FP6733S6G [FITIPOWER]
PWM Controlled, Step-up DC/DC Converter in Tiny Package;型号: | FP6733S6G |
厂家: | Fitipower |
描述: | PWM Controlled, Step-up DC/DC Converter in Tiny Package |
文件: | 总11页 (文件大小:704K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
fitipower integrated technology lnc.
PWM Controlled, Step-up DC/DC
Converter in Tiny Package
Description
Features
The FP6733 is a high efficiency PWM DC/DC
step-up converter with internal compensated current
mode controller. The output voltage is set by using
0.9V (Typ.) Low Start-up Input Voltage at 1mA
Load
High Switching Frequency at 550kHz
two external resistors.
The 550kHz switching
Provide Flexibility for Using Internal and External
Power Switches
frequency
minimizes the size of external
components. Both internal 1A switch and driver for
driving external power device (NMOS or NPN) are
provided.
Automatic PFM Mode at Light Load
Low Ripple and High Efficiency
Excellent Line/Load Regulation
Chip Enable Control Function
Current Limit Protection
Thermal Overload Protection
Space Saving Packages: SOT-23-6 and
TSOT-23-6
The FP6733 starts up below 1V input voltage with
1mA load. Due to built-in automatic PWM/PFM
switch-over function, the FP6733 is able to get high
efficiency during both light and heavy load.
External transistor pin is available to accommodate
high output current applications.
Applications
PDA
The FP6733 is available in SOT-23-6 and
TSOT-23-6 packages.
MP3
DSC
RF Tag
Wireless Equipment
Portable Equipment
Pin Assignments
Ordering Information
FP6733□□□
S6 Package (SOT-23-6)
TR: Tape/Reel
VDD LX
FB
G: Green
6
5
4
3
(Marking)
2
1
Package Type
S6: SOT-23-6
S9: TSOT-23-6
CE EXT GND
S9 Package (TSOT-23-6)
SOT-23-6 Marking
Part Number
Product Code
AA=
VDD LX
FB
FP6733S6G
6
5
4
3
TSOT-23-6 Marking
Part Number
(Marking)
2
Product Code
aa=
1
FP6733S9G
CE EXT GND
Figure1. Pin Assignment of FP6733
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Typical Application Circuit
D1
L
VIN
VOUT
3.3~10µH
1N5819
COUT
10µF
R1
R2
CIN
10µF
LX
GND
FP6733
VDD
EXT
Option
ON
FB
CE
OFF
D1
L
VIN
VOUT
3.3~10µH
IN5819
COUT
10µF
R1
R2
CIN
10µF
LX
GND
FP6733
M1
NMOS
VDD
EXT
Option
ON
FB
CE
OFF
Figure 2. Typical Application Circuit of FP6733
Functional Pin Description
Pin Name
Pin Function
CE
EXT
GND
LX
IC chip enable.
External switch transistor driver output.
Ground.
Internal switch MOS output.
IC internal power supply.
VDD
FB
Feedback input pin. Internal reference voltage for error amplifier is 1.25V.
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Block Diagram
Sense
Current
LX
Vref
VDD
FB
Logic &
Buffer
GND
Slope
Compensation
EXT
CE
Chip Enable
Figure 3. Block Diagram of FP6733
Absolute Maximum Ratings
● LX to GND ---------------------------------------------------------------------------------------------------------- +6V
● All Other Pins to GND ------------------------------------------------------------------------------------------- +6V
● Maximum Junction Temperature -----------------------------------------------------------------------------
+150C
● Power Dissipation @TA=25°C, SOT-23-6, TSOT-23-6 (PD) -------------------------------------------- +0.40W
● Package Thermal Resistance, SOT-23-6, TSOT-23-6 (θJA) ------------------------------------------- +250°C/W
● Storage Temperature Range (TSTG) --------------------------------------------------------------------------
-65C to +150C
● Lead Temperature (Soldering, 10sec.) (TLEAD) ------------------------------------------------------------ +260°C
Note1:Stresses beyond those listed under “Absolute Maximum Ratings" may cause permanent damage to the device.
Recommended Operating Conditions
● Operating Voltage (VDD) ---------------------------------------------------------------------------------------- +2.9V to +5.5V
● Operating Temperature Range (TOPR) -----------------------------------------------------------------------
-40C to +85C
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Electrical Characteristics
(TA=25C, unless otherwise specified.)
Parameter
Symbol
VDD
Test Conditions
Normal Operation
Min
Typ
Max
5.5
Units
V
Operation Voltage
2.9
VSTART
INO_LOAD
ISWITCH
IQ
Start-Up Voltage
VIN : 0→1V, IOUT=1mA
VIN=1.5V, VOUT=3.3V
VDD=3.3V, VFB=0V
VIN=6V
0.9
75
1.05
V
No-Load Input Current
Continuous Switching Current
No Switch Current
µA
mA
µA
0.2
0.3
17
0.4
25
Shutdown Current
ISD
VDD=4.5V, CE pin=0V
Close loop, VDD=3.3V
VDD=3.3V
0.1
1.25
5
1.0
µA
V
VFB
Feedback Reference Voltage
EXT ON Resistance to VDD
EXT ON Resistance to GND
LX ON Resistance (Note 2)
Max. Duty Ratio
1.225
1.275
8.5
Ω
Ω
VDD=3.3V
5
8.5
RDS-ON
DUTY
fOSC
VDD=3.3V
0.3
95
Ω
VDD=3.3V
85
%
Oscillator Frequency
LX Leakage Current
Line Regulation
VDD=3.3V
450
550
0.1
3
650
1.0
10
kHz
µA
mV/V
mV/mA
A
ILXL
VLX=6V
ΔVLINE
ΔVLOAD
ILIMIT
VCEH
VCEL
ICEH
VIN=1.5 ~2.5V, IL=50mA
VIN=2.5V, IL=1~100mA
VDD=3.3V
Load Regulation
0.15
1
0.3
Switch Current Limit (Note 2)
CE “High” Voltage
0.75
1.2
VDD=3.3V, switch ON
VDD=3.3V, switch OFF
VDD =3.3V, VCE=VDD
VDD =3.3V, VCE=0V
V
CE “Low” Voltage
0.4
0.1
V
CE “High” Current
µA
µA
%
ICEL
CE “Low” Current
-0.1
η
Efficiency (Note 2)
85
145
30
TSD
ºC
Thermal Shutdown Threshold
(Note 2)
TSD
Hysteresis
ºC
Note 2:Guarantee by design.
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Typical Performance Curves
Figure 4. Operation Voltage vs. En Pin Trip Level
Figure 5. Operation Voltage vs. EXT NMOS Resistance
Figure 6. Operation Voltage vs. Max Duty
Figure 7. Operation Voltage vs. LX On Resistance
350
300
250
200
150
100
50
0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Input Voltage (V)
Figure 8. Input Voltage vs. Input Current
Figure 9. Operation Voltage vs. Switch Current
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Typical Performance Curves (Continued)
Figure 11. Operation Voltage vs. Frequency
(analog control)
Figure 10. Operation Voltage vs. Quiescent Current
700
24
VDD3.3V
VDD5.0V
VDD3.3V
VDD5.0V
22
20
18
16
14
12
10
600
500
400
300
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperture. (OC)
Temperture. (OC)
Figure 13. Temperature vs. Quiescent Current
Vin=5V, 3LEDs, ILED=100mA, Cout=1μF
Figure 12. Temperature vs. Frequency
1.4
VDD3.3V
VDD5.0V
1.0
0.8
0.6
0.4
0.2
0.0
VDD3.3V
VDD5.0V
1.3
1.2
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
Temperture. (OC)
-40
-20
0
20
40
60
80
Temperture. (OC)
Figure 14. Temperature vs. Switch current
3.3Vi to 3LEDs (PWM control)
Figure 15. Temperature vs. Feedback Voltage
3.3Vi to 4LEDs (PWM control)
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Typical Performance Curves (Continued)
90
90
85
VIN=4.5V
VIN=4.0V
VIN=3.5V
80
VIN=3.0V
V =2.5V
VIN=2.0VIN
80
VIN=1.5V
VIN=1.0V
VIN=2.5V
70
60
50
VIN=2.0V
VIN=1.0V
75
70
65
VIN=1.5V
0
200
400
600
800
1000
1200
-100
0
100
200
300
400
500
600
700
800
Output current (mA)
Output Current (mA)
Figure 17. Efficiency (VOUT=5.0V)
(analog control)
Figure 16. Efficiency (VOUT=3.3V)
5.00
4.98
4.96
4.94
4.92
4.90
4.88
4.86
4.84
4.82
4.80
3.30
3.28
3.26
3.24
3.22
3.20
3.18
3.16
3.14
3.12
3.10
VIN=1.0V
VIN=2.0V
VIN=2.5V
VIN=3.0V
VIN=2.5V
VIN=1.5V
VIN=1.5V
VIN=2.0V
VIN=3.5V
VIN=4.0V
VIN=4.5V
1200
0
200
400
600
800
1000
-100
0
100
200
300
400
500
600
700
800
Output current (mA)
Output Current (mA)
Figure 19. Load Regulation (VOUT=5.0V)
VIN=5V, 3LEDs, ILED=100mA, COUT=1μF
Figure 18. Load Regulation (VOUT=3.3V)
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Application Information
Operation
The inductor value can be calculated as:
The FP6733 is designed in a current mode
PFM/PWM scheme which features an automatic
switch PFM/PWM mode to maintain the highest
efficiency and extend battery life. The quiescent
current is less than 25μA at no switching status.
ꢁ
ꢃ
VIꢈ VꢀꢁꢂꢂVIꢈ
Lꢃ
fꢆꢉILꢆVꢀꢁꢂ
ꢉIL: inductor ripple current, usually set 20% x IL,
which defined as:
The control loop is internally compensated reducing
the amount of external components.
ꢁ
ꢃ
VꢀꢁꢂꢊVIꢈ
Lꢆf
VIꢈ
ꢀ
ꢉILꢃ
Vꢀꢁꢂ
Chip Enable
The inductor should be rated for the maximum
output current (IO(MAX)) plus the inductor ripple
current (ꢉIL) to avoid saturation. The maximum
inductor current (IL(MAX)) is given by:
The FP6733 features a chip enable input pin that
allows on/off control of the regulator.
When
CE=Low, shutdown of the chip occurs and at that
time almost no quiescent current (<1μA) flows. The
chip enable input is TTL/CMOS compatible.
Connect CE to battery for normal operation.
ꢉIL
IL MAꢋꢃꢃIꢀ maxꢃꢇ
ꢁ
ꢁ
ꢄ
Current Limit Protection
Capacitor Selection
The FP6733 provides cycle-by-cycle over-current
The FP6733 is permissible to use ceramic capacitor
for hand held instrument applications. The value of
capacitor depends on acceptable voltage ripple.
protection.
Current limit is accomplished by
sensing voltage drop across the drain to source of
power switch. If the current sense amplifier output
voltage is larger than current-limited threshold level
(Typ. 1.0A), it will immediately turn off power MOS.
The input capacitor can reduce peak current and
noise at power source. It should be 10μF at least
and be increased for better input voltage filtering.
Select the input capacitor to meet the input ripple
current and voltage rating.
Thermal Protection
Thermal protection limits total power dissipation in
the FP6733.
When the junction temperature
When selecting an output capacitor, consider the
output ripple voltage and the ripple current. The
ESR of capacitor is a major factor to the output
ripple. For best performance, a low ESR output
capacitor is required. The ripple voltage is given
by:
exceeds Tj=145C, the thermal sensor signals the
shutdown logic and turns off most of the internal
circuitry. The thermal sensor will turn internal
circuitry on again after the IC’s junction temperature
drops 30C.
1
Adjustable Output Voltage
ꢀ
ꢉVꢀꢃꢉIL ESRꢇ
ꢌꢆfꢆCꢀ
The output voltage of FP6733 ranges from 1.25V to
5.0V which is set by the external feedback resistor.
It can be calculated as:
The common aluminum-electrolytic capacitors have
high ESR and should be avoided. Ceramic
capacitors have the lowest ESR in general. It’s
recommended to use 10μF ceramic output
capacitors for the FP6733.
R1
ꢀ
Vꢀꢁꢂꢃ1.ꢄꢅꢆ 1ꢇ
Rꢄ
Inductor Selection
Diode Selection
A 3.3μH to 10μH inductor is recommended for
general use. The value of inductor depends on the
For diode selection, both forward voltage and diode
capacitance need to be considered. The output
diode should be rated to the output voltage and
peak switch current. Schottky diodes, with low
forward voltage drop and fast reverse recovery, are
the ideal choices for FP6733 applications. Make
sure the diode’s peak current rating is at least IPK and
operating frequency.
Higher frequency allows
smaller inductor and capacitor but increasing internal
switching loss. Two inductor parameters should be
considered, current rating and DCR. The DCR of
inductor affects the efficiency of the converter. The
inductor with lowest DCR is chosen for highest
efficiency.
its breakdown voltage exceeds VOUT
.
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Application Information (Continued)
Layout Consideration
Careful PCB layout is extremely important to avoid
causing parasitical capacitance and line inductance.
The following layout guidelines are recommended to
achieve optimum performance.
Place the Boost converter diode and inductor
close to the LX pin and no via.
Place the ceramic bypass capacitors near the VDD
and GND pin.
Place COUT next to Schottky diode as possible.
Use as wide and short traces as possible to the
LX node.
Keep the noise-sensitive feedback away from the
switching node.
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Outline Information
SOT-23-6 Package (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
0.90
0.00
MAX
1.45
0.15
A
A1
A2
B
0.90
0.30
2.80
2.60
1.50
0.90
1.80
0.30
1.30
0.50
3.00
3.00
1.70
1.00
2.00
0.60
D
E
E1
e
e1
L
Note:Followed From JEDEC MO-178-C.
Carrier Dimensions
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Outline Information (Continued)
TSOT-23-6 Package (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
MAX
A
A1
A2
B
0.70
0.90
0.00
0.70
0.30
2.80
2.60
1.50
0.90
1.80
0.30
0.10
1.00
0.50
3.00
3.00
1.70
1.00
2.00
0.60
D
E
E1
e
e1
L
Carrier Dimensions
Life Support Policy
Fitipower’s products are not authorized for use as critical components in life support devices or other medical systems.
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