NC7SZ384M5_NL [FAIRCHILD]

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NC7SZ384M5_NL
型号: NC7SZ384M5_NL
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
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总线驱动器 总线收发器 开关 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:109K)
中文:  中文翻译
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November 1996  
Revised May 2003  
NC7SZ384  
TinyLogic UHS 1-Bit Low Power Bus Switch  
General Description  
Features  
The NC7SZ384 provides 1-bit of ultra high-speed CMOS  
TTL-compatible bus switch. The low On Resistance of the  
switch allows inputs to be connected to outputs with mini-  
mal propagation delay and without generating additional  
ground bounce noise. The device is organized as a 1-bit  
switch with a bus enable (OE) signal. When OE is LOW,  
the switch is on and Port A is connected to Port B. When  
OE is HIGH, the switch is open and a high-impedance  
state exists between the two ports.  
Space saving SOT23 or SC70 5-lead package  
Ultra small MicroPak leadless package  
5switch connection between two ports  
Minimal propagation delay through the switch  
Low ICC  
Zero bounce in flow-through mode  
Control inputs compatible with TTL level  
Ordering Code:  
Order  
Package  
Number  
MA05B  
Product Code  
Top Mark  
8Z84  
Package Description  
Supplied As  
3k Units on Tape and Reel  
Number  
NC7SZ384M5X  
NC7SZ384P5X  
NC7SZ384L6X  
5-Lead SOT23, JEDEC MO-178, 1.6mm  
MAA05A  
MAC06A  
Z84  
5-Lead SC70, EIAJ SC-88a, 1.25mm Wide 3k Units on Tape and Reel  
6-Lead MicroPak, 1.0mm Wide 5k Units on Tape and Reel  
C3  
Logic Diagram  
Connection Diagrams  
Pin Assignments for SOT23 and SC70  
Pin Description  
Pin Name  
Description  
OE  
A
Bus Switch Enable  
Bus A  
(Top View)  
Pad Assignments for MicroPak  
B
Bus B  
NC  
No Connect  
Truth Table  
BO  
AO  
HIGH-Z State  
OE  
L
Function  
Connect  
H
Disconnect  
(Top Thru View)  
TinyLogic is a registered trademark of Fairchild Semiconductor Corporation.  
MicroPak is a trademark of Fairchild Semiconductor Corporation.  
© 2003 Fairchild Semiconductor Corporation  
DS012178  
www.fairchildsemi.com  
Absolute Maximum Ratings(Note 1)  
Recommended Operating  
Conditions (Note 3)  
Supply Voltage (VCC  
)
0.5V to +7.0V  
0.5V to +7.0V  
0.5V to +7.0V  
DC Switch Voltage (VS)  
DC Input Voltage (VIN) (Note 2)  
DC Input Diode Current  
(IIK) VIN < 0V  
Power Supply Operating (VCC  
Input Voltage (VIN  
Output Voltage (VOUT  
)
4.0V to 5.5V  
0V to 5.5V  
0V to 5.5V  
)
)
50 mA  
Input Rise and Fall Time (tr, tf)  
Switch Control Input  
Switch I/O  
DC Output (IOUT) Sink Current  
DC VCC/GND Current  
128 mA  
0 ns/V to 5 ns  
0 ns/V to DC  
(ICC/IGND  
Storage Temperature Range  
(TSTG  
)
±100 mA  
65°C to +150°C  
+150°C  
Operating Temperature (TA)  
40°C to +85°C  
Thermal Resistance (θJA  
SOT23-5  
)
)
300°C/W  
425°C/W  
Junction Temperature  
under Bias (TJ)  
SC70-5  
Note 1: The “Absolute Maximum Ratings” are those values beyond which  
the safety of the device cannot be guaranteed. The device should not be  
operated at these limits. The parametric values defined in the Electrical  
Characteristics tables are not guaranteed at the absolute maximum ratings.  
The “Recommended Operating Conditions” table will define the conditions  
for actual device operation.  
Junction Lead Temperature (TL)  
(Soldering, 10 Seconds)  
Power Dissipation (PD) @ +85°C  
SOT23-5  
+260°C  
Note 2: The input and output negative voltage ratings may be exceeded if  
the input and output diode current ratings are observed.  
200 mW  
150 mW  
SC70-5  
Note 3: Unused inputs must be held HIGH or LOW. They may not float.  
DC Electrical Characteristics  
VCC  
TA = −40°C to +85°C  
Symbol  
Parameter  
Units  
Conditions  
IIN = −18 mA  
(V)  
4.5  
Min  
Typ  
Max  
VIK  
Clamp Diode Voltage  
HIGH Level Input Voltage  
LOW Level Input Voltage  
Input Leakage Current  
OFFLeakage Current  
Switch On Resistance  
(Note 4)  
1.2  
V  
V
VIH  
VIL  
4.55.5  
4.55.5  
5.5  
2.0  
0.8  
±1.0  
±10.0  
7
V
IIN  
µA  
µA  
0 VIN 5.5V  
0 A, B VCC  
IOFF  
RON  
5.5  
4.5  
3
3
VIN = 0V, IIN = 64 mA  
VIN = 0V, IIN = 30 mA  
VIN = 2.4V, IIN = 15 mA  
VIN = 2.4V, IIN = 15 mA  
VIN = VCC or GND  
4.5  
7
4.5  
6
15  
4.0  
10  
20  
ICC  
Quiescent Supply Current  
5.5  
10  
µA  
I
O= 0  
ICC  
Increase in ICC per Input (Note 5)  
5.5  
0.9  
2.5  
mA  
VIN = 3.4V, IO = 0, Control Input only  
Note 4: Measured by the voltage drop between A and B pins at the indicated current through the switch. On Resistance is determined by the lower of the  
voltages on the two (A or B) pins.  
Note 5: Per TTL driven input (VIN = 3.4V, control input only). A and B pins do not contribute to ICC  
.
www.fairchildsemi.com  
2
AC Electrical Characteristics  
TA = −40°C to +85°C,  
VCC  
(V)  
CL = 50 pF, RU = RD = 500Ω  
Symbol  
Parameter  
Units  
Conditions  
Figure  
Min  
Typ  
Max  
Number  
(Note 6)  
tPHL  
tPLH  
tPZL  
tPZH  
tPLZ  
tPHZ  
,
Propagation Delay Bus to Bus  
(Note 7)  
4.05.5  
0.25  
ns  
VI = OPEN  
Figures  
1, 2  
,
Output Enable Time  
4.55.5  
4.0  
1.0  
1.0  
1.0  
1.0  
2.5  
2.5  
5.0  
5.5  
5.0  
5.5  
ns  
ns  
ns  
ns  
VI = 7V for tPZL  
Figures  
1, 2  
VI = OPEN for tPZH  
VI = 7V for tPLZ  
,
Output Disable Time  
4.55.5  
4.0  
Figures  
1, 2  
VI = OPEN for tPHZ  
Capacitance (Note 8)  
Symbol  
Parameter  
Control Pin Input Capacitance  
Input/Output Capacitance  
Typ  
Max  
Units  
Conditions  
CIN  
2
6
pF  
V
CC = 5.0V  
CI/O  
4.5  
10  
pF  
VCC, BE = 5.0V  
Note 6: All typical values are VCC = 5.0V, TA = 25°C.  
Note 7: This parameter is guaranteed by design but is not tested. The bus switch contributes no propagation delay other than the RC delay of the typical On  
Resistance of the switch and the 50 pF load capacitance, when driven by an ideal voltage source (zero output impedance).  
Note 8: TA = 25°C, f = 1 MHz.  
AC Loading and Waveforms  
Input driven by 50source terminated in 50Ω  
CL includes load and stray capacitance  
Input PRR = 1.0 MHz; tW = 500 ns  
FIGURE 1. AC Test Circuit  
FIGURE 2. AC Waveforms  
3
www.fairchildsemi.com  
Tape and Reel Specification  
TAPE FORMAT for SOT23 and SC70  
Package  
Tape  
Number  
Cavities  
125 (typ)  
3000  
Cavity  
Status  
Empty  
Filled  
Cover Tape  
Status  
Designator  
Section  
Leader (Start End)  
Carrier  
Sealed  
M5X, P5X  
Sealed  
Trailer (Hub End)  
75 (typ)  
Empty  
Sealed  
TAPE DIMENSIONS inches (millimeters)  
Tape Size  
DIM A  
DIM B  
DIM F  
DIM Ko  
DIM P1  
DIM W  
Package  
0.093  
(2.35)  
0.130  
(3.3)  
0.096  
(2.45)  
0.130  
(3.3)  
0.138 ± 0.004 0.053 ± 0.004  
(3.5 ± 0.10) (1.35 ± 0.10)  
0.138 ± 0.002 0.055 ± 0.004  
(3.5 ± 0.05) (1.4 ± 0.11)  
0.157  
(4)  
0.315 ± 0.004  
(8 ± 0.1)  
SC70-5  
8 mm  
0.157  
(4)  
0.315 ± 0.012  
(8 ± 0.3)  
SOT23-5  
8 mm  
www.fairchildsemi.com  
4
Tape and Reel Specification (Continued)  
TAPE FORMAT for MicroPak  
Package  
Tape  
Section  
Number  
Cavities  
125 (typ)  
5000  
Cavity  
Status  
Empty  
Filled  
Cover Tape  
Status  
Designator  
Leader (Start End)  
Carrier  
Sealed  
L6X  
Sealed  
Trailer (Hub End)  
75 (typ)  
Empty  
Sealed  
REEL DIMENSIONS inches (millimeters)  
Tape  
Size  
A
B
C
D
N
W1  
W2  
W3  
7.0  
0.059  
0.512  
0.795  
2.165 0.331 + 0.059/0.000  
0.567  
W1 + 0.078/0.039  
(W1 + 2.00/1.00)  
8 mm  
(177.8) (1.50) (13.00) (20.20) (55.00) (8.40 + 1.50/0.00)  
(14.40)  
5
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted  
5-Lead SOT23, JEDEC MO-178, 1.6mm  
Package Number MA05B  
www.fairchildsemi.com  
6
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
5-Lead SC70, EIAJ SC-88a, 1.25mm Wide  
Package Number MAA05A  
7
www.fairchildsemi.com  
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)  
6-Lead MicroPak, 1.0mm Wide  
Package Number MAC06A  
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and  
Fairchild reserves the right at any time without notice to change said circuitry and specifications.  
LIFE SUPPORT POLICY  
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the  
body, or (b) support or sustain life, and (c) whose failure  
to perform when properly used in accordance with  
instructions for use provided in the labeling, can be rea-  
sonably expected to result in a significant injury to the  
user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be rea-  
sonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
www.fairchildsemi.com  
www.fairchildsemi.com  
8

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