F75383S [FINTEK]
±1oC Accuracy Temperature Sensor IC Datasheet; ± 1℃精确度温度传感器IC数据表
| 型号： | F75383S |
| 厂家： | 
FEATURE INTEGRATION TECHNOLOGY INC. |
| 描述： | ±1oC Accuracy Temperature Sensor IC Datasheet |
| 文件： | 总21页 (文件大小：659K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
F75383M/F75383S/F75384M/F75384S
±1oC Accuracy Temperature Sensor IC Datasheet
Release Date: July, 2007
Revision: V0.32P
F75383/F75384
F75383/F75384 Datasheet Revision History
Version
0.21P
0.22P
0.23P
0.24P
0.25P
0.26P
0.27P
Date
Page
Revision History
Mar.,2004
Mar.,2004
Mar.,2004
Mar.,2004
Apr.,2004
Jul.,2004
Sep.,2004
Original version (Confidential)
Revised version ID/vendor ID, AC/DC spec.
Add 8-SOP(F75383) package supporting
1-2
Add additional description of 8-SOP(F75383S)/8-MSOP(F75383M)
Add PCB Layout guide and update DC specification
Add F75384 description
8,13
6
12
15
4
Revise(1)High Byte of 1°C value (0000 0001)
(2) Read address (high byte) of VT2 low limit (08h (00h)
Revise serial bus timing
)
0.28P
0.29P
0.30P
0.31P
Jan.,2005
Aug.,2005
Dec.,2005
Dec.,2006
Modify alert response address
Revise typo and updated patent no.
Add Patent Note
1
-
Revise typo ( VDD Æ VCC)
Company readdress
0.32P
July,2007
-
Please note that all data and specifications are subject to change without notice. All the trade marks of products and
companies mentioned in this data sheet belong to their respective owners.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Fintek for any damages resulting from
such improper use or sales.
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Table of Contents
1. General Description................................................................................................................. 1
2. Features.................................................................................................................................. 1
3. Key Specifications................................................................................................................... 2
4. Pin Configuration..................................................................................................................... 2
5. Pin Descriptions ...................................................................................................................... 2
6. Functional Description............................................................................................................. 3
6.1 General Description.......................................................................................................... 3
6.2 The warning message...................................................................................................... 3
6.3 Access Interface............................................................................................................... 3
6.4 Typical Operating Characteristics ...................................................................................... 5
6.5 Temperature Monitoring..................................................................................................... 6
6.5 Alert#................................................................................................................................ 6
6.6 THERM#............................................................................................................................ 7
6.7 ADC Conversion Sequence............................................................................................... 7
6.8 Thermal Mass and Self Heating......................................................................................... 7
6.9 ADC Noise Filtering ........................................................................................................... 7
6.10 PCB Layout Guide........................................................................................................... 8
7. Registers Description .............................................................................................................. 9
7.1 Configuration Register Index 03h(Read), 09h(Write)................................................... 9
7.2 Status Register Index 02h .............................................................................................. 9
7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write).............................................. 10
7.4 One-Shot Register Index 0Fh...................................................................................... 10
7.5 Alert Queue & Timeout Register Index 22h .................................................................. 10
7.6 Status-with-ARA Control Register Index 24h ............................................................. 11
7.7 Chip ID I Register Index 5Ah........................................................................................ 11
7.8 Chip ID II Register Index 5Bh....................................................................................... 11
7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh....................................................... 11
7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh..................................................... 11
7.11 Vendor ID II (Manufacturer ID) Register Index FEh.................................................... 11
7.12 Value RAM Index 10h- 2Fh ........................................................................................ 11
8. Electrical characteristic.......................................................................................................... 12
8.1 Absolute Maximum Ratings .............................................................................................. 12
8.2 DC Characteristics............................................................................................................ 12
8.3 AC Characteristics ............................................................................................................ 14
9. Package Dimensions............................................................................................................. 15
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10 Application Circuit .................................................................................................................. 17
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1. General Description
The F75383/F75384 is a temperature sensor IC with alert signal which is specific designed for notebook,
graphic cards etc. An 11-bit analog-to-digital converter (ADC) was built inside F75383/F75384. The
F75383/F75384 can monitor two set of temperature which is very important for the system to work stably and
properly. This chip provides 1 remote temperature sensor and 1 local temperature sensor. The remote
temperature sensor can be performed by CPU thermal diode or transistor 2N3906. The users can set up the
upper and lower limits (alarm thresholds) of all monitored parameters and this chip can also issue warning
messages for system protection when there is something wrong with monitored items.
Through the BIOS or application software, the users can read all the monitored parameters of system all the
time. And a pop-up warning can be also activated when the monitored item was out of the proper/pre-setting
range. The application software could be Fintek's application utility, or other management application software.
The F75383/F75384 is in the package of 8-pin MSOP/SOP and powered by 3.3V.
2. Features
Provide 1 on-chip local and 1 remote temperature sensing
±1 oC accuarcy on remote channel and ±3 oC accuarcy on local channel
±1 oC (+60 oC to +100 oC, remote)
±3 oC (+60 oC to +100 oC, local)
ALERT# output for SMBus alert
THERM# output for over temperature alert or for system shut down
Programmable THERM# limits and THERM# hysteresis
Programmable alert queue
Programmable limited and setting points(alert threshold) for all monitored items
2 wire SMBus interface
3VCC operation and in 8-SOP/8-MSOP green class package
8-MSOP Package – F75383M/F75384M ; 8-SOP Package – F75383S/F75384S
The difference between F75383 and F75384 is SMBus address ID and they have the following
SMBus slave address:
A6
A5
A4
A3
A2
A1
A0
F75383
F75384
1
0
0
1
1
0
0
1
0
0
1
1
0
1
Noted: Patented TW 235231 TWI263778
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3. Key Specifications
Supply Voltage
Supply Current
3.0~3.6V
180 uA (typ)
4. Pin Configuration
8
7
SCL
SDA
VCC
1
F75383
F75384
D+
D-
2
3
4
6
5
ALERT#
GND
THERM#
5. Pin Descriptions
I/O12t
I/O12ts
O12
- TTL level bi-directional pin with 12 mA source-sink capability
- TTL level and schmitt trigger
- Output pin with 12 mA source-sink capability
- Output pin with 24 mA source-sink capability, output 4V
O24V4
AOUT - Output pin(Analog)
OD12
INt
- Open-drain output pin with 12 mA sink capability
- TTL level input pin
INts
- TTL level input pin and schmitt trigger
- Input pin(Analog)
AIN
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PIN NO
PIN NAME
VCC
TYPE
PWR
AIN
PWR
3VCC
3VCC
3VCC
DESCRIPTION
1
2
3
Power Pin
D+
D-
Positive connection to remote temperature sensor (ex: thermal diode anode)
Negative connection to remote temperature sensor(ex: thermal diode
AIN
cathode)
4
THERM#
3VCC
Active LOW output. This pin will be logic low when the temperature exceeds
OD12
its limit.
5
6
7
8
GND
3VCC
3VCC
3VCC
3VCC
Ground
PWR
OD12
ALERT#
SDA
Active LOW output. Used as SMBus alert or Interrupt
Serial bus data
INts/OD12
INts
SCL
Serial bus clock
6. Functional Description
6.1 General Description
The F75383/F75384 is a simple temperature sensor with warning signal output. It includes a local and a remote temperature sensor.
Both measured temperature are compared with its high, low and THERM limits which are stored in the registers. When one or more
out-of-limit events occur, the flags in Status Register will be set and that may cause ALERT output to low. Also, measured
temperature exceeding THERM limit may cause THERM output to low.
6.2 The warning message
Pin4 and pin6 act as warning message when the temperature exceeds it threshold point.
6.3 Access Interface
The F75383/F75384 can be connected to a compatible 2-wire serial system management bus as a slave device under the control of
the master device, using two device terminals SCL and SDA. The F75383/F75384 supports SMBus protocol of, “Write Byte”, “Read
Byte”, both with or without Packet Error checking(PEC) which is calculated using CRC-8. For detail information about PEC, please
check SMBus 1.1 specification. F75383/F75384 supports 25ms timeout for no activity on the SMBus. This timeout function is
programmed at 22h bit7 and default is disabled. F75383/F75384 also supports Alert Response Address(ARA) protocol.
The operation of the protocol is described with details in the following sections.
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(a) SMBus write to internal address register followed by the data byte
0
7
8
0
7
8
SCL
SDA
1
0
0
1
1
0
0
R/W
D7
D6
D5
D4
D3
D2
D1
D0
Start By
Master
Ack
by
383
Ack
by
383
Frame 1
Frame 2
Serial Bus Address Byte
Internal Index Register Byte
0
7
8
SCL (Continued)
SDA (Continued)
D7
D6
D5
D4
D3
D2
D1
D0
Stop
by
Master
Frame 3
Data Byte
Figure 1. Serial Bus Write to Internal Address Register followed by the Data Byte
(b) Serial bus write to internal address register only
0
1
7
8
0
7
8
SCL
SDA
0
0
1
1
0
0
R/W
D7
D6
D5
D4
D3
D2
D1
D0
Start By
Master
Ack
by
383
Stop by
Master
Ack
by
383
Frame 1
Serial Bus Address Byte
Frame 2
Internal Index Register Byte
0
Figure 2. Serial Bus Write to Internal Address Register Only
(c) Serial bus read from a register with the internal address register prefer to desired location
0
7
8
0
7
8
SCL
SDA
1
0
0
1
1
0
0
R/W
D7
D6
D5
D4
D3
D2
D1
D0
Start By
Master
Ack
by
Master
Ack
by
383
Stop by
Master
Frame 1
Serial Bus Address Byte
Frame 2
Internal Index Register Byte
0
Figure 3. Serial Bus Read from Internal Address Register
(d) Alert Response Address
0
7
8
0
0
7
0
8
SCL
R/W
SDA
0
0
0
1
1
0
0
1
0
0
1
1
0
Start By
Master
Ack
by
Master
Ack
by
383
Stop by
Master
Frame 1
Alert Response Address
Frame 2
Device Address
0
Figure 4. Alert Response Address
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6.4 Typical Operating Characteristics
Temperature Error vs.D+/D- Capacitance
Local Temperature Error vs. Die Temperature
Local Temperature error(
℃
)
Temperature error(℃) vs. D+/D- capacitance
0.8
0.6
0.4
0.2
0
1
0
-1
-2
-3
-4
-5
-6
-7
-0.2
-0.4
-0.6
-8
-9
-10
0
10 20 30 40 50 60 70 80 90 100 110 120
Capacitance(nf)
0
10
20
30
40
50
60
70
80
90
100
Temperature(℃)
Remote Diode Error vs. Remote Temperature Error
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1
0
20
40
60
Tem perature
80
100
120
Operating Supply Current vs. Conversion Rate
Operating current (uA)
250
200
150
100
50
0
0.0625 0.125 0.25
0.5
1
2
4
8
16
32
64
Conversion rate(Hz)
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6.5 Temperature Monitoring
The F75383/F75384 monitors a local and a remote temperature sensor. Both can be measured from 0°C to 140.875°C.
The temperature format is as the following table:
Temperature ( High Byte )
Digital Output
0000 0000
0000 0001
0001 1001
0011 0010
0100 1011
0101 1010
0110 0100
1000 1100
Temperature ( Low Byte )
0°C
Digital Output
000 0 0000
001 0 0000
010 0 0000
011 0 0000
100 0 0000
101 0 0000
110 0 0000
111 0 0000
0°C
1°C
0.125°C
25°C
50°C
75°C
90°C
100°C
140°C
0.250°C
0.375°C
0.500°C
0.625°C
0.750°C
0.875°C
Remote-sensor transistor manufacturers
Manufacturer
Panasonic
Philips
Model Number
2SB0709 2N3906
PMBT3906
6.5 Alert#
Five events can trigger ALERT# to low:
(1). VT1(Local) temperature exceeds High Limit
(2). VT1(Local) temperature goes below Low Limit
(3). VT2(Remote) temperature exceeds High Limit
(4). VT2(Remote) temperature goes below Low Limit
(5). VT2(Remote) temperature is Open-circuit.
These five events are wired-NOR together. This means that when one of out-of-limit event occurs, the ALERT# output goes low if the
MASK control is disabled. ALERT# signal can be used as an IRQ-like interrupt or as an SMBALERT. When ALERT# acts as an
IRQ-like interrupt, the ALERT# will be de-asserted until the following 2 conditions are matched:
(1). The abnormal condition is gone
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(2). Reading the Status register to clear the status
When ALERT# acts as a SMBALERT, the ALERT# will be de-asserted until the following 3 conditions are matched:
(1). The abnormal condition is gone
(2). Reading the Status register to clear the status
(3). The ALERT# has been serviced by the SMBus master reading the device address.
For more information about SMBALERT, please see SMBus 1.1 specification.
6.6 THERM#
Either VT1(Local) or VT2(Remote) temperature exceeds the corresponding THERM limit, the THERM# output will assert low. The
asserted output will be de-asserted until the temperature goes below (THERM Limit – Hysteresis). The hysteresis default value is
10°C and it can be programmed. Both VT1 and VT2 have their own THERM limits and Hysteresis values.
6.7 ADC Conversion Sequence
If a START command is written, both channels are converted and the results of both measurements are available after the end of
conversion. A BUSY status bit in the status byte shows that the device is actually performing a new conversion; however, even if the
ADC is busy, the results of the previous conversion are always available.
6.8 Thermal Mass and Self Heating
Thermal mass effect can seriously degrade the F75383’s effective accuracy. The thermal time constant of the SOP package is about
140 in still air. For the F75383/S junction temperature to settle to within +1°C after a sudden +100°C change requires about five time
constants or 12 minutes. The use of smaller packages for remote sensors such as SOT23, improves the situation. Take care to
account for thermal gradients between the heat source and the sensor package do not interfere with measurement accuracy.
Sel-heating does not significantly affect measurement accuracy. Remote sensor self-heating due to the diode current source is
negligible. For the local diode, the worst case error occurs when auto-converting at the fastest rate and simultaneously sinking
maximum current at the ALERT# output. For instance, at an 64Hz rate and ALERT# sink around 0.7mA when pull up resistor 4.7K
ohm to 3.3VCC, the typical power dissipation is VCC x 220 uA plus 0.4V x 0.7mA. Package θJA is about 120 °C/W, so with VCC =
3.3V and no copper PC board heat-sinking, the resulting temperature rise is:
dT = 1.01mW x 120 °C/W = 0.12 °C
Even with these contrived circumstances, it is difficult to introduce significant self-heating errors.
6.9 ADC Noise Filtering
The ADC is integrating type with inherently good noise rejection. Micro-power operation places constraints on high-frequency noise
rejection; therefore, careful PCB board layout and suitable external filtering are required for high-accuracy remote measurement in
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electronically noisy environment. High frequency EMI is best filtered at D+ and D- with an external 2200pF capacitor. Too high
capacitance may introduce errors due to the rise time of the switched current source. Nearly all noise sources tested cause the ADC
measurement to be higher than the actual temperature, depending on the frequency and amplitude.
6.10 PCB Layout Guide
PCB can be electrically noisy environments, and the F75383/F75384 is measuring very small voltage from the remote sensor, so
care must be taken to minimize noise which is occurred at the sensor inputs. The following guideline should be taken to reduce the
measurement error of the temperature sensors:
1. Place the F75383/F75384 as close as practical to the remote sensing diode. In noisy environments, such as a computer
main-board, the distance can be 4 to 8 inches. (typ). This length can be increased if the worst noise sources are avoided. Noise
sources generally include clock generators, CRTs, memory buses and PCI/ISA bus etc.
2. Route the D+ and D- tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under
the tracks if possible. Do not route D+ & D- lines next to the deflection coil of the CRT. And also don’t route the trace across fast
digital signals which can easily induce bigger error.
GND
10MILS
DXP
10MILS
MINIMUM
DXN
10MILS
10MILS
GND
3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track minimum width and spacing is recommended.
4. Try to minimize the number of copper/solder joints, which can cause thermocouple effects. Where copper/solder joints are used,
make sure that they are in both the D+ and D- path and at the same temperature. Thermocouple effects should not be a major
problem as 1℃corresponds to about 200µV. It means that a copper-solder thermocouple exhibits 3µV/℃, and takes about
200µV of the voltage error at D+ & D- to cause a 1℃ measurement error. Adding a few thermocouples causes a negligible
error.
5. Place a 0.1µF bypass capacitor close to the VCC pin. In very noisy environments, place an external 2200pF input filter
capacitors across D+, D- close to the F75383/F75384.
6. If the distance to the remote sensor is more than 8 inches, the use of twisted pair cable is recommended. It will work up to
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around 6 to 12 feet.
7. Because the measurement technique uses switched current sources, excessive cable and/or filter capacitance will affect the
measurement accuracy. When using long cables, the filter capacitor may be reduced or removed. Cable resistance can also
induce errors. 1 Ω series resistance introduces about 0.5℃error.
7. Registers Description
7.1 Configuration Register Index 03h(Read), 09h(Write)
Power on default <7:0> = 00h
Bit
7
Name
Attribute
R/W
Description
ALERT_MASK
RUN_STOP
Reserved
Set to 1, mask ALERT# signal output.
Set to 0, monitor. Set to 1, stop to monitor(software power down).
6
R/W
5-0
7.2 Status Register Index 02h
Power on default <7:0> = 00h
Bit
Name
Attribute
RO
Description
7
ADC_BUSY
VT1HIGH
Set to 1, ADC is converting.
6
5
4
3
RO
Set to 1, VT1 temperature exceeds high limit.
Set to 0, VT1 temperature does not exceed high limit.
Set to 1, VT1 temperature goes below low limit.
Set to 0, VT1 temperature does not goes below low limit.
Set to 1, VT2 temperature exceeds high limit.
Set to 0, VT2 temperature does not exceed high limit.
Set to 1, VT2 temperature goes below low limit.
Set to 0, VT2 temperature does not goes below low limit.
Set to 1, VT2 is open-circuit.
VT1LOW
VT2HIGH
VT2LOW
RO
RO
RO
2
1
0
OPEN
RO
RO
RO
VT2THERM
VT1THERM
Set to 1, VT2 temperature exceeds its THERM limit.
Set to 1, VT1 temperature exceeds its THERM limit.
VT1(Local) ; VT2(Remote)
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7.3 Conversion Rate Register Index 04h(Read), 0Ah(Write)
Power on default <7:0> = 08h
Bit
Name
Attribute
Description
7-0
CONV_RATE
R/W
Set conversion times per second.
Value
00h
01h
02h
03h
04h
05h
Conversion/Sec
Value
Conversion/Sec
0.0625
0.125
0.25
0.5
06h
07h
4
8
16
08h
09h
32
1
0Ah
64
2
0Bh ~ FFh
Reserved
7.4 One-Shot Register Index 0Fh
Power on default <7:0> = xxh
Bit
7-0
Name
Attribute
Description
ONE-SHOT
WO
When F75383/F75384 is at standby mode, writing any value to this register
will initiate a single conversion and comparison cycle. After the single cycle,
F75383/F75384 will returns to standby mode.
7.5 Alert Queue & Timeout Register Index 22h
Power on default <7:0> = 01h
Bit
Name
Attribute
Description
Set to 1, enable serial interface timeout function. (Timeout time = 25ms)
Set to 0, disable.
7
EN_I2CTMOUT
R/W
6-4
3-1
Reserved
ALERT_QUEUE
R/W
This number determines how many abnormal measurements must occur before
ALERT signal is generated.
000 : Once
001 : Twice
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011 : 3 times
111 : 4 times
Always read 1.
0
Reserved
RO
7.6 Status-with-ARA Control Register Index 24h
Power on default <7:0> = 01h
Bit
7-6
0
Name
Attribute
Description
Reserved
EN_ARA_STS
R/W
Set to 1, ALERT de-asserted condition is related with ARA.
Set to 0, ALERT de-asserted condition is not related with ARA(Alert Response
Address).
7.7 Chip ID I Register Index 5Ah
Power on default: 03h.
7.8 Chip ID II Register Index 5Bh
Power on default: 03h.
7.9 Vendor ID I (Manufacturer ID) Register Index 5Dh
Power on default: 19h.
7.10 Vendor ID I (Manufacturer ID) Register Index 5Eh
Power on default: 34h.
7.11 Vendor ID II (Manufacturer ID) Register Index FEh
Power on default: 23h. (programmable)
7.12 Value RAM Index 10h- 2Fh
VT1 : Local Temperature
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VT2 : Remote Temperature
The value in quota is its power-on default value.
Description
Attribute
Read Address
(High Byte)
00h
Read Address
(Low Byte)
1Ah
Write Address
Write Address
(Low Byte)
(High Byte)
VT1 reading
RO
VT2 reading
RO
01h
10h
VT1 High Limit
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
05h (55h)
06h (00h)
07h (55h)
08h (00h)
20h (55h)
21h (0Ah)
19h (55h)
23h (0Ah)
1Bh (00h)
1Ch (00h)
13h (00h)
14h (00h)
0Bh
0Ch
0Dh
0Eh
20h
21h
19h
23h
1Bh
1Ch
13h
14h
VT1 Low Limit
VT2 High Limit
VT2 Low Limit
VT1 THERM limit
VT1 THERM Hysteresis
VT2 THERM limit
VT2 THERM Hysteresis
8. Electrical characteristic
8.1 Absolute Maximum Ratings
PARAMETER
RATING
-0.5 to 5.5
UNIT
Power Supply Voltage
Input Voltage
V
V
-0.5 to VCC+0.5
0 to +140
Operating Temperature
Storage Temperature
° C
° C
-55 to 150
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of
the device
8.2 DC Characteristics
(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V )
Parameter
Conditions
60 oC < TD < 100 oC, VCC = 3.0V to 3.6V
0 oC <TD < 140 oC
MIN
TYP
MAX
Unit
Temperature Error, Remote Diode
oC
± 1
± 1
± 3
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Temperature Error, Local Diode
Supply Voltage range
0 oC < TA < 100 oC, VCC = 3.0V to 3.6V
oC
± 1
3.3
180
90
± 3
3.0
3.6
V
Average operating supply current
16 Conversions / Sec Rate
uA
uA
uA
oC
V
0.0625 Conversions / Sec Rate
Standby supply current
Resolution
5
0.125
2.55
2.2
95
Under-voltage lockout threshold
Power on reset threshold
Diode source current
VCC input, Disables ADC , Rising Edge
2.4
V
High Level
Low Level
uA
uA
10
(TA = 0° C to 70° C, VCC = 3.3V ± 10%, VSS = 0V)
PARAMETER SYM.
MIN.
TYP.
MAX.
UNIT
CONDITIONS
I/O12t - TTL level bi-directional pin with source-sink capability of 12 mA
Input Low Voltage
Input High Voltage
Output Low Current
Output High Current
Input High Leakage
Input Low Leakage
VIL
0.8
V
VIH
IOL
IOH
ILIH
ILIL
2.0
10
V
12
mA
mA
µA
µA
VOL = 0.4V
VOH = 2.4V
VIN = VCC
VIN = 0V
-12
-10
+1
-1
I/O12ts - TTL level bi-directional pin with source-sink capability of 12 mA and schmitt-trigger level input
Input Low Threshold Voltage
Input High Threshold Voltage
Output Low Current
Vt-
0.5
1.6
10
0.8
2.0
12
1.1
2.4
V
VCC = 3.3 V
VCC = 3.3 V
VOL = 0.4 V
VOH = 2.4V
VIN = VCC
VIN = 0V
Vt+
IOL
IOH
ILIH
ILIL
V
mA
mA
µA
µA
Output High Current
-12
-10
+1
-1
Input High Leakage
Input Low Leakage
8.2 DC Characteristics, continued
PARAMETER
SYM.
MIN.
TYP.
MAX.
UNIT
CONDITIONS
OUT12t - TTL level output pin with source-sink capability of 12 mA
Output Low Current
Output High Current
IOL
12
16
mA
mA
VOL = 0.4V
VOH = 2.4V
IOH
-14
-12
OD8 - Open-drain output pin with sink capability of 8 mA
Output Low Current
IOL
6
8
mA
VOL = 0.4V
F75383/F75384
-13-
July, 2007
V0.32P
F75383/F75384
OD16 - Open-drain output pin with sink capability of 16 mA
Output Low Current IOL 12
16
mA
VOL = 0.4V
I/OOD16ts - TTL level bi-directional pin, can select to OD or OUT by register, with 16 mA source-sink capability
Input Low Threshold Voltage
Input High Threshold Voltage
Output Low Current
Output High Current
Input High Leakage
Input Low Leakage
Vt-
0.5
1.6
6
0.8
2.0
8
1.1
2.4
V
VCC = 3.3 V
VCC = 3.3 V
VOL = 0.4 V
VOH = 2.4V
VIN = VCC
VIN = 0V
Vt+
IOL
IOH
ILIH
ILIL
V
mA
mA
µA
µA
-16
-12
+1
-1
INt - TTL level input pin
Input Low Voltage
VIL
0.8
V
Input High Voltage
VIH
ILIH
ILIL
2.0
V
Input High Leakage
Input Low Leakage
+1
-1
VIN = VCC
VIN = 0 V
µA
µA
INts
-
TTL level Schmitt-triggered input pin
Input Low Threshold Voltage
Input High Threshold Voltage
Input High Leakage
Vt-
0.5
1.6
0.8
2.0
1.1
2.4
+1
-1
V
VCC = 3.3V
VCC = 3.3V
VIN = VCC
VIN = 0 V
Vt+
ILIH
ILIL
V
µA
µA
Input Low Leakage
8.3 AC Characteristics
t
t
SCL
R
t
R
SCL
t
t
SU;STO
t
SU;DAT
HD;SDA
SDA IN
VALID DATA
t
HD;DAT
SDA OUT
Serial Bus Timing Diagram
F75383/F75384
-14-
July, 2007
V0.32P
F75383/F75384
Serial Bus Timing
PARAMETER
SYMBOL
t-SCL
MIN.
0.5
0.5
0.5
50
MAX.
UNIT
uS
SCL clock period
10000
Start condition hold time
Stop condition setup-up time
DATA to SCL setup time
DATA to SCL hold time
SCL and SDA rise time
SCL and SDA fall time
tHD;SDA
tSU;STO
tSU;DAT
tHD;DAT
tR
uS
uS
nS
50
nS
0.4
0.4
uS
tF
uS
9. Package Dimensions
(F75383/F75384 8-MSOP Package )
F75383/F75384
-15-
July, 2007
V0.32P
F75383/F75384
8
c
5
E
HE
L
1
4
O
0.25
D
A
Y
e
SEATING PLANE
GAUGE PLANE
A1
b
Control demensions are in milmeters
.
DIMENSION IN MM
SYMBOL
DIMENSION IN INCH
MIN.
1.35
MAX.
1.75
MIN.
MAX.
0.053
0.069
0.010
0.020
A
A1
b
0.10
0.33
0.19
0.25
0.51
0.004
0.013
c
0.25
0.008
0.150
0.188
0.010
0.157
3.80
4.80
E
D
4.00
5.00
0.196
e
0.050 BSC
1.27 BSC
6.20
0.10
1.27
10
HE
5.80
0.228
0.244
0.004
0.050
10
Y
0.40
0
0.016
0
L
θ
(F75383/F75384 8-SOP Package )
Feature Integration Technology Inc.
Headquarters
Taipei Office
3F-7, No 36, Tai Yuan St.,
Bldg. K4, 7F, No.700, Chung Cheng Rd.,
Chungho City, Taipei, Taiwan 235, R.O.C.
TEL : 866-2-8227-8027
Chupei City, Hsinchu, Taiwan 302, R.O.C.
TEL : 886-3-5600168
FAX : 886-3-5600166
FAX : 866-2-8227-8037
www: http://www.fintek.com.tw
Please note that all datasheet and specifications are subject to change without notice. All
the trade marks of products and companies mentioned in this datasheet belong to their
respective owner
F75383/F75384
-16-
July, 2007
V0.32P
10 Application Circuit
Example 1:
TEMPERATURE MONITOR (CPU THERMAL DIODE)
D+
THERDA
VCC3V
C1
2200pF
D-
THERDC
C2
R1
0.1u
R2
R3
R4
4.7K
4.7K 4.7K 4.7K
Example 2:
U1
1
2
3
4
8
7
6
5
TEMPERATURE MONITOR (2N3906)
SCLK
VCC
D+
SCL
SDA
D+
D-
SDATA
D-
ALERT#
GND
D+
THERM#
F75383M
Q1
C3
2N3906
2200pF
D-
Title
Feature Integration Technology Inc.
Size
A
Document Number
Rev
0.1
F75383M Application Circuit
Date:
Tuesday, January 27, 2004
Sheet
1
of
1
July, 2007
V0.32P
-17-
相关型号：
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