive)¹

Output Pad Slew Rate (High Drive)¹

Output Pad Slew Rate (Medium Drive)¹

Output Pad Slew Rate (Low Drive)¹

tps

15 pF

35 pF

0.69/0.78

0.36/0.39

V/ns

—

15 pF

35 pF

0.55/0.62

0.28/0.30

15 pF

35 pF

0.39/0.44

0.19/0.20

15 pF

35 pF

0.21/0.22

0.09/0.1

Output Pad di/dt (Max Drive)

Output Pad di/dt (High Drive)

Output Pad di/dt (Medium drive)

Output Pad di/dt (Low drive)

Input Transition Times²

tdit

trm

—

70

53

35

18

25

mA/ns

ns

1

tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

Hysteresis mode is recommended for inputs with transition time greater than 25 ns.

2

4.5.2

LPDDR2 I/O AC Electrical Characteristics

The DDR2/LVDDR2 interface mode fully complies with JESD79-2E DDR2 JEDEC standard release

April, 2008. The DDR3 interface mode fully complies with JESD79-3D DDR3 JEDEC standard release

April, 2008.

Table 23 shows the AC parameters for LPDDR2 I/O operating in DDR2 mode.

1

Table 23. LPDDR2 I/O DDR2 mode AC Characteristics

Parameter

AC input logic high

Symbol Test Condition

Min

Typ

Max

Unit

Vih(ac)

Vil(ac)

Vid(ac)

Vix(ac)

Vox(ac)

tsr

—

Vref+0.25

—

V

AC input logic low

—

Vref-0.25

OVDD

AC differential input voltage²

Input AC differential cross point voltage³

Output AC differential cross point voltage⁴

Single output slew rate

—

0.5

Vref – 0.175

Vref – 0.125

0.4

V

—

Vref + 0.175

Vref + 0.125

2

V

At 25 Ω to Vref

V/ns

ns

Skew between pad rise/fall asymmetry +

skew caused by SSN

t_SKD

clk=266Mhz

clk=400Mhz

—

0.2

0.1

1

Note that the JEDEC SSTL_18 specification (JESD8-15a) for class II operation supersedes any specification in this

document.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

41

Electrical Characteristics

2

Vid(ac) specifies the input differential voltage |Vtr – Vcp| required for switching, where Vtr is the “true” input signal and Vcp is

the “complementary” input signal. The Minimum value is equal to Vih(ac) – Vil(ac).

3

The typical value of Vix(ac) is expected to be about 0.5 * OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

4

The typical value of Vox(ac) is expected to be about 0.5 * OVDD and Vox(ac) is expected to track variation in OVDD. Vox(ac)

indicates the voltage at which differential output signal must cross.

Table 24 shows the AC parameters for LPDDR2 I/O operating in LPDDR2 mode.

1

Table 24. LPDDR2 I/O LPDDR2 mode AC Characteristics

Parameter

AC input logic high

Symbol

Test Condition

Min

Typ

Max

Unit

Vih(ac)

Vil(ac)

—

Vref + 0.22

—

OVDD

Vref – 0.22

—

V

AC input logic low

—

0

0.44

—

AC differential input high voltage²

AC differential input low voltage

Input AC differential cross point voltage³

Over/undershoot peak

Vidh(ac)

Vidl(ac)

Vix(ac)

Vpeak

—

V

—

Relative to OVDD/2

—

0.44

V

-0.12

—

0.12

V

0.35

V

Over/undershoot area (above OVDD

or below OVSS)

Varea

266MHz

—

0.6

V*ns

Single output slew rate

tsr

50Ohm to Vref.

5pF load.

Drive impedance=

40Ohm +-30%

1.5

1

—

3.5

2.5

V/ns

50Ohm to Vref.

5pF load.Drive

impedance= 60Ohm

+-30%

Skew between pad rise/fall asymmetry +

skew caused by SSN

t_SKD

clk=266MHz

clk=400MHz

ns

—

0.2

0.1

1

2

Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

Vid(ac) specifies the input differential voltage |Vtr – Vcp| required for switching, where Vtr is the “true” input signal and Vcp is

the “complementary” input signal. The Minimum value is equal to Vih(ac) – Vil(ac).

3

The typical value of Vix(ac) is expected to be about 0.5 * OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

Table 25 shows the AC parameters for LPDDR2 I/O operating in DDR3 mode.

1

Table 25. LPDDR2 I/O DDR3 mode AC Characteristics

Parameter

AC input logic high

Symbol Test Condition

Min

Typ

Max

Unit

Vih(ac)

Vil(ac)

Vid(ac)

Vix(ac)

—

Vref + 0.175

0

—

OVDD

Vref – 0.175

—

V

AC input logic low

AC differential input voltage²

Input AC differential cross point voltage³

0.35

Vref – 0.15

Vref + 0.15

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Freescale Semiconductor

Electrical Characteristics

Table 25. LPDDR2 I/O DDR3 mode AC Characteristics (continued)

1

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Output AC differential cross point voltage⁴

Single output slew rate

Vox(ac)

tsr

—

Vref – 0.15

—

Vref + 0.15

5

V

V/ns

ns

At 25 Ω to Vref

2.5

—

Skew between pad rise/fall asymmetry +

skew caused by SSN

t_SKD

clk=266MHz

clk=400MHz

0.2

0.1

1

Note that the JEDEC JESD79_3C specification supersedes any specification in this document.

2

3

4

Vid(ac) specifies the input differential voltage |Vtr-Vcp| required for switching, where Vtr is the “true” input signal and Vcp is

the “complementary” input signal. The Minimum value is equal to Vih(ac) – Vil(ac).

The typical value of Vix(ac) is expected to be about 0.5 * OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

The typical value of Vox(ac) is expected to be about 0.5 * OVDD and Vox(ac) is expected to track variation in OVDD. Vox(ac)

indicates the voltage at which differential output signal must cross.

4.5.3

LVIO I/O AC Electrical Characteristics

AC electrical characteristics for LVIO I/O in slow and fast modes are presented in the Table 26 and

Table 27, respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bit

in the IOMUXC control registers.

Table 26. LVIO I/O AC Parameters in Slow Mode

Parameter

Input Transition Times¹

Symbol Test Condition

trm

Min

Typ

Max

Unit

—

25

ns

1

Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

43

Electrical Characteristics

4.5.4

UHVIO I/O AC Electrical Characteristics

Table 27. LVIO I/O AC Parameters in Fast Mode

Test

Condition

Parameter

Input Transition Times¹

Symbol

Min

Typ

Max

Unit

trm

—

25

ns

1

Hysteresis mode is recommended for inputs with transition time greater than 25 ns.

Table 28 shows the AC parameters for UHVIO I/O operating in low output voltage mode. Table 29

shows the AC parameters for UHVIO I/O operating in high output voltage mode.

Table 28. AC Electrical Characteristics of UHVIO Pad (Low Output Voltage Mode)

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Output Pad Transition Times (High Drive)

tr, tf

tps

15 pF

35 pF

—

1.59/1.69

3.05/3.30

Output Pad Transition Times (Medium Drive)

Output Pad Transition Times (Low Drive)

Output Pad Slew Rate (High Drive)¹

Output Pad Slew Rate (Medium Drive)¹

Output Pad Slew Rate (Low Drive)¹

15 pF

35 pF

—

2.16/2.35

4.45/4.84

ns

15 pF

35 pF

4.06/4.42

8.79/9.55

15 pF

35 pF

0.63/0.59

0.33/0.30

—

tps

15 pF

35 pF

0.46/0.42

0.22/0.21

V/ns

tps

15 pF

35 pF

0.25/0.23

0.11/0.11

Output Pad di/dt (High Drive)

Output Pad di/dt (Medium drive)

Output Pad di/dt (Low drive)

Input Transition Times²

tdit

trm

—

43.6

32.3

18.24

25

mA/ns

ns

1

tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

2

Table 29. AC Electrical Characteristics of UHVIO Pad (High Output Voltage Mode)

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Output Pad Transition Times (High Drive)

Output Pad Transition Times (Medium Drive)

Output Pad Transition Times (Low Drive)

tr, tf

15 pF

35 pF

—

1.72/1.92

3.46/3.70

15 pF

35 pF

—

2.38/2.56

5.07/5.25

ns

15 pF

35 pF

4.55/4.58

10.04/9.94

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Freescale Semiconductor

Electrical Characteristics

Table 29. AC Electrical Characteristics of UHVIO Pad (High Output Voltage Mode) (continued)

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Output Pad Slew Rate (High Drive)¹

tps

15 pF

35 pF

1.05/0.94

0.52/0.49

—

Output Pad Slew Rate (Medium Drive)¹

Output Pad Slew Rate (Low Drive)¹

15 pF

35 pF

0.76/0.71

0.36/0.34

—

V/ns

15 pF

35 pF

0.40/0.93

0.18/0.18

Output Pad di/dt (High Drive)

Output Pad di/dt (Medium drive)

Output Pad di/dt (Low drive)

Input Transition Times²

tdit

trm

—

82.8

65.6

43.1

25

mA/ns

ns

1

tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

2

4.5.5

LVDS I/O AC Electrical Characteristics

The differential output transition time waveform is shown in Figure 7.

Figure 7. Differential LVDS Driver Transition Time Waveform

Table 30 shows the AC parameters for LVDS I/O.

Table 30. AC Electrical Characteristics of LVDS Pad

Parameter

Symbol Test Condition

Min

Typ

Max

Unit

Transition Low to High Time¹

Transition High to Low Time¹

Operating Frequency

t_TLH

0.26

—

0.5

—

Rload = 100 Ω,

Cload = 2 pF

ns

t_THL

f

—

300

—

MHz

mV

Offset voltage imbalance

Vos

—

150

1

Measurement levels are 20-80% from output voltage.

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Electrical Characteristics

4.6

System Modules Timing

This section contains the timing and electrical parameters for the modules in the i.MX53xD processor.

4.6.1

Reset Timings Parameters

Figure 8 shows the reset timing and Table 31 lists the timing parameters.

RESET_IN

(Input)

CC1

Figure 8. Reset Timing Diagram

Table 31. Reset Timing Parameters

ID

Parameter

Min

Max

Unit

CC1

Duration of RESET_IN to be qualified as valid (input slope = 5 ns)

50

—

ns

4.6.2

WDOG Reset Timing Parameters

Figure 9 shows the WDOG reset timing and Table 32 lists the timing parameters.

WATCHDOG_RST

(Input)

CC5

Figure 9. WATCHDOG_RST Timing Diagram

Table 32. WATCHDOG_RST Timing Parameters

ID

Parameter

Min

Max

Unit

T_CKIL

CC5

Duration of WATCHDOG_RESET Assertion

1

—

NOTE

is one period or approximately 30 μs.

CKIL is approximately 32 kHz. T

CKIL

4.6.3

Clock Amplifier Parameters (CKIH1, CKIH2)

The input to Clock Amplifier (CAMP) is internally ac-coupled allowing direct interface to a square wave

or sinusoidal frequency source. No external series capacitors are required.

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Electrical Characteristics

Table 33 shows the electrical parameters of CAMP.

Table 33. CAMP Electrical Parameters (CKIH1, CKIH2)

Parameter

Min

Typ

Max

Unit

Input frequency

8.0

—

50

40.0

0.3

MHz

V

VIL (for square wave input)

VIH (for square wave input)¹

Sinusoidal input amplitude

Output duty cycle

0

NVCC_CKIH – 0.25

NVCC_CKIH

VDD

V

0.4

45

Vp-p

%

55

1

NVCC_CKIH is the supply voltage of CAMP.

4.6.4

DPLL Electrical Parameters

Table 34 shows the electrical parameters of digital phase-locked loop (DPLL).

Table 34. DPLL Electrical Parameters

Parameter

Test Conditions/Remarks

Min

Typ

Max

Unit

Reference clock frequency range¹

—

10

—

100

40

MHz

Reference clock frequency range after

pre-divider

Output clock frequency range (dpdck_2)

Pre-division factor²

—

300

—

50

—

1025

16

MHz

—

1

Multiplication factor integer part

Multiplication factor numerator³

Multiplication factor denominator²

Output Duty Cycle

—

5

15

—

Should be less than denominator

–67108862

67108862

67108863

51.5

—

1

—

48.5

—

%

Frequency lock time⁴

(FOL mode or non-integer MF)

398

T_d

pdref

Phase lock time

—

0.02

2.0

—

100

0.04

3.5

µs

T_dck

ns

Frequency jitter⁵(peak value)

Phase jitter (peak value)

Power dissipation

—

FPL mode, integer and fractional MF

f_dck= 300 MHz at avdd = 1.8 V,

0.65 (avdd)

0.92 (dvdd)

1.98 (avdd)

1.8 (dvdd)

mW

dvdd = 1.2 V

f

dvdd = 1.2 V

_dck= 650 MHz at avdd = 1.8 V,

1

Device input range cannot exceed the electrical specifications of the CAMP, see Table 33.

2

The values specified here are internal to DPLL. Inside the DPLL, a “1” is added to the value specified by the user. Therefore,

the user has to enter a value “1” less than the desired value at the inputs of DPLL for PDF and MFD.

3

The maximum total multiplication factor (MFI + MFN/MFD) allowed is 15. Therefore, if the MFI value is 15, MFN value must

be zero.

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Electrical Characteristics

4

T_dpdrefis the time period of the reference clock after predivider. According to the specification, the maximum lock time in FOL

mode is 398 cycles of divided reference clock when DPLL starts after full reset.

5

Tdck is the time period of the output clock, dpdck_2.

4.6.5

NAND Flash Controller (NFC) Parameters

This section provides the relative timing requirements among various signals of NFC at the module level,

in each operational mode.

Timing parameters in Figure 10, Figure 11, Figure 12, Figure 13, Figure 15, and Table 36 show the default

NFC mode (asymmetric mode) using two Flash clock cycles per one access of RE_B and WE_B.

Timing parameters in Figure 10, Figure 11, Figure 12, Figure 14, Figure 15, and Table 36 show symmetric

NFC mode using one Flash clock cycle per one access of RE_B and WE_B.

With reference to the timing diagrams, a high is defined as 80% of signal value and low is defined as 20%

of signal value. All parameters are given in nanoseconds. The BGA contact load used in calculations is

20 pF (except for NF16 - 40 pF) and there is maximum drive strength on all contacts.

All timing parameters are a function of T, which is the period of the flash_clk clock (“enfc_clk” at system

level). This clock frequency can be controlled by the user, configuring CCM (SoC clock controller). The

clock is derived from emi_slow_clk after single divider.

Figure 35 demonstrates several examples of clock frequency settings.

Table 35. NFC Clock Settings Examples

emi_slow_clk (MHz)

nfc_podf (Division Factor)

enfc_clk (MHz)

T-Clock Period (ns)

100 (Boot mode)

7¹

3²

4

14.29

33.33

44.33³

66³

70

30

133

30

3

22.5

15

2

1

2

3

Boot value NFC_FREQ_SEL Fuse High (burned)

Boot value NFC_FREQ_SEL Fuse Low

For RBB_MODE=1, using NANDF_RB0 signal for ready/busy indication. This mode require setting the delay line. See the

Reference Manual for details.

NOTE

A potential limitation for minimum clock frequency may exist for some

devices. When the clock frequency is too low, the data bus capturing might

occur after the specified t

(RE_B high to output hold) period. Setting the

rhoh

clock frequency above 25.6 MHz (that is, T = 39 ns) guaranties a proper

operation for devices having t > 15 ns. It is also recommended that the

rhoh

NFC_FREQ_SEL Fuse be set accordingly to initiate the boot with

33.33 MHz clock.

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Lower frequency operation can be supported for most available devices in

the market, relying on data lines Bus-Keeper logic. This depends on device

behavior on the data bus in the time interval between data output valid to

data output high-Z state. In NAND device parameters this period is marked

between t

and t (RE_B high to output high-Z). In most devices, the

rhoh

rhz

data transition from valid value to high-Z occurs without going through

other states. Setting the data bus pads to Bus-Keeper mode in the IOMUXC

registers, keeps the data bus valid internally after the specified hold time,

allowing proper capturing with slower clock.

NFCLE

NF2

NF1

NF3

NF4

NFCE_B

NF5

NFWE_B

NFIO[7:0]

NF8

NF9

command

Figure 10. Command Latch Cycle Timing

NF4

NF3

NFCE_B

NF10

NF11

NF5

NFWE_B

NFALE

NF7

NF6

NF8

NF9

NFIO[7:0]

Address

Figure 11. Address Latch Cycle Timing

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Electrical Characteristics

NF3

NFCE_B

NF10

NF11

NF5

NFWE_B

NF8

NF9

NFIO[15:0]

Data to NF

Figure 12. Write Data Latch Timing

NFCE_B

NF14

NF15

NF13

NFRE_B

NFRB_B

NF17

NF16

NF12

NFIO[15:0]

NFCE_B

Data from NF

Figure 13. Read Data Latch Timing, Asymmetric Mode

NF14

NF15

NF13

NFRE_B

NFRB_B

NF18

NF16

NF12

NFIO[15:0]

Data from NF

Figure 14. Read Data Latch Timing, Symmetric Mode

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NF19

NFCLE

NF20

NFCE_B

NFWE_B

NF21

NF22

NFRE_B

NFRB_B

Figure 15. Other Timing Parameters

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Electrical Characteristics

Table 36. NFC—Timing Characteristics

Symmetric Mode

Min

ID

Parameter

Symbol

Asymmetric Mode Min

Max

NF1

NF2

NFCLE setup Time

NFCLE Hold Time

NFCE_B Setup Time

NFCE_B Hold Time

NFWE_B Pulse Width

NFALE Setup Time

NFALE Hold Time

Data Setup Time

tCLS

tCLH

tCS

2T + 0.1

T – 4.45

3T + 0.95

2T–5.55

T – 1.4

2T + 0.1

T – 4.45

T – 0.9

T – 5.55

2T

2T + 0.1

T – 4.45

3T+0.95

1.5T–5.55

0.5T – 1.4

2T + 0.1

T – 4.45

0.5T – 0.9

0.5T – 5.55

T–0.5

—

NF3¹

NF4

—

tCH

—

NF5

tWP

tALS

tALH

tDS

—

NF6

—

NF7

—

NF8

—

NF9

Data Hold Time

tDH

—

NF10

NF11

NF12

NF13

NF14

NF15

NF16²

NF17⁴

NF18⁵

NF19

NF20

NF21

NF22

Write Cycle Time

tWC

tWH

tRR

—

NFWE_B Hold Time

Ready to NFRE_B Low

NFRE_B Pulse Width

READ Cycle Time

NFRE_B High Hold Time

Data Setup on READ

Data Hold on READ

CLE to RE delay

T – 1.15

9T + 8.9

1.5T

0.5T – 1.15

9T + 8.9

0.5T–1

—

tRP

—

tRC

2T

T

tREH

tDSR

tDHR

tCLR

tCRE

tWHR

tWB

0.5T – 1.15

11.2 + 0.5T – Tdl³

0

0.5T – 1.15

11.2 – Tdl²

—

2Taclk + T

—

Tdl²– 11.2

9T

CE to RE delay

T – 3.45

10.5T

T – 3.45

10.5T

T + 0.3

—

WE high to RE low

WE high to busy

—

6T

1

2

In case of NUM_OF_DEVICES is greater than 0 (for example, interleaved mode), then only during the data phase of

symmetric mode the setup time will equal 1.5T + 0.95.

tDSR is calculated by the following formula:

2

1

Asymmetric mode: tDSR = tREpd + tDpd + / T – Tdl

2

Symmetric mode:

tREpd + tDpd = 11.2 ns (including clock skew)

tDSR = tREpd + tDpd – Tdl²

where tREpd is RE propogation delay in the chip including I/O pad delay, and tDpd is Data propogation delay from I/O pad to

EXTMC including I/O pad delay.

tDSR can be used to determine tREA max parameter with the following formula: tREA = 1.5T – tDSR.

3

Tdl is composed of 4 delay-line units each generates an equal delay with min 1.25 ns and max 1 aclk period (Taclk). Default

is 1/4 aclk period for each delay-line unit, so all 4 delay lines together generates a total of 1 aclk period. Taclk is

“emi_slow_clk” of the system, which default value is 7.5 ns (133 MHz).

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4

5

NF17 is defined only in asymmetric operation mode.

NF17 max value is equivalent to max tRHZ value that can be used with NFC.

Taclk is “emi_slow_clk” of the system.

NF18 is defined only in Symmetric operation mode.

tDHR (MIN) is calculated by the following formula:

Tdl²– (tREpd + tDpd)

where tREpd is RE propogation delay in the chip including I/O pad delay, and tDpd is Data propogation delay from I/O pad to

EXTMC including I/O pad delay.

NF18 max value is equivalent to max tRHZ value that can be used with NFC.

Taclk is “emi_slow_clk” of the system.

4.6.6

External Interface Module (EIM)

The following subsections provide information on the EIM.

4.6.6.1 EIM Signal Cross Reference

Table 37 is a guide intended to help the user identify signals in the External Interface Module Chapter of

the Reference Manual which are identical to those mentioned in this data sheet.

Table 37. EIM Signal Cross Reference

Data Sheet Nomenclature,

Reference Manual

Reference Manual External Signals and Pin Multiplexing Chapter,

EIM Chapter Nomenclature

and IOMUXC Controller Chapter Nomenclature

BCLK

CSx

EIM_BCLK

EIM_CSx

WE_B

EIM_RW

OE_B

EIM_OE

BEy_B

ADV

EIM_EBx

EIM_LBA

ADDR

EIM_A[25:16], EIM_DA[15:0]

EIM_DAx (Addr/Data muxed mode)

ADDR/M_DATA

DATA

EIM_NFC_D (Data bus shared with NAND Flash)

EIM_Dx (dedicated data bus)

WAIT_B

EIM_WAIT

4.6.6.2

EIM Interface Pads Allocation

EIM supports16-bit and 8-bit devices operating in address/data separate or multiplexed modes. In some

of the modes the EIM and the NAND FLASH have shared data bus. Table 38 provides EIM interface

pads allocation in different modes.

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Electrical Characteristics

Table 38. EIM Internal Module Multiplexing

Non Multiplexed Address/Data Mode

Multiplexed

Address/Data mode

Setup

8 Bit

MUM = 0,

16 Bit

MUM = 0, MUM = 0,

32 Bit

MUM = 0,

16 Bit

32 Bit

MUM = 0,

MUM = 1,

DSZ = 111 DSZ = 111 DSZ = 111 DSZ = 001 DSZ = 010 DSZ = 011 DSZ = 001 DSZ = 011

A[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

A[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

NANDF_D

[8:0]¹

[24:16]¹

D[7:0],

EIM_EB

0

NANDF_D

[7:0]²

—

NANDF_D

[7:0]²

—

NANDF_D

[7:0]

EIM_DA

[7:0]

EIM_DA

[7:0]

D[15:8],

EIM_EB

1

—

NANDF_D

[15:8]³

NANDF_D

[15:8]³

—

NANDF_D

[15:8]

EIM_DA

[15:8]

EIM_DA

[15:8]

D[23:16]

—

EIM_D

[23:16]

EIM_D

[23:16]

—

NANDF_D

[7:0]

,

EIM_EB

2

D[31:24]

—

EIM_D

[31:24]

—

EIM_D

[31:24]

EIM_D

[31:24]

—

NANDF_D

[15:8]

,

EIM_EB

3

1

2

3

For 32-bit mode, the address range is A[24:0], due to address space allocation in memory map.

NANDF_D[7:0] multiplexed on ALT3 mode of PATA_DATA[7:0]

NANDF_D[15:8] multiplexed on ALT3 mode of PATA_DATA[15:8]

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4.6.6.3

General EIM Timing-Synchronous Mode

Figure 16, Figure 17, and Table 39 specify the timings related to the EIM module. All EIM output control

signals may be asserted and deasserted by an internal clock synchronized to the BCLK rising edge

according to corresponding assertion/negation control fields.

,

...

WE3

BCLK

WE1

WE4

WE6

WE5

WE7

WE9

Address

CSx_B

WE8

WE10

WE12

WE_B

OE_B

BEy_B

WE11

WE13

WE15

WE17

WE14

WE16

ADV_B

Output Data

Figure 16. EIM Outputs Timing Diagram

BCLK

WE18

Input Data

WE19

WE20

WAIT_B

WE21

Figure 17. EIM Inputs Timing Diagram

1

Table 39. EIM Bus Timing Parameters

BCD = 0

Max

BCD = 1

Min Max

BCD = 2

Max

BCD = 3

Min Max

ID

Parameter

Min

WE1 BCLK Cycle time²

t

2*t

3*t

4*t

1.6*t

WE2 BCLK Low Level

Width

0.4*t

0.8*t

1.2*t

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Electrical Characteristics

1

Table 39. EIM Bus Timing Parameters (continued)

BCD = 0 BCD = 1 BCD = 2

Max Min Max

BCD = 3

Max

ID

Parameter

Min

1.2*t

Max

Min

1.6*t

WE3 BCLK High Level

Width

0.4*t

0.8*t

-t-1.25

t-1.25

-t-1.25

t-1.25

-t-1.25

t-1.25

-t-1.25

t-1.25

-t-1.25

t-1.25

-t-1.25

t-1.25

-t-1.25

t-1.25

WE4 Clock rise to

address valid³

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE5 Clock rise to

address invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE6 Clock rise to

CSx_B valid

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE7 Clock rise to

CSx_B invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE8 Clock rise to

WE_B Valid

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE9 Clock rise to

WE_B Invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE10 Clock rise to OE_B -0.5*t-1.25 -0.5*t+1.75

Valid

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE11 Clock rise to OE_B 0.5*t-1.25

Invalid

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE12 Clock rise to

BEy_B Valid

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE13 Clock rise to

BEy_B Invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE14 Clock rise to

ADV_B Valid

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE15 Clock rise to

ADV_B Invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE16 Clock rise to

Output Data Valid

-0.5*t-1.25 -0.5*t+1.75

-t+1.75 -1.5*t-1.2

5

-1.5*t

+1.75

-2*t-1.25 -2*t+1.75

WE17 Clock rise to

Output Data

Invalid

0.5*t-1.25

0.5*t+1.75

t+1.75 1.5*t-1.2 1.5*t +1.75 2*t-1.25

5

2*t+1.75

WE18 Input Data setup

time to Clock rise

2

—

4

2

—

WE19 Input Data hold

time from Clock

rise

WE20 WAIT_B setup

time to Clock rise

2

—

4

2

—

WE21 WAIT_B hold time

from Clock rise

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1

t is the maximal EIM logic (axi_clk) cycle time. The maximum allowed axi_clk frequency is 133 MHz, whereas the maximum

allowed BCLK frequency is 104 MHz. As a result, if BCD = 0, axi_clk must be ≤ 104 MHz. If BCD = 1, then 133 MHz is

allowed for axi_clk, resulting in a BCLK of 66.5 MHz. When the clock branch to EIM is decreased to 104 MHz, other busses

are impacted which are clocked from this source. See the CCM chapter of the i.MX53 Reference Manual for a detailed clock

tree description.

2

3

BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is defined

as 50% as signal value.

For signal measurements “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

4.6.6.4

Examples of EIM Synchronous Accesses

Figure 18 to Figure 21 provide few examples of basic EIM accesses to external memory devices with the

timing parameters mentioned previously for specific control parameters settings.

BCLK

WE4

WE6

WE5

WE7

ADDR

CSx_B

WE_B

ADV_B

OE_B

Address v1

Last Valid Address

WE14

WE10

WE12

WE15

WE18

WE11

WE13

BEy_B

DATA

D(v1)

WE19

Figure 18. Synchronous Memory Read Access, WSC=1

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BCLK

WE5

WE4

ADDR

CSx_B

WE_B

ADV_B

OE_B

Last Valid Address

Address V1

WE7

WE6

WE8

WE9

WE14

WE15

WE13

WE12

WE16

BEy_B

DATA

WE17

D(V1)

Figure 19. Synchronous Memory, Write Access, WSC=1, WBEA=0, and WADVN=0

BCLK

WE16

WE17

WE5

WE4

ADDR/

M_DATA

Write Data

Address V1

Valid Addr

Last

WE6

WE7

WE9

CSx_B

WE_B

WE8

WE14

WE15

ADV_B

OE_B

WE10

WE11

BEy_B

Figure 20. Muxed Address/Data (A/D) Mode, Synchronous Write Access, WSC=6, ADVA=0, ADVN=1, and

ADH=1

NOTE

In 32-bit muxed address/data (A/D) mode the 16 MSBs are driven on the

data bus.

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BCLK

WE4

Valid Addr

WE6

WE5

Address V1

WE19

Data

ADDR/

M_DATA

Last

WE18

CSx_B

WE_B

WE7

WE15

WE10

WE14

WE12

ADV_B

OE_B

WE11

WE13

BEy_B

Figure 21. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, and OEA=0

4.6.6.5

General EIM Timing-Asynchronous Mode

Figure 22 through Figure 27, and Table 40 help to determine timing parameters relative to the chip select

(CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the timing

parameters mentioned above.

Asynchronous read and write access length in cycles may vary from what is shown in Figure 22 through

Figure 25 as RWSC, OEN, and CSN is configured differently. Refer to i.MX53xD RM for the EIM

programming model.

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59

Electrical Characteristics

end of

access

start of

access

INT_CLK

MAXCSO

CSx_B

ADDR/

WE31

WE32

Next Address

Last Valid Address

Address V1

M_DATA

WE_B

WE39

WE40

WE36

WE38

ADV_B

WE35

WE37

OE_B

BEy_B

WE44

MAXCO

DATA[7:0]

D(V1)

WE43

MAXDI

Figure 22. Asynchronous Memory Read Access (RWSC = 5)

end of

access

start of

access

INT_CLK

CSx_B

MAXCSO

MAXDI

WE31

D(V1)

Addr. V1

WE32A

ADDR/

M_DATA

WE44

WE_B

WE40A

WE39

WE35A

WE37

ADV_B

WE36

WE38

OE_B

BEy_B

MAXCO

Figure 23. Asynchronous A/D Muxed Read Access (RWSC = 5)

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Electrical Characteristics

CSx_B

ADDR

WE31

Last Valid Address

WE32

WE34

WE40

Next Address

Address V1

WE33

WE_B

ADV_B

OE_B

WE39

WE45

WE41

WE46

BEy_B

DATA

WE42

D(V1)

Figure 24. Asynchronous Memory Write Access

CSx_B

WE41

WE31

D(V1)

Addr. V1

WE32A

ADDR/

M_DATA

WE42

WE33

WE39

WE34

WE_B

WE40A

ADV_B

OE_B

WE45

WE46

WE42

BEy_B

Figure 25. Asynchronous A/D Muxed Write Access

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61

Electrical Characteristics

CSx_B

ADDR

WE31

WE32

Next Address

Last Valid Address

Address V1

WE_B

ADV_B

OE_B

WE39

WE35

WE37

WE40

WE36

WE38

BEy_B

WE44

DATA[7:0]

D(V1)

WE43

WE48

DTACK

WE47

Figure 26. DTACK Read Access (DAP=0)

CSx_B

ADDR

WE31

WE32

WE34

WE40

Next Address

Last Valid Address

Address V1

WE33

WE_B

ADV_B

OE_B

WE39

WE45

WE41

WE46

BEy_B

DATA

WE42

D(V1)

WE48

DTACK

WE47

Figure 27. DTACK Write Access (DAP=0)

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Electrical Characteristics

Table 40. EIM Asynchronous Timing Parameters Table Relative Chip Select

Max

Determination by

Synchronous measured

parameters ¹²

Ref

No.

(If 133 Mhz is

supported by

SOC)

Parameter

Min

Unit

WE31

WE32

CSx_B valid to Address Valid

WE4 - WE6 - CSA³

WE7 - WE5 - CSN⁴

—

3 - CSA

3 - CSN

ns

Address Invalid to CSx_B

invalid

WE32

A(mux

ed A/D

CSx_B valid to Address

Invalid

t⁵+ WE4 - WE7 + (ADVN +

ADVA + 1 - CSA³)

-3 + (ADVN +

ADVA + 1 - CSA)

—

ns

WE33

WE34

CSx_B Valid to WE_B Valid

WE8 - WE6 + (WEA - CSA)

WE7 - WE9 + (WEN - CSN)

—

3 + (WEA - CSA)

3 - (WEN_CSN)

ns

WE_B Invalid to CSx_B

Invalid

WE35

CSx_B Valid to OE_B Valid

WE10 - WE6 + (OEA - CSA)

—

3 + (OEA - CSA)

ns

WE35

A

(muxe

d A/D)

WE10 - WE6 + (OEA +

RADVN + RADVA + ADH + 1

- CSA)

-3 + (OEA +

RADVN+RADVA

+ADH+1-CSA)

3 + (OEA +

RADVN+RADVA+A

DH+1-CSA)

WE36

WE37

WE38

OE_B Invalid to CSx_B

Invalid

WE7 - WE11 + (OEN - CSN)

WE12 - WE6 + (RBEA - CSA)

WE7 - WE13 + (RBEN - CSN)

—

3 - (OEN - CSN)

3 + (RBEA⁶- CSA)

3 - (RBEN⁷- CSN)

ns

CSx_B Valid to BEy_B Valid

(Read access)

BEy_B Invalid to CSx_B

Invalid (Read access)

WE39

WE40

CSx_B Valid to ADV_B Valid

WE14 - WE6 + (ADVA - CSA)

WE7 - WE15 - CSN

—

3 + (ADVA - CSA)

3 - CSN

ns

ADV_B Invalid to CSx_B

Invalid (ADVL is asserted)

WE40

A

CSx_B Valid to ADV_B Invalid

WE14 - WE6 + (ADVN +

ADVA + 1 - CSA)

-3 + (ADVN +

ADVA + 1 - CSA)

3 + (ADVN + ADVA

+ 1 - CSA)

ns

(muxe

d A/D)

WE41

CSx_B Valid to Output Data

Valid

WE16 - WE6 - WCSA

—

3 - WCSA

ns

WE41

A

(muxe

d A/D)

CSx_B Valid to Output Data

Valid

WE16 - WE6 + (WADVN +

WADVA + ADH + 1 - WCSA)

3 + (WADVN +

WADVA + ADH + 1 -

WCSA)

WE42

Output Data Invalid to CSx_B

Invalid

WE17 - WE7 - CSN

—

3 - CSN

ns

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Electrical Characteristics

Table 40. EIM Asynchronous Timing Parameters Table Relative Chip Select

Max

Determination by

Synchronous measured

parameters ¹²

Ref

No.

(If 133 Mhz is

supported by

SOC)

Parameter

Min

Unit

MAXC

O

Output max. delay from

internal driving ADDR/control

FFs to chip outputs.

10

—

ns

MAXC

SO

Output max. delay from CSx

internal driving FFs to CSx

out.

10

—

MAXDI

WE43

DATA MAXIMUM delay from

chip input data to its internal

FF

5

Input Data Valid to CSx_B

Invalid

MAXCO - MAXCSO + MAXDI

MAXCO ^-

MAXCSO +

MAXDI

ns

WE44

WE45

WE46

CSx_B Invalid to Input Data

invalid

0

—

ns

—

CSx_B Valid to BEy_B Valid

(Write access)

WE12 - WE6 + (WBEA - CSA)

—

3 + (WBEA - CSA)

-3 + (WBEN - CSN)

—

BEy_B Invalid to CSx_B

Invalid (Write access)

WE7 - WE13 + (WBEN -

CSN)

MAXD

TI

DTACKMAXIMUMdelayfrom

chip dtack input to its internal

FF + 2 cycles for

synchronization

WE47

WE48

Dtack Active to CSx_B Invalid

MAXCO - MAXCSO +

MAXDTI

MAXCO -

MAXCSO +

MAXDTI

—

ns

CSx_B Invalid to Dtack

invalid

0

1

2

3

4

5

6

7

Parameters WE4... WE21 value see column BCD = 0 in Table 39

All config. parameters (CSA,CSN,WBEA,WBEN,ADVA,ADVN,OEN,OEA,RBEA & RBEN) are in cycle units.

CS Assertion. This bit field determines when CS signal is asserted during read/write cycles.

CS Negation. This bit field determines when CS signal is negated during read/write cycles.

t is axi_clk cycle time.

BE Assertion. This bit field determines when BE signal is asserted during read cycles.

BE Negation. This bit field determines when BE signal is negated during read cycles.

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Electrical Characteristics

4.6.7

DDR SDRAM Specific Parameters (DDR2/LVDDR2, LPDDR2, and

DDR3)

The DDR2/LVDDR2 interface fully complies with JESD79-2E – DDR2 JEDEC release April, 2008,

supporting DDR2-800 and LVDDR2-800.

The DDR3 interface fully complies with JESD79-3D – DDR3 JEDEC release April 2008 supporting

DDR3-800.

The LPDDR2 interface fully complies with JESD209-2B, supporting LPDDR2-800.

Figure 28 and Table 41 show the address and control timing parameters for DDR2 and DDR3.

DDR1

SDCLK

DDR2

DDR4

CS

DDR5

RAS

DDR5

DDR4

CAS

DDR4

DDR5

WE

ODT/CKE

DDR4

DDR6

DDR7

ADDR

ROW/BA

COL/BA

Figure 28. DDR SDRAM Address and Control Parameters for DDR2 and DDR3

1 2

Table 41. DDR SDRAM Timing Parameter Table

SDCLK = 400 MHz

ID

Parameter

Symbol

Units

Min

Max

DDR1 SDRAM clock high-level width

DDR2 SDRAM clock low-level width

tCH

tCL

0.48

0.52

tCK

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Electrical Characteristics

1 2

Table 41. DDR SDRAM Timing Parameter Table (continued)

SDCLK = 400 MHz

ID

Parameter

Symbol

Units

Min

Max

DDR4 CS, RAS, CAS, CKE, WE, ODT setup time

DDR5 CS, RAS, CAS, CKE, WE, ODT hold time

DDR6 Address output setup time

tIS

tIH

tIS

tIH

0.6

—

ns

DDR7 Address output hold time

1

2

All timings are refer to Vref level cross point.

Reference load model is 25 ohm resistor from each of the DDR outputs to VDD_REF.

Figure 29 and Table 42 show the address and control timing parameters for LPDDR2.

CK

LP1

LP4

LP2

CS

LP3

CKE

LP3

LP4

CA

LP4

LP3

Figure 29. DDR SDRAM Address and Control Timing Parameters for LPDDR2

1 2

Table 42. DDR SDRAM Timing Parameter Table for LPDDR2

SDCLK = 400 MHz

ID

Parameter

Symbol

Units

Min

Max

LP1

LP2

LP3

LP4

LP3

LP4

SDRAM clock high-level width

SDRAM clock low-level width

CS, CKE setup time

CS, CKE hold time

tCH

tCL

tIS

0.45

0.3

0.55

—

tCK

ns

tIH

tIS

0.3

—

CA setup time

0.3

—

CA hold time

tIH

0.3

—

1

2

All timings are refer to Vref level cross point.

Reference load model is 25 ohm resistor from each of the DDR outputs to VDD_REF.

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Electrical Characteristics

Figure 30 and Table 43 show the data write timing parameters.

SDCLK

SDCLK_B

DDR21

DDR17

DDR22

DDR23

DQS (output)

DQ (output)

DDR18

Data

DDR17

DDR18

Data

DM

Data

DM

Data

DM

Data

DM

Data

DM

DQM (output)

DDR17

DDR18

Figure 30. DDR SDRAM Data Write Cycle

1 2 3

Table 43. DDR SDRAM Write Cycle

SDCLK = 400 MHz

ID

Parameter

Symbol

Unit

Min

Max

DDR17 DQ and DQM setup time to DQS (differential strobe)

DDR18 DQ and DQM hold time to DQS (differential strobe)

DDR21 DQS latching rising transitions to associated clock edges

DDR22 DQS high level width

tDS

tDH

0.285

-0.25

0.45

—

ns

tDQSS

tDQSH

tDQSL

+0.25

0.55

tCK

DDR23 DQS low level width

0.45

1

2

3

All timings are refer to Vref level cross point.

Reference load model is 25 ohm resistor from each of the DDR outputs to VDD_REF.

To receive the reported setup and hold values, write calibration should be performed in order to locate the DQS in the middle

of DQ window.

Figure 31 and Table 44 show the data read timing parameters.

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Electrical Characteristics

SDCLK

SDCLK_B

DQS (input)

DDR27

DATA

DQ (input)

DDR26

Figure 31. DDR SDRAM DQ vs. DQS and SDCLK Read Cycle

1

Table 44. DDR SDRAM Read Cycle

SDCLK = 400 MHz

ID

Parameter

Symbol

Unit

Min

Max

DDR26

Minimum required DQ valid window width

except from LPDDR2

—

0.6

—

ns

DDR26(LP Minimum required DQ valid window width

DDR2)

0.425

—

for LPDDR2

DDR27

DQS to DQ valid data

0.275

0.475

1

To receive the reported setup and hold values, read calibration should be performed in order to locate the DQS in the middle

of DQ window.

4.7

External Peripheral Interfaces Parameters

The following subsections provide information on external peripheral interfaces.

4.7.1

AUDMUX Timing Parameters

The AUDMUX provides a programmable interconnect logic for voice, audio and data routing between

internal serial interfaces (SSIs) and external serial interfaces (audio and voice codecs). The AC timing of

AUDMUX external pins is governed by the SSI module. For more information, see the respective SSI

electrical specifications found within this document.

4.7.2

CSPI and ECSPI Timing Parameters

This section describes the timing parameters of the CSPI and ECSPI blocks. The CSPI and ECSPI have

separate timing parameters for master and slave modes. The nomenclature used with the CSPI / ECSPI

modules and the respective routing of these signals is shown in Table 45.

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Electrical Characteristics

Table 45. CSPI Nomenclature and Routing

I/O Access

Block Instance

ECSPI-1

ECSPI-2

CSPI

GPIO, KPP, DISP0_DAT, CSI0_DAT and EIM_D through IOMUXC

DISP0_DAT, CSI0_DAT and EIM through IOMUXC

DISP0_DAT, EIM_A/D, SD1 and SD2 through IOMUXC

4.7.2.1

CSPI Master Mode Timing

Figure 32 depicts the timing of CSPI in master mode. Table 46 lists the CSPI master mode timing

characteristics.

RDY

CS10

SSx

CS5

CS6

CS2

CS1

CS3

CS4

SCLK

MOSI

MISO

CS2

CS7

CS3

CS9

CS8

Figure 32. CSPI/ECSPI Master Mode Timing Diagram

Table 46. CSPI Master Mode Timing Parameters

ID

Parameter

Symbol

Min

Max

Unit

CS1

CS2

CS3

CS4

CS5

SCLK Cycle Time

SCLK High or Low Time

SCLK Rise or Fall¹

SSx pulse width

t_clk

t_SW

60

26

—

26

—

ns

t_RISE/FALL

t_CSLH

t_SCS

SSx Lead Time (Slave Select setup

time)

CS6

CS7

SSx Lag Time (SS hold time)

t_HCS

26

–1

—

ns

MOSI Propagation Delay

(C_LOAD= 20 pF)

t_PDmosi

21

CS8

MISO Setup Time

t_Smiso

5

—

ns

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Electrical Characteristics

Table 46. CSPI Master Mode Timing Parameters (continued)

ID

Parameter

Symbol

Min

Max

Unit

CS9

MISO Hold Time

RDY to SSx Time²

t_Hmiso

t_SDRY

5

—

ns

CS10

1

2

See specific I/O AC parameters Section 4.5, “I/O AC Parameters”

SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

4.7.2.2

CSPI Slave Mode Timing

Figure 33 depicts the timing of CSPI in slave mode. Timing characteristics were not available at the time

of publication.

SSx

CS1

CS5

CS6

CS2

CS4

SCLK

MISO

CS2

CS9

CS8

CS7

MOSI

Figure 33. CSPI/ECSPI Slave Mode Timing Diagram

4.7.2.3

ECSPI Master Mode Timing

Figure 32 depicts the timing of ECSPI in master mode. Table 47 lists the ECSPI master mode timing

characteristics.

Table 47. ECSPI Master Mode Timing Parameters

ID

Parameter

SCLK Cycle Time–Read

Symbol

Min

Max

Unit

CS1

t_clk

30

15

—

ns

SCLK Cycle Time–Write

CS2

SCLK High or Low Time–Read

SCLK High or Low Time–Write

t_SW

14

7

—

ns

CS3

CS4

CS5

CS6

CS7

CS8

SCLK Rise or Fall¹

t_RISE/FALL

t_CSLH

—

2.5

—

ns

SSx pulse width

Half SCLK period

SSx Lead Time (CS setup time)

SSx Lag Time (CS hold time)

MOSI Propagation Delay (C_LOAD= 20 pF)

MISO Setup Time

t_SCS

5

t_HCS

t_PDmosi

t_Smiso

-0.5

8.5

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Electrical Characteristics

Table 47. ECSPI Master Mode Timing Parameters (continued)

ID

Parameter

Symbol

Min

Max

Unit

CS9

MISO Hold Time

t_Hmiso

t_SDRY

0

5

—

ns

CS10

RDY to SSx Time²

1

2

See specific I/O AC parameters Section 4.5, “I/O AC Parameters”

SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

4.7.2.4

ECSPI Slave Mode Timing

Figure 33 depicts the timing of ECSPI in slave mode. Table 48 lists the ECSPI slave mode timing

characteristics.

Table 48. ECSPI Slave Mode Timing Parameters

ID

Parameter

SCLK Cycle Time–Read

Symbol

Min

Max

Unit

CS1

t_clk

15

40

—

ns

SCLK Cycle Time–Write

CS2

SCLK High or Low Time–Read

SCLK High or Low Time–Write

t_SW

7

20

—

ns

CS4

CS5

CS6

CS7

CS8

CS9

SSx pulse width

t_CSLH

t_SCS

Half SCLK period

—

17

ns

SSx Lead Time (CS setup time)

SSx Lag Time (CS hold time)

MOSI Setup Time

5

4

t_HCS

t_Smosi

t_Hmosi

t_PDmiso

MOSI Hold Time

MISO Propagation Delay (C_LOAD= 20 pF)

4.7.3

Enhanced Serial Audio Interface (ESAI) Timing Parameters

The ESAI consists of independent transmitter and receiver sections, each section with its own clock

generator. Table 49 shows the interface timing values. The number field in the table refers to timing signals

found in Figure 34 and Figure 35.

Table 49. Enhanced Serial Audio Interface (ESAI) Timing

Characteristics¹’^2,3

No.

Symbol Expression³Min

Max Condition⁴Unit

62 Clock cycle⁵

t_SSICC

4 × T

30.0

—

i ck

ns

c

63 Clock high period

• For internal clock

—

2 × T − 9.0

6

—

c

• For external clock

2 × T

15

c

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Electrical Characteristics

Table 49. Enhanced Serial Audio Interface (ESAI) Timing (continued)

Characteristics¹’^2,3

No.

Symbol Expression³Min

Max Condition⁴Unit

64 Clock low period

ns

—

2 × T − 9.0

6

—

• For internal clock

c

• For external clock

2 × T

15

c

65 SCKR rising edge to FSR out (bl) high

—

17.0

7.0

x ck

i ck a

ns

66 SCKR rising edge to FSR out (bl) low

67 SCKR rising edge to FSR out (wr) high⁶

68 SCKR rising edge to FSR out (wr) low⁶

69 SCKR rising edge to FSR out (wl) high

70 SCKR rising edge to FSR out (wl) low

—

17.0

7.0

x ck

i ck a

—

19.0

9.0

x ck

i ck a

—

19.0

9.0

x ck

i ck a

—

16.0

6.0

x ck

i ck a

—

17.0

7.0

x ck

i ck a

71 Data in setup time before SCKR (SCK in synchronous

mode) falling edge

—

12.0

19.0

—

x ck

i ck

72 Data in hold time after SCKR falling edge

73 FSR input (bl, wr) high before SCKR falling edge⁶

74 FSR input (wl) high before SCKR falling edge

75 FSR input hold time after SCKR falling edge

78 SCKT rising edge to FST out (bl) high

79 SCKT rising edge to FST out (bl) low

80 SCKT rising edge to FST out (wr) high⁶

81 SCKT rising edge to FST out (wr) low⁶

82 SCKT rising edge to FST out (wl) high

83 SCKT rising edge to FST out (wl) low

—

3.5

9.0

—

x ck

i ck

—

2.0

12.0

—

x ck

i ck a

—

2.0

12.0

—

x ck

i ck a

—

2.5

8.5

—

x ck

i ck a

—

18.0

8.0

x ck

i ck

—

20.0

10.0

x ck

i ck

—

20.0

10.0

x ck

i ck

—

22.0

12.0

x ck

i ck

—

19.0

9.0

x ck

i ck

—

20.0

10.0

x ck

i ck

84 SCKT rising edge to data out enable from high

impedance

—

22.0

17.0

x ck

i ck

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Electrical Characteristics

Table 49. Enhanced Serial Audio Interface (ESAI) Timing (continued)

Characteristics¹’^2,3

No.

Symbol Expression³Min

Max Condition⁴Unit

86 SCKT rising edge to data out valid

—

18.0

13.0

x ck

i ck

ns

87 SCKT rising edge to data out high impedance ⁷⁷

89 FST input (bl, wr) setup time before SCKT falling edge⁶

90 FST input (wl) setup time before SCKT falling edge

91 FST input hold time after SCKT falling edge

—

21.0

16.0

x ck

i ck

—

2.0

18.0

—

x ck

i ck

—

2.0

18.0

—

x ck

i ck

—

4.0

5.0

—

x ck

i ck

95 HCKR/HCKT clock cycle

—

2 x T_C

—

15

—

ns

96 HCKT input rising edge to SCKT output

97 HCKR input rising edge to SCKR output

18.0

—

1

2

VCORE_VDD= 1.00 +- 0.10V

Tj = -40C to 125C

CL=50pF

i ck = internal clock

x ck = external clock

i ck a = internal clock, asynchronous mode

(asynchronous implies that SCKT and SCKR are two different clocks)

i ck s = internal clock, synchronous mode

(synchronous implies that SCKT and SCKR are the same clock)

3

4

bl = bit length

wl = word length

wr = word length relative

SCKT(SCKT pin) = transmit clock

SCKR(SCKR pin) = receive clock

FST(FST pin) = transmit frame sync

FSR(FSR pin) = receive frame sync

HCKT(HCKT pin) = transmit high frequency clock

HCKR(HCKR pin) = receive high frequency clock

5

6

For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.

The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync

signal waveform, but it spreads from one serial clock before the first bit clock (like the bit length frame sync signal), until the

second-to-last bit clock of the first word in the frame.

7

Periodically sampled and not 100% tested.

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Electrical Characteristics

62

63

64

SCKT

(Input/Output)

78

79

FST (Bit)

Out

82

83

FST (Word)

Out

86

84

86

87

First Bit

Last Bit

Data Out

89

91

FST (Bit) In

91

90

FST (Word) In

Figure 34. ESAI Transmitter Timing

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Electrical Characteristics

62

63

64

SCKR

(Input/Output)

65

66

FSR (Bit)

Out

69

70

FSR (Word)

Out

72

71

Data In

Last Bit

First Bit

75

73

FSR (Bit)

In

74

75

FSR (Word)

In

Figure 35. ESAI Receiver Timing

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Electrical Characteristics

4.7.4

Enhanced Secured Digital Host Controller(eSDHCv2/v3) AC timing

This section describes the electrical information of the eSDHCv2/v3, which includes SD/eMMC4.3

(Single Data Rate) timing and eMMC4.4 (Dual Date Rate) timing.

4.7.4.1

SD/eMMC4.3 (Single Data Rate) AC Timing

Figure 36 depicts the timing of SD/eMMC4.3, and Table 50 lists the SD/eMMC4.3 timing characteristics.

SD4

SD2

SD1

SD5

SCK

SD3

CMD

SD6

DAT0

DAT1

output from eSDHCv2 to card

......

DAT7

SD7

SD8

CMD

DAT0

DAT1

......

input from card to eSDHCv2

DAT7

Figure 36. SD/eMMC4.3 Timing

Table 50. SD/eMMC4.3 Interface Timing Specification

ID

Parameter

Symbols

Min

Max

Unit

Card Input Clock

1

SD1 Clock Frequency (Low Speed)

f_PP

0

400

25/50

20/52

400

—

kHz

MHz

kHz

ns

2

Clock Frequency (SD/SDIO Full Speed/High Speed)

Clock Frequency (MMC Full Speed/High Speed)

Clock Frequency (Identification Mode)

f_PP

3

f_PP

0

f_OD

t_WL

100

7

SD2 Clock Low Time

SD3 Clock High Time

SD4 Clock Rise Time

SD5 Clock Fall Time

t_WH

t_TLH

t_THL

7

—

ns

—

3

ns

3

ns

eSDHC Output/Card Inputs CMD, DAT (Reference to CLK)

SD6 eSDHC Output Delay

t_OD

–5

5

ns

eSDHC Input/Card Outputs CMD, DAT (Reference to CLK)

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Table 50. SD/eMMC4.3 Interface Timing Specification (continued)

ID

Parameter

Symbols

Min

Max

Unit

eSDHC Input Setup Time

eSDHC Input Hold Time⁴

t_ISU

2.5

—

ns

SD7

SD8

t_IH

2.5

—

ns

1

2

In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.

In normal (full) speed mode for SD/SDIO card, clock frequency can be any value between 0–25 MHz. In high-speed mode,

clock frequency can be any value between 0–50 MHz.

In normal (full) speed mode for MMC card, clock frequency can be any value between 0–20 MHz. In high-speed mode, clock

frequency can be any value between 0–52 MHz.

3

⁴To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.

4.7.4.2

eMMC4.4 (Dual Data Rate) eSDHCv3 AC Timing

Figure 37 depicts the timing of eMMC4.4. Table 51 lists the eMMC4.4 timing characteristics. Be aware

that only DATA is sampled on both edges of the clock (not applicable to CMD).

SD1

SCK

SD2

DAT0

DAT1

......

output from eSDHCv3 to card

......

DAT7

SD3

SD4

DAT0

DAT1

......

DAT7

input from card to eSDHCv3

Figure 37. eMMC4.4 Timing

Table 51. eMMC4.4 Interface Timing Specification

ID

Parameter

Symbols

Min

Max

Unit

Card Input Clock

Clock Frequency (MMC Full Speed/High Speed)

SD1

SD2

f_PP

0

52

5

MHz

ns

eSDHC Output / Card Inputs CMD, DAT (Reference to CLK)

eSDHC Output Delay t_OD–5

eSDHC Input / Card Outputs CMD, DAT (Reference to CLK)

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Electrical Characteristics

Table 51. eMMC4.4 Interface Timing Specification (continued)

ID

Parameter

Symbols

Min

Max

Unit

SD3

SD4

eSDHC Input Setup Time

eSDHC Input Hold Time

t_ISU

t_IH

2.5

—

ns

4.7.5

FEC AC Timing Parameters

This section describes the electrical information of the Fast Ethernet Controller (FEC) module. The FEC

is designed to support both 10 and 100 Mbps Ethernet/IEEE 802.3 networks. An external transceiver

interface and transceiver function are required to complete the interface to the media. The FEC supports

the 10/100 Mbps MII (18 pins in total) and the 10 Mbps (only 7-wire interface, which uses 7 of the MII

pins), for connection to an external Ethernet transceiver. For the pin list of MII and 7-wire, see the i.MX53

Reference Manual.

This section describes the AC timing specifications of the FEC. The MII signals are compatible with

transceivers operating at a voltage of 3.3 V.

4.7.5.1

MII Receive Signal Timing

The MII receive signal timing involves the FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER, and

FEC_RX_CLK signals. The receiver functions correctly up to a FEC_RX_CLK maximum frequency of

25 MHz + 1%. There is no minimum frequency requirement but the processor clock frequency must

exceed twice the FEC_RX_CLK frequency. Table 52 lists the MII receive channel signal timing

parameters and Figure 38 shows MII receive signal timings.

.

Table 52. MII Receive Signal Timing

No.

Characteristics^{1 2}

Min

Max

Unit

M1

M2

M3

M4

FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER to FEC_RX_CLK setup

FEC_RX_CLK to FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER hold

FEC_RX_CLK pulse width high

5

—

ns

5

ns

35%

65%

FEC_RX_CLK period

FEC_RX_CLK pulse width low

1

2

FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have same timing in 10 Mbps 7-wire interface mode.

Test conditions: 25pF on each output signal.

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Electrical Characteristics

M3

FEC_RX_CLK (input)

M4

FEC_RXD[3:0] (inputs)

FEC_RX_DV

FEC_RX_ER

M1

M2

Figure 38. MII Receive Signal Timing Diagram

4.7.5.2

MII Transmit Signal Timing

The MII transmit signal timing affects the FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER, and

FEC_TX_CLK signals. The transmitter functions correctly up to a FEC_TX_CLK maximum frequency

of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency

must exceed twice the FEC_TX_CLK frequency.

Table 53 lists MII transmit channel timing parameters. Figure 39 shows MII transmit signal timing

diagram for the values listed in Table 53.

Table 53. MII Transmit Signal Timing

Num

Characteristic^{1 2}

Min

Max

Unit

M5

M6

M7

M8

FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER invalid

FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER valid

FEC_TX_CLK pulse width high

5

—

ns

—

20

ns

35%

65%

FEC_TX_CLK period

FEC_TX_CLK pulse width low

1

2

FEC_TX_EN, FEC_TX_CLK, and FEC_TXD0 have the same timing in 10 Mbps 7-wire interface mode.

Test conditions: 25pF on each output signal.

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Electrical Characteristics

.

M7

FEC_TX_CLK (input)

M5

M8

FEC_TXD[3:0] (outputs)

FEC_TX_EN

FEC_TX_ER

M6

Figure 39. MII Transmit Signal Timing Diagram

4.7.5.3

MII Async Inputs Signal Timing (FEC_CRS and FEC_COL)

Table 54 lists MII asynchronous inputs signal timing information. Figure 40 shows MII asynchronous

input timings listed in Table 54.

Table 54. MII Async Inputs Signal Timing

Num

Characteristic ¹

Min

Max

Unit

M9²

FEC_CRS to FEC_COL minimum pulse width

1.5

—

FEC_TX_CLK period

1

2

Test conditions: 25pF on each output signal.

FEC_COL has the same timing in 10 Mbit 7-wire interface mode.

.

FEC_CRS, FEC_COL

M9

Figure 40. MII Async Inputs Timing Diagram

4.7.5.4

MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)

Table 55 lists MII serial management channel timings. Figure 41 shows MII serial management channel

timings listed in Table 55. The MDC frequency should be equal to or less than 2.5 MHz to be compliant

with the IEEE 802.3 MII specification. However, the FEC can function correctly with a maximum MDC

frequency of 15 MHz.

Table 55. MII Transmit Signal Timing

ID

Characteristics¹

Min Max

Unit

M10 FEC_MDC falling edge to FEC_MDIO output invalid (minimum propagation delay)

M11 FEC_MDC falling edge to FEC_MDIO output valid (max propagation delay)

M12 FEC_MDIO (input) to FEC_MDC rising edge setup

0

—

5

ns

—

18

—

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Electrical Characteristics

Table 55. MII Transmit Signal Timing (continued)

Characteristics¹

ID

Min Max

Unit

M13 FEC_MDIO (input) to FEC_MDC rising edge hold

M14 FEC_MDC pulse width high

0

—

ns

40 60% FEC_MDC period

%

M15 FEC_MDC pulse width low

40 60% FEC_MDC period

%

1

Test conditions: 25pF on each output signal.

M14

M15

FEC_MDC (output)

FEC_MDIO (output)

M10

M11

FEC_MDIO (input)

M12

M13

Figure 41. MII Serial Management Channel Timing Diagram

4.7.5.5

RMII Mode Timing

In RMII mode, FEC_TX_CLK is used as the REF_CLK which is a 50 MHz 50 ppm continuous reference

clock. FEC_RX_DV is used as the CRS_DV in RMII, and other signals under RMII mode include

FEC_TX_EN, FEC_TXD[1:0], FEC_RXD[1:0] and optional FEC_RX_ER.

The RMII mode timings are shown in Table 56 and Figure 42.

Table 56. RMII Signal Timing

No.

Characteristics¹

Min

Max

Unit

M16

M17

M18

M19

REF_CLK(FEC_TX_CLK) pulse width high

REF_CLK(FEC_TX_CLK) pulse width low

REF_CLK to FEC_TXD[1:0], FEC_TX_EN invalid

REF_CLK to FEC_TXD[1:0], FEC_TX_EN valid

35%

2

65%

—

REF_CLK period

ns

—

16

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Electrical Characteristics

No.

Table 56. RMII Signal Timing (continued)

Characteristics¹

Min

Max

Unit

M20

FEC_RXD[1:0], CRS_DV(FEC_RX_DV), FEC_RX_ER to

REF_CLK setup

4

—

ns

M21

REF_CLK to FEC_RXD[1:0], FEC_RX_DV, FEC_RX_ER

hold

2

—

1

Test conditions: 25pF on each output signal.

M16

M17

REF_CLK (input)

M18

FEC_TXD[1:0] (output)

FEC_TX_EN

M19

CRS_DV (input)

FEC_RXD[1:0]

FEC_RX_ER

M20

M21

Figure 42. RMII Mode Signal Timing Diagram

4.7.6

Flexible Controller Area Network (FLEXCAN) AC Electrical

Specifications

The electrical characteristics are related to the CAN transceiver external to i.MX53xD such as MC33902

from Freescale.The i.MX53xD has two CAN modules available for systems design. Tx and Rx ports for

both modules are multiplexed with other I/O pins. See the IOMUXC chapter of the i.MX53 Reference

Manual to see which pins expose Tx and Rx pins; these ports are named TXCAN and RXCAN,

respectively.

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Electrical Characteristics

4.7.7

I²C Module Timing Parameters

2

This section describes the timing parameters of the I C module. Figure 43 depicts the timing of I C

module, and Table 57 lists the I C module timing characteristics.

2

IC11

IC9

IC10

I2DAT

I2CLK

IC7

IC4

IC2

IC3

IC8

IC10

IC6

IC11

STOP

START

IC5

IC1

2

Figure 43. I C Bus Timing

2

Table 57. I C Module Timing Parameters

Standard Mode

Supply Voltage =

1.65 V–1.95 V, 2.7 V–3.3 V

Fast Mode

Supply Voltage =

2.7 V–3.3 V

ID

Parameter

Unit

Min

Max

Min

Max

IC1

IC2

I2CLK cycle time

10

4.0

0¹

—

2.5

0.6

0¹

—

µs

Hold time (repeated) START condition

Set-up time for STOP condition

IC3

—

IC4

Data hold time

3.45²

—

0.9²µs

IC5

HIGH Period of I2CLK Clock

4.0

4.7

250

4.7

—

0.6

1.3

0.6

100³

1.3

—

µs

ns

µs

IC6

LOW Period of the I2CLK Clock

Set-up time for a repeated START condition

Data set-up time

—

IC7

—

IC8

—

IC9

Bus free time between a STOP and START condition

Rise time of both I2DAT and I2CLK signals

Fall time of both I2DAT and I2CLK signals

Capacitive load for each bus line (C_b)

—

4

IC10

IC11

IC12

1000

300

400

20 + 0.1C_b300 ns

4

—

20 + 0.1C_b300 ns

—

400 pF

1

A device must internally provide a hold time of at least 300 ns for I2DAT signal in order to bridge the undefined region of the

falling edge of I2CLK.

2

3

The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2CLK signal.

A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)

of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2CLK signal.

If such a device does stretch the LOW period of the I2CLK signal, it must output the next data bit to the I2DAT line

max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification)

before the I2CLK line is released.

4

C_b= total capacitance of one bus line in pF.

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Electrical Characteristics

4.7.8

Image Processing Unit (IPU) Module Parameters

The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor

and/or to a display device. This support covers all aspects of these activities:

•

Connectivity to relevant devices—cameras, displays, graphics accelerators, and TV encoders.

Related image processing and manipulation: sensor image signal processing, display processing,

image conversions, and other related functions.

•

Synchronization and control capabilities, such as avoidance of tearing artifacts.

4.7.8.1

IPU Sensor Interface Signal Mapping

The IPU supports a number of sensor input formats. Table 58 defines the mapping of the Sensor Interface

Pins used for various supported interface formats.

Table 58. Camera Input Signal Cross Reference, Format and Bits per Cycle

RGB565

8 bits

2 cycles

RGB565²

8 bits

3 cycles

RGB666³RGB888

YCbCr RGB565⁴YCbCr⁵

YCbCr⁶

16 bits

1 cycle

YCbCr⁷

20 bits

1 cycle

Signal

Name¹

8 bits

16 bits

1 cycle

3 cycles

2 cycles 2 cycles

CSIx_DAT0

CSIx_DAT1

CSIx_DAT2

CSIx_DAT3

CSIx_DAT4

CSIx_DAT5

CSIx_DAT6

CSIx_DAT7

CSIx_DAT8

CSIx_DAT9

CSIx_DAT10

CSIx_DAT11

—

0

C[0]

C[1]

C[2]

C[3]

C[4]

C[5]

C[6]

C[7]

C[8]

C[9]

Y[0]

Y[1]

Y[2]

Y[3]

Y[4]

Y[5]

Y[6]

Y[7]

Y[8]

Y[9]

—

0

—

C[0]

C[1]

C[2]

C[3]

C[4]

C[5]

C[6]

C[7]

0

—

B[0]

B[1]

B[2]

B[3]

B[4]

G[0]

G[1]

G[2]

G[3]

G[4]

G[5]

R[0]

R[1]

R[2]

R[3]

R[4]

C[0]

C[1]

C[2]

C[3]

C[4]

C[5]

C[6]

C[7]

Y[0]

Y[1]

Y[2]

Y[3]

Y[4]

Y[5]

Y[6]

Y[7]

—

0

CSIx_DAT12 B[0], G[3] R[2],G[4],B[2] R/G/B[4]

CSIx_DAT13 B[1], G[4] R[3],G[5],B[3] R/G/B[5]

CSIx_DAT14 B[2], G[5] R[4],G[0],B[4] R/G/B[0]

CSIx_DAT15 B[3], R[0] R[0],G[1],B[0] R/G/B[1]

CSIx_DAT16 B[4], R[1] R[1],G[2],B[1] R/G/B[2]

CSIx_DAT17 G[0], R[2] R[2],G[3],B[2] R/G/B[3]

CSIx_DAT18 G[1], R[3] R[3],G[4],B[3] R/G/B[4]

CSIx_DAT19 G[2], R[4] R[4],G[5],B[4] R/G/B[5]

R/G/B[0]

R/G/B[1]

R/G/B[2]

R/G/B[3]

R/G/B[4]

R/G/B[5]

R/G/B[6]

R/G/B[7]

Y/C[0]

Y/C[1]

Y/C[2]

Y/C[3]

Y/C[4]

Y/C[5]

Y/C[6]

Y/C[7]

Y[0]

Y[1]

Y[2]

Y[3]

Y[4]

Y[5]

Y[6]

Y[7]

1

CSIx stands for CSI1 or CSI2

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Electrical Characteristics

2

3

4

The MSB bits are duplicated on LSB bits implementing color extension

The two MSB bits are duplicated on LSB bits implementing color extension

RGB 16 bits – supported in two ways: (1) As a “generic data” input – with no on-the-fly processing; (2) With on-the-fly

processing, but only under some restrictions on the control protocol.

5

6

7

YCbCr 16 bits - supported as a “generic-data” input – with no on-the-fly processing.

YCbCr 16 bits - supported as a sub-case of the YCbCr, 20 bits, under the same conditions (BT.1120 protocol).

YCbCr, 20 bits, supported only within the BT.1120 protocol (syncs embedded within the data stream).

4.7.8.2

Sensor Interface Timings

There are three camera timing modes supported by the IPU.

4.7.8.2.1

BT.656 and BT.1120 Video Mode

Smart camera sensors, which include imaging processing, usually support video mode transfer. They use

an embedded timing syntax to replace the SENSB_VSYNC and SENSB_HSYNC signals. The timing

syntax is defined by the BT.656/BT.1120 standards.

This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only

control signal used is SENSB_PIX_CLK. Start-of-frame and active-line signals are embedded in the data

stream. An active line starts with a SAV code and ends with a EAV code. In some cases, digital blanking

is inserted in between EAV and SAV code. The CSI decodes and filters out the timing-coding from the data

stream, thus recovering SENSB_VSYNC and SENSB_HSYNC signals for internal use. On BT.656 one

component per cycle is received over the SENSB_DATA bus. On BT.1120 two components per cycle are

received over the SENSB_DATA bus.

4.7.8.2.2

Gated Clock Mode

The SENSB_VSYNC, SENSB_HSYNC, and SENSB_PIX_CLK signals are used in this mode. See

Figure 44.

Active Line

Start of Frame

nth frame

n+1th frame

SENSB_VSYNC

SENSB_HSYNC

SENSB_PIX_CLK

invalid

SENSB_DATA[19:0]

1st byte

Figure 44. Gated Clock Mode Timing Diagram

A frame starts with a rising edge on SENSB_VSYNC (all the timings correspond to straight polarity of the

corresponding signals). Then SENSB_HSYNC goes to high and hold for the entire line. Pixel clock is valid

as long as SENSB_HSYNC is high. Data is latched at the rising edge of the valid pixel clocks.

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Electrical Characteristics

SENSB_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI stops

receiving data from the stream. For next line the SENSB_HSYNC timing repeats. For next frame the

SENSB_VSYNC timing repeats.

4.7.8.2.3

Non-Gated Clock Mode

The timing is the same as the gated-clock mode (described in Section 4.7.8.2.2, “Gated Clock Mode,”)

except for the SENSB_HSYNC signal, which is not used (see Figure 45). All incoming pixel clocks are

valid and cause data to be latched into the input FIFO. The SENSB_PIX_CLK signal is inactive (states

low) until valid data is going to be transmitted over the bus.

Start of Frame

nth frame

n+1th frame

SENSB_VSYNC

SENSB_PIX_CLK

invalid

SENSB_DATA[19:0]

1st byte

Figure 45. Non-Gated Clock Mode Timing Diagram

The timing described in Figure 45 is that of a typical sensor. Some other sensors may have a slightly

different timing. The CSI can be programmed to support rising/falling-edge triggered SENSB_VSYNC;

active-high/low SENSB_HSYNC; and rising/falling-edge triggered SENSB_PIX_CLK.

4.7.8.3

Electrical Characteristics

Figure 46 depicts the sensor interface timing. SENSB_MCLK signal described here is not generated by

the IPU. Table 59 lists the sensor interface timing characteristics.

SENSB_PIX_CLK

(Sensor Output)

1/IP1

IP2

IP3

SENSB_DATA,

SENSB_VSYNC,

SENSB_HSYNC

Figure 46. Sensor Interface Timing Diagram

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Electrical Characteristics

Table 59. Sensor Interface Timing Characteristics

ID

Parameter

Symbol

Fpck

Min

Max

Unit

MHz

IP1

IP2

IP3

Sensor output (pixel) clock frequency

Data and control setup time

0.01

2

180

—

Tsu

Thd

ns

Data and control holdup time

1

—

4.7.8.4

IPU Display Interface Signal Mapping

The IPU supports a number of display output video formats. Table 60 defines the mapping of the Display

Interface Pins used during various supported video interface formats.

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Electrical Characteristics

Table 60. Video Signal Cross-Reference

LCD

i.MX53xD

RGB/TV Signal Allocation (Example)

16-bit 18-bit 24 Bit 8-bit 16-bit 20-bit

Smart

Comment¹

RGB,

Signal

Name

Port Name

(x=0, 1)

Signal

Name

(General) RGB RGB RGB YCrCb²YCrCb YCrCb

DISPx_DAT0

DISPx_DAT1

DISPx_DAT2

DISPx_DAT3

DISPx_DAT4

DISPx_DAT5

DISPx_DAT6

DISPx_DAT7

DISPx_DAT8

DISPx_DAT9

DAT[0]

DAT[1]

DAT[2]

DAT[3]

DAT[4]

DAT[5]

DAT[6]

DAT[7]

DAT[8]

DAT[9]

B[0]

B[1]

B[2]

B[3]

B[4]

G[0]

G[1]

G[2]

G[3]

G[4]

G[5]

R[0]

R[1]

R[2]

R[3]

R[4]

—

B[0]

B[1]

B[2]

B[3]

B[4]

B[5]

G[0]

G[1]

G[2]

G[3]

G[4]

G[5]

R[0]

R[1]

R[2]

R[3]

R[4]

R[5]

—

B[0]

B[1]

B[2]

B[3]

B[4]

B[5]

B[6]

B[7]

G[0]

G[1]

G[2]

G[3]

G[4]

G[5]

G[6]

G[7]

R[0]

R[1]

R[2]

R[3]

R[4]

R[5]

Y/C[0]

Y/C[1]

Y/C[2]

Y/C[3]

Y/C[4]

Y/C[5]

Y/C[6]

Y/C[7]

—

C[0]

C[1]

C[2]

C[3]

C[4]

C[5]

C[6]

C[7]

Y[0]

Y[1]

Y[2]

Y[3]

Y[4]

Y[5]

Y[6]

Y[7]

—

C[0]

C[1]

C[2]

C[3]

C[4]

C[5]

C[6]

C[7]

C[8]

C[9]

Y[0]

Y[1]

Y[2]

Y[3]

Y[4]

Y[5]

Y[6]

Y[7]

Y[8]

Y[9]

—

DAT[0]

DAT[1]

DAT[2]

DAT[3]

DAT[4]

DAT[5]

DAT[6]

DAT[7]

DAT[8]

DAT[9]

DAT[10]

DAT[11]

DAT[12]

DAT[13]

DAT[14]

DAT[15]

—

The restrictions are as follows:

a) There are maximal three

continuous groups of bits that

could be independently mapped to

the external bus.

Groups should not be overlapped.

b) The bit order is expressed in

each of the bit groups, for example

B[0] = least significant blue pixel

bit

—

DISPx_DAT10 DAT[10]

DISPx_DAT11 DAT[11]

DISPx_DAT12 DAT[12]

DISPx_DAT13 DAT[13]

DISPx_DAT14 DAT[14]

DISPx_DAT15 DAT[15]

DISPx_DAT16 DAT[16]

DISPx_DAT17 DAT[17]

DISPx_DAT18 DAT[18]

DISPx_DAT19 DAT[19]

DISPx_DAT20 DAT[20]

DISPx_DAT21 DAT[21]

—

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Electrical Characteristics

Table 60. Video Signal Cross-Reference (continued)

LCD

i.MX53xD

RGB/TV Signal Allocation (Example)

16-bit 18-bit 24 Bit 8-bit 16-bit 20-bit

Smart

Comment¹

RGB,

Signal

Name

Port Name

(x=0, 1)

Signal

Name

(General) RGB RGB RGB YCrCb²YCrCb YCrCb

DISPx_DAT22 DAT[22]

DISPx_DAT23 DAT[23]

DIx_DISP_CLK

—

R[6]

R[7]

—

PixCLK

—

DIx_PIN1

VSYNC_IN May be required for anti-tearing

DIx_PIN2

DIx_PIN3

DIx_PIN4

DIx_PIN5

DIx_PIN6

DIx_PIN7

DIx_PIN8

DIx_D0_CS

DIx_D1_CS

HSYNC

—

VSYNC

—

VSYNC out

—

Additional frame/row synchronous

signals with programmable timing

—

CS0

CS1

—

Alternate mode of PWM output for

contrast or brightness control

DIx_PIN11

DIx_PIN12

DIx_PIN13

DIx_PIN14

DIx_PIN15

DIx_PIN16

DIx_PIN17

—

WR

RD

—

RS1

RS2

DRDY

—

Register select signal

Optional RS2

—

DRDY/DV

Data validation/blank, data enable

—

Q

Additional data synchronous

signals with programmable

features/timing

—

1

Signal mapping (both data and control/synchronization) is flexible. The table provides examples.

2

This mode works in compliance with recommendation ITU-R BT.656. The timing reference signals (frame start, frame end, line

start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data

during blanking intervals is not supported.

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Electrical Characteristics

NOTE

Table 60 provides information for both the Disp0 and Disp1 ports. However,

Disp1 port has reduced pinout depending on IOMUXC configuration and

therefore may not support all the above configurations. See the IOMUXC

table for details.

4.7.8.5

IPU Display Interface Timing

The IPU Display Interface supports two kinds of display accesses: synchronous and asynchronous. There

are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.

4.7.8.5.1

Synchronous Controls

The synchronous control changes its value as a function of a system or of an external clock. This control

has a permanent period and a permanent wave form.

There are special physical outputs to provide synchronous controls:

•

The ipp_disp_clk is a dedicated base synchronous signal that is used to generate a base display

(component, pixel) clock for a display.

•

The ipp_pin_1– ipp_pin_7 are general purpose synchronous pins, that can be used to provide

HSYNC, VSYNC, DRDY or any else independent signal to a display.

The IPU has a system of internal binding counters for internal events (such as HSYNC/VSYCN and so on)

calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control

starts from the local start point with predefined UP and DOWN values to calculate control’s changing

points with half DI_CLK resolution. A full description of the counters system can be found in the IPU

chapter of the i.MX53 Reference Manual.

4.7.8.5.2

Asynchronous Controls

The asynchronous control is a data-oriented signal that changes its value with an output data according to

additional internal flags coming with the data.

There are special physical outputs to provide asynchronous controls, as follows:

•

The ipp_d0_cs and ipp_d1_cs pins are dedicated to provide chip select signals to two displays.

The ipp_pin_11– ipp_pin_17 are general purpose asynchronous pins, that can be used to provide

WR. RD, RS or any other data oriented signal to display.

NOTE

The IPU has independent signal generators for asynchronous signals

toggling. When a DI decides to put a new asynchronous data in the bus, a

new internal start (local start point) is generated. The signals generators

calculate predefined UP and DOWN values to change pins states with half

DI_CLK resolution.

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Electrical Characteristics

4.7.8.6

Synchronous Interfaces to Standard Active Matrix TFT LCD Panels

IPU Display Operating Signals

4.7.8.6.1

The IPU uses four control signals and data to operate a standard synchronous interface:

•

IPP_DISP_CLK—Clock to display

HSYNC—Horizontal synchronization

VSYNC—Vertical synchronization

DRDY—Active data

All synchronous display controls are generated on the base of an internally generated “local start point”.

The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters.

The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved

relative to the local start point. The data bus of the synchronous interface is output direction only.

4.7.8.6.2

LCD Interface Functional Description

Figure 47 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure

signals are shown with negative polarity. The sequence of events for active matrix interface timing is:

•

DI_CLK internal DI clock, used for calculation of other controls.

IPP_DISP_CLK latches data into the panel on its negative edge (when positive polarity is selected).

In active mode, IPP_DISP_CLK runs continuously.

•

HSYNC causes the panel to start a new line. (Usually IPP_PIN_2 is used as HSYNC.)

VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse.

(Usually IPP_PIN_3 is used as VSYNC.)

•

DRDY acts like an output enable signal to the CRT display. This output enables the data to be

shifted onto the display. When disabled, the data is invalid and the trace is off.

(DRDY can be used either synchronous or asynchronous generic purpose pin as well.)

VSYNC

HSYNC

LINE 1

LINE 2

LINE 3

LINE 4

LINE n-1 LINE n

HSYNC

DRDY

1

2

3

m–1

m

IPP_DISP_CLK

IPP_DATA

Figure 47. Interface Timing Diagram for TFT (Active Matrix) Panels

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Electrical Characteristics

4.7.8.6.3

TFT Panel Sync Pulse Timing Diagrams

Figure 48 depicts the horizontal timing (timing of one line), including both the horizontal sync pulse and

the data. All the parameters shown in the figure are programmable. All controls are started by

corresponding internal events—local start points. The timing diagrams correspond to inverse polarity of

the IPP_DISP_CLK signal and active-low polarity of the HSYNC, VSYNC, and DRDY signals.

IP13o

IP7

IP5

IP5o

IP8o

IP8

DI clock

IPP_DISP_CLK

VSYNC

HSYNC

DRDY

IPP_DATA

Dn

D0

D1

IP9o

IP10

IP9

IP6

Figure 48. TFT Panels Timing Diagram—Horizontal Sync Pulse

Figure 49 depicts the vertical timing (timing of one frame). All parameters shown in the figure are

programmable.

End of frame

Start of frame

IP13

VSYNC

HSYNC

DRDY

IP11

IP15

IP14

IP12

Figure 49. TFT Panels Timing Diagram—Vertical Sync Pulse

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Electrical Characteristics

Table 61 shows timing characteristics of signals presented in Figure 48 and Figure 49.

Table 61. Synchronous Display Interface Timing Characteristics (Pixel Level)

ID

Parameter

Symbol

Value

Description

Unit

IP5

IP6

Display interface clock period Tdicp

Display pixel clock period

(¹)

Display interface clock. IPP_DISP_CLK

ns

Tdpcp DISP_CLK_PER_PIXEL Time of translation of one pixel to display,

× Tdicp

DISP_CLK_PER_PIXEL—number of pixel

components in one pixel (1.n). The

DISP_CLK_PER_PIXEL is virtual

parameter to define Display pixel clock

period.

The DISP_CLK_PER_PIXELis receivedby

DC/DI one access division to n

components.

IP7

Screen width time

Tsw

(SCREEN_WIDTH)

SCREEN_WIDTH—screen width in,

interface clocks. horizontal blanking

included.

ns

× Tdicp

The SCREEN_WIDTH should be built by

suitable DI’s counter².

IP8

IP9

HSYNC width time

Thsw

Thbi1

(HSYNC_WIDTH)

HSYNC_WIDTH—Hsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter.

ns

Horizontal blank interval 1

^BGXP× Tdicp

BGXP—width of a horizontal blanking

before a first active data in a line (in

interface clocks). The BGXP should be built

by suitable DI’s counter.

IP10 Horizontal blank interval 2

IP12 Screen height

Thbi2

Tsh

(SCREEN_WIDTH –

^{BGXP – FW)}× Tdicp

Width a horizontal blanking after a last

active data in a line (in interface clocks)

FW—with of active line in interface clocks.

The FW should be built by suitable DI’s

counter.

ns

(SCREEN_HEIGHT)

SCREEN_HEIGHT—screenheight in lines ns

with blanking.

The SCREEN_HEIGHT is a distance

between 2 VSYNCs.

× Tsw

The SCREEN_HEIGHT should be built by

suitable DI’s counter.

IP13 VSYNC width

Tvsw

Tvbi1

Tvbi2

VSYNC_WIDTH

VSYNC_WIDTH—Vsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter

ns

IP14 Vertical blank interval 1

IP15 Vertical blank interval 2

^BGYP× Tsw

BGYP—width of first Vertical

blanking interval in line.The BGYP should

be built by suitable DI’s counter.

(SCREEN_HEIGHT – Width of second Vertical

^{BGYP – FH)}× Tsw blanking interval in line.The FH should be

built by suitable DI’s counter.

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Electrical Characteristics

Table 61. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)

ID

Parameter

Symbol

Value

Description

Unit

IP5o Offset of IPP_DISP_CLK

Todicp

DISP_CLK_OFFSET—offset of

IPP_DISP_CLK edges from local start

^{point, in DI_CLK}×2

ns

^DISP_×^CLT^Kd^_ic^Olk^FFSET

(0.5 DI_CLK Resolution)

Defined by DISP_CLK counter

IP13o Offset of VSYNC

Tovs

Tohs

VSYNC_OFFSET

VSYNC_OFFSET—offset of Vsync edges

from a local start point, when a Vsync

^{should be active, in DI_CLK}×2

(0.5 DI_CLK Resolution).The

VSYNC_OFFSET should be built by

suitable DI’s counter.

ns

× Tdiclk

IP8o Offset of HSYNC

HSYNC_OFFSET

HSYNC_OFFSET—offset of Hsync edges

from a local start point, when a Hsync

^{should be active, in DI_CLK}×2

(0.5 DI_CLK Resolution).The

HSYNC_OFFSET should be built by

suitable DI’s counter.

× Tdiclk

IP9o Offset of DRDY

Todrdy

DRDY_OFFSET

DRDY_OFFSET—offset of DRDY edges

from a suitable local start point, when a

corresponding data has been set on the

^{bus, in DI_CLK}×2

× Tdiclk

(0.5 DI_CLK Resolution)

The DRDY_OFFSET should be built by

suitable DI’s counter.

1

Display interface clock period immediate value.

⎧

⎪

⎨

⎪

DISP_CLK_PERIOD

----------------------------------------------------

DISP_CLK_PERIOD

DI_CLK_PERIOD

T

×

,

for integer ----------------------------------------------------

diclk

DI_CLK_PERIOD

Tdicp =

DISP_CLK_PERIOD

----------------------------------------------------

+ 0.5 ± 0.5 , for fractional ----------------------------------------------------

DISP_CLK_PERIOD

DI_CLK_PERIOD

⎛

⎞

T

floor

⎪ diclk⎝

⎠

DI_CLK_PERIOD

⎩

DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK.

DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency

Display interface clock period average value.

DISP_CLK_PERIOD

----------------------------------------------------

Tdicp = T

×

diclk

DI_CLK_PERIOD

2

DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the

counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by

corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance

between HSYNCs is a SCREEN_WIDTH.

The maximal accuracy of UP/DOWN edge of controls is:

Accuracy = (0.5 × T

)±0.62ns

diclk

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Electrical Characteristics

The maximal accuracy of UP/DOWN edge of IPP_DATA is:

Accuracy = T

±0.62ns

diclk

The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed through the registers.

Figure 50 depicts the synchronous display interface timing for access level. The DISP_CLK_DOWN and

DISP_CLK_UP parameters are set through the Register. Table 62 lists the synchronous display interface

timing characteristics.

IP20o IP20

VSYNC

HSYNC

DRDY

other controls

IPP_DISP_CLK

Tdicd

Tdicu

IP18

IPP_DATA

IP16

IP17

IP19

local start point

Figure 50. Synchronous Display Interface Timing Diagram—Access Level

Table 62. Synchronous Display Interface Timing Characteristics (Access Level)

ID

Parameter

Symbol

Min

Typ¹

Max

Unit

IP16

Display interface clock Tckl

low time

Tdicd-Tdicu–1.24

Tdicd²–Tdicu³

Tdicd–Tdicu+1.24

ns

IP17

Display interface clock Tckh

high time

Tdicp–Tdicd+Tdicu–1.24 Tdicp–Tdicd+Tdicu Tdicp–Tdicd+Tdicu+1.2 ns

IP18

IP19

IP20o

Data setup time

Data holdup time

Tdsu

Tdhd

Tdicd–1.24

Tdicu

—

ns

Tdicp–Tdicd–1.24

Tocsu–1.24

Tdicp–Tdicu

Tocsu

Control signals offset Tocsu

times (defines for each

pin)

Tocsu+1.24

IP20

Control signals setup Tcsu

time to display

Tdicd–1.24–Tocsu%Tdicp Tdicu

—

ns

interface clock

(defines for each pin)

¹The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.

These conditions may be chip specific.

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Electrical Characteristics

2

Display interface clock down time

2 × DISP_CLK_DOWN

1

2

⎛

⎞

⎠

-----------------------------------------------------------

× ceil

Tdicd = -- T

⎝ diclk

DI_CLK_PERIOD

3

Display interface clock up time where CEIL(X) rounds the elements of X to the nearest integers towards infinity.

2 × DISP_CLK_UP

1

2

⎛

⎞

⎠

------------------------------------------------

× ceil

Tdicu = -- T

⎝ diclk

DI_CLK_PERIOD

4.7.8.7

Interface to a TV Encoder (TVDAC)

The interface has an 8-bit data bus, transferring a single 8-bit value (Y/U/V) in each cycle. The timing of

the interface is described in Figure 51.

NOTE

•

The frequency of the clock DISP_CLK is 27 MHz (within 10%)

The HSYNC, VSYNC signals are active low.

The DRDY signal is shown as active high.

The transition to the next row is marked by the negative edge of the

HSYNC signal. It remains low for a single clock cycle.

•

The transition to the next field/frame is marked by the negative edge of

the VSYNC signal. It remains low for at least one clock cycles.

— At a transition to an odd field (of the next frame), the negative edges

of VSYNC and HSYNC coincide.

— At a transition is to an even field (of the same frame), they do not

coincide.

•

The active intervals—during which data is transferred—are marked by

the HSYNC signal being high.

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Electrical Characteristics

DISP_CLK

HSYNC

VSYNC

DRDY

Cb

Y

Cr

Y

3

Cb

Y

Cr

IPP_DATA

Pixel Data Timing

523

524

525

1

2

4

5

6

10

HSYNC

DRDY

VSYNC

Even Field

262 263

Odd Field

268 269

261

264

265

266

267

273

HSYNC

DRDY

VSYNC

Even Field

Odd Field

Line and Field Timing - NTSC

621

622

623

624

625

1

2

3

4

23

HSYNC

DRDY

VSYNC

Even Field

Odd Field

308

309

310

311

312

313

314

315

316

336

HSYNC

DRDY

VSYNC

Even Field

Odd Field

Line and Field Timing - PAL

Figure 51. TV Encoder Interface Timing Diagram

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Electrical Characteristics

4.7.8.7.1

TVEv2 TV Encoder Performance Specifications

The TV encoder output specifications are shown in Table 63. All the parameters in the table are defined

under the following conditions:

•

R

= 1.05 kΩ 1%, resistor on TVDAC_VREF pin to GND

set

R

= 37.5 Ω 1%, output load to the GND

load

Table 63. TV Encoder Video Performance Specifications

Parameter

Conditions

Min

Typ

Max

Unit

DAC STATIC PERFORMANCE

Resolution¹

—

10

1

—

2

Bits

LSBs

%

Integral Nonlinearity (INL)²

Differential Nonlinearity (DNL) ²

Channel-to-channel gain matching²

Full scale output voltage²

—

0.6

2

1

—

R_set= 1.05 kΩ ±1%

1.24

1.306

1.37

V

R_load= 37.5 Ω ±1%

DAC DYNAMIC PERFORMANCE

Spurious Free Dynamic Range (SFDR)

F_out= 3.38 MHz

F_samp= 216 MHz

—

59

54

—

dBc

Spurious Free Dynamic Range (SFDR)

F_out= 9.28 MHz

F_samp= 297 MHz

VIDEO PERFORMANCE IN SD MODE²

Short Term Jitter (Line to Line)

Long Term Jitter (Field to Field)

Frequency Response

—

2.5

3.5

—

0.1

0

ns

—

ns

0-4.0 MHz

–0.1

–0.7

—

dB

5.75 MHz

—

dB

Luminance Nonlinearity

Differential Gain

—

0.5

0.35

0.6

75

—

%

—

%

Degrees

dB

Differential Phase

—

Signal-to-Noise Ratio (SNR)

Hue Accuracy

Flat field full bandwidth

—

0.8

1.5

–70

–47

0.5

2.5

0.1

1.0

Degrees

%

Color Saturation Accuracy

Chroma AM Noise

—

dB

Chroma PM Noise

—

dB

Chroma Nonlinear Phase

Chroma Nonlinear Gain

Chroma/Luma Intermodulation

Chroma/Luma Gain Inequality

—

Degrees

%

—

%

—

%

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Electrical Characteristics

Table 63. TV Encoder Video Performance Specifications (continued)

Parameter

Conditions

Min

Typ

Max

Unit

Chroma/Luma Delay Inequality

VIDEO PERFORMANCE IN HD MODE²

Luma Frequency Response

—

1.0

—

ns

0-30 MHz

0-15 MHz,

–0.2

—

0.2

dB

Chroma Frequency Response

YCbCr 422 mode

Luma Nonlinearity

—

3.2

3.4

62

—

%

Chroma Nonlinearity

—

Luma Signal-to-Noise Ratio

Chroma Signal-to-Noise Ratio

0-30 MHz

0-15 MHz

dB

72

1

Guaranteed by design.

2

Guaranteed by characterization.

4.7.8.8

Asynchronous Interfaces

The following sections describes the types of asynchronous interfaces.

4.7.8.8.1 Standard Parallel Interfaces

The IPU has four signal generator machines for asynchronous signal. Each machine generates IPU’s

internal control levels (0 or 1) by UP and DOWN that are defined in registers. Each asynchronous pin has

a dynamic connection with one of the signal generators. This connection is redefined again with a new

display access (pixel/component). The IPU can generate control signals according to system 80/68

requirements. The burst length is received as a result from predefined behavior of the internal signal

generator machines.

The access to a display is realized by the following:

•

CS (IPP_CS) chip select

WR (IPP_PIN_11) write strobe

RD (IPP_PIN_12) read strobe

RS (IPP_PIN_13) Register select (A0)

Both system 80 and system 68k interfaces are supported for all described modes as depicted in Figure 52,

Figure 53, Figure 54, and Figure 55. The timing images correspond to active-low IPP_CS, WR and RD

signals.

Each asynchronous access is defined by an access size parameter. This parameter can be different between

different kinds of accesses. This parameter defines a length of windows, when suitable controls of the

current access are valid. A pause between two different display accesses can be guaranteed by programing

suitable access sizes. There are no minimal/maximal hold/setup times hard defined by DI. Each control

signal can be switched at any time during access size.

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Electrical Characteristics

IPP_CS

RS

WR

RD

IPP_DATA

Burst access mode with sampling by CS signal

IPP_CS

RS

WR

RD

IPP_DATA

Single access mode (all control signals are not active for one display interface clock after each display access)

Figure 52. Asynchronous Parallel System 80 Interface (Type 1) Timing Diagram

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Electrical Characteristics

IPP_CS

RS

WR

RD

IPP_DATA

IPP_CS

Burst access mode with sampling by WR/RD signals

RS

WR

RD

IPP_DATA

Single access mode (all control signals are not active for one display interface clock after each display access)

Figure 53. Asynchronous Parallel System 80 Interface (Type 2) Timing Diagram

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Electrical Characteristics

IPP_CS

RS

WR

(READ/WRITE)

RD

(ENABLE)

IPP_DATA

Burst access mode with sampling by CS signal

IPP_CS

RS

WR

(READ/WRITE)

RD

(ENABLE)

IPP_DATA

Single access mode (all control signals are not active for one display interface clock after each display access)

Figure 54. Asynchronous Parallel System 68k Interface (Type 1) Timing Diagram

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Electrical Characteristics

IPP_CS

RS

WR

(READ/WRITE)

RD

(ENABLE)

IPP_DATA

Burst access mode with sampling by ENABLE signal

IPP_CS

RS

WR

(READ/WRITE)

RD

(ENABLE)

IPP_DATA

Single access mode (all control signals are not active for one display interface clock after each display access)

Figure 55. Asynchronous Parallel System 68k Interface (Type 2) Timing Diagram

Display operation can be performed with IPP_WAIT signal. The DI reacts to the incoming IPP_WAIT

signal with 2 DI_CLK delay. The DI finishes a current access and a next access is postponed until

IPP_WAIT release. Figure 56 shows timing of the parallel interface with IPP_WAIT control.

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Electrical Characteristics

DI clock

IPP_CS

IPP_DATA

WR

RD

IPP_WAIT

IPP_DATA_IN

waiting

IP39

waiting

Figure 56. Parallel Interface Timing Diagram—Read Wait States

4.7.8.8.2

Asynchronous Parallel Interface Timing Parameters

Figure 57 depicts timing of asynchronous parallel interfaces based on the system 80 and system 68k

interfaces. Table 65 shows timing characteristics at display access level. All timing diagrams are based

on active low control signals (signals polarity is controlled through the DI_DISP_SIG_POL register).

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Electrical Characteristics

IP29 IP32

IP35

IP33

IP30

IP36

IP47

IP31

IP34

DI clock

IPP_CS

RS

WR

RD

IPP_DATA

A0

D0

D1

D2

D3

PP_DATA_IN

IP27

IP28a

IP28d

IP37

IP38

Figure 57. Asynchronous Parallel Interface Timing Diagram

Table 64. Asynchronous Display Interface Timing Parameters (Pixel Level)

ID

Parameter

Symbol

Value

Description

Unit

IP28a Address Write system cycle time Tcycwa

ACCESS_SIZE_#

UP#

predefined value in DI REGISTER

ns

IP28d Data Write system cycle time

Tcycwd

Tdcsrr

IP29

IP30

IP31

IP32

IP35

IP36

RS start

RS strobe switch, predefined value

in DI REGISTER

CS start

Tdcsc

Tdchc

Tdchrr

Tdcsw

Tdchw

UP#

CS strobe switch, predefined value

in DI REGISTER

ns

—

ns

CS hold

DOWN#

UP#

CS strobe release, predefined

value in DI REGISTER

RS hold

RS strobe release, predefined

value in DI REGISTER

Write start

write strobe switch, predefined

value in DI REGISTER

Controls hold time for write

DOWN#

write strobe release, predefined

value in DI REGISTER

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Table 65. Asynchronous Parallel Interface Timing Parameters (Access Level)

ID

Parameter

Symbol

Min

Typ¹

Tdicpw²

Max

Tdicpw+1.24

Unit

IP28 Write system cycle time Tcycw

Tdicpw – 1.24

Tdicurs – 1.24

Tdicucs – 1.24

ns

IP29 RS start

IP30 CS start

IP31 CS hold

Tdcsrr

Tdcsc

Tdchc

Tdicurs

Tdicur

Tdicurs+1.24

Tdicucs+1.24

Tdicdcs – Tdicucs – 1.2 Tdicdcs³–Tdicucs⁴Tdicdcs – Tdicucs+1.24

4

IP32 RS hold

Tdchrr Tdicdrs – Tdicurs – 1.24 Tdicdrs⁵–Tdicurs⁶Tdicdrs – Tdicurs+1.24

ns

IP35 Controls setup time for

write

Tdcsw Tdicuw – 1.24

Tdicuw

Tdicuw+1.24

IP36 Controls hold time for

write

Tdchw Tdicdw – Tdicuw – 1.24 Tdicpw⁷–Tdicuw⁸

Tdicdw–Tdicuw+1.24

Tdicpr – Tdicdr – 1.24

ns

IP38 Slave device data hold

time⁸

Troh

Tdrp – Tlbd – Tdicdr+1.

24

—

¹The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.

These conditions may be chip specific.

²Display period value for write

DI_ACCESS_SIZE_#

-----------------------------------------------------

DI_CLK_PERIOD

Tdicpw = T

DI_CLK × ceil

ACCESS_SIZE is predefined in REGISTER.

³Display control down for CS

2 × DISP_DOWN_#

1

2

⎛

⎞

⎠

--------------------------------------------------

DI_CLK_PERIOD

Tdicdcs = -- T

× ceil

DI_CLK

⎝

DISP_DOWN is predefined in REGISTER.

⁴Display control up for CS

2 × DISP_UP_#

1

2

⎛

⎞

⎠

---------------------------------------------

Tdicucs = -- T

⎝ DI_CLK

DI_CLK_PERIOD

DISP_UP is predefined in REGISTER.

⁵Display control down for RS

2 × DISP_DOWN_#

1

2

⎛

⎞

⎠

--------------------------------------------------

Tdicdrs = -- T

⎝ DI_CLK

DI_CLK_PERIOD

DISP_DOWN is predefined in REGISTER.

⁶Display control up for RS

2 × DISP_UP_#

1

2

⎛

⎞

⎠

---------------------------------------------

Tdicurs = -- T

⎝ DI_CLK

DI_CLK_PERIOD

DISP_UP is predefined in REGISTER.

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⁷Display control down for read

2 × DISP_DOWN_#

1

2

⎛

⎞

⎠

--------------------------------------------------

Tdicdrw = -- T

⎝ DI_CLK

× ceil

DI_CLK_PERIOD

DISP_DOWN is predefined in REGISTER.

⁸Display control up for write

2 × DISP_UP_#

1

2

⎛

⎞

---------------------------------------------

Tdicuw = -- T

⎝ DI_CLK

⎠

DI_CLK_PERIOD

DISP_UP is predefined in REGISTER.

4.7.9

LVDS Display Bridge (LDB) Module Parameters

The LVDS interface complies with TIA/EIA 644-A standard. For more details, see TIA/EIA STANDARD

644-A, “Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits”.

4.7.10 One-Wire (OWIRE) Timing Parameters

Figure 58 depicts the RPP timing, and Table 66 lists the RPP timing parameters.

One-WIRE Tx

“Reset Pulse”

One Wire Device Tx

“Presence Pulse”

OW2

OW3

One-Wire bus

(BATT_LINE)

OW1

OW4

t_R

Figure 58. Reset and Presence Pulses (RPP) Timing Diagram

Table 66. RPP Sequence Delay Comparisons Timing Parameters

ID

Parameters

Reset Time Low

Symbol

Min

Typ

Max

Unit

1

OW1

t_RSTL

t_PDH

t_PDL

480

15

511

—

µs

OW2

OW3

OW4

Presence Detect High

Presence Detect Low

60

240

—

60

—

Reset Time High

t_RSTH

480

512

(includes recovery time)

1

In order not to mask signaling by other devices on the 1-Wire bus, t_RSTL+ t_Rshould always be less than 960 µs.

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Figure 59 depicts Write 0 Sequence timing, and Table 67 lists the timing parameters.

OW6

t_REC

One-Wire bus

(BATT_LINE)

OW5

Figure 59. Write 0 Sequence Timing Diagram

Table 67. WR0 Sequence Timing Parameters

ID

Parameter

Write 0 Low Time

Symbol

Min

Typ

Max

Unit

OW5

OW6

t_LOW0

t_SLOT

t_REC

60

OW5

1

100

117

—

120

—

µs

Transmission Time Slot

Recovery time

Figure 60 depicts Write 1 Sequence timing, Figure 61 depicts the Read Sequence timing, and Table 68

lists the timing parameters.

OW8

One-Wire bus

(BATT_LINE)

OW7

Figure 60. Write 1 Sequence Timing Diagram

OW8

One-Wire bus

(BATT_LINE)

t_SU

OW11

OW9

OW10

Figure 61. Read Sequence Timing Diagram

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Table 68. WR1 /RD Timing Parameters

ID

Parameter

Write 1 Low Time

Symbol

Min

Typ

Max

Unit

OW7

OW8

t_LOW1

t_SLOT

1

60

—

1

5

117

—

5

15

120

1

µs

Transmission Time Slot

Read Data Setup

Read Low Time

Read Data Valid

Release Time

t_SU

OW9

OW10

OW11

t_LOWR

t_RDV

15

—

0

15

—

t_RELEASE

45

4.7.11 Pulse Width Modulator (PWM) Timing Parameters

This section describes the electrical information of the PWM. The PWM can be programmed to select one

of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before

being input to the counter. The output is available at the pulse-width modulator output (PWMO) external

pin.

Figure 62 depicts the timing of the PWM, and Table 69 lists the PWM timing parameters.

1

2a

3b

System Clock

2b

4b

3a

4a

PWM Output

Figure 62. PWM Timing

Table 69. PWM Output Timing Parameter

Ref. No.

Parameter

System CLK frequency¹

Min

Max

Unit

1

0

12.29

9.91

—

ipg_clk

—

MHz

ns

2a

2b

3a

3b

4a

4b

Clock high time

Clock low time

Clock fall time

—

ns

0.5

ns

Clock rise time

Output delay time

Output setup time

—

0.5

ns

—

9.37

—

ns

8.71

ns

1

CL of PWMO = 30 pF

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4.7.12 PATA Timing Parameters

This section describes the timing parameters of the Parallel ATA module which are compliant with

ATA/ATAPI-6 specification.

Parallel ATA module can work on PIO/Multi-Word DMA/Ultra DMA transfer modes. Each transfer mode

has different data transfer rate, Ultra DMA mode 4 data transfer rate is up to 100MB/s. Parallel ATA

module interface consist of a total of 29 pins. Some pins act on different function in different transfer

mode. There are different requirements of timing relationships among the function pins conform with

ATA/ATAPI-6 specification and these requirements are configurable by the ATA module registers.

Table 70 and Figure 63 define the AC characteristics of all the PATA interface signals in all data transfer

modes.

ATA Interface Signals

SI2

SI1

Figure 63. PATA Interface Signals Timing Diagram

Table 70. AC Characteristics of All Interface Signals

ID

Parameter

Symbol

Min

Max

Unit

SI1

SI2

SI3

Rising edge slew rate for any signal on ATA interface¹

Falling edge slew rate for any signal on ATA interface¹

Host interface signal capacitance at the host connector

S_rise

S_fall

—

1.25

20

V/ns

pF

C_host

1

SRISE and SFALL shall meet this requirement when measured at the sender’s connector from 10–90% of full signal

amplitude with all capacitive loads from 15–40 pF where all signals have the same capacitive load value.

The user must use level shifters for 5.0 V compatibility on the ATA interface. The i.MX53xD PATA

interface is 3.3 V compatible.

The use of bus buffers introduces delay on the bus and skew between signal lines. These factors make it

difficult to operate the bus at the highest speed (UDMA-5) when bus buffers are used. If fast UDMA mode

operation is needed, this may not be compatible with bus buffers.

Another area of attention is the slew rate limit imposed by the ATA specification on the ATA bus.

According to this limit, any signal driven on the bus should have a slew rate between 0.4 and 1.2 V/ns with

a 40 pF load. Not many vendors of bus buffers specify slew rate of the outgoing signals.

When bus buffers are used, the ata_data bus buffer is special. This is a bidirectional bus buffer, so a

direction control signal is needed. This direction control signal is ata_buffer_en. When its high, the bus

should drive from host to device. When its low, the bus should drive from device to host. Steering of the

signal is such that contention on the host and device tri-state busses is always avoided.

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In the timing equations, some timing parameters are used. These parameters depend on the

implementation of the i.MX53xD PATA interface on silicon, the bus buffer used, the cable delay and

cable skew. Table 71 shows ATA timing parameters.

Table 71. PATA Timing Parameters

Value/

Name

Description

Bus clock period (AHB_CLK_ROOT)

Contributing Factor¹

T

Peripheral clock frequency

(7.5 ns for 133 MHz clock)

ti_ds

Set-up time ata_data to ata_iordy edge (UDMA-in only)

UDMA0

UDMA1

UDMA2, UDMA3

UDMA4

15 ns

10 ns

7 ns

5 ns

UDMA5

4 ns

ti_dh

tco

Hold time ata_iordy edge to ata_data (UDMA-in only)

UDMA0, UDMA1, UDMA2, UDMA3, UDMA4

UDMA5

5.0 ns

4.6 ns

Propagation delay bus clock L-to-H to

12.0 ns

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data, ata_buffer_en

tsu

tsui

Set-up time ata_data to bus clock L-to-H

Set-up time ata_iordy to bus clock H-to-L

Hold time ata_iordy to bus clock H to L

8.5 ns

2.5 ns

7 ns

thi

tskew1

Max difference in propagation delay bus clock L-to-H to any of following signals

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data (write), ata_buffer_en

tskew2

tskew3

Max difference in buffer propagation delay for any of following signals:

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data (write), ata_buffer_en

Transceiver

Max difference in buffer propagation delay for any of following signals ata_iordy,

ata_data (read)

tbuf

Max buffer propagation delay

Transceiver

Cable

tcable1

tcable2

Cable propagation delay for ata_data

Cable propagation delay for control signals ata_dior, ata_diow, ata_iordy,

ata_dmack

Cable

tskew4

tskew5

Max difference in cable propagation delay between ata_iordy and ata_data (read)

Cable

Max difference in cable propagation delay between (ata_dior, ata_diow,

ata_dmack) and ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_data(write)

tskew6

Max difference in cable propagation delay without accounting for ground bounce

Cable

1

Values provided where applicable.

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4.7.12.1 PIO Mode Read Timing

Figure 64 shows timing for PIO read. Table 72 lists the timing parameters for PIO read.

Figure 64. PIO Read Timing Diagram

Table 72. PIO Read Timing Parameters

ATA

Parameter

Controlling

Variable

Value

Parameter from Figure 64

t1

t2 (read)

t9

t1

t2r

t9

t1(min) = time_1 * T – (tskew1 + tskew2 + tskew5)

t2(min) = time_2r * T – (tskew1 + tskew2 + tskew5)

t9(min) = time_9 * T – (tskew1 + tskew2 + tskew6)

t5(min) = tco + tsu + tbuf + tbuf+ tcable1 + tcable2

time_1

time_2r

time_9

t5

time_2 (affects tsu and

tco)

t6

tA

trd

t6

tA

0

—

tA(min) = (1.5 + time_ax) * T – (tco + tsui + tcable2 + tcable2 + 2*tbuf)

time_ax

trd1

trd1(max) = (–trd)+ (tskew3 + tskew4)

time_pio_rdx

trd1(min) = (time_pio_rdx – 0.5)*T – (tsu + thi)

(time_pio_rdx – 0.5) * T > tsu + thi + tskew3 + tskew4

t0

—

t0(min) = (time_1 + time_2r+ time_9) * T

time_1, time_2r, time_9

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Figure 65 shows timing for PIO write. Table 73 lists the timing parameters for PIO write.

Figure 65. Multi-word DMA (MDMA) Timing

Table 73. PIO Write Timing Parameters

ATA

Paramete

r

Parameter

from Figure 65

Controlling

Variable

Value

t1

t2 (write)

t9

t1

t2w

t9

t1(min) = time_1 * T – (tskew1 + tskew2 + tskew5)

t2(min) = time_2w * T – (tskew1 + tskew2 + tskew5)

t9(min) = time_9 * T – (tskew1 + tskew2 + tskew6)

t3(min) = (time_2w – time_on)* T – (tskew1 + tskew2 +tskew5)

time_1

time_2w

time_9

t3

—

If not met, increase

time_2w

t4

tA

t0

t4

tA

—

t4(min) = time_4 * T – tskew1

time_4

tA = (1.5 + time_ax) * T – (tco + tsui + tcable2 + tcable2 + 2*tbuf)

t0(min) = (time_1 + time_2 + time_9) * T

time_ax

time_1, time_2r,

time_9

—

Avoid bus contention when switching buffer on by making ton long enough

Avoid bus contention when switching buffer off by making toff long enough

—

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Figure 66 shows timing for MDMA read, Figure 67 shows timing for MDMA write, and Table 74 lists

the timing parameters for MDMA read and write.

Figure 66. MDMA Read Timing Diagram

Figure 67. MDMA Write Timing Diagram

Table 74. MDMA Read and Write Timing Parameters

Parameter from

ATA

Parameter

Controlling

Variable

Figure 66 (Read),

Figure 67 (Write)

Value

tm, ti

tm

td, td1

tk¹

tm(min) = ti(min) = time_m * T – (tskew1 + tskew2 + tskew5)

td1(min) = td(min) = time_d * T – (tskew1 + tskew2 + tskew6)

tk(min) = time_k * T – (tskew1 + tskew2 + tskew6)

t0(min) = (time_d + time_k) * T

time_m

time_d

td

tk

time_k

t0

—

time_d, time_k

time_d

tg(read)

tgr

tgr(min-read) = tco + tsu + tbuf + tbuf + tcable1 + tcable2

tgr(min-drive) = td – te(drive)

tf(read)

tg(write)

tf(write)

tL

tfr

—

tfr(min) = 5 ns

—

tg(min-write) = time_d * T – (tskew1 + tskew2 + tskew5)

tf(min-write) = time_k * T – (tskew1 + tskew2 + tskew6)

^{tL (max) = (time_d + time_k – 2)}×T – (tsu + tco + 2×tbuf + 2×tcable2)

time_d

time_k

time_d,

time_k²

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Table 74. MDMA Read and Write Timing Parameters (continued)

Parameter from

Figure 66 (Read),

Figure 67 (Write)

ATA

Parameter

Controlling

Variable

Value

tn, tj

—

tkjn

tn= tj= tkjn = time_jn * T – (tskew1 + tskew2 + tskew6)

time_jn

—

ton

toff

ton = time_on × T – tskew1

^{toff = time_off}× T – tskew1

1

2

tk1 in the MDMA figures (Figure 66 and Figure 67) equals (tk – 2*T).

tk1 in the MDMA figures equals (tk – 2*T).

4.7.12.2 Ultra DMA (UDMA) Input Timing

Figure 68 shows timing when the UDMA in transfer starts, Figure 69 shows timing when the UDMA in

host terminates transfer, Figure 70 shows timing when the UDMA in device terminates transfer, and

Table 75 lists the timing parameters for UDMA in burst.

Figure 68. UDMA in Transfer Starts Timing Diagram

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Figure 69. UDMA in Host Terminates Transfer Timing Diagram

Figure 70. UDMA in Device Terminates Transfer Timing Diagram

Table 75. UDMA in Burst Timing Parameters

Parameter

from

ATA

Parameter

Figure 68,

Figure 69,

Figure 70

Description

Controlling Variable

tack

tenv

tack

tenv

^{tack (min) = (time_ack}× T) – (tskew1 + tskew2)

time_ack

time_env

tenv (min) = (time_env × T) – (tskew1 + tskew2)

^{tenv (max) = (time_env}× T) + (tskew1 + tskew2)

tds

tdh

tds1

tdh1

tds – (tskew3) – ti_ds > 0

tskew3, ti_ds, ti_dh

should be low enough

tdh – (tskew3) – ti_dh > 0

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Controlling Variable

Table 75. UDMA in Burst Timing Parameters (continued)

Parameter

from

ATA

Parameter

Figure 68,

Figure 69,

Figure 70

Description

tcyc

trp

tc1

trp

(tcyc – tskew) > T

T big enough

time_rp

trp (min) = time_rp × T – (tskew1 + tskew2 + tskew6)

(time_rp × T) – (tco + tsu + 3T + 2 ×tbuf + 2×tcable2) > trfs (drive)

tmli1 (min) = (time_mlix + 0.4) × T

—

tx1¹

tmli1

tzah

tdzfs

tcvh

time_rp

tmli

tzah

tdzfs

tcvh

—

time_mlix

time_zah

time_dzfs

time_cvh

—

tzah (min) = (time_zah + 0.4) × T

tdzfs = (time_dzfs × T) – (tskew1 + tskew2)

tcvh = (time_cvh ×T) – (tskew1 + tskew2)

ton

ton = time_on × T – tskew1

^{toff = time_off}× T – tskew1

toff²

1

2

There is a special timing requirement in the ATA host that requires the internal DIOW to go only high 3 clocks after the last

active edge on the DSTROBE signal. The equation given on this line tries to capture this constraint.

Make ton and toff big enough to avoid bus contention.

4.7.12.3 UDMA Output Timing

Figure 71 shows timing when the UDMA out transfer starts, Figure 72 shows timing when the UDMA out

host terminates transfer, Figure 73 shows timing when the UDMA out device terminates transfer, and

Table 76 lists the timing parameters for UDMA out burst.

Figure 71. UDMA Out Transfer Starts Timing Diagram

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Figure 72. UDMA Out Host Terminates Transfer Timing Diagram

Figure 73. UDMA Out Device Terminates Transfer Timing Diagram

Table 76. UDMA Out Burst Timing Parameters

Parameter

from

Figure 71,

Figure 72,

Figure 73

ATA

Parameter

Controlling

Variable

Value

tack

tenv

tack

tenv

^{tack (min) = (time_ack}× T) – (tskew1 + tskew2)

time_ack

time_env

tenv (min) = (time_env × T) – (tskew1 + tskew2)

^{tenv (max) = (time_env}× T) + (tskew1 + tskew2)

tdvs

tdvh

tcyc

tdvs

tdvh

tcyc

—

tdvs = (time_dvs × T) – (tskew1 + tskew2)

^{tdvs = (time_dvh}× T) – (tskew1 + tskew2)

tcyc = time_cyc × T – (tskew1 + tskew2)

t2cyc = time_cyc × 2 × T

time_dvs

time_dvh

time_cyc

t2cyc

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Table 76. UDMA Out Burst Timing Parameters (continued)

Parameter

from

ATA

Parameter

Controlling

Variable

Figure 71,

Figure 72,

Figure 73

Value

trfs1

—

trfs

tdzfs

tss

trfs = 1.6 × T + tsui + tco + tbuf + tbuf

—

time_dzfs

time_ss

—

tdzfs = time_dzfs × T – (tskew1)

tss

tmli

tli

tss = time_ss × T – (tskew1 + tskew2)

tdzfs_mli

tli1

tdzfs_mli =max (time_dzfs, time_mli) × T – (tskew1 + tskew2)

tli1 > 0

—

tli

tli2

tli2 > 0

—

tli

tli3

tli3 > 0

—

tcvh

—

tcvh

^{tcvh = (time_cvh}×T) – (tskew1 + tskew2)

time_cvh

—

ton

toff

ton = time_on × T – tskew1

^{toff = time_off}× T – tskew1

4.7.13 SATA PHY Parameters

This section describes SATA PHY electrical specifications.

4.7.13.1 Reference Clock Electrical and Jitter Specifications

The refclk signal is differential and supports frequencies of 25 MHz or 50-156.25 MHz (100 MHz and

125 MHz are common frequencies). The frequency is pin-selectable (for more information about the

signal, see “Per-Transceiver Control and Status Signals” in the SATA PHY chapter in the Reference

Manual).

Table 77 provides the SATA PHY reference clock specifications.

Table 77. Reference Clock Specifications

Parameters

Test Conditions

Min

Max

Unit

mV

Differential peak voltage (typically 0.71 V)

—

350

850

Common mode voltage

(refclk_p + refclk_m) / 2

175

2,000

mV

Total phase jitter

For information about total

phase jitter, see following

section

—

3

ps RMS

Minimum/maximum duty cycle

Frequency range

—

40

25

60

% UI

MHz

156.25

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4.7.13.1.1 Reference Clock Jitter Measurement

The total phase jitter on the reference clock is specified at 3 ps RMS. There are numerous ways to measure

the reference clock jitter, one of which is as follows.

Using a high-speed sampling scope (20 GSamples/s), 1 million samples of the differential reference clock

are taken, and the zero-crossing times of each rising edge are calculated. From the zero-crossing data, an

average reference clock period is calculated. This average reference clock period is subtracted from each

sequential, instantaneous period to find the difference between each reference clock rising edge and the

ideal placement to produce the phase jitter sequence. The power spectral density (PSD) of the phase jitter

is calculated and integrated after being weighted with the transfer function shown in Figure 74. The square

root of the resultant integral is the RMS total phase jitter.

Figure 74. Weighting Function for RMS Phase Jitter Calculation

4.7.13.2 Transmitter and Receiver Characteristics

The SATA PHY meets or exceeds the electrical compliance requirements defined in the SATA

specification. The following subsections provide values obtained from a combination of simulations and

silicon characterization.

NOTE

The tables in the following sections indicate any exceptions to the SATA

specification or aspects of the SATA PHY that exceed the standard, as well

as provide information about parameters not defined in the standard.

4.7.13.2.1 SATA PHY Transmitter Characteristics

Table 78 provides specifications for SATA PHY transmitter characteristics.

Table 78. SATA2 PHY Transmitter Characteristics

Parameters

Symbol

Min

Typ

Max

Unit

V

Transmit common mode voltage

V_CTM

—

0.4

—

0.6

Transmitter pre-emphasis accuracy (measured

change in de-emphasized bit)

–0.5

—

0.5

dB

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4.7.13.2.2 SATA PHY Receiver Characteristics

Table 79 provides specifications for SATA PHY receiver characteristics.

Table 79. SATA PHY Receiver Characteristics

Parameters

Symbol

Min

Typ

Max

Unit

Minimum Rx eye height (differential peak-to-peak) V_{MIN_RX_EYE_HEIGHT}

Tolerance PPM

—

175

400

mV

–400

ppm

4.7.13.3 SATA_REXT Reference Resistor Connection

The impedance calibration process requires connection of reference resistor 191 Ω. 1% precision resistor

on SATA_REXT pad to ground.

Resistor calibration consists of learning which state of the internal Resistor Calibration register causes an

internal, digitally trimmed calibration resistor to best match the impedance applied to the SATA_REXT

pin. The calibration register value is then supplied to all Tx and Rx termination resistors.

During the calibration process (for a few tens of microseconds), up to 0.3 mW can be dissipated in the

external SATA_REXT resistor. At other times, no power is dissipated by the SATA_REXT resistor.

4.7.13.4 SATA Connectivity When Not in Use

NOTE

The Temperature Sensor is part of the SATA module. If SATA IP is disabled,

the Temperature Sensor will not work as well. Temperature Sensor

functionality is important in supporting high performance applications

without overheating the device (at high ambient temp).

When both SATA and thermal sensor are not required, connect VP and VPH supplies to ground. The rest

of the ports, both inputs and outputs (SATA_REFCLKM, SATA_REFCLKP, SATA_REXT, SATA_RXM,

SATA_RXP, SATA_TXM) can be left floating. It is not recommended to turn off the VPH while the VP is

active.

When SATA is not in use but thermal sensor is still required, both VP and VPH supplies must be powered

on according to their nominal voltage levels. The reference clock input frequency must fall within the

specified range of 25 MHz to 156.25 MHz. SATA_REXT does not need to be connected, as the

termination impedance is not of consequence.

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Electrical Characteristics

4.7.14 SCAN JTAG Controller (SJC) Timing Parameters

Figure 75 depicts the SJC test clock input timing. Figure 76 depicts the SJC boundary scan timing.

Figure 77 depicts the SJC test access port. Signal parameters are listed in Table 80.

SJ1

SJ2

VM

SJ2

VM

TCK

(Input)

VIH

VIL

SJ3

Figure 75. Test Clock Input Timing Diagram

TCK

(Input)

VIH

SJ5

Input Data Valid

VIL

SJ4

Data

Inputs

SJ6

Data

Outputs

Output Data Valid

SJ7

SJ6

Data

Outputs

Data

Outputs

Output Data Valid

Figure 76. Boundary Scan (JTAG) Timing Diagram

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Electrical Characteristics

TCK

(Input)

VIH

VIL

SJ8

Input Data Valid

SJ9

TDI

TMS

(Input)

SJ10

SJ11

SJ10

TDO

Output Data Valid

(Output)

TDO

(Output)

TDO

(Output)

Output Data Valid

Figure 77. Test Access Port Timing Diagram

TCK

(Input)

SJ13

TRST

(Input)

SJ12

Figure 78. TRST Timing Diagram

Table 80. JTAG Timing

All Frequencies

ID

Parameter^1,2

Unit

Min

Max

1

SJ0

SJ1

SJ2

SJ3

SJ4

SJ5

SJ6

SJ7

SJ8

TCK frequency of operation 1/(3•T_DC

)

0.001

45

22.5

—

22

—

3

MHz

ns

TCK cycle time in crystal mode

2

TCK clock pulse width measured at V_M

TCK rise and fall times

ns

Boundary scan input data set-up time

Boundary scan input data hold time

TCK low to output data valid

5

—

40

—

ns

24

—

ns

TCK low to output high impedance

TMS, TDI data set-up time

—

ns

5

ns

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Electrical Characteristics

Table 80. JTAG Timing (continued)

Parameter^1,2

All Frequencies

ID

Unit

Min

Max

SJ9

TMS, TDI data hold time

25

—

44

—

ns

SJ10 TCK low to TDO data valid

SJ11 TCK low to TDO high impedance

SJ12 TRST assert time

—

100

40

SJ13 TRST set-up time to TCK low

1

2

T

= target frequency of SJC

DC

V_M= mid-point voltage

4.7.15 SPDIF Timing Parameters

The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When

encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.

Table 81 and Figures , show SPDIF timing parameters for the Sony/Philips Digital Interconnect Format

(SPDIF), including the timing of the modulating Rx clock (SRCK) for SPDIF in Rx mode and the timing

of the modulating Tx clock (STCLK) for SPDIF in Tx mode.

Table 81. SPDIF Timing Parameters

Timing Parameter Range

Characteristics

Symbol

Units

Min

Max

SPDIFIN Skew: asynchronous inputs, no specs apply

SPDIFOUT output (Load = 50pf)

—

0.7

ns

—

1.5

24.2

31.3

• Skew

• Transition rising

• Transition falling

SPDIFOUT1 output (Load = 30pf)

—

ns

• Skew

• Transition rising

• Transition falling

—

1.5

13.6

18.0

Modulating Rx clock (SRCK) period

SRCK high period

srckp

srckph

srckpl

stclkp

stclkph

stclkpl

40.0

16.0

40.0

16.0

—

ns

SRCK low period

Modulating Tx clock (STCLK) period

STCLK high period

STCLK low period

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Electrical Characteristics

srckp

srckpl

V_M

srckph

V_M

SRCK

(Output)

Figure 79. SPDIF Timing Diagram

stclkp

stclkpl

V_M

stclkph

V_M

STCLK

(Input)

Figure 80. STCLK Timing

4.7.16 SSI Timing Parameters

This section describes the timing parameters of the SSI module. The connectivity of the serial

synchronous interfaces are summarized in Table 82.

Table 82. AUDMUX Port Allocation

Port

Signal Nomenclature

Type and Access

AUDMUX port 1

AUDMUX port 2

AUDMUX port 3

AUDMUX port 4

AUDMUX port 5

AUDMUX port 6

AUDMUX port 7

SSI 1

SSI 2

AUD3

AUD4

AUD5

AUD6

SSI 3

Internal

External – AUD3 I/O

External – EIM or CSPI1 I/O through IOMUXC

External – EIM or SD1 I/O through IOMUXC

External – EIM or DISP2 through IOMUXC

Internal

NOTE

•

The terms WL and BL used in the timing diagrams and tables refer to

Word Length (WL) and Bit Length (BL).

The SSI timing diagrams use generic signal names wherein the names

used in the i.MX53 Reference Manual are channel specific signal

names. For example, a channel clock referenced in the IOMUXC

chapter as AUD3_TXC appears in the timing diagram as TXC.

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Electrical Characteristics

4.7.16.1 SSI Transmitter Timing with Internal Clock

Figure 81 depicts the SSI transmitter internal clock timing and Table 83 lists the timing parameters for the

SSI transmitter internal clock.

.

SS1

SS5

SS4

SS3

SS2

TXC

SS8

SS6

TXFS (bl)

(Output)

SS10

SS12

SS14

SS17

TXFS (wl)

(Output)

SS15

SS16

SS18

TXD

(Output)

SS43

SS42

SS19

RXD

(Input)

Note: SRXD input in synchronous mode only

: SRXD input in synchronous mode only

Figure 81. SSI Transmitter Internal Clock Timing Diagram

Table 83. SSI Transmitter Timing with Internal Clock

ID

Parameter

Internal Clock Operation

Min

Max

Unit

SS1

SS2

(Tx/Rx) CK clock period

81.4

36.0

—

ns

(Tx/Rx) CK clock high period

(Tx/Rx) CK clock rise time

(Tx/Rx) CK clock low period

(Tx/Rx) CK clock fall time

(Tx) CK high to FS (bl) high

(Tx) CK high to FS (bl) low

(Tx) CK high to FS (wl) high

(Tx) CK high to FS (wl) low

(Tx/Rx) Internal FS rise time

(Tx/Rx) Internal FS fall time

SS3

6.0

SS4

36.0

—

SS5

6.0

SS6

—

15.0

6.0

SS8

—

SS10

SS12

SS14

SS15

SS16

—

6.0

(Tx) CK high to STXD valid from high impedance

—

15.0

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Electrical Characteristics

Table 83. SSI Transmitter Timing with Internal Clock (continued)

ID

Parameter

(Tx) CK high to STXD high/low

Min

Max

Unit

SS17

SS18

SS19

—

15.0

6.0

ns

(Tx) CK high to STXD high impedance

STXD rise/fall time

Synchronous Internal Clock Operation

SS42

SS43

SS52

SRXD setup before (Tx) CK falling

SRXD hold after (Tx) CK falling

Loading

10.0

0.0

—

ns

pF

25.0

NOTE

•

All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

•

All timings are on Audiomux Pads when SSI is being used for data

transfer.

•

The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

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Electrical Characteristics

4.7.16.2 SSI Receiver Timing with Internal Clock

Figure 82 depicts the SSI receiver internal clock timing and Table 84 lists the timing parameters for the

receiver timing with the internal clock

SS1

SS3

SS5

SS4

SS2

TXC

(Output)

SS9

SS7

TXFS (bl)

(Output)

SS11

SS13

TXFS (wl)

(Output)

SS20

SS21

RXD

(Input)

SS51

SS50

SS47

SS49

SS48

RXC

(Output)

Figure 82. SSI Receiver Internal Clock Timing Diagram

Table 84. SSI Receiver Timing with Internal Clock

ID

Parameter

Internal Clock Operation

Min

Max

Unit

SS1

SS2

(Tx/Rx) CK clock period

81.4

36.0

—

ns

(Tx/Rx) CK clock high period

(Tx/Rx) CK clock rise time

SS3

6.0

—

SS4

(Tx/Rx) CK clock low period

(Tx/Rx) CK clock fall time

36.0

—

SS5

6.0

15.0

—

SS7

(Rx) CK high to FS (bl) high

(Rx) CK high to FS (bl) low

(Rx) CK high to FS (wl) high

(Rx) CK high to FS (wl) low

SRXD setup time before (Rx) CK low

SRXD hold time after (Rx) CK low

—

SS9

—

SS11

SS13

SS20

SS21

—

10.0

0.0

—

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Electrical Characteristics

Table 84. SSI Receiver Timing with Internal Clock (continued)

ID

Parameter

Min

Max

Unit

Oversampling Clock Operation

SS47

SS48

SS49

SS50

SS51

Oversampling clock period

15.04

6.0

—

ns

Oversampling clock high period

Oversampling clock rise time

Oversampling clock low period

Oversampling clock fall time

3.0

—

6.0

—

3.0

NOTE

•

All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

•

All timings are on Audiomux Pads when SSI is being used for data

transfer.

•

“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

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Electrical Characteristics

4.7.16.3 SSI Transmitter Timing with External Clock

Figure 83 depicts the SSI transmitter external clock timing and Table 85 lists the timing parameters for

the transmitter timing with the external clock

SS22

SS23

SS25

SS26

SS24

TXC

(Input)

SS27

SS29

TXFS (bl)

SS33

(Input)

SS31

TXFS (wl)

(Input)

SS39

SS37

SS38

TXD

(Output)

SS45

SS44

RXD

(Input)

SS46

Note: SRXD Input in Synchronous mode only

Figure 83. SSI Transmitter External Clock Timing Diagram

Table 85. SSI Transmitter Timing with External Clock

ID

Parameter

External Clock Operation

Min

Max

Unit

SS22

SS23

SS24

SS25

SS26

SS27

SS29

SS31

SS33

SS37

SS38

(Tx/Rx) CK clock period

81.4

36.0

—

ns

(Tx/Rx) CK clock high period

(Tx/Rx) CK clock rise time

(Tx/Rx) CK clock low period

(Tx/Rx) CK clock fall time

(Tx) CK high to FS (bl) high

(Tx) CK high to FS (bl) low

(Tx) CK high to FS (wl) high

(Tx) CK high to FS (wl) low

6.0

—

36.0

—

6.0

15.0

—

–10.0

10.0

–10.0

10.0

—

15.0

—

(Tx) CK high to STXD valid from high impedance

(Tx) CK high to STXD high/low

15.0

—

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Table 85. SSI Transmitter Timing with External Clock (continued)

ID

Parameter

Min

Max

Unit

SS39

(Tx) CK high to STXD high impedance

—

15.0

ns

Synchronous External Clock Operation

SS44

SS45

SS46

SRXD setup before (Tx) CK falling

SRXD hold after (Tx) CK falling

SRXD rise/fall time

10.0

2.0

—

ns

6.0

NOTE

•

All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

•

All timings are on Audiomux Pads when SSI is being used for data

transfer.

•

“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

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Electrical Characteristics

4.7.16.4 SSI Receiver Timing with External Clock

Figure 84 depicts the SSI receiver external clock timing and Table 86 lists the timing parameters for the

receiver timing with the external clock.

SS22

SS26

SS25

SS24

SS23

TXC

SS30

SS28

TXFS (bl)

TXFS (wl)

SS32

SS35

SS34

SS41

SS36

SS40

RXD

(Input)

Figure 84. SSI Receiver External Clock Timing Diagram

Table 86. SSI Receiver Timing with External Clock

ID

Parameter

External Clock Operation

Min

Max

Unit

SS22

SS23

SS24

SS25

SS26

SS28

SS30

SS32

SS34

SS35

SS36

SS40

SS41

(Tx/Rx) CK clock period

81.4

36

—

ns

(Tx/Rx) CK clock high period

(Tx/Rx) CK clock rise time

6.0

—

(Tx/Rx) CK clock low period

(Tx/Rx) CK clock fall time

36

—

6.0

15.0

—

(Rx) CK high to FS (bl) high

(Rx) CK high to FS (bl) low

(Rx) CK high to FS (wl) high

(Rx) CK high to FS (wl) low

(Tx/Rx) External FS rise time

(Tx/Rx) External FS fall time

SRXD setup time before (Rx) CK low

SRXD hold time after (Rx) CK low

–10

10

–10

10

—

15.0

—

6.0

—

10

2

—

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NOTE

•

All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

All timings are on Audiomux Pads when SSI is being used for data

transfer.

•

“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

4.7.17 UART I/O Configuration and Timing Parameters

4.7.17.1 UART RS-232 I/O Configuration in Different Modes

The i.MX53xD UART interfaces can serve both as DTE or DCE device. This can be configured by the

DCEDTE control bit (default 0 – DCE mode). Table 87 shows the UART I/O configuration based on the

enabled mode.

Table 87. UART I/O Configuration vs. Mode

DTE Mode

Description

DCE Mode

Description

Port

Direction

RTS

CTS

Output

Input

RTS from DTE to DCE

CTS from DCE to DTE

DTR from DTE to DCE

DSR from DCE to DTE

DCD from DCE to DTE

RING from DCE to DTE

Serial data from DCE to DTE

Serial data from DTE to DCE

Input

Output

Input

RTS from DTE to DCE

CTS from DCE to DTE

DTR from DTE to DCE

DSR from DCE to DTE

DCD from DCE to DTE

RING from DCE to DTE

Serial data from DCE to DTE

Serial data from DTE to DCE

DTR

Output

Input

DSR

Output

Input

DCD

Input

RI

Input

TXD_MUX

RXD_MUX

Input

Output

4.7.17.2 UART RS-232 Serial Mode Timing

The following sections describe the electrical information of the UART module in the RS-232 mode.

4.7.17.2.1

UART Transmitter

Figure 85 depicts the transmit timing of UART in the RS-232 serial mode, with 8 data bit/1 stop bit format.

Table 88 lists the UART RS-232 serial mode transmit timing characteristics.

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Electrical Characteristics

Possible

Parity

Bit

UA1

Bit 3

Bit

Start

TXD

STOP

BIT

Bit 7

Bit 0

Bit 1

Bit 2

Bit 4

Bit 5

Bit 6

Par Bit

Bit

(output)

UA1

Figure 85. UART RS-232 Serial Mode Transmit Timing Diagram

Table 88. RS-232 Serial Mode Transmit Timing Parameters

ID

Parameter

Transmit Bit Time

Symbol

Min

Max

Units

1

UA1

t_Tbit

1/F_{baud_rate}

–

1/F_{baud_rate}

T_{ref_clk}

+

—

2

T_{ref_clk}

1

2

F_{baud_rate}: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

_{ref_clk}: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

T

4.7.17.2.2

UART Receiver

Figure 86 depicts the RS-232 serial mode receive timing with 8 data bit/1 stop bit format. Table 89 lists

serial mode receive timing characteristics.

Possible

UA2

Parity

Bit

UA2

Bit 3

Bit

Start

Bit

RXD

(input)

STOP

BIT

Bit 7

Bit 0

Bit 1

Bit 2

Bit 4

Bit 5

Bit 6

Par Bit

UA2

Figure 86. UART RS-232 Serial Mode Receive Timing Diagram

Table 89. RS-232 Serial Mode Receive Timing Parameters

ID

Parameter

Symbol

Min

Max

Units

Receive Bit Time¹

t_Rbit

1/F_{baud_rate}

–

1/F_{baud_rate}+

—

2

UA2

1/(16*F_{baud_rate}

)

1/(16*F_{baud_rate})

1

2

The UART receiver can tolerate 1/(16*F_{baud_rate}) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16*F_{baud_rate}).

F_{baud_rate}: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

4.7.17.3 UART IrDA Mode Timing

The following subsections give the UART transmit and receive timings in IrDA mode.

4.7.17.3.3

UART IrDA Mode Transmitter

Figure 87 depicts the UART IrDA mode transmit timing, with 8 data bit/1 stop bit format. Table 90 lists

the transmit timing characteristics.

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Electrical Characteristics

UA4

Bit 5

UA3

TXD

(output)

Start

Bit

STOP

BIT

Bit 0

Bit 1

Possible

Parity

Bit

Bit 2

Bit 3

Bit 4

Bit 6

Bit 7

Figure 87. UART IrDA Mode Transmit Timing Diagram

Table 90. IrDA Mode Transmit Timing Parameters

ID

Parameter

Symbol

Min

Max

1/F_{baud_rate}+ T

Units

1

UA3

Transmit Bit Time in IrDA mode

t_TIRbit

1/F_{baud_rate}

–

—

ref_clk

2

T

ref_clk

UA4

Transmit IR Pulse Duration

t_TIRpulse

(3/16)*(1/F_{baud_rate}

– T

)

(3/16)*(1/F_{baud_rate})+

—

T

ref_clk

1

2

F_{baud_rate}: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

_{ref_clk}: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

T

4.7.17.3.4

UART IrDA Mode Receiver

Figure 88 depicts the UART IrDA mode receive timing, with 8 data bit/1 stop bit format. Table 91 lists the

receive timing characteristics.

UA6

UA5

RXD

(input)

Start

Bit

STOP

BIT

Bit 0

Bit 1

Possible

Parity

Bit

Bit 2

Bit 3

Bit 4

Bit 5

Bit 6

Bit 7

Figure 88. UART IrDA Mode Receive Timing Diagram

Table 91. IrDA Mode Receive Timing Parameters

ID

Parameter

Symbol

Min

Max

Units

Receive Bit Time¹in IrDA mode

t_RIRbit

1/F_{baud_rate}

–

1/F_{baud_rate}

1/(16*F_{baud_rate})

+

—

2

UA5

1/(16*F_{baud_rate}

)

UA6

Receive IR Pulse Duration

t_RIRpulse

1.41 us

(5/16)*(1/F_{baud_rate}

)

—

1

2

The UART receiver can tolerate 1/(16*F_{baud_rate}) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16*F_{baud_rate}).

F_{baud_rate}: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

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4.7.18 USB-OH-3 Parameters

This section describes the electrical parameters of the USB OTG port and USB HOST ports. For on-chip

USB PHY parameters see Section 4.7.19, “USB PHY Parameters.”

4.7.18.1 Serial Interface

In order to support four serial different interfaces, the USB serial transceiver can be configured to operate

in one of four modes:

•

DAT_SE0 bidirectional, 3-wire mode

DAT_SE0 unidirectional, 6-wire mode

VP_VM bidirectional, 4-wire mode

VP_VM unidirectional, 6-wire mode

4.7.18.1.1 DAT_SE0 Bidirectional Mode

Table 92. Signal Definitions - DAT_SE0 Bidirectional Mode

Direction Signal Description

Transmit enable, active low

Name

USB_TXOE_B

USB_DAT_VP

Out

In

TX data when USB_TXOE_B is low

Differential RX data when USB_TXOE_B is high

USB_SE0_VM

Out

In

SE0 drive when USB_TXOE_B is low

SE0 RX indicator when USB_TXOE_B is high

Transmit

US3

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

US1

US4

US2

Figure 89. USB Transmit Waveform in DAT_SE0 Bidirectional Mode

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Receive

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

US7

US8

USB_SE0_VM

Figure 90. USB Receive Waveform in DAT_SE0 Bidirectional Mode

Table 93. Definitions of USB Waveform in DAT_SE0 Bi-Directional Mode

Conditions /

Reference Signal

No.

US1

Parameter

Signal Name

Direction

Min

Max

Unit

TX Rise/Fall Time

TX Duty Cycle

USB_DAT_VP

USB_SE0_VM

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

Out

In

-—

—

5.0

ns

%

50 pF

—

US2

US3

US4

US7

US8

—

5.0

49.0

—

51.0

3.0

RX Rise/Fall Time

ns

35 pF

In

—

3.0

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4.7.18.1.2 DAT_SE0 Unidirectional Mode

Table 94. Signal Definitions - DAT_SE0 Unidirectional Mode

Name

USB_TXOE_B

Direction

Signal Description

Transmit enable, active low

Out

In

USB_DAT_VP

USB_SE0_VM

USB_VP1

TX data when USB_TXOE_B is low

SE0 drive when USB_TXOE_B is low

Buffered data on DP when USB_TXOE_B is high

Buffered data on DM when USB_TXOE_B is high

USB_VM1

In

Transmit

US11

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

US9

US10

US12

Figure 91. USB Transmit Waveform in DAT_SE0 Unidirectional Mode

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Receive

USB_TXOE_B

USB_DAT_VP

US15

US16

USB_SE0_VM

Figure 92. USB Receive Waveform in DAT_SE0 Unidirectional Mode

Table 95. USB Port Timing Specification in DAT_SE0 Unidirectional Mode

Signal

Source

Condition /

Reference Signal

No.

US9

Parameter

Signal Name

Min

Max

Unit

TX Rise/Fall Time

TX Duty Cycle

USB_DAT_VP

USB_SE0_VM

USB_TXOE_B

USB_DAT_VP

USB_VP1

Out

In

—

5.0

51.0

3.0

ns

%

50 pF

—

US10

US11

US12

US15

US16

—

49.0

—

RX Rise/Fall Time

ns

35 pF

USB_VM1

In

—

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4.7.18.1.3 VP_VM Bidirectional Mode

Table 96. Signal Definitions - VP_VM Bidirectional mode

Direction Signal Description

Out Transmit enable, active low

Name

USB_TXOE_B

USB_DAT_VP

Out (Tx)

In (Rx)

TX VP data when USB_TXOE_B is low

RX VP data when USB_TXOE_B is high

USB_SE0_VM

Out (Tx)

In (Rx)

TX VM data when USB_TXOE_B low

RX VM data when USB_TXOE_B high

Transmit

US20

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

US18

US21

US19

US22

Figure 93. USB Transmit Waveform in VP_VM Bidirectional Mode

Receive

US26

USB_DAT_VP

USB_SE0_VM

US27

US28

Figure 94. USB Receive Waveform in VP_VM Bidirectional Mode

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Table 97. USB Port Timing Specification in VP_VM Bidirectional Mode

Condition /

Reference Signal

No.

Parameter

TX Rise/Fall Time

TX Duty Cycle

TX Overlap

Signal Name Direction

Min

—

Max

5.0

Unit

ns

%

USB_DAT_V

US18

US19

US20

US21

US22

US26

US27

US28

Out

In

50 pF

P

USB_SE0_V

—

5.0

M

USB_TXOE

—

5.0

50 pF

_B

USB_DAT_V

49.0

-3.0

—

51.0

+3.0

3.0

—

P

USB_SE0_V

ns

USB_DAT_VP

35 pF

M

USB_DAT_V

RX Rise/Fall Time

RX Skew

P

USB_SE0_V

—

3.0

35 pF

M

USB_DAT_V

-4.0

+4.0

USB_SE0_VM

P

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4.7.18.1.4 VP_VM Unidirectional Mode

Table 98. Signal Definitions - VP_VM Unidirectional mode

Name

USB_TXOE_B

Direction

Signal Description

Transmit enable, active low

Out

In

USB_DAT_VP

USB_SE0_VM

USB_VP1

TX VP data when USB_TXOE_B is low

TX VM data when USB_TXOE_B is low

RX VP data when USB_TXOE_B is high

RX VM data when USB_TXOE_B is high

USB_VM1

In

Transmit

US32

USB_TXOE_B

USB_DAT_VP

USB_SE0_VM

US30

US33

US31

US34

Figure 95. USB Transmit Waveform in VP_VM Unidirectional Mode

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Receive

USB_TXOE_B

USB_VP1

US38

US39

USB_VM1

US40

Figure 96. USB Receive Waveform in VP_VM Unidirectional Mode

Table 99. USB Timing Specification in VP_VM Unidirectional Mode

Conditions /

Reference Signal

No.

Parameter

Signal

Direction

Min

Max

Unit

US30

US31

TX Rise/Fall Time

USB_DAT_VP

Out

—

5.0

ns

50 pF

USB_SE0_V

M

US32

TX Rise/Fall Time

USB_TXOE_

B

Out

—

5.0

ns

50 pF

US33

US34

TX Duty Cycle

TX Overlap

USB_DAT_VP

Out

49.0

-3.0

51.0

3.0

%

—

USB_SE0_V

M

ns

USB_DAT_VP

US38

US39

US40

RX Rise/Fall Time

RX Skew

USB_VP1

USB_VM1

USB_VP1

In

—

3.0

ns

35 pF

-4.0

+4.0

USB_VM1

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4.7.18.2 Parallel Interface (Normal ULPI) Timing

Electrical and timing specifications of Parallel Interface (Normal ULPI) for Host Port2 and Port3 are

presented in the subsequent sections.

Table 100. Signal Definitions - Parallel Interface (Normal ULPI)

Name

Direction

Signal Description

USB_Clk

Interface clock. All interface signals are synchronous to Clock.

In

USB_Data[7:0]

Bi-directional data bus, driven low by the link during idle. Bus

ownership is determined by Dir.

I/O

In

USB_Dir

USB_Stp

Direction. Control the direction of the Data bus.

Stop. The link asserts this signal for 1 clock cycle to stop the

data stream currently on the bus.

Out

In

USB_Nxt

Next. The PHY asserts this signal to throttle the data.

USB_Clk

US15

US16

USB_Dir/Nxt

US15

US16

USB_Data

USB_Stp

US17

Figure 97. USB Transmit/Receive Waveform in Parallel Mode

Table 101. USB Timing Specification for Normal ULPI Mode

Conditions /

Reference Signal

ID

Parameter

Min

Max

Unit

US15

US16

US17

Setup Time (Dir&Nxt in, Data in)

Hold Time (Dir&Nxt in, Data in)

6.0

0.0

—

ns

10 pF

Output Delay Time (Stp out, Data out

9.0

4.7.19 USB PHY Parameters

This section describes the USB-OTG PHY and the USB Host port PHY parameters.

4.7.19.1 USB PHY AC Parameters

Table 102 lists the AC timing parameters for USB PHY.

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Table 102. USB PHY AC Timing Parameters

Parameter

Conditions

Min

Typ

Max

Unit

trise

1.5 Mbps

12 Mbps

480 Mbps

75

4

0.5

—

300

20

ns

tfall

1.5 Mbps

12 Mbps

480 Mbps

75

4

0.5

—

300

20

ns

Jitter

1.5 Mbps

12 Mbps

480 Mbps

—

10

1

0.2

4.7.19.2 USB PHY Additional Electrical Parameters

Table 103 lists the parameters for additional electrical characteristics for USB PHY.

Table 103. Additional Electrical Characteristics for USB PHY

Parameter

Conditions

HS Mode

Min

Typ

Max

Unit

Vcm DC

–0.05

0.8

—

0.5

2.5

V

(dc level measured at receiver connector)

LS/FS Mode

Crossover Voltage

LS Mode

FS Mode

1.3

—

0

2

V

Power supply ripple noise

(analog 3.3 V)

< 160 MHz

–50

50

mV

Power supply ripple noise

(analog 2.5 V)

< 1.2 MHz

> 1.2 MHz

–10

–50

0

10

50

Power supply ripple noise

(Digital 1.2 V)

All conditions

–50

0

50

4.7.19.3 USB PHY System Clocking (SYSCLK)

Table 104 lists the USB PHY system clocking parameters.

Table 104. USB PHY System Clocking Parameters

Parameter

Conditions

Min

Typ

Max

Unit

Clock deviation

Reference Clock

–150

—

150

ppm

frequency 24 MHz

Rise/fall time

—

0

—

200

50

ps

%

Jitter (peak-peak)

Duty-cycle

< 1.2 MHz

> 1.2 MHz

0

100

60

Reference Clock

40

frequency 24 MHz

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4.7.19.4 USB PHY Voltage Thresholds

Table 105 lists the USB PHY voltage thresholds.

Table 105. VBUS Comparators Thresholds

Parameter

Conditions

Min

Typ

Max

Unit

A-Device Session Valid

—

0.8

0.2

4.4

1.4

2.0

4.0

V

B-Device Session Valid

B-Device Session End

0.45

4.6

0.8

VBUS Valid Comparator Threshold¹

4.75

1

For VBUS maximum rating, see Table 4 on page 18

4.7.19.5 USB PHY Termination

USB driver impedance in FS and HS modes is 45 Ω 10% (steady state). No external resistors required.

4.8

XTAL Electrical Specifications

Table 106 shows the XTALOSC electrical specifications.

Table 107 shows the XTALOSC_32K electrical specifications.

Table 106. XTALOSC Electrical Specifications

Parameter

Frequency

Min

Typ

Max

Units

22

24

27

MHz

Table 107. XTALOSC_32K Electrical Specifications

Parameter

Frequency

Min

Typ

Max

Units

--

32.768/32.0¹

--

kHz

1

Recommended nominal frequency 32.768 kHz.

4.9

Integrated LDO Voltage Regulators Parameters

The PLL supplies VDD_DIG_PLL and VDD_ANA_PLL can be powered ON from internal LDO voltage

regulator (default case). In this case VDD_REG is used as internal regulator’s power source. The

regulator’s output can be used as a supply for other domains such as VDDA and VDDAL1.

Table 108 shows the VDD_DIG_PLL and VDD_ANA_PLL Integrated Voltage Regulators Parameters.

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Boot Mode Configuration

Table 108. LDO Voltage Regulators Electrical Specifications

Parameter

Symbol

Min

Typ

Max

Units

VDD_DIG_PLL functional Voltage

Range¹

V_{VID_DIG_PLL}

1.15

1.2

1.3

V

VDD_ANA_PLL functional Voltage

Range¹

V_{VDD_ANA_PLL}

1.7

—

1.8

—

1.95

+/–3

—

V

%

VDD_DIG_PLL and VDD_ANA_PLL

accuracy

—

VDD_DIG_PLL power-supply rejection

ratio²

–18

–15

—

dB

mA

VDD_ANA_PLL power-supply rejection

ratio²

—

Output current³

I_{VID_DIG_PLL}

+

125

I_{VDD_ANA_PLL}

1

VDD_DIG_PLL and VDD_ANA_PLL voltages are programmable, but should not be set outside the target functional range

for proper PLL operation.

2

3

The gain or attenuation from the input supply variation to the output of the LDO (by design).

The limitation is for sum of the VDD_DIG_PLL and VDD_ANA_PLL current.

5 Boot Mode Configuration

This section provides information on boot mode configuration pins allocation and boot devices interfaces

allocation.

5.1

Boot Mode Configuration Pins

Table 109 provides boot options, functionality, fuse values, and associated pins. Several input pins are also

sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.

The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an

unblown fuse). For detailed boot mode options configured by the boot mode pins, please refer to the

i.MX53xD Fuse Map document and Boot chapter in i.MX53 Reference Manual.

Table 109. Fuses and Associated Pins Used for Boot

Direction at

E-Fuse Name

Details

Reset

BOOT_MODE[1]

BOOT_MODE[0]

Input

N/A

Boot Mode selection

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Boot Mode Configuration

Table 109. Fuses and Associated Pins Used for Boot (continued)

Direction at

Reset

E-Fuse Name

Details

EIM_A22

EIM_A21

EIM_A20

EIM_A19

EIM_A18

EIM_A17

EIM_A16

EIM_LBA

EIM_EB0

EIM_EB1

EIM_DA0

EIM_DA1

EIM_DA2

EIM_DA3

EIM_DA4

EIM_DA5

EIM_DA6

EIM_DA7

EIM_DA8

EIM_DA9

EIM_DA10

Input

BOOT_CFG1[7]/Test Mode Selection

BOOT_CFG1[6]/Test Mode Selection

BOOT_CFG1[5]/Test Mode Selection

BOOT_CFG1[4]

Boot Options, Pin value overrides fuse

settings for BT_FUSE_SEL = ‘0’.

Signal Configuration as Fuse Override

Input at Power Up. These are special I/O

lines that control the boot up configuration

during product development. In production,

the boot configuration can be controlled by

fuses.

BOOT_CFG1[3]

BOOT_CFG1[2]

BOOT_CFG1[1]

BOOT_CFG1[0]

BOOT_CFG2[7]

BOOT_CFG2[6]

BOOT_CFG2[5]

BOOT_CFG2[4]

BOOT_CFG2[3]

BOOT_CFG2[2]

BOOT_CFG3[7]

BOOT_CFG3[6]

BOOT_CFG3[5]

BOOT_CFG3[4]

BOOT_CFG3[3]

BOOT_CFG3[2]

BOOT_CFG3[1]

5.2

Boot Devices Interfaces Allocation

Table 110 lists the interfaces that can be used by the boot process in accordance with the specific boot

mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,

which are configured during boot when appropriate.

Table 110. Interfaces Allocation During Boot

Interface

IP Instance

Allocated Pads During Boot

Comment

SPI

CSPI

EIM_A25, EIM_D21, EIM_D22, EIM_D28

EIM_D[19:16]

Only SS1 is supported

ECSPI-1

ECSPI-2

CSI_DAT[10:8], EIM_LBA

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Comment

Table 110. Interfaces Allocation During Boot (continued)

Allocated Pads During Boot

Interface

IP Instance

EIM

• Lower 16 bit data bus A/D

multiplexed or upper 16 bit data bus

non multiplexed

• Only CS0 is supported.

NAND Flash

EXTMC

NAND

• 8/16 bit

• NAND data can be muxed either over

EIM data or PATA data

• Only CS0 is supported

SD/MMC

eSDHCv2-1 PATA_DATA[11:8], SD1_DATA[3:0], SD1_CMD,

SD1_CLK

1, 4 or 8 bit

eSDHCv2-2 PATA_DATA[15:12], SD2_CLK, SD2_CMD,

SD2_DATA[3:0]

eSDHCv3-3 PATA_RESET_B, PATA_IORDY, PATA_DA_0,

PATA_DATA[3:0], PATA_DATA[11:8]

eSDHCv2-4 PATA_DA1, PATA_DA_2, PATA_DATA[7:4],

PATA_DATA[15:12]

I2C

I2C-1

I2C-2

I2C-3

PATA

EIM_D21, EIM_D28

EIM_D16, EIM_EB2

EIM_D[18:17]

—

I2C

PATA

PATA_DIOW, PATA_DMACK, PATA_DMARQ,

PATA_BUFFER_EN, PATA_INTRQ, PATA_DIOR,

PATA_RESET_B, PATA_IORDY, PATA_DA_[2:0],

PATA_CS_[1:0], PATA_DATA[15:0]

SATA

SATA_PHY SATA_TXM, SATA_TXP, SATA_RXP, SATA_RXM,

SATA_REXT, SATA_REFCLKM, SATA_REFCLKP

—

UART

USB

UARTv2-1 CSI0_DAT[11:10]

RXD/TXD only

—

UARTv2-2 PATA_DMARQ, PATA_BUFFER_EN

UARTv2-3 EIM_D24, EIM_D25

UARTv2-4 CSI0_DAT[13:12]

UARTv2-5 CSI0_DAT[15:14]

USB-OTG USB_H1_GPANAIO

PHY

USB_H1_RREFEXT

USB_H1_DP

USB_H1_DN

USB_H1_VBUS

5.3

Power setup during Boot

By default, VDD_DIG_PLL is driven from internal on-die 1.2 V linear regulator (LDO). In order to

achieve the standard operating mode (see VDD_DIG_PLL on Table 7), LDO output to VDD_DIG_PLL

should be configured by software by boot code after power-up to 1.3 V output. This is done by

programming the PLL1P2_VREG bits.

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Package Information and Contact Assignments

6 Package Information and Contact Assignments

This section includes the contact assignment information and mechanical package drawing.

6.1

19x19 mm Package Information

This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid

location) for the 19 × 19 mm, 0.8 mm pitch package.

6.1.1

Case TEPBGA-2, 19 x 19 mm, 0.8 mm Pitch, 23 x 23 Ball Matrix

Figure 98 shows the top view of the 19×19 mm package, Figure 99 shows the bottom view and the ball

location (529 solder balls) of the 19×19 mm package, and Figure 100 shows the side view of the 19×19

mm package.

Figure 98. 19 x 19 mm Package Top View

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Package Information and Contact Assignments

Figure 99. 19 x 19 mm Package, 529 Solder Balls, Bottom View

Figure 100. 19 x 19 mm Package Side View

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Package Information and Contact Assignments

The following notes apply to Figure 98, Figure 99, and Figure 100.

1. All dimensions are in millimeters.

2. Dimensions and tolerancing per ASME Y14.5M1–994.

6.1.2

19 x 19 mm Signal Assignments, Power Rails, and I/O

Table 111 shows the device connection list for ground, power, sense, and reference contact signals.

Table 112 displays an alpha-sorted list of the signal assignments including associated power supplies. The

table also includes out of reset pad state. Table 113 shows the package ball map.

6.1.2.1

19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments

Table 111 shows the device connection list for ground, power, sense, and reference contact signals

alpha-sorted by name.

Table 111. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments

Contact Name

DDR_VREF

Package Contact Assignment(s)

L17

GND

A1, A11, A13, A18, A2, A22, A23, AA11, AA15, AA20, AA21, AB1, AB18, AB2, AB22, AB23,

AC1, AC18, AC2, AC22, AC23, B1, B11, B13, B18, B23, C12, C20, C21, D19, E19, F19, F20,

F21, F22, G19, G7, H10, H12, H8, J11, J13, J15, J17, J20, J9, K10, K12, K14, K16, K21, K8,

L11, L13, L15, L7, L9, M10, M12, M14, M16, M8, N11, N13, N15, N9, P10, P12, P14, P16,

P21, P7, P8, R11, R13, R15, R17, R20, R9, T10, T14, T16, T8, U15, U19, V15, V18, V19,

V20, V21, V22, W19, Y14, Y15, Y19

NVCC_CKIH

G17

NVCC_CSI

R7

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_EMI_DRAM

NVCC_FEC

U10, U9

U7

H18, K17, N17, P17, T18

F11

F8

NVCC_GPIO

NVCC_JTAG

G9

NVCC_KEYPAD

NVCC_LCD

F7

J6, J7

U13

U14

T12

N7

NVCC_LVDS

NVCC_LVDS_BG

NVCC_NANDF

NVCC_PATA

NVCC_RESET

NVCC_SD1

H16

H15

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Package Information and Contact Assignments

Table 111. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name

NVCC_SD2

Package Contact Assignment(s)

H14

V11

NVCC_SRTC_POW

NVCC_XTAL

V12

SVCC

B22

SVDDGP

B2

TVDAC_AHVDDRGB

TVDAC_DHVDD

USB_H1_VDDA25

USB_H1_VDDA33

USB_OTG_VDDA25

USB_OTG_VDDA33

VCC

U17, V16

U16

F13

G13

F14

G14

H13, J14, J16, K13, K15, L14, L16, M11, M13, M15, M9, N10, N12, N14, N16, N8, P11, P13,

P15, P9, R10, R12, R14, R16, R8, T11, T13, T15, T17, T7, T9, U18, U8

VDDA

G12, M17, M7, U12

VDDAL1

VDD_ANA_PLL

VDD_DIG_PLL

VDD_FUSE

VDDGP

F9

G16

H17

G15

G10, G11, G8, H11, H7, H9, J10, J12, J8, K11, K7, K9, L10, L12, L8

VDD_REG

VP

G18

A15, B15

A9, B9

VPH

Table 112 displays an alpha-sorted list of the signal assignments including power rails. The table also

includes out of reset pad state.

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Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

BOOT_MODE C18

0

NVCC_RESET

NVCC_CKIH

LVIO

ALT0 SRC

src_BOOT_MOD

E[0]

Input

100 KΩ PD

Analog

BOOT_MODE B20

1

LVIO

src_BOOT_MOD

E[1]

CKIH1

B21

ANALOG

ALT0 CAMP- camp1_CKIH

1

CKIH2

D18

ALT0 CAMP- camp2_CKIH

2

Analog

CKIL

AB10

R5

T2

NVCC_SRTC_POW ANALOG

—

SRCT

CKIL

—

CSI0_DAT10

CSI0_DAT11

CSI0_DAT12

CSI0_DAT13

CSI0_DAT14

CSI0_DAT15

CSI0_DAT16

CSI0_DAT17

CSI0_DAT18

CSI0_DAT19

CSI0_DAT4

CSI0_DAT5

CSI0_DAT6

CSI0_DAT7

CSI0_DAT8

CSI0_DAT9

NVCC_CSI

UHVIO

ALT1 GPIO-5 gpio5_GPIO[28]

ALT1 GPIO-5 gpio5_GPIO[29]

ALT1 GPIO-5 gpio5_GPIO[30]

ALT1 GPIO-5 gpio5_GPIO[31]

ALT1 GPIO-6 gpio6_GPIO[0]

ALT1 GPIO-6 gpio6_GPIO[1]

ALT1 GPIO-6 gpio6_GPIO[2]

ALT1 GPIO-6 gpio6_GPIO[3]

ALT1 GPIO-6 gpio6_GPIO[4]

ALT1 GPIO-6 gpio6_GPIO[5]

ALT1 GPIO-5 gpio5_GPIO[22]

ALT1 GPIO-5 gpio5_GPIO[23]

ALT1 GPIO-5 gpio5_GPIO[24]

ALT1 GPIO-5 gpio5_GPIO[25]

ALT1 GPIO-5 gpio5_GPIO[26]

ALT1 GPIO-5 gpio5_GPIO[27]

ALT1 GPIO-5 gpio5_GPIO[20]

Input

100 KΩ PU

360 KΩ PD

100 KΩ PU

360 KΩ PD

100 KΩ PU

360 KΩ PD

100 KΩ PU

T3

T6

U1

U2

T4

T5

U3

U4

R1

R2

R6

R3

T1

R4

CSI0_DATA_E P3

N

CSI0_MCLK

P2

NVCC_CSI

UHVIO

ALT1 GPIO-5 gpio5_GPIO[19]

ALT1 GPIO-5 gpio5_GPIO[18]

ALT1 GPIO-5 gpio5_GPIO[21]

Input

100 KΩ PU

CSI0_PIXCLK P1

CSI0_VSYNC P4

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

DI0_DISP_CL H4

K

NVCC_LCD

GPIO

ALT1 GPIO-4 gpio4_GPIO[16]

Input

100 KΩ PU

DI0_PIN15

DI0_PIN2

E4

D3

C2

D2

J5

NVCC_LCD

GPIO

ALT1 GPIO-4 gpio4_GPIO[17]

ALT1 GPIO-4 gpio4_GPIO[18]

ALT1 GPIO-4 gpio4_GPIO[19]

ALT1 GPIO-4 gpio4_GPIO[20]

ALT1 GPIO-4 gpio4_GPIO[21]

ALT1 GPIO-4 gpio4_GPIO[22]

ALT1 GPIO-4 gpio4_GPIO[31]

ALT1 GPIO-5 gpio5_GPIO[5]

ALT1 GPIO-5 gpio5_GPIO[6]

ALT1 GPIO-5 gpio5_GPIO[7]

ALT1 GPIO-5 gpio5_GPIO[8]

ALT1 GPIO-5 gpio5_GPIO[9]

ALT1 GPIO-5 gpio5_GPIO[10]

ALT1 GPIO-5 gpio5_GPIO[11]

ALT1 GPIO-5 gpio5_GPIO[12]

ALT1 GPIO-5 gpio5_GPIO[13]

ALT1 GPIO-4 gpio4_GPIO[23]

ALT1 GPIO-5 gpio5_GPIO[14]

ALT1 GPIO-5 gpio5_GPIO[15]

ALT1 GPIO-5 gpio5_GPIO[16]

ALT1 GPIO-5 gpio5_GPIO[17]

ALT1 GPIO-4 gpio4_GPIO[24]

ALT1 GPIO-4 gpio4_GPIO[25]

ALT1 GPIO-4 gpio4_GPIO[26]

ALT1 GPIO-4 gpio4_GPIO[27]

ALT1 GPIO-4 gpio4_GPIO[28]

ALT1 GPIO-4 gpio4_GPIO[29]

Input

100 KΩ PU

100 KΩ PD

100 KΩ PU

100 KΩ PD

100 KΩ PU

100 KΩ PD

100 KΩ PU

100 KΩ PD

100 KΩ PU

DI0_PIN3

DI0_PIN4

DISP0_DAT0

DISP0_DAT1

J4

DISP0_DAT10 G3

DISP0_DAT11 H5

DISP0_DAT12 H1

DISP0_DAT13 E1

DISP0_DAT14 F2

DISP0_DAT15 F3

DISP0_DAT16 D1

DISP0_DAT17 F5

DISP0_DAT18 G4

DISP0_DAT19 G5

DISP0_DAT2

H2

DISP0_DAT20 F4

DISP0_DAT21 C1

DISP0_DAT22 E3

DISP0_DAT23 C3

DISP0_DAT3

DISP0_DAT4

DISP0_DAT5

DISP0_DAT6

DISP0_DAT7

DISP0_DAT8

F1

G2

H3

G1

H6

G6

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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155

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

DISP0_DAT9

DRAM_A0

DRAM_A1

DRAM_A10

E2

NVCC_LCD

GPIO

ALT1 GPIO-4 gpio4_GPIO[30]

ALT0 EXTMC emi_DRAM_A[0]

ALT0 EXTMC emi_DRAM_A[1]

Input

100 KΩ PU

Low

M19

L21

K19

NVCC_EMI_DRAM DDR3

Output

Low

ALT0 EXTMC emi_DRAM_A[10

]

Low

DRAM_A11

DRAM_A12

DRAM_A13

DRAM_A14

DRAM_A15

L22

L20

L23

N18

M18

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_A[11

]

Output

Low

ALT0 EXTMC emi_DRAM_A[12

]

ALT0 EXTMC emi_DRAM_A[13

]

ALT0 EXTMC emi_DRAM_A[14

]

ALT0 EXTMC emi_DRAM_A[15

]

DRAM_A2

DRAM_A3

DRAM_A4

DRAM_A5

DRAM_A6

DRAM_A7

DRAM_A8

DRAM_A9

M20

N20

K20

N21

M22

N22

N23

M21

NVCC_EMI_DRAM DDR3

NVCC_EMI_DRAM special

ALT0 EXTMC emi_DRAM_A[2]

ALT0 EXTMC emi_DRAM_A[3]

ALT0 EXTMC emi_DRAM_A[4]

ALT0 EXTMC emi_DRAM_A[5]

ALT0 EXTMC emi_DRAM_A[6]

ALT0 EXTMC emi_DRAM_A[7]

ALT0 EXTMC emi_DRAM_A[8]

ALT0 EXTMC emi_DRAM_A[9]

Output

Input

Low

—

DRAM_CALIB M23

RATION

—

(used in DRAM

driver calibration.

See Special

Signal

Considerations

{add xref} above)

DRAM_CAS

DRAM_CS0

L18

K18

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_CAS

Output

High

ALT0 EXTMC emi_DRAM_CS[

0]

DRAM_CS1

P19

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_CS[

1]

Output

High

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

DRAM_D0

DRAM_D1

DRAM_D10

H20

G21

E22

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[0]

ALT0 EXTMC emi_DRAM_D[1]

Output

High

ALT0 EXTMC emi_DRAM_D[10 Output

]

DRAM_D11

DRAM_D12

DRAM_D13

DRAM_D14

DRAM_D15

DRAM_D16

DRAM_D17

DRAM_D18

DRAM_D19

D20

E23

C23

F23

C22

U20

T21

U21

R21

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[11 Output

]

High

ALT0 EXTMC emi_DRAM_D[12 Output

]

ALT0 EXTMC emi_DRAM_D[13 Output

]

ALT0 EXTMC emi_DRAM_D[14 Output

]

ALT0 EXTMC emi_DRAM_D[15 Output

]

ALT0 EXTMC emi_DRAM_D[16 Output

]

ALT0 EXTMC emi_DRAM_D[17 Output

]

ALT0 EXTMC emi_DRAM_D[18 Output

]

ALT0 EXTMC emi_DRAM_D[19 Output

]

DRAM_D2

J21

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[2]

Output

High

DRAM_D20

U23

ALT0 EXTMC emi_DRAM_D[20 Output

]

DRAM_D21

DRAM_D22

DRAM_D23

DRAM_D24

DRAM_D25

R22

U22

R23

Y20

W21

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[21 Output

]

High

ALT0 EXTMC emi_DRAM_D[22 Output

]

ALT0 EXTMC emi_DRAM_D[23 Output

]

ALT0 EXTMC emi_DRAM_D[24 Output

]

ALT0 EXTMC emi_DRAM_D[25 Output

]

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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157

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

DRAM_D26

DRAM_D27

DRAM_D28

DRAM_D29

Y21

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[26 Output

]

High

W22

AA23

V23

ALT0 EXTMC emi_DRAM_D[27 Output

]

ALT0 EXTMC emi_DRAM_D[28 Output

]

ALT0 EXTMC emi_DRAM_D[29 Output

]

DRAM_D3

G20

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[3]

Output

High

DRAM_D30

AA22

ALT0 EXTMC emi_DRAM_D[30 Output

]

DRAM_D31

W23

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[31 Output

]

High

DRAM_D4

DRAM_D5

DRAM_D6

DRAM_D7

DRAM_D8

DRAM_D9

J23

G23

J22

G22

E21

D21

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_D[4]

ALT0 EXTMC emi_DRAM_D[5]

ALT0 EXTMC emi_DRAM_D[6]

ALT0 EXTMC emi_DRAM_D[7]

ALT0 EXTMC emi_DRAM_D[8]

ALT0 EXTMC emi_DRAM_D[9]

Output

High

Low

DRAM_DQM0 H21

DRAM_DQM1 E20

DRAM_DQM2 T20

DRAM_DQM3 W20

ALT0 EXTMC emi_DRAM_DQ

M[0]

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_DQ

M[1]

Output

Low

ALT0 EXTMC emi_DRAM_DQ

M[2]

ALT0 EXTMC emi_DRAM_DQ

M[3]

DRAM_RAS

J19

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_RAS

Output

High

Low

DRAM_RESE P18

T

ALT0 EXTMC emi_DRAM_RES

ET

DRAM_SDBA R19

0

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_SDB

A[0]

Output

Low

DRAM_SDBA P20

1

ALT0 EXTMC emi_DRAM_SDB

A[1]

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

DRAM_SDBA N19

2

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_SDB

A[2]

Output

Low

DRAM_SDCK H19

E0

ALT0 EXTMC emi_DRAM_SDC Output

KE[0]

DRAM_SDCK T19

E1

ALT0 EXTMC emi_DRAM_SDC Output

KE[1]

Low

DRAM_SDCL K23

K_0

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC Output

LK0

Floating

Low

DRAM_SDCL K22

K_0_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC Output

LK0_B

DRAM_SDCL P22

K_1

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC Output

LK1

DRAM_SDCL P23

K_1_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC Output

LK1_B

DRAM_SDOD J18

T0

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_ODT Output

[0]

DRAM_SDOD R18

T1

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_ODT Output

[1]

Low

DRAM_SDQS H23

0

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[0]

Input

Output

Low

DRAM_SDQS H22

0_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[0]

High

DRAM_SDQS D23

1

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[1]

Low

DRAM_SDQS D22

1_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[1]

High

DRAM_SDQS T22

2

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[2]

Low

DRAM_SDQS T23

2_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[2]

High

DRAM_SDQS Y22

3

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[3]

Low

DRAM_SDQS Y23

3_B

NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[3]

High

DRAM_SDWE L19

NVCC_EMI_DRAM DDR3

ALT0 EXTMC emi_DRAM_SD

WE

High

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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159

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

ECKIL

AC10

NVCC_SRTC_POW ANALOG

—

SRTC

ECKIL {no block

I/O by this name

in RM}

—

EIM_A16

EIM_A17

EIM_A18

EIM_A19

EIM_A20

EIM_A21

EIM_A22

EIM_A23

EIM_A24

EIM_A25

EIM_BCLK

EIM_CS0

EIM_CS1

EIM_D16

EIM_D17

EIM_D18

EIM_D19

EIM_D20

EIM_D21

EIM_D22

EIM_D23

EIM_D24

EIM_D25

EIM_D26

EIM_D27

EIM_D28

EIM_D29

AA5

V7

NVCC_EIM_MAIN

NVCC_EIM_SEC

UHVIO

ALT0 EXTMC emi_EIM_A[16]

ALT0 EXTMC emi_EIM_A[17]

ALT0 EXTMC emi_EIM_A[18]

ALT0 EXTMC emi_EIM_A[19]

ALT0 EXTMC emi_EIM_A[20]

ALT0 EXTMC emi_EIM_A[21]

ALT0 EXTMC emi_EIM_A[22]

ALT0 EXTMC emi_EIM_A[23]

ALT0 EXTMC emi_EIM_A[24]

ALT0 EXTMC emi_EIM_A[25]

ALT0 EXTMC emi_EIM_BCLK

ALT0 EXTMC emi_EIM_CS[0]

ALT0 EXTMC emi_EIM_CS[1]

ALT1 GPIO-3 gpio3_GPIO[16]

ALT1 GPIO-3 gpio3_GPIO[17]

ALT1 GPIO-3 gpio3_GPIO[18]

ALT1 GPIO-3 gpio3_GPIO[19]

ALT1 GPIO-3 gpio3_GPIO[20]

ALT1 GPIO-3 gpio3_GPIO[21]

ALT1 GPIO-3 gpio3_GPIO[22]

ALT1 GPIO-3 gpio3_GPIO[23]

ALT1 GPIO-3 gpio3_GPIO[24]

ALT1 GPIO-3 gpio3_GPIO[25]

ALT1 GPIO-3 gpio3_GPIO[26]

ALT1 GPIO-3 gpio3_GPIO[27]

ALT1 GPIO-3 gpio3_GPIO[28]

ALT1 GPIO-3 gpio3_GPIO[29]

Output²

Output

Input

—

AB3

W7

Y6

—

AA4

AA3

V6

—

Y5

—

W6

W11

W8

Y7

—

U6

100 KΩ PU

360 KΩ PD

100 KΩ PU

U5

Input

V1

Input

V2

Input

W1

V3

Input

W2

Y1

Input

Y2

Input

W3

V5

Input

V4

Input

AA1

AA2

Input

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

EIM_D30

EIM_D31

EIM_DA0

W4

W5

Y8

NVCC_EIM_SEC

NVCC_EIM_MAIN

UHVIO

ALT1 GPIO-3 gpio3_GPIO[30]

ALT1 GPIO-3 gpio3_GPIO[31]

Input

Input²

100 KΩ PU

360 KΩ PD

100 KΩ PU

ALT0 EXTMC emi_NAND_EIM

_DA[0]

EIM_DA1

EIM_DA10

EIM_DA11

EIM_DA12

EIM_DA13

EIM_DA14

EIM_DA15

EIM_DA2

EIM_DA3

EIM_DA4

EIM_DA5

EIM_DA6

EIM_DA7

EIM_DA8

EIM_DA9

EIM_EB0

AC4

AB7

AC6

V10

AC7

Y10

AA9

AA7

W9

NVCC_EIM_MAIN

UHVIO

ALT0 EXTMC emi_NAND_EIM

_DA[1]

Input²

Input

100 KΩ PU

—

ALT0 EXTMC emi_NAND_EIM

_DA[10]

ALT0 EXTMC emi_NAND_EIM

_DA[11]

ALT0 EXTMC emi_NAND_EIM

_DA[12]

Input

ALT0 EXTMC emi_NAND_EIM

_DA[13]

Input

ALT0 EXTMC emi_NAND_EIM

_DA[14]

Input

ALT0 EXTMC emi_NAND_EIM

_DA[15]

Input

ALT0 EXTMC emi_NAND_EIM

_DA[2]

Input²

Output²

ALT0 EXTMC emi_NAND_EIM

_DA[3]

AB6

V9

ALT0 EXTMC emi_NAND_EIM

_DA[4]

ALT0 EXTMC emi_NAND_EIM

_DA[5]

Y9

ALT0 EXTMC emi_NAND_EIM

_DA[6]

AC5

AA8

W10

AC3

ALT0 EXTMC emi_NAND_EIM

_DA[7]

ALT0 EXTMC emi_NAND_EIM

_DA[8]

ALT0 EXTMC emi_NAND_EIM

_DA[9]

ALT0 EXTMC emi_EIM_EB[0]

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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161

Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

EIM_EB1

EIM_EB2

EIM_EB3

EIM_LBA

EIM_OE

EIM_RW

EIM_WAIT

EXTAL

AB5

Y3

NVCC_EIM_MAIN

NVCC_XTAL

UHVIO

ANALOG

ALT0 EXTMC emi_EIM_EB[1]

ALT1 GPIO-2 gpio2_GPIO[30]

ALT1 GPIO-2 gpio2_GPIO[31]

ALT0 EXTMC emi_EIM_LBA

ALT0 EXTMC emi_EIM_OE

ALT0 EXTMC emi_EIM_RW

ALT0 EXTMC emi_EIM_WAIT

Output²

Input

—

100 KΩ PU

Y4

Input

100 KΩ PU

AA6

V8

Output²

Output

—

AB4

AB9

AB11

—

EXTAL EXTAL

OSC

FASTR_ANA

FASTR_DIG

E18

E17

NVCC_CKIH

ANALOG

—

(reserved, tie to

—

ground)

—

(reserved, tie to

ground)

FEC_CRS_DV D11

NVCC_FEC

UHVIO

ALT1 GPIO-1 gpio1_GPIO[25]

ALT1 GPIO-1 gpio1_GPIO[31]

ALT1 GPIO-1 gpio1_GPIO[22]

ALT1 GPIO-1 gpio1_GPIO[23]

Input

100 KΩ PU

FEC_MDC

FEC_MDIO

E10

D12

FEC_REF_CL E12

K

FEC_RX_ER F12

NVCC_FEC

NVCC_GPIO

UHVIO

ALT1 GPIO-1 gpio1_GPIO[24]

ALT1 GPIO-1 gpio1_GPIO[27]

ALT1 GPIO-1 gpio1_GPIO[26]

ALT1 GPIO-1 gpio1_GPIO[28]

ALT1 GPIO-1 gpio1_GPIO[30]

ALT1 GPIO-1 gpio1_GPIO[29]

ALT1 GPIO-1 gpio1_GPIO[0]

ALT1 GPIO-1 gpio1_GPIO[1]

ALT0 GPIO-4 gpio4_GPIO[0]

Input

100 KΩ PU

360 KΩ PD

100 KΩ PU

360 KΩ PD

100 KΩ PU

FEC_RXD0

FEC_RXD1

FEC_TX_EN

FEC_TXD0

FEC_TXD1

GPIO_0

C11

E11

C10

F10

D10

C8

GPIO_1

B7

GPIO_10

W16

TVDAC_AHVDDRG GPIO

B

GPIO_11

GPIO_12

V17

TVDAC_AHVDDRG GPIO

B

ALT0 GPIO-4 gpio4_GPIO[1]

ALT0 GPIO-4 gpio4_GPIO[2]

Input

100 KΩ PU

W17

TVDAC_AHVDDRG GPIO

B

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Package Information and Contact Assignments

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

GPIO_13

GPIO_14

AA18

W18

TVDAC_AHVDDRG GPIO

B

ALT0 GPIO-4 gpio4_GPIO[3]

ALT0 GPIO-4 gpio4_GPIO[4]

Input

100 KΩ PU

TVDAC_AHVDDRG GPIO

B

GPIO_16

GPIO_17

GPIO_18

GPIO_19

GPIO_2

C6

A3

D7

B4

C7

A6

D8

A5

B6

A4

B5

E8

C9

D9

B8

A7

A8

NVCC_GPIO

NVCC_KEYPAD

NVCC_GPIO

NVCC_JTAG

NVCC_KEYPAD

UHVIO

GPIO

ALT1 GPIO-7 gpio7_GPIO[11]

ALT1 GPIO-7 gpio7_GPIO[12]

ALT1 GPIO-7 gpio7_GPIO[13]

ALT1 GPIO-4 gpio4_GPIO[5]

ALT1 GPIO-1 gpio1_GPIO[2]

ALT1 GPIO-1 gpio1_GPIO[3]

ALT1 GPIO-1 gpio1_GPIO[4]

ALT1 GPIO-1 gpio1_GPIO[5]

ALT1 GPIO-1 gpio1_GPIO[6]

ALT1 GPIO-1 gpio1_GPIO[7]

ALT1 GPIO-1 gpio1_GPIO[8]

ALT1 GPIO-1 gpio1_GPIO[9]

Input

Input³

Input

Input⁴

Input

360 KΩ PD

100 KΩ PU

360 KΩ PD

100 KΩ PU

360 KΩ PD

100 KΩ PU

100 KΩ PD

47 KΩ PU

Keeper

GPIO_3

GPIO_4

GPIO_5

GPIO_6

GPIO_7

GPIO_8

GPIO_9

JTAG_MOD

JTAG_TCK

JTAG_TDI

JTAG_TDO

JTAG_TMS

ALT0 SJC

sjc_MOD

sjc_TCK

sjc_TDI

GPIO

sjc_TDO

sjc_TMS

sjc_TRSTB

GPIO

47 KΩ PU

100 KΩ PU

360 KΩ PD

100 KΩ PU

JTAG_TRSTB E9

GPIO

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_ROW0

KEY_ROW1

KEY_ROW2

C5

E7

C4

F6

E5

B3

D6

D5

UHVIO

ALT1 GPIO-4 gpio4_GPIO[6]

ALT1 GPIO-4 gpio4_GPIO[8]

ALT1 GPIO-4 gpio4_GPIO[10]

ALT1 GPIO-4 gpio4_GPIO[12]

ALT1 GPIO-4 gpio4_GPIO[14]

ALT1 GPIO-4 gpio4_GPIO[7]

ALT1 GPIO-4 gpio4_GPIO[9]

ALT1 GPIO-4 gpio4_GPIO[11]

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Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

KEY_ROW3

KEY_ROW4

D4

E6

NVCC_KEYPAD

NVCC_LVDS_BG

UHVIO

ALT1 GPIO-4 gpio4_GPIO[13]

ALT1 GPIO-4 gpio4_GPIO[15]

Input

—

100 KΩ PU

360 KΩ PD

—

UHVIO

LVDS_BG_RE AA14

S

ANALOG

—

LDB

LVDS_BG_RES

LVDS0_CLK_ AB16

N

NVCC_LVDS

LVDS

ALT0 GPIO-7 gpio7_GPI[25]

ALT0 GPIO-7 gpio7_GPI[24]

ALT0 GPIO-7 gpio7_GPI[31]

Input

Floating

LVDS0_CLK_ AC16

P

LVDS0_TX0_ Y17

N

LVDS0_TX0_P AA17

NVCC_LVDS

LVDS

ALT0 GPIO-7 gpio7_GPI[30]

ALT0 GPIO-7 gpio7_GPI[29]

Input

Floating

LVDS0_TX1_ AB17

N

LVDS0_TX1_P AC17

NVCC_LVDS

LVDS

ALT0 GPIO-7 gpio7_GPI[28]

ALT0 GPIO-7 gpio7_GPI[27]

Input

Floating

LVDS0_TX2_ Y16

N

LVDS0_TX2_P AA16

NVCC_LVDS

LVDS

ALT0 GPIO-7 gpio7_GPI[26]

ALT0 GPIO-7 gpio7_GPI[23]

Input

Floating

LVDS0_TX3_ AB15

N

LVDS0_TX3_P AC15

NVCC_LVDS

LVDS

ALT0 GPIO-7 gpio7_GPI[22]

ALT0 GPIO-6 gpio6_GPI[27]

Input

Floating

LVDS1_CLK_ AA13

N

LVDS1_CLK_ Y13

P

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[26]

ALT0 GPIO-6 gpio6_GPI[31]

Input

Floating

LVDS1_TX0_ AC14

N

LVDS1_TX0_P AB14

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[30]

ALT0 GPIO-6 gpio6_GPI[29]

Input

Floating

LVDS1_TX1_ AC13

N

LVDS1_TX1_P AB13

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[28]

ALT0 GPIO-6 gpio6_GPI[25]

Input

Floating

LVDS1_TX2_ AC12

N

LVDS1_TX2_P AB12

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[24]

Input

Floating

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Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

LVDS1_TX3_ AA12

N

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[23]

Input

Floating

LVDS1_TX3_P Y12

NANDF_ALE Y11

NANDF_CLE AA10

NANDF_CS0 W12

NANDF_CS1 V13

NANDF_CS2 V14

NANDF_CS3 W13

NANDF_RB0 U11

NANDF_RE_B AC8

NVCC_LVDS

LVDS

ALT0 GPIO-6 gpio6_GPI[22]

ALT1 GPIO-6 gpio6_GPIO[8]

ALT1 GPIO-6 gpio6_GPIO[7]

ALT1 GPIO-6 gpio6_GPIO[11]

ALT1 GPIO-6 gpio6_GPIO[14]

ALT1 GPIO-6 gpio6_GPIO[15]

ALT1 GPIO-6 gpio6_GPIO[16]

ALT1 GPIO-6 gpio6_GPIO[10]

ALT1 GPIO-6 gpio6_GPIO[13]

ALT1 GPIO-6 gpio6_GPIO[12]

Input

Floating

NVCC_NANDF

NVCC_EIM_MAIN

UHVIO

100 KΩ PU

NANDF_WE_ AB8

B

NANDF_WP_ AC9

B

NVCC_NANDF

NVCC_PATA

UHVIO

ALT1 GPIO-6 gpio6_GPIO[9]

ALT1 GPIO-7 gpio7_GPIO[1]

Input

100 KΩ PU

PATA_BUFFE K4

R_EN

PATA_CS_0

PATA_CS_1

PATA_DA_0

PATA_DA_1

PATA_DA_2

PATA_DATA0

PATA_DATA1

L5

L2

K6

L3

L4

L1

M1

NVCC_PATA

UHVIO

ALT1 GPIO-7 gpio7_GPIO[9]

ALT1 GPIO-7 gpio7_GPIO[10]

ALT1 GPIO-7 gpio7_GPIO[6]

ALT1 GPIO-7 gpio7_GPIO[7]

ALT1 GPIO-7 gpio7_GPIO[8]

ALT1 GPIO-2 gpio2_GPIO[0]

ALT1 GPIO-2 gpio2_GPIO[1]

ALT1 GPIO-2 gpio2_GPIO[10]

ALT1 GPIO-2 gpio2_GPIO[11]

ALT1 GPIO-2 gpio2_GPIO[12]

ALT1 GPIO-2 gpio2_GPIO[13]

ALT1 GPIO-2 gpio2_GPIO[14]

ALT1 GPIO-2 gpio2_GPIO[15]

Input

100 KΩ PU

PATA_DATA10 N4

PATA_DATA11 M6

PATA_DATA12 N5

PATA_DATA13 N6

PATA_DATA14 P6

PATA_DATA15 P5

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Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

PATA_DATA2

PATA_DATA3

PATA_DATA4

PATA_DATA5

PATA_DATA6

PATA_DATA7

PATA_DATA8

PATA_DATA9

PATA_DIOR

PATA_DIOW

L6

NVCC_PATA

UHVIO

ALT1 GPIO-2 gpio2_GPIO[2]

ALT1 GPIO-2 gpio2_GPIO[3]

ALT1 GPIO-2 gpio2_GPIO[4]

ALT1 GPIO-2 gpio2_GPIO[5]

ALT1 GPIO-2 gpio2_GPIO[6]

ALT1 GPIO-2 gpio2_GPIO[7]

ALT1 GPIO-2 gpio2_GPIO[8]

ALT1 GPIO-2 gpio2_GPIO[9]

ALT1 GPIO-7 gpio7_GPIO[3]

ALT1 GPIO-6 gpio6_GPIO[17]

ALT1 GPIO-6 gpio6_GPIO[18]

ALT1 GPIO-7 gpio7_GPIO[0]

ALT1 GPIO-7 gpio7_GPIO[2]

ALT1 GPIO-7 gpio7_GPIO[5]

ALT1 GPIO-7 gpio7_GPIO[4]

Input

100 KΩ PU

M2

M3

M4

N1

M5

N2

N3

K3

J3

NVCC_PATA

PATA_DMACK J2

PATA_DMARQ J1

PATA_INTRQ K5

PATA_IORDY K1

PATA_RESET K2

_B

PMIC_ON_RE W14

Q

NVCC_SRTC_POW GPIO

ALT0 SRTC

ALT0 CCM

srtc_SRTCALAR

M

Output

—

PMIC_STBY_ W15

REQ

ccm_PMIC_VST

BY_REQ

POR_B

C19

NVCC_RESET

VPH

LVIO

ALT0 SRC

src_POR_B

Input

—

100 KΩ PU

—

RESET_IN_B A21

LVIO

src_RESET_B

SATA_REFCLKM

SATA_REFCL A14

KM

ANALOG

—

SATA

SATA_REFCL B14

KP

VPH

ANALOG

—

SATA

SATA_REFCLKP

—

SATA_REXT

SATA_RXM

SATA_RXP

SATA_TXM

SATA_TXP

C13

A12

B12

B10

A10

VPH

ANALOG

—

SATA

SATA_REXT

SATA_RXM

SATA_RXP

SATA_TXM

SATA_TXP

—

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Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

SD1_CLK

E16

F18

A20

C17

F17

F16

E14

C15

D13

C14

D14

E13

NVCC_SD1

UHVIO

LVIO

ALT1 GPIO-1 gpio1_GPIO[20]

ALT1 GPIO-1 gpio1_GPIO[18]

ALT1 GPIO-1 gpio1_GPIO[16]

ALT1 GPIO-1 gpio1_GPIO[17]

ALT1 GPIO-1 gpio1_GPIO[19]

ALT1 GPIO-1 gpio1_GPIO[21]

ALT1 GPIO-1 gpio1_GPIO[10]

ALT1 GPIO-1 gpio1_GPIO[11]

ALT1 GPIO-1 gpio1_GPIO[15]

ALT1 GPIO-1 gpio1_GPIO[14]

ALT1 GPIO-1 gpio1_GPIO[13]

ALT1 GPIO-1 gpio1_GPIO[12]

Input

100 KΩ PU

100 KΩ PD

SD1_CMD

SD1_DATA0

SD1_DATA1

SD1_DATA2

SD1_DATA3

SD2_CLK

NVCC_SD1

NVCC_SD2

NVCC_RESET

SD2_CMD

SD2_DATA0

SD2_DATA1

SD2_DATA2

SD2_DATA3

TEST_MODE D17

ALT0

tcu_TEST_MOD

E

TVCDC_IOB_ AB19

BACK

TVDAC_AHVDDRG ANALOG

B

—

TVE

USB

TVCDC_IOB_BA

CK

—

TVCDC_IOG_ AC20

BACK

TVDAC_AHVDDRG ANALOG

B

—

TVCDC_IOG_BA

CK

TVCDC_IOR_ AB21

BACK

TVDAC_AHVDDRG ANALOG

B

—

TVCDC_IOR_BA

CK

TVDAC_COM AA19

P

TVDAC_AHVDDRG ANALOG

B

—

TVDAC_COMP

TVDAC_IOB

TVDAC_IOG

TVDAC_IOR

TVDAC_VREF

USB_H1_DN

TVDAC_IOB

TVDAC_IOG

TVDAC_IOR

AC19

AB20

AC21

TVDAC_AHVDDRG ANALOG

B

—

TVDAC_AHVDDRG ANALOG

B

—

TVDAC_AHVDDRG ANALOG

B

—

TVDAC_VREF Y18

USB_H1_DN B17

TVDAC_AHVDDRG ANALOG

B

—

USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG50 —

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Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

Package

Contact

Assign

ment

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Config./

Value

Block I/O

Direction

USB_H1_DP

A17

USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG50 —

ANALOG25 —

ANALOG50 —

USB

USB_H1_DP

—

USB_H1_GPA A16

NAIO

USB_H1_VDDA25,

USB_H1_VDDA33

USB_H1_GPANA

IO

USB_H1_RRE B16

FEXT

USB_H1_VDDA25,

USB_H1_VDDA33

USB_H1_RREFE

XT

USB_H1_VBU D15

S

USB_H1_VDDA25,

USB_H1_VDDA33

USB_H1_VBUS

USB_OTG_DN

USB_OTG_DP

USB_OTG_D A19

N

USB_OTG_VDDA25, ANALOG50 —

USB_OTG_VDDA33

USB_OTG_DP B19

USB_OTG_VDDA25, ANALOG50 —

USB_OTG_VDDA33

USB_OTG_G F15

PANAIO

USB_OTG_VDDA25, ANALOG25 —

USB_OTG_VDDA33

USB_OTG_GPA

NAIO

USB_OTG_ID C16

USB_OTG_VDDA25, ANALOG25 —

USB_OTG_VDDA33

USB_OTG_ID

USB_OTG_R D16

REFEXT

USB_OTG_VDDA25, ANALOG25 —

USB_OTG_VDDA33

USB_OTG_RRE

FEXT

USB_OTG_VB E15

US

USB_OTG_VDDA25, ANALOG50 —

USB_OTG_VDDA33

USB_OTG_VBU

S

XTAL

AC11

NVCC_XTAL

ANALOG

—

XTALO XTAL

SC

1

2

The state immediately after reset and before ROM firmware or software has executed.

During power-on reset, this port acts as input for fuse override. See Section 5.1, “Boot Mode Configuration Pins” for details.

For appropriate resistor values, see Chapter 1 of i.MX53 System Development User's Guide, document number MX53UG.

3

4

During power-on reset this port acts as output for diagnostic signal INT_BOOT

During power-on reset this port acts as output for diagnostic signal ANY_PU_RST

NOTE

KEY_COL0 and GPIO_19 act as output for diagnostic signals during

power-on reset.

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6.2

19 x 19 mm, 0.8 Pitch Ball Map

Table 113 shows the 19 × 19 mm, 0.8 pitch ball map.

Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

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Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

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Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

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Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

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6.3

PoP 12 x 12 mm Package on Package (PoP) Information

This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid

location) for the 12 x 12 mm, 0.4 mm pitch PoP package.

6.3.1

Case PoP, 0.4 mm Pitch, 12 x 12 Ball Matrix

Figure 101. 12x12 mm PoP Top View

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Figure 102. 12 x 12 mm PoP, Bottom View

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Figure 103. 12 x 12 mm PoP, Side View

The following notes apply to Figure 101, Figure 102, and Figure 103.

1

All dimensions are in millimeters.

2

Dimensions and tolerancing per ASME Y14.5M–1994.

Terminal position designation per JESD 95-1, SPP-010

3

4

Compliant to JESD 95-1 design guide 4.22, no exact variation, and with exception to dimension ‘A’

5

Raw solder ball size during assembly is 0.25mm

6.3.2

12x 12 PoP Signal Assignments, Power Rails, and I/O

Table 114 and Table 115 show the device connection list for ground, power, sense, and reference contact

signals.

Table 118 displays an alpha-sorted list of the signal assignments including associated power supplies. The

table also includes out of reset pad state. Table 119 and Table 120 show the package ball maps.

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6.3.2.1

12 x 12 mm PoP Ground, Power, Sense, and Reference Contact

Assignments

Table 114 and Table 115 show the device connection list for ground, power, sense, and reference contact

signals alpha-sorted by name.

Table 114. 12 x 12 mm PoP Bottom Ground, Power, Sense, and Reference Contact Assignments

Contact Name

DDR_VREF

Contact Assignment

U23

GND

A1, A2, A28, A29, B1, B2, B28, B29, C17, L14, L15, L16, M14, M15, M16, N14, N15, N16,

P11,P12, P13, P17, P18, P19, R11, R12, R13, R17, R18, R19, T11,T12, T13, T17, T18,

T19, U14, U15, U16, V14, V15, V16, W14,W15, W16, AH1, AH15, AH29, AJ1, AJ2, AJ15,

AJ28, AJ29

NVCC_CKIH

AD22

NVCC_CSI

J6

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_EMI_DRAM

NVCC_EMI_DRAM_2P5

NVCC_FEC

G9

G6

F24, G24, H24, K24, L24, N24, P24, R24, U24, V24, W24, AC24, AD24

K23,Y24

AC14

NVCC_GPIO

AD9

NVCC_JTAG

AD11

NVCC_KEYPAD

NVCC_LCD

AD6

W7, Y7

NVCC_LVDS

F19

NVCC_LVDS_BG

NVCC_NANDF

NVCC_PATA

F18

G12

N6

NVCC_RESET

NVCC_SD1

AD18

AC20

NVCC_SD2

AC16

NVCC_SRTC_POW

NVCC_XTAL

F13

F14

POP_VACC

AG14

POP_VCCMM

POP_VCCQMM

POP_VCCQMM1

POP_VDD1

C8, L3

C11

H3

C3, C13, C26, T3, T27, AG6, AG26

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Table 114. 12 x 12 mm PoP Bottom Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name

POP_VDD2

Contact Assignment

C14, C27, D3, P27, W3, AF3, AG12, AG27

POP_VDDCA

POP_VDDMM

POP_VDDQ

AA3, AD3, AG10

AG13

C16, C20, C24, E27, J27, N27, W27, AB27, AF27, AG16, AG20, AG24

POP_ZQ

U3

SVCC

AH28

AH2

SVDDGP

TVDAC_AHVDDRGB

TVDAC_DHVDD

TVDAC_VREF

USB_H1_VDDA25

USB_H1_VDDA33

USB_OTG_VDDA25

USB_OTG_VDDA33

VCC

G22, G23

F23

A27

AD19

AC18

AC19

AD20

L11, L12, L13, L17, L18, L19, M11, M12, M13, M17, M18, M19, N11, N12, N13, N17, N18,

N19, U17, U18, U19, V17, V18,V19, W17, W18, W19

VDD_ANA_PLL

VDD_DIG_PLL

VDD_FUSE

VDD_REG

VDDA

AC22

AC23

AC21

AD23

F16, M6, R6, T24, AD14

VDDAL1

VDDGP

AC8

U11, U12, U13, V11, V12, V13, W11, W12, W13

VP

AH19, AJ19

AH13, AJ13

VPH

Table 115. 12 x 12 mm PoP Top Ground, Power, Sense, and Reference Contact Assignments

Contact Name Contact Assignment

DDR_VREF

P2, M22

GND

A12, A15, A18, A21, B5, B8, B10, C1, C23, F2, F23, J2, J23, M2, M23, P23,

R1, U23, V1, Y23,AA1, AB7, AB11, AC5, AC9, AC12, AC15, AC18, AC21

POP_VACC

AC11

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Table 115. 12 x 12 mm PoP Top Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name

Contact Assignment

POP_VCCMM

A6, J1

A9

POP_VCCQMM

POP_VCCQMM1

POP_VDD1

F1

A11, A20, B3, N2, N22,AB5, AC20

POP_VDD2

B11, B21, C2, L22, R2, AA2, AB10, AB21

POP_VDDCA

POP_VDDMM

POP_VDDQ

POP_ZQ

U2, W2, AC8

AC10

B13, B16, B19, D22, G22, K22, R22, V22, AA22, AB13, AB16, AB19

P1

6.3.2.2

PoP Memory Support and Signal Cross Reference

Support is provided for 8- and 16-bit MLC NAND Flash mounted on the top of the package. To ensure

JESD209 compliance, dedicated PCB connections are required per Table 116. With NAND flash selected

as the boot source, NANDF_CLE and the EIM signals are configured as outputs. The PATA signals are

configured as inputs with weak pull-ups (default) which allows the NANDF_CLE and the EIM signals to

drive them. Note that the 16-bit NAND flash is on the EIM bus only.

EIM_DA[4:7] and EIM_DA[12:15] are assigned to top balls and require no PCB connections.

Table 116. Additional PCB connections for PoP NAND Flash

Suggested

First i.MX53

I/O on Net

Second

Required for

8-bit NAND

Flash?

PCB Net

Name

i.MX53 I/O on

Net

Associated

Top Ball

Required for 16-bit

NAND Flash?

NANDF_CLE

NANDF_D0

NANDF_D1

NANDF_D2

NANDF_D3

NANDF_D8

NANDF_D9

NANDF_D10

NANDF_D11

NANDF_CLE

EIM_DA10

EIM_DA2

EIM_DA11

EIM_DA3

EIM_DA8

EIM_DA0

EIM_DA9

EIM_DA1

PATA_DA_0

PATA_DATA0

PATA_DATA1

PATA_DATA2

PATA_DATA3

PATA_DATA8

PATA_DATA9

PATA_DA_0

PATA_DATA0

PATA_DATA1

PATA_DATA2

PATA_DATA3

PATA_DATA8

PATA_DATA9

Yes

No

Yes

No

PATA_DATA10 PATA_DATA10 No

PATA_DATA11 PATA_DATA11 No

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To support eMMC per the JESD209 option, top ball signals per Table 117 are provided. IOMUX mode

ALT2 is invoked for these I/O.

Table 117. Additional Top Ball Connections for PoP eMMC

eMMC Signal on

Port eSDHC3

Associated Top Ball

RST

CLK

CMD

PATA_DA0

PATA_IORDY

PATA_RESETB

i.MX53 PoP supports 16- and 32-bit LPDDR2-800 per JESD209 with no additional PCB digital signal

connections. No signal cross reference is needed. The designer must ensure that the PCB routes power to

POP_VDD1, POP_VDD2, POP_VDDQ, POP_VDDCA, POP_VACC, and POP_VCCQMM,

POP_VCCMM, and POP_VDDMM. Appropriate discrete components must be employed for POP_ZQ,

DRAM_CALIBRATION, DDR_VREF, and POP_VCCQMM1.

6.3.2.3

PoP 12 x 12 mm, Signal Assignments, Power Rails, and I/O

Table 118 displays an alpha-sorted list of the signal assignments including power rails. The table also

includes out of reset pad state.

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

ion

Config./

Value

Function

BOOT_MODE0 AA28

BOOT_MODE1 AB29

—

NVCC_RESET

LVIO

ALT0

src_BOOT_MODE[0 Input 100 KΩ PD

]

LVIO

src_BOOT_MODE[1 Input 100 KΩ PD

]

CKIH1

AC29

AC28

G13

R2

—

NVCC_CKIH

ANALOG

ALT0

—

camp1_CKIH

camp2_CKIH

CKIL

Input Analog

CKIH2

CKIL

NVCC_SRTC_POW ANALOG

—

CSI0_DAT10

CSI0_DAT11

CSI0_DAT12

CSI0_DAT13

CSI0_DAT14

CSI0_DAT15

NVCC_CSI

UHVIO

ALT1

gpio5_GPIO[28]

gpio5_GPIO[29]

gpio5_GPIO[30]

gpio5_GPIO[31]

gpio6_GPIO[0]

gpio6_GPIO[1]

Input 100 KΩ PU

Input 360 KΩ PD

R7

U1

R1

T1

P1

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Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

CSI0_DAT16

CSI0_DAT17

CSI0_DAT18

CSI0_DAT19

CSI0_DAT4

CSI0_DAT5

CSI0_DAT6

CSI0_DAT7

CSI0_DAT8

CSI0_DAT9

M1

N1

L2

—

NVCC_CSI

UHVIO

GPIO

ALT1

gpio6_GPIO[2]

gpio6_GPIO[3]

gpio6_GPIO[4]

gpio6_GPIO[5]

gpio5_GPIO[22]

gpio5_GPIO[23]

gpio5_GPIO[24]

gpio5_GPIO[25]

gpio5_GPIO[26]

gpio5_GPIO[27]

gpio5_GPIO[20]

gpio5_GPIO[19]

gpio5_GPIO[18]

gpio5_GPIO[21]

gpio4_GPIO[16]

gpio4_GPIO[17]

gpio4_GPIO[18]

gpio4_GPIO[19]

gpio4_GPIO[20]

gpio4_GPIO[21]

gpio4_GPIO[22]

gpio4_GPIO[31]

gpio5_GPIO[5]

gpio5_GPIO[6]

gpio5_GPIO[7]

gpio5_GPIO[8]

gpio5_GPIO[9]

gpio5_GPIO[10]

gpio5_GPIO[11]

gpio5_GPIO[12]

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 100 KΩ PD

Input 100 KΩ PU

Input 100 KΩ PD

Input 100 KΩ PU

NVCC_CSI

NVCC_LCD

L1

T7

R3

P7

N7

U2

P3

CSI0_DATA_EN P6

CSI0_MCLK

CSI0_PIXCLK

CSI0_VSYNC

T6

U6

U7

DI0_DISP_CLK AF2

DI0_PIN15

AH6

AD7

AC7

AC6

AD1

AC3

AG2

AE3

AC1

AH3

AG3

AH4

AG5

AB6

AJ4

GPIO

DI0_PIN2

GPIO

DI0_PIN3

GPIO

DI0_PIN4

GPIO

DISP0_DAT0

DISP0_DAT1

DISP0_DAT10

DISP0_DAT11

DISP0_DAT12

DISP0_DAT13

DISP0_DAT14

DISP0_DAT15

DISP0_DAT16

DISP0_DAT17

DISP0_DAT18

GPIO

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Freescale Semiconductor

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

DISP0_DAT19

DISP0_DAT2

DISP0_DAT20

DISP0_DAT21

DISP0_DAT22

DISP0_DAT23

DISP0_DAT3

DISP0_DAT4

DISP0_DAT5

DISP0_DAT6

DISP0_DAT7

DISP0_DAT8

DISP0_DAT9

DRAM_A0

AA7

AC2

AJ5

AB7

AH5

AJ6

AE2

AF1

AE1

AD2

AG1

AG4

AJ3

W23

Y23

M28

J29

—

NVCC_LCD

GPIO

ALT1

ALT0

gpio5_GPIO[13]

gpio4_GPIO[23]

gpio5_GPIO[14]

gpio5_GPIO[15]

gpio5_GPIO[16]

gpio5_GPIO[17]

gpio4_GPIO[24]

gpio4_GPIO[25]

gpio4_GPIO[26]

gpio4_GPIO[27]

gpio4_GPIO[28]

gpio4_GPIO[29]

gpio4_GPIO[30]

emi_DRAM_A[0]

emi_DRAM_A[1]

emi_DRAM_A[10]

emi_DRAM_A[11]

emi_DRAM_A[12]

emi_DRAM_A[13]

emi_DRAM_A[14]

emi_DRAM_A[15]

emi_DRAM_A[2]

emi_DRAM_A[3]

emi_DRAM_A[4]

emi_DRAM_A[5]

emi_DRAM_A[6]

emi_DRAM_A[7]

emi_DRAM_A[8]

emi_DRAM_A[9]

Input 100 KΩ PU

Input 100 KΩ PD

Input 100 KΩ PU

Input 100 KΩ PD

Input 100 KΩ PU

Output Low

—

NVCC_LCD

—

AC6

AB6

—

NVCC_EMI_DRAM DDR3

DRAM_A1

Output Low

DRAM_A10

DRAM_A11

DRAM_A12

DRAM_A13

DRAM_A14

DRAM_A15

DRAM_A2

Output Low

—

Output Low

L28

—

Output Low

M27

L27

—

Output Low

—

Output Low

D27

V23

L23

—

Output Low

AC7

AB8

AB9

W1

V2

U1

T2

T1

Output Low

DRAM_A3

Output Low

DRAM_A4

AA24

M23

P23

N23

M24

T23

Output Low

DRAM_A5

Output Low

DRAM_A6

Output Low

DRAM_A7

Output Low

DRAM_A8

Output Low

DRAM_A9

Output Low

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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181

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

DRAM_CALIBR R23

ATION

—

NVCC_EMI_DRAM CALIBRATI

ON

DRAM_CALIBRATI Input

ON

—

DRAM_CAS

DRAM_CS0

DRAM_CS1

DRAM_D0

AA23

AB23

J24

—

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_CAS

emi_DRAM_CS[0]

emi_DRAM_CS[1]

emi_DRAM_D[0]

emi_DRAM_D[1]

emi_DRAM_D[10]

emi_DRAM_D[11]

emi_DRAM_D[12]

emi_DRAM_D[13]

emi_DRAM_D[14]

emi_DRAM_D[15]

emi_DRAM_D[16]

emi_DRAM_D[17]

emi_DRAM_D[18]

emi_DRAM_D[19]

emi_DRAM_D[2]

emi_DRAM_D[20]

emi_DRAM_D[21]

emi_DRAM_D[22]

emi_DRAM_D[23]

emi_DRAM_D[24]

emi_DRAM_D[25]

emi_DRAM_D[26]

emi_DRAM_D[27]

emi_DRAM_D[28]

emi_DRAM_D[29]

emi_DRAM_D[3]

emi_DRAM_D[30]

Output High

AB3

AB4

W22

AA23

T29

DRAM_D1

V27

DRAM_D10

DRAM_D11

DRAM_D12

DRAM_D13

DRAM_D14

DRAM_D15

DRAM_D16

DRAM_D17

DRAM_D18

DRAM_D19

DRAM_D2

AG22 AC13

AG29 AC17

AG23 AB14

AF29

AB15

AG28 AB12

AJ27

D29

E29

D28

F28

R29

F27

G27

E28

F29

F21

C19

G21

G18

G20

F17

U27

F20

AC16

C22

E23

D23

G23

U22

F22

H22

E22

H23

A17

A14

B17

A13

B15

B12

Y22

A16

DRAM_D20

DRAM_D21

DRAM_D22

DRAM_D23

DRAM_D24

DRAM_D25

DRAM_D26

DRAM_D27

DRAM_D28

DRAM_D29

DRAM_D3

DRAM_D30

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

DRAM_D31

DRAM_D4

DRAM_D5

DRAM_D6

DRAM_D7

DRAM_D8

DRAM_D9

DRAM_DQM0

G19

R27

R28

P29

B14

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_D[31]

emi_DRAM_D[4]

emi_DRAM_D[5]

emi_DRAM_D[6]

emi_DRAM_D[7]

emi_DRAM_D[8]

emi_DRAM_D[9]

Output High

T23

V23

Output High

T22

T28

W23

AC14

AB17

N23

AF28

AE29

N28

emi_DRAM_DQM[0 Output Low

]

DRAM_DQM1

DRAM_DQM2

DRAM_DQM3

DRAM_RAS

AD27 AB20

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_DQM[1 Output Low

]

H29

C23

M29

L23

B20

emi_DRAM_DQM[2 Output Low

]

emi_DRAM_DQM[3 Output Low

]

—

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_RAS

Output High

DRAM_RESET J28

DRAM_SDBA0 H27

emi_DRAM_RESET Output Low

emi_DRAM_SDBA[ Output Low

0]

DRAM_SDBA1 K27

DRAM_SDBA2 K28

DRAM_SDCKE0 AB24

DRAM_SDCKE1 F22

—

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_SDBA[ Output Low

1]

—

emi_DRAM_SDBA[ Output Low

2]

AC3

AC4

—

emi_DRAM_SDCK Output Low

E[0]

emi_DRAM_SDCK Output Low

E[1]

DRAM_SDCLK_

0

NVCC_EMI_DRAM DDR3CLK ALT0

emi_DRAM_SDCLK Output Floating

0

DRAM_SDCLK_

0_B

—

emi_DRAM_SDCLK Output Floating

0_B

DRAM_SDCLK_ H23

1

Y2

Y1

emi_DRAM_SDCLK Output Floating

1

DRAM_SDCLK_ J23

1_B

emi_DRAM_SDCLK Output Floating

1_B

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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183

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

DRAM_SDODT L29

0

—

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_ODT[0] Output Low

emi_DRAM_ODT[1] Output Low

DRAM_SDODT H28

1

—

DRAM_SDQS0 N29

R23

P22

AB18

AC19

J22

K23

B18

A19

NVCC_EMI_DRAM DDR3CLK ALT0

emi_DRAM_SDQS[ Input Low

0]

DRAM_SDQS0_ P28

B

emi_DRAM_SDQS_ Input High

B[0]

DRAM_SDQS1 AE28

emi_DRAM_SDQS[ Input Low

1]

DRAM_SDQS1_ AE27

B

emi_DRAM_SDQS_ Input High

B[1]

DRAM_SDQS2 G28

emi_DRAM_SDQS[ Input Low

2]

DRAM_SDQS2_ G29

B

emi_DRAM_SDQS_ Input High

B[2]

DRAM_SDQS3 C22

emi_DRAM_SDQS[ Input Low

3]

DRAM_SDQS3_ C21

B

emi_DRAM_SDQS_ Input High

B[3]

DRAM_SDWE

ECKIL

K29

G14

A7

—

NVCC_EMI_DRAM DDR3

ALT0

emi_DRAM_SDWE Output High

NVCC_SRTC_POW ANALOG

ECKIL

—

EIM_A16

NVCC_EIM_MAIN

UHVIO

ALT0

emi_EIM_A[16]

Output —

2

EIM_A17

EIM_A18

EIM_A19

EIM_A20

EIM_A21

EIM_A22

G8

F8

A6

B7

C6

C2

—

emi_EIM_A[17]

emi_EIM_A[18]

emi_EIM_A[19]

emi_EIM_A[20]

emi_EIM_A[21]

emi_EIM_A[22]

Output —

2

Output —

2

Output —

2

Output —

2

Output —

2

Output —

2

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

EIM_A23

EIM_A24

EIM_A25

EIM_BCLK

EIM_CS0

EIM_CS1

EIM_D16

EIM_D17

EIM_D18

EIM_D19

EIM_D20

EIM_D21

EIM_D22

EIM_D23

EIM_D24

EIM_D25

EIM_D26

EIM_D27

EIM_D28

EIM_D29

EIM_D30

EIM_D31

EIM_DA0

B3

A4

A3

F11

G10

C4

H1

G3

H2

G2

M7

H6

G1

F1

—

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_EIM_MAIN

UHVIO

ALT0

ALT1

ALT0

emi_EIM_A[23]

Output —

emi_EIM_A[24]

emi_EIM_A[25]

emi_EIM_BCLK

emi_EIM_CS[0]

emi_EIM_CS[1]

gpio3_GPIO[16]

gpio3_GPIO[17]

gpio3_GPIO[18]

gpio3_GPIO[19]

gpio3_GPIO[20]

gpio3_GPIO[21]

gpio3_GPIO[22]

gpio3_GPIO[23]

gpio3_GPIO[24]

gpio3_GPIO[25]

gpio3_GPIO[26]

gpio3_GPIO[27]

gpio3_GPIO[28]

gpio3_GPIO[29]

gpio3_GPIO[30]

gpio3_GPIO[31]

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

F9

E1

D1

C10

D2

C7

C1

F7

K1

emi_NAND_EIM_D Input²100 KΩ PU

A[0]

EIM_DA1

EIM_DA10

EIM_DA11

EIM_DA12

G11

L7

—

D1

NVCC_EIM_MAIN

UHVIO

ALT0

emi_NAND_EIM_D Input²100 KΩ PU

A[1]

emi_NAND_EIM_D Input²100 KΩ PU

A[10]

K7

emi_NAND_EIM_D Input 100 KΩ PU

A[11]

E2

emi_NAND_EIM_D Input 100 KΩ PU

A[12]

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

185

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

EIM_DA13

EIM_DA14

EIM_DA15

EIM_DA2

EIM_DA3

EIM_DA4

EIM_DA5

EIM_DA6

EIM_DA7

EIM_DA8

EIM_DA9

EIM_EB0

EIM_EB1

F2

J2

E1

G1

H1

—

NVCC_EIM_MAIN

UHVIO

ALT0

emi_NAND_EIM_D Input 100 KΩ PU

A[13]

emi_NAND_EIM_D Input 100 KΩ PU

A[14]

K2

F10

A8

E3

F3

J3

emi_NAND_EIM_D Input 100 KΩ PU

A[15]

emi_NAND_EIM_D Input²100 KΩ PU

A[2]

—

emi_NAND_EIM_D Input²100 KΩ PU

A[3]

D2

E2

G2

H2

—

emi_NAND_EIM_D Input²100 KΩ PU

A[4]

emi_NAND_EIM_D Input²100 KΩ PU

A[5]

emi_NAND_EIM_D Input²100 KΩ PU

A[6]

K3

A10

K6

J1

emi_NAND_EIM_D Input²100 KΩ PU

A[7]

emi_NAND_EIM_D Input²100 KΩ PU

A[8]

—

emi_NAND_EIM_D Input²100 KΩ PU

A[9]

—

emi_EIM_EB[0]

emi_EIM_EB[1]

Output —

2

G7

—

Output —

2

EIM_EB2

EIM_EB3

EIM_LBA

J7

F6

A5

—

NVCC_EIM_MAIN

UHVIO

ALT1

ALT0

gpio2_GPIO[30]

gpio2_GPIO[31]

emi_EIM_LBA

Input 100 KΩ PU

Output —

2

EIM_OE

A9

—

NVCC_EIM_MAIN

NVCC_XTAL

UHVIO

ALT0

—

emi_EIM_OE

emi_EIM_RW

emi_EIM_WAIT

EXTAL

Output —

EIM_RW

EIM_WAIT

EXTAL

H7

UHVIO

L6

UHVIO

G15

AD29

ANALOG

—

FASTR_ANA

NVCC_CKIH

—

FASTR_ANA

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

FASTR_DIG

FEC_CRS_DV

FEC_MDC

AD28

Y27

—

NVCC_CKIH

ANALOG

UHVIO

—

FASTR_DIG

—

NVCC_FEC

NVCC_GPIO

ALT1

ALT0

gpio1_GPIO[25]

gpio1_GPIO[31]

gpio1_GPIO[22]

gpio1_GPIO[23]

gpio1_GPIO[24]

gpio1_GPIO[27]

gpio1_GPIO[26]

gpio1_GPIO[28]

gpio1_GPIO[30]

gpio1_GPIO[29]

gpio1_GPIO[0]

gpio1_GPIO[1]

gpio4_GPIO[0]

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

U28

FEC_MDIO

AA29

FEC_REF_CLK Y29

FEC_RX_ER

FEC_RXD0

FEC_RXD1

FEC_TX_EN

FEC_TXD0

FEC_TXD1

GPIO_0

Y28

W28

W29

V29

U29

V28

AD12

AH12

B25

GPIO_1

GPIO_10

TVDAC_AHVDDRG GPIO

B

GPIO_11

GPIO_12

GPIO_13

GPIO_14

B26

A26

C25

B27

—

TVDAC_AHVDDRG GPIO

B

ALT0

gpio4_GPIO[1]

gpio4_GPIO[2]

gpio4_GPIO[3]

gpio4_GPIO[4]

Input 100 KΩ PU

TVDAC_AHVDDRG GPIO

B

TVDAC_AHVDDRG GPIO

B

TVDAC_AHVDDRG GPIO

B

GPIO_16

GPIO_17

GPIO_18

GPIO_19

GPIO_2

GPIO_3

GPIO_4

GPIO_5

GPIO_6

AH10

AC10

AC9

—

NVCC_GPIO

NVCC_KEYPAD

NVCC_GPIO

UHVIO

ALT1

gpio7_GPIO[11]

gpio7_GPIO[12]

gpio7_GPIO[13]

gpio4_GPIO[5]

gpio1_GPIO[2]

gpio1_GPIO[3]

gpio1_GPIO[4]

gpio1_GPIO[5]

gpio1_GPIO[6]

Input 360 KΩ PD

Input³100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

AJ10

AG11

AC12

AH11

AJ11

AJ12

i.MX53xD Applications Processors for Consumer Products, Rev. 2

Freescale Semiconductor

187

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

GPIO_7

AC11

AD10

AC13

AD15

AD13

AC15

AG15

AD16

AC17

AG9

—

NVCC_GPIO

UHVIO

GPIO

ALT1

ALT0

ALT1

—

gpio1_GPIO[7]

gpio1_GPIO[8]

gpio1_GPIO[9]

sjc_MOD

Input 360 KΩ PD

Input 100 KΩ PU

Input 100 KΩ PD

Input 47 KΩ PU

Input Keeper

GPIO_8

NVCC_GPIO

NVCC_JTAG

GPIO_9

JTAG_MOD

JTAG_TCK

JTAG_TDI

JTAG_TDO

JTAG_TMS

JTAG_TRSTB

KEY_COL0

KEY_COL1

KEY_COL2

KEY_COL3

KEY_COL4

KEY_ROW0

KEY_ROW1

KEY_ROW2

KEY_ROW3

KEY_ROW4

NVCC_JTAG

GPIO

sjc_TCK

NVCC_JTAG

GPIO

sjc_TDI

NVCC_JTAG

GPIO

sjc_TDO

NVCC_JTAG

GPIO

sjc_TMS

Input 47 KΩ PU

Input⁴100 KΩ PU

Input 100 KΩ PU

Input 360 KΩ PD

Input 100 KΩ PU

Input 360 KΩ PD

NVCC_JTAG

GPIO

sjc_TRSTB

NVCC_KEYPAD

NVCC_LVDS_BG

NVCC_LVDS

UHVIO

ANALOG

LVDS

gpio4_GPIO[6]

gpio4_GPIO[8]

gpio4_GPIO[10]

gpio4_GPIO[12]

gpio4_GPIO[14]

gpio4_GPIO[7]

gpio4_GPIO[9]

gpio4_GPIO[11]

gpio4_GPIO[13]

gpio4_GPIO[15]

LVDS_BG_RES

gpio7_GPI[25]

gpio7_GPI[24]

gpio7_GPI[31]

gpio7_GPI[30]

gpio7_GPI[29]

gpio7_GPI[28]

gpio7_GPI[27]

gpio7_GPI[26]

gpio7_GPI[23]

gpio7_GPI[22]

AJ9

AG8

AJ8

AH7

AH9

AH8

AJ7

AG7

AD8

LVDS_BG_RES C18

LVDS0_CLK_N B19

LVDS0_CLK_P A19

LVDS0_TX0_N B22

—

ALT0

Input Floating

LVDS

LVDS0_TX0_P

LVDS0_TX1_N A21

LVDS0_TX1_P B21

LVDS0_TX2_N B20

LVDS0_TX2_P A20

LVDS0_TX3_N B18

A22

LVDS

LVDS0_TX3_P

A18

LVDS

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

LVDS1_CLK_N A15

LVDS1_CLK_P B15

LVDS1_TX0_N B17

—

L2

—

M1

—

K2

K1

N1

—

NVCC_LVDS

LVDS

ALT0

ALT1

gpio6_GPI[27]

Input Floating

NVCC_LVDS

LVDS

gpio6_GPI[26]

gpio6_GPI[31]

gpio6_GPI[30]

gpio6_GPI[29]

gpio6_GPI[28]

gpio6_GPI[25]

gpio6_GPI[24]

gpio6_GPI[23]

gpio6_GPI[22]

gpio6_GPIO[8]

gpio6_GPIO[7]

gpio6_GPIO[11]

gpio6_GPIO[14]

gpio6_GPIO[15]

gpio6_GPIO[16]

gpio6_GPIO[10]

gpio6_GPIO[13]

gpio6_GPIO[12]

gpio6_GPIO[9]

gpio7_GPIO[1]

Input Floating

NVCC_LVDS

LVDS

Input Floating

LVDS1_TX0_P

LVDS1_TX1_N A16

LVDS1_TX1_P B16

LVDS1_TX2_N A14

LVDS1_TX2_P B14

LVDS1_TX3_N A13

A17

NVCC_LVDS

LVDS

Input Floating

NVCC_LVDS

LVDS

Input Floating

NVCC_LVDS

LVDS

Input Floating

NVCC_LVDS

LVDS

Input Floating

NVCC_LVDS

LVDS

Input Floating

NVCC_LVDS

LVDS

Input Floating

LVDS1_TX3_P

NANDF_ALE

NANDF_CLE

NANDF_CS0

NANDF_CS1

NANDF_CS2

NANDF_CS3

NANDF_RB0

NANDF_RE_B

B13

N3

NVCC_LVDS

LVDS

Input Floating

NVCC_NANDF

NVCC_EIM_MAIN

NVCC_NANDF

NVCC_PATA

UHVIO

Input 100 KΩ PU

G16

P2

A11

C12

A12

C15

M3

NANDF_WE_B M2

NANDF_WP_B T2

PATA_BUFFER_ V6

EN

PATA_CS_0

PATA_CS_1

PATA_DA_0

PATA_DA_1

PATA_DA_2

PATA_DATA0

PATA_DATA1

PATA_DATA10

AA2

—

L1

—

A7

B6

A8

NVCC_PATA

UHVIO

ALT1

gpio7_GPIO[9]

gpio7_GPIO[10]

gpio7_GPIO[6]

gpio7_GPIO[7]

gpio7_GPIO[8]

gpio2_GPIO[0]

gpio2_GPIO[1]

gpio2_GPIO[10]

Input 100 KΩ PU

AB1

N2

AB2

Y3

B9

B8

B10

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Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

PATA_DATA11

PATA_DATA12

PATA_DATA13

PATA_DATA14

PATA_DATA15

PATA_DATA2

PATA_DATA3

PATA_DATA4

PATA_DATA5

PATA_DATA6

PATA_DATA7

PATA_DATA8

PATA_DATA9

PATA_DIOR

C9

B7

—

A5

B4

—

A10

B9

—

A4

A3

—

NVCC_PATA

UHVIO

ALT1

ALT0

gpio2_GPIO[11]

gpio2_GPIO[12]

gpio2_GPIO[13]

gpio2_GPIO[14]

gpio2_GPIO[15]

gpio2_GPIO[2]

gpio2_GPIO[3]

gpio2_GPIO[4]

gpio2_GPIO[5]

gpio2_GPIO[6]

gpio2_GPIO[7]

gpio2_GPIO[8]

gpio2_GPIO[9]

gpio7_GPIO[3]

gpio6_GPIO[17]

gpio6_GPIO[18]

gpio7_GPIO[0]

gpio7_GPIO[2]

gpio7_GPIO[5]

gpio7_GPIO[4]

Input 100 KΩ PU

Y1

NVCC_PATA

AA1

W1

V1

B6

C5

Y2

V3

V2

W2

B12

B11

AB3

AA6

Y6

PATA_DIOW

PATA_DMACK

PATA_DMARQ

PATA_INTRQ

PATA_IORDY

W6

V7

B5

PATA_RESET_B B4

PMIC_ON_REQ F12

NVCC_SRTC_POW GPIO

srtc_SRTCALARM Output —

PMIC_STBY_R G17

EQ

ccm_PMIC_VSTBY Output —

_REQ

POR_B

AC27

AB28

—

NVCC_RESET

VPH

LVIO

ALT0

—

src_POR_B

Input 100 KΩ PU

RESET_IN_B

LVIO

src_RESET_B

SATA_REFCLKM

SATA_REFCLK AJ18

M

ANALOG

—

SATA_REFCLK AH18

P

—

VPH

ANALOG

—

SATA_REFCLKP

—

SATA_REXT

SATA_RXM

AJ17

AH16

—

VPH

ANALOG

—

SATA_REXT

SATA_RXM

—

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Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

SATA_RXP

SATA_TXM

SATA_TXP

SD1_CLK

AJ16

AH14

AJ14

AJ26

AH26

AH27

AG25

AH25

AJ25

AG19

AD21

AH17

AG17

AD17

AG18

AA27

—

VPH

ANALOG

UHVIO

LVIO

—

SATA_RXP

—

SATA_TXM

—

SATA_TXP

NVCC_SD1

NVCC_SD2

NVCC_RESET

ALT1

ALT0

—

gpio1_GPIO[20]

gpio1_GPIO[18]

gpio1_GPIO[16]

gpio1_GPIO[17]

gpio1_GPIO[19]

gpio1_GPIO[21]

gpio1_GPIO[10]

gpio1_GPIO[11]

gpio1_GPIO[15]

gpio1_GPIO[14]

gpio1_GPIO[13]

gpio1_GPIO[12]

tcu_TEST_MODE

Input 100 KΩ PU

Input 100 KΩ PD

SD1_CMD

SD1_DATA0

SD1_DATA1

SD1_DATA2

SD1_DATA3

SD2_CLK

SD2_CMD

SD2_DATA0

SD2_DATA1

SD2_DATA2

SD2_DATA3

TEST_MODE

TVCDC_IOB_B B23

ACK

TVDAC_AHVDDRG ANALOG

B

TVCDC_IOB_BACK —

—

TVCDC_IOG_B A24

ACK

—

TVDAC_AHVDDRG ANALOG

B

—

TVCDC_IOG_BAC

K

—

TVCDC_IOR_B C28

ACK

TVDAC_AHVDDRG ANALOG

B

TVCDC_IOR_BACK —

TVDAC_COMP A25

TVDAC_AHVDDRG ANALOG

B

TVDAC_COMP

TVDAC_IOB

TVDAC_IOG

TVDAC_IOR

USB_H1_DN

—

TVDAC_IOB

TVDAC_IOG

TVDAC_IOR

USB_H1_DN

A23

TVDAC_AHVDDRG ANALOG

B

B24

TVDAC_AHVDDRG ANALOG

B

C29

AH21

TVDAC_AHVDDRG ANALOG

B

USB_H1_VDDA25, ANALOG5

USB_H1_VDDA33

0

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Package Information and Contact Assignments

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Out of Reset Condition¹

I/O Buffer

Type

Contact Name

Power Rail

Alt.

Mode

Direct

Config./

Value

Function

ion

USB_H1_DP

AJ21

—

USB_H1_VDDA25, ANALOG5

USB_H1_VDDA33

—

USB_H1_DP

—

0

USB_H1_GPAN AJ20

AIO

USB_H1_VDDA25, ANALOG2

USB_H1_VDDA33

—

USB_H1_GPANAIO —

—

5

USB_H1_RREF AH20

EXT

USB_H1_VDDA25, ANALOG2

USB_H1_VDDA33

USB_H1_RREFEX

T

—

5

USB_H1_VBUS AJ22

USB_H1_VDDA25, ANALOG5

USB_H1_VDDA33

USB_H1_VBUS

0

USB_OTG_DN AJ23

USB_OTG_VDDA25 ANALOG5

USB_OTG_DN

,

0

USB_OTG_VDDA33

USB_OTG_DP

AH23

—

USB_OTG_VDDA25 ANALOG5

—

USB_OTG_DP

—

,

0

USB_OTG_VDDA33

USB_OTG_GPA AH24

NAIO

USB_OTG_VDDA25 ANALOG2

USB_OTG_GPANAI —

O

,

5

USB_OTG_VDDA33

USB_OTG_ID

AH22

USB_OTG_VDDA25 ANALOG2

USB_OTG_ID

—

,

5

USB_OTG_VDDA33

USB_OTG_RRE AJ24

FEXT

USB_OTG_VDDA25 ANALOG2

USB_OTG_RREFE

XT

,

5

USB_OTG_VDDA33

USB_OTG_VBU AG21

S

USB_OTG_VDDA25 ANALOG5

USB_OTG_VBUS

,

0

USB_OTG_VDDA33

XTAL

F15

NVCC_XTAL

ANALOG

XTAL

1

2

The state immediately after reset and before ROM firmware or software has executed.

During power-on reset this port acts as input for fuse override, ~33KΩ PU/PD recommended to set the value. See Section 5.1,

“Boot Mode Configuration Pins” for details.

3

4

During power-on reset this port acts as output for diagnostic signal INT_BOOT

During power-on reset this port acts as output for diagnostic signal ANY_PU_RST

6.3.3

12 x 12 mm PoP, 0.4 Pitch Ball Maps

Table 119 shows the 12 × 12 mm, 0.4 pitch top ball map.

Table 120 shows the 12 × 12 mm, 0.4 pitch bottom ball map.

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Package Information and Contact Assignments

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map

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193

Package Information and Contact Assignments

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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195

Package Information and Contact Assignments

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

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197

Package Information and Contact Assignments

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Freescale Semiconductor

Package Information and Contact Assignments

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Package Information and Contact Assignments

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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Revision History

7 Revision History

Table 121 provides a revision history for this data sheet.

Table 121. i.MX53xD Data Sheet Document Revision History

Substantive Change(s)

Rev.

Number

Date

Rev 2

05/2011 • In Table 1, "Ordering Information," on page 3, deleted the row for part number PCIMX535DVV1B,

added a row for MCIMX538DZK1C and updated the PCIMX538DZK1C row.

• Updated the note on page 6 in Section 1.2, “Features.”

• Added 167 MHz ARM specification to Table 7, "i.MX53xD Operating Ranges," on page 20.

• Modified VDD_FUSE design best practice footnote on Table 7, "i.MX53xD Operating Ranges," on

page 20.

• Changed VDD_FUSE max current to 120 mA in Table 9, "Maximal Supply Currents," on page 23.

• Deleted the last row of Table 10, "USB Interface Current Consumption," on page 25.

• Added Section 4.1.2.2, “PoP Package Thermal Resistance,” according to package design report.

• Made changes related to text, tables, and figures in Section 4.6.7, “DDR SDRAM Specific

Parameters (DDR2/LVDDR2, LPDDR2, and DDR3). Changes include adding LPDDR2 waves,

updating timings by ACCZ test results, and changing note about DDR load model.

• Removed the Standard Serial Interfaces section.

• In Table 11, "GPIO I/O DC Electrical Characteristics," on page 29, changed input current with no

pull-up/down from 250/120 nA to 2 μA, all input currents with pull-up from 0.12 μΑ to 2 μA when

Vin = OVDD, and input current with pull-down from 0.25 μA to 2 μA when Vin = 0.

• In Table 12, Table 13, and Table 14, changed input current from the nA range to 1 μA.

• In Table 15, "LVIO DC Electrical Characteristics," on page 33, changed input current with no

pull-up/down from 250/120 nA to 1 μA, all input currents with pull-up from 0.12 μΑ to 1 μA when

Vin = OVDD, and input current with pull-down from 0.25 μA to 1 μA when Vin = 0.

• In Table 16, "UHVIO DC Electrical Characteristics," on page 34, changed input current with no

pull-up/down from 300/63 nA to 1 μA, all input currents with pull-up from 0.06 μΑ to 1 μA when Vin

= OVDD, and input current with pull-down from 0.3 μA to 1 μA when Vin = 0.

• Updated keeper values in Table 11 through Table 16.

• Fixed titles of Figure 18 through Figure 26, to fit original EIM AC spec.

• Updated Figure 2, "Power Up Detailed Sequence," on page 27.

• Added Figure 27, "DTACK Write Access (DAP=0)," on page 62.

• Added Table 19, "DDR Output Driver Average Impedance," on page 38.

• Deleted the second footnote of Table 33, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page

47.

• Deleted the Revision 1.0 EIM Internal Module Multiplexing table.

• Deleted the CKIL Electrical Specifications table.

• Deleted the CSPI Slave Mode Timing Parameters table .

• Updated the last paragragh of Section 4.7.8.6.1, “IPU Display Operating Signals.”

• Changed the title of the Section 4.4.2, “DDR Output Driver Average Impedance,” from “LPDDR2

I/O Output Buffer Impedance.”

• Added Section 6.3.2.2, “PoP Memory Support and Signal Cross Reference.”

• Updated Table 36, " NFC—Timing Characteristics," on page 52.

• Removed the “Differential pulse skew” row from Table 30, "AC Electrical Characteristics of LVDS

Pad," on page 45.

• Updated Table 64, "Asynchronous Display Interface Timing Parameters (Pixel Level)," on page

105.

• Updated Table 65, "Asynchronous Parallel Interface Timing Parameters (Access Level)," on page

106.

• Updated Table 101, "USB Timing Specification for Normal ULPI Mode," on page 144.

• Updated the second footnote on Table 112, "19 x 19 mm Signal Assignments, Power Rails, and

I/O," on page 154.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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201

Revision History

Table 121. i.MX53xD Data Sheet Document Revision History (continued)

Date Substantive Change(s)

Rev.

Number

Rev 1

03/2011 • Updated the first sentence of Section 3.1, “Special Signal Considerations.”

• Deleted two tables, “Special Signal Considerations” and “JTAG Controller Interface Summary,” in

Section 3.1, “Special Signal Considerations.”

• Updated Table 7, "i.MX53xD Operating Ranges," on page 20.

•

Changed VDDGP voltages as follows:

—

400 MHz from 1.35 to 1.05 V maximum.

800 MHz from 1.0/1.05/1.1 to 1.05/1.1/1.15 V minimum/nominal/maximum.

Stop mode from 0.9/0.95/1.1 to 0.8/0.85/1.3 V minimum/nominal/maximum.

•

Added statements to footnotes 5 and 6.

Added footnote on voltage ramping.

• In Section 1, “Introduction,” the second bullet point changed from “Smartbooks” to “Smart mobile

devices.”

• In Table 1, "Ordering Information," on page 3, added two new rows for part numbers

PCIMX535DVV1C and MCIMX535DVV1C.

Rev 0

02/2011 Initial release.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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THIS PAGE INTENTIONALLY LEFT BLANK

i.MX53xD Applications Processors for Consumer Products, Rev. 2

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203

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Document Number: IMX53CEC

Rev. 2

5/2011


型号：	MCIMX538DZK1C
厂家：	Freescale
描述：	Applications Processors for Consumer Products 应用处理器的消费类产品
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