QSE114 [FAIRCHILD]

PLASTIC SILICON INFRARED PHOTOTRANSISTOR; 塑封硅红外光敏晶体管
QSE114
型号: QSE114
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

PLASTIC SILICON INFRARED PHOTOTRANSISTOR
塑封硅红外光敏晶体管

晶体 光电 晶体管 光电晶体管 LTE
文件: 总4页 (文件大小:322K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PLASTIC SILICON  
INFRARED PHOTOTRANSISTOR  
QSE113 QSE114  
PACKAGE DIMENSIONS  
0.175 (4.44)  
0.087 (2.22)  
Ø 0.065 (1.65)  
0.050 (1.27)  
0.200 (5.08)  
Ø 0.095 (2.41)  
0.500 (12.70)  
MIN  
COLLECTOR  
EMITTER  
0.020 (0.51) SQ.  
(2X)  
SCHEMATIC  
Collector  
0.100 (2.54)  
0.030 (0.76)  
0.100 (2.54)  
NOM  
NOTES:  
1. Dimensions for all drawings are in inches (mm).  
2. Tolerance of .010 (.25) on all nonꢀnominal dimensions ꢁnless  
otherwise specied.  
Emitter  
DESCRIPTION  
The QSE113/114 is a silicon phototransistor encapsulated in a wide angle, infrared transparent, black plastic sidelooker package.  
FEATURES  
NPN silicon phototransistor  
Package type: Sidelooker  
Medium wide reception angle, 50°  
Package material and color: black epoxy  
Matched emitter: QEE113  
Daylight filter  
High sensitivity  
© 2002 Fairchild Semiconductor Corporation  
Page 1 of 4  
5/1/02  
PLASTIC SILICON  
INFRARED PHOTOTRANSISTOR  
QSE113 QSE114  
ABSOLUTE MAXIMUM RATINGS (T = 25°C ꢁnless otherwise specied)  
A
Parameter  
Symbol  
Rating  
ꢀ40 to +100  
ꢀ40 to +100  
240 for 5 sec  
260 for 10 sec  
30  
Unit  
°C  
°C  
°C  
°C  
V
T
Operating Temperatꢁre  
Storage Temperatꢁre  
OPR  
T
STG  
(2,3,4)  
(2,3)  
T
Soldering Temperatꢁre (Iron)  
SOLꢀI  
T
Soldering Temperatꢁre (Flow)  
Collector Emitter Voltage  
Emitter Collector Voltage  
SOLꢀF  
V
CE  
V
5
V
EC  
(1)  
P
100  
mW  
Power Dissipation  
D
NOTES:  
1. Derate power dissipation linearly 1.33 mW/°C above 25°C.  
2. RMA ꢁx is recommended.  
3. Methanol or isopropyl alcohols are recommended as cleaning agents.  
4. Soldering iron 1/16" (1.6 mm) minimꢁm from hoꢁsing.  
5. λ = 880 nm (AlGaAs).  
ELECTRICAL / OPTICAL CHARACTERISTICS (T =25°C ꢁnless otherwise specied)  
A
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Units  
λ
Peak Sensitivity  
30  
5
880  
25  
nM  
Deg.  
nA  
V
PS  
Reception Angle  
Θ
V
= 10 V, E = 0  
I
Collector Emitter Dark Cꢁrrent  
CollectorꢀEmitter Breakdown  
EmitterꢀCollector Breakdown  
100  
CE  
e
CEO  
I = 1 mA  
BV  
C
CEO  
I = 100 µA  
BV  
V
E
ECO  
(5)  
OnꢀState Collector Cꢁrrent  
QSE113  
2
I
0.25  
1.00  
1.50  
mA  
mA  
E = 0.5 mW/cm , V = 5 V  
C(ON)  
e
CE  
(5)  
OnꢀState Collector Cꢁrrent  
2
I
E = 0.5 mW/cm , V = 5 V  
C(ON)  
e
CE  
QSE114  
2
(5)  
V
8
0.4  
V
E = 0.5 mW/cm , I = 0.1 mA  
Satꢁration Voltage  
CE(SAT)  
e
C
t
Rise Time  
Fall Time  
µs  
µs  
r
I = 1mA, V = 5V, R = 100Ω  
C
CC  
L
t
8
f
© 2002 Fairchild Semicondꢁctor Corporation  
Page 2 of 4  
5/1/02  
PLASTIC SILICON  
INFRARED PHOTOTRANSISTOR  
QSE113 QSE114  
Figure 1. Light Current vs. Radiant Intensity  
= 5V  
101  
100  
10ꢀ1  
Figure 2. Angular Response Curve  
V
CE  
90  
100  
80  
110  
GaAs Light Soꢁrce  
70  
120  
60  
130  
50  
40  
140  
150  
160  
170  
30  
20  
10  
180  
1.0  
0
1.0  
0.4  
0.2  
0.0  
0.2  
0.4  
0.6  
0.8  
0.8  
0.6  
0.1  
1
2
E
ꢀ Radiant Intensity (mW/cm )  
e
Figure 3. Dark Current vs. Collector - Emitter Voltage  
Figure 4. Light Current vs. Collector - Emitter Voltage  
101  
100  
101  
100  
10ꢀ1  
10ꢀ2  
2
I
= 1mW/cm  
e
2
I
I
= 0.5mW/cm  
e
2
= 0.2mW/cm  
= 0.1mW/cm  
e
e
10ꢀ1  
10ꢀ2  
10ꢀ3  
2
I
Normalized to:  
= 5V  
V
CE  
2
I
e
= 0.5mW/cm  
T
A
= 25°C  
0.1  
1
10  
0
5
10  
15  
20  
25  
30  
VCE ꢀ CollectorꢀEmitter Voltage (V)  
VCE ꢀ CollectorꢀEmitter Voltage (V)  
Figure 5. Dark Current vs. Ambient Temperature  
Normalized to:  
104  
103  
102  
101  
V
= 25V  
CE  
V
= 25V  
CE  
T
= 25°C  
A
= 10V  
V
CE  
100  
10ꢀ1  
25  
50  
75  
100  
°C  
)
TA ꢀ Ambient Temperatꢁre (  
© 2002 Fairchild Semicondꢁctor Corporation  
Page 3 of 4  
5/1/02  
PLASTIC SILICON  
INFRARED PHOTOTRANSISTOR  
QSE113 QSE114  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As ꢁsed herein:  
1. Life sꢁpport devices or systems are devices or systems  
which, (a) are intended for sꢁrgical implant into the body, or  
(b) sꢁpport or sꢁstain life, and (c) whose failꢁre to perform  
when properly ꢁsed in accordance with instrꢁctions for ꢁse  
provided in the labeling, can be reasonably expected to  
resꢁlt in a significant injꢁry of the ꢁser.  
2. A critical component in any component of a life sꢁpport  
device or system whose failꢁre to perform can be  
reasonably expected to caꢁse the failꢁre of the life sꢁpport  
device or system, or to affect its safety or effectiveness.  
© 2002 Fairchild Semicondꢁctor Corporation  
Page 4 of 4  
5/1/02  

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