MOC3042M [FAIRCHILD]
6-PIN DIP ZERO-CROSS OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK); 6引脚DIP零交叉光隔离器可控硅驱动器输出（ 250/400伏PEAK ）
| 型号： | MOC3042M |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | 6-PIN DIP ZERO-CROSS OPTOISOLATORS TRIAC DRIVER OUTPUT (250/400 VOLT PEAK) |
| 文件： | 总11页 (文件大小：520K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 2005
MOC3031M, MOC3032M, MOC3033M, MOC3041M,
MOC3042M, MOC3043M
6-Pin DIP Zero-Cross Optoisolators Triac Driver Output
(250/400 Volt Peak)
Features
Description
■ Simplifies logic control of 115 VAC power
The MOC303XM and MOC304XM devices consist of a AlGaAs
infrared emitting diode optically coupled to a monolithic silicon
detector performing the function of a zero voltage crossing bilat-
eral triac driver.
■ Zero voltage crossing
■ dv/dt of 2000 V/µs typical, 1000 V/µs guaranteed
■ VDE recognized (File # 94766), ordering option V
They are designed for use with a triac in the interface of logic
systems to equipment powered from 115 VAC lines, such as
teletypewriters, CRTs, solid-state relays, industrial controls,
printers, motors, solenoids and consumer appliances, etc.
(e.g., MOC3043VM)
Applications
■ Solenoid/valve controls
■ Static power switches
■ Temperature controls
■ AC motor starters
■
■
■
■
Lighting controls
AC motor drives
E.M. contactors
Solid state relays
Schematic
6
ANODE
1
6
MAIN TERM.
6
1
CATHODE
N/C
2
3
5
4
NC*
1
ZERO
MAIN TERM.
CROSSING
CIRCUIT
6
*DO NOT CONNECT
(TRIAC SUBSTRATE)
1
©2005 Fairchild Semiconductor Corporation
1
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Absolute Maximum Ratings (T = 25°C unless otherwise noted)
A
Parameters
Symbol
Device
Value
Units
TOTAL DEVICE
Storage Temperature
T
All
All
All
All
All
-40 to +150
-40 to +85
260 for 10 sec
-40 to +100
7500
°C
°C
STG
Operating Temperature
T
OPR
Lead Solder Temperature
T
°C
SOL
Junction Temperature Range
T
°C
J
(1)
Isolation Surge Voltage
V
Vac(pk)
ISO
(peak AC voltage, 60Hz, 1 sec duration)
Total Device Power Dissipation @ 25°C
Derate above 25°C
P
All
250
mW
D
2.94
mW/°C
EMITTER
Continuous Forward Current
Reverse Voltage
I
All
All
All
60
6
mA
V
F
V
P
R
D
Total Power Dissipation 25°C Ambient
Derate above 25°C
120
1.41
mW
mW/°C
DETECTOR
Off-State Output Terminal Voltage
V
MOC3031M/2M/3M
250
400
1
V
DRM
MOC3041M/2M/3M
Peak Repetitive Surge Current (PW = 100 µs, 120 pps)
Total Power Dissipation @ 25°C Ambient
Derate above 25°C
I
All
All
All
A
TSM
P
150
1.76
mW
D
mW/°C
Note
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are
common.
Electrical Characteristics (T = 25°C Unless otherwise specified)
A
Individual Component Characteristics
Parameters
Test Conditions
Symbol Device Min Typ Max Units
EMITTER
Input Forward Voltage
I = 30 mA
V
All
All
1.25
0.01
1.5
V
F
F
Reverse Leakage Current
V
= 6 V
I
100
µA
R
R
DETECTOR
Peak Blocking Current, Either Direction
Peak On-State Voltage, Either Direction
Critical Rate of Rise of Off-State Voltage
Rated V
, I = 0 (note 1)
I
DRM1
All
All
All
100
3
nA
V
DRM
F
I
= 100 mA peak, I = 0
V
TM
1.8
TM
F
I
= 0 (Figure 9, note 3)
dv/dt
1000
V/µs
F
Transfer Characteristics (T = 25°C Unless otherwise specified.)
A
DC Characteristics
Test Conditions
Symbol
Device
Min Typ Max Units
LED Trigger Current
Main terminal voltage = 3V
(note 2)
I
MOC3031M/
MOC3041M
15
10
5
mA
µA
FT
MOC3032M/
MOC3042M
MOC3033M/
MOC3043M
Holding Current, Either Direction
I
All
400
H
2
www.fairchildsemi.com
MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Zero Crossing Characteristics (T = 25°C Unless otherwise specified.)
A
Characteristics
Test Conditions
Symbol Device Min Typ Max Units
Inhibit Voltage
I = rated I , MT1-MT2 voltage
V
IH
All
20
V
F
FT
above which device will not trigger
off-state
Leakage in Inhibited State I = rated I , rated V
, off-state
I
DRM2
All
500
µA
F
F
DRM
Note
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max IFT
(15 mA for MOC3031M & MOC3041M, 10 mA for MOC3032M & MOC3042M, 5 mA for MOC3033M & MOC3043M) and absolute max IF (60 mA).
3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.
3
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Figure 1. LED Forward Voltage vs. Forward Current
Figure 2. On-State Characteristics
800
600
400
200
0
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
I
= 30mA
F
T
= 25°C
A
TA = -40°C
TA = 25°C
TA = 85°C
-200
-400
-600
-800
-4
-3
-
2
-
1
0
1
2
3
4
0.1
1
10
100
I
F
- LED FORWARD CURRENT (mA)
V
, ON-STATE VOLTAGE (VOLTS)
TM
Figure 3. Trigger Current vs. Temperature
Figure 4. Leakage Current, IDRM vs. Temperature
1.3
1.2
1.1
1.0
0.9
0.8
10000
1000
100
10
1
NORMALIZED TO
A = 25oC
T
0.1
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE ( oC)
A
T , AMBIENT TEMPERATURE (°C)
A
4
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Figure 6. LED Current Required to Trigger vs. LED Pulse Width
Figure 5. IDRM2 - Leakage in Inhibit State vs. Temperature
1.8
16
NORMALIZED TO
PW >> 100 µs
IN
1.6
1.4
1.2
1.0
0.8
0.6
0.4
14
12
10
8
I
= RATED I
FT
F
6
4
2
-40
-20
0
20
40
60
80
100
0
T , AMBIENT TEMPERATURE (°C)
A
1
10
100
PW , LED TRIGGER PULSE WIDTH (µS)
IN
Figure 7. Holding Current, IH vs. Temperature
Figure 8. Inhibit Voltage vs. Temperature
3.2
2.8
2.4
2.0
1.6
1.2
0.8
0.4
0.0
1.3
1.2
1.1
1.0
0.9
0.8
0.7
NORMALIZED TO
T
= 25° C
A
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
T , AMBIENT TEMPERATURE (°C)
A
T , AMBIENT TEMPERATURE (°C)
A
5
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
1. The mercury wetted relay provides a high speed repeated pulse
to the D.U.T.
+250 for MOC303XM
+400 for MOC304XM
Vdc
RTEST
R = 10 kΩ
2. 100x scope probes are used, to allow high speeds and voltages.
CTEST
3. The worst-case condition for static dv/dt is established by trigger-
ing the D.U.T. with a normal LED input current, then removing the
PULSE
INPUT
MERCURY
X100
SCOPE
PROBE
WETTED
RELAY
current. The variable R
allows the dv/dt to be gradually
TEST
D.U.T.
increased until the D.U.T. continues to trigger in response to the
applied voltage pulse, even after the LED current has been
removed. The dv/dt is then decreased until the D.U.T. stops trig-
gering. τRC is measured at this point and recorded.
Figure 9. Static dv/dt Test Circuit
V
= 400 V
max
V
= 250 V
max
APPLIED VOLTAGE
WAVEFORM
APPLIED VOLTAGE
WAVEFORM
252 V
158 V
0.63 V
τRC
252
τRC
max
0.63 V
τRC
158
RC
max
dv/dt =
=
dv/dt =
=
0 VOLTS
0 VOLTS
τRC
τRC
Figure 11. Static dv/dt Test Waveform
(MOC3041M, MOC3042M, MOC3043M)
Figure 10. Static dv/dt Test Waveform
(MOC3031M, MOC3032M, MOC3033M)
Typical circuit (Fig 12, 13) for use when hot line switching is required. In this circuit the “hot” side of the line is switched and the load
connected to the cold or neutral side. The load may be connected to either the neutral or hot line.
R
is calculated so that I is equal to the rated I of the part, 5 mA for the MOC3033M and MOC3043M, 10 mA for the MOC3032M
F FT
in
and MOC3042M, or 15 mA for the MOC3031M and MOC3041M. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the
triac and may or may not be necessary depending upon the particular triac and load used.
Rin
Rin
360Ω
180Ω
1
2
6
5
1
2
6
5
HOT
VCC
HOT
VCC
MOC3041M
MOC3042M
MOC3043M
MOC3031M
MOC3032M
MOC3033M
39Ω
39Ω
*
*
3
4
3
4
240 VAC
115 VAC
0.01
0.01
330
1 k
LOAD
NEUTRAL
LOAD
NEUTRAL
For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
For highly inductive loads (power factor < 0.5), change this value to 360 ohms.
*
*
Figure 13. Hot-Line Switching Application Circuit
(MOC3041M, MOC3042M, MOC3043M)
Figure 12. Hot-Line Switching Application Circuit
(MOC3031M, MOC3032M, MOC3033M)
6
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
115 VAC
R1
D1
1
2
6
5
VCC
Rin
MOC3031M
MOC3032M
MOC3033M
SCR
SCR
180
3
4
R2
D2
LOAD
Figure 14. Inverse-Parallel SCR Driver Circuit
(MOC3031M, MOC3032M, MOC3033M)
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are
optional 1 k ohm.
240 VAC
R1
D1
1
2
6
5
VCC
Rin
MOC3041M
MOC3042M
MOC3043M
SCR
SCR
360
3
4
R2
D2
LOAD
Figure 15. Inverse-Parallel SCR Driver Circuit
(MOC3041M, MOC3042M, MOC3043M)
Suggested method of firing two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are
optional 330 ohm.
Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.
7
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Package Dimensions (Through Hole)
Package Dimensions (Surface Mount)
0.350 (8.89)
0.320 (8.13)
0.350 (8.89)
0.320 (8.13)
Pin 1 ID
Pin 1 ID
0.390 (9.90)
0.332 (8.43)
0.260 (6.60)
0.240 (6.10)
0.260 (6.60)
0.240 (6.10)
0.070 (1.77)
0.040 (1.02)
0.070 (1.77)
0.040 (1.02)
0.320 (8.13)
0.320 (8.13)
0.014 (0.36)
0.010 (0.25)
0.014 (0.36)
0.010 (0.25)
0.200 (5.08)
0.115 (2.93)
0.200 (5.08)
0.115 (2.93)
0.012 (0.30)
0.008 (0.20)
0.100 (2.54)
0.015 (0.38)
0.025 (0.63)
0.020 (0.51)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
15°
0.035 (0.88)
0.012 (0.30)
0.020 (0.50)
0.016 (0.41)
0.100 (2.54)
0.012 (0.30)
Package Dimensions (0.4” Lead Spacing)
Recommended Pad Layout for
Surface Mount Leadform
0.350 (8.89)
0.320 (8.13)
PIN 1 ID
0.070 (1.78)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.070 (1.77)
0.040 (1.02)
0.014 (0.36)
0.425 (10.79)
0.100 (2.54)
0.305 (7.75)
0.010 (0.25)
0.030 (0.76)
0.200 (5.08)
0.115 (2.93)
0.100 (2.54)
0.015 (0.38)
0.012 (0.30)
0.100 [2.54]
0.020 (0.50)
0.016 (0.41)
0.008 (0.21)
0.425 (10.80)
0.400 (10.16)
NOTE
All dimensions are in inches (millimeters)
8
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Ordering Information
Option
Order Entry Identifier
Description
S
SR2
T
S
SR2
T
Surface Mount Lead Bend
Surface Mount; Tape and reel
0.4" Lead Spacing
V
V
VDE 0884
TV
TV
VDE 0884, 0.4" Lead Spacing
VDE 0884, Surface Mount
VDE 0884, Surface Mount, Tape & Reel
SV
SR2V
SV
SR2V
Carrier Tape Specifications (White Package, -M Suffix)
12.0 0.1
4.5 0.20
2.0 0.05
Ø1.5 MIN
1.75 0.10
0.30 0.05
4.0 0.1
11.5 1.0
24.0 0.3
9.1 0.20
21.0 0.1
Ø1.5 0.1/-0
10.1 0.20
0.1 MAX
User Direction of Feed
NOTE
All dimensions are in inches (millimeters)
9
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
Marking Information
1
2
6
MOC3031V
XX YY Q
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4
5
6
One digit year code, e.g., ‘3’
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
*Note – Parts that do not have the ‘V’ option (see definition 3 above) that are marked with
date code ‘325’ or earlier are marked in portrait format.
Reflow Profile (White Package, -M Suffix)
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
10
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MOC3031M, MOC3032M, MOC3033M, MOC3041M, MOC3042M, MOC3043M Rev. 1.0.1
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
®
ACEx™
PowerSaver™
SuperSOT™-8
SyncFET™
TinyLogic
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
FAST
®
ActiveArray™
Bottomless™
Build it Now™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E2CMOS™
EnSigna™
FACT™
PowerTrench
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
®
®
QFET
QS™
TINYOPTO™
TruTranslation™
UHC™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
μSerDes™
SILENT SWITCHER
SMART START™
SPM™
®
UltraFET
HiSeC™
I2C™
UniFET™
VCX™
Wire™
MSXPro™
OCX™
i-Lo™
ImpliedDisconnect™
IntelliMAX™
®
OCXPro™
OPTOLOGIC
®
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerEdge™
FACT Quiet Series™
Stealth™
Across the board. Around the world.™
SuperFET™
SuperSOT™-3
SuperSOT™-6
®
The Power Franchise
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVESTHE RIGHTTO MAKE CHANGES WITHOUTFURTHER NOTICETOANY
PRODUCTS HEREINTO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOTASSUMEANYLIABILITY
ARISING OUTOFTHEAPPLICATION OR USE OFANYPRODUCTOR CIRCUITDESCRIBED HEREIN; NEITHER DOES IT
CONVEYANYLICENSE UNDER ITS PATENTRIGHTS, NORTHE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I16
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