WM21B23-R0 [FOXCONN]
Card Edge Connector,;
| 型号： | WM21B23-R0 |
| 厂家： | 
FOXCONN |
| 描述： | Card Edge Connector, 连接器 |
| 文件： | 总8页 (文件大小：228K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MEMORY CARD CONNECTOR SERIES
SMART CARD CONN
MMC CONN
SSFDC
SSFDC PUSH TYPE
MATERIALS/FINISHES
INSULATOR
SPECIFICATION
ELECTRICAL CHARACTERISTICS :
THERMOPLASTIC ( UL94V-0 )
CONTACT
PHOSPHOR BRONZE
CONTACT AREA:
* LOW LEVEL CONTACT RESISTANCE : 40 mΩ MAX.
* DIELECTRIC WITHSTANDING VOLTAGE : 500 VAC MIN.
* INSULATION RESISTANCE : 1000 MΩ MIN.
* CONTACT CURRENT RATING : 1.5 Ampere
GOLD OVER Ni ( 50∼ 90u" )
SOLDER AREA:
TIN/LEAD ( 100∼ 200u" ) OVER Ni
MECHANICAL CHARACTERISTICS :
* CONNECTOR INSERTION FORCE : 4 oz. MAX.
* CONNECTOR EXTRACTION FORCE : 0.6 oz. MAX.
* DURABILITY : 10000 CYCLES
SHELL
STEEL
* OPERATING TEMPERATURE : -20℃ TO +60℃
Ni PLATING
ORDER INFORMATION
W M
N
N N N N – N N
SERIES
PREFIX
MODIFICATION CODE
`
M = MEMORY CARD
CONNECTOR
CONTACT GOLD PLATING
3 = 30u” GOLD PLATING
L = GOLD FLASH OVER 25u" Pd/ Ni
TERMINATOR TYPE
1 = RIGHT ANGLE
2 = S.M.T
UPPER COVER TYPE
1 = PLASTIC UPPER COVER
2 = METAL UPPER COVER
CONTACT DESIGN TYPE
0 = NO SWITCH
NO. OF CONTACT POSITION
4 = 8 POS.
1 = NOMAL OPEN
2 = NOMAL CLOSE
8 = 16 POS.
B = 22 POS.
10-3
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