FSUSB31K8X [FAIRCHILD]
Low-Power 1-Port Hi-Speed USB 2.0 (480Mbps) Switch; 低功耗单端口高速USB 2.0 （ 480Mbps的）开关
| 型号： | FSUSB31K8X |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | Low-Power 1-Port Hi-Speed USB 2.0 (480Mbps) Switch |
| 文件： | 总15页 (文件大小：727K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
January 2007
FSUSB31
Low-Power 1-Port Hi-Speed USB 2.0 (480Mbps) Switch
Features
Description
■ Low On capacitance, 3.7pF (typical)
■ Low On resistance, 6.5Ω (typical)
■ Low power consumption (1µA maximum)
The FSUSB31 is a low-power, single-port, high-speed
USB 2.0 switch. This part is configured as a single pole,
single-throw switch and is optimized for switching or iso-
lating a high-speed (480Mbps) source or a high-speed
and full-speed (12Mbps) source. The FSUSB31 is com-
patible with the requirements of USB2.0 and features an
extremely low on capacitance (CON) of 3.7pF. The wide
bandwidth of this device (>720MHz) exceeds the band-
width needed to pass the third harmonic, resulting in sig-
nals with minimum edge and phase distortion. Superior
channel-to-channel crosstalk minimizes interference.
– 10µA maximum ICCT over and expanded control
voltage range (VIN =2.6V, VCC =4.3V)
■ Wide -3dB bandwidth, > 720MHz
■ 8K I/O to GND ESD protection
■ Power OFF protection when VCC = 0V, D+/D- pins
can tolerate up to 4.3V
■ Packaged in:
– Pb-Free 8-lead MicroPak™ (1.6 x 1.6mm)
– Pb-Free 8-lead US8
The FSUSB31 contains special circuitry on the D+ / D-
pins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize cur-
rent consumption even when the control voltage applied
to the OE pin is lower than the supply voltage (VCC). This
feature is especially valuable for ultra-portable applica-
tions such as cell phones, allowing for direct interface
with the general purpose I/Os of the baseband proces-
sor. Other applications include port isolation and switch-
ing in portable cell phones, PDAs, digital cameras,
printers, and notebook computers.
Applications
■ Cell phone, PDA, Digital Camera, and Notebook
■ LCD Monitor, TV, and Set-Top Box
Related Application Notes
■ AN-6022 Using the FSUSB30/31 to Comply with
USB 2.0 Fault Condition Requirements
Ordering Information
Part Number
FSUSB31K8X
FSUSB31L8X
Package
MAB08A
MAC08A
Pb-Free
Yes
Package Description
8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
8-Lead MicroPak, 1.6mm Wide
Yes
Pb-Free package per JEDEC J-STD-020B.
Application Diagram
FSUSB31
V
CC
D+
D–
USB
Connector
Base Band
Processor
or FS USB
Controller
OE
HS USB
Controller
Figure 1. Typical Application Diagram
MicroPak™ is a trademark of Fairchild Semiconductor Corporation.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
Connection Diagrams
Analog Symbol
HSD+
D+
D–
7
6
2
5
HSD–
VCC
8
4
3
GND
1
Control
OE
Figure 4. Analog Symbol
Figure 2. Pin Assignments for MicroPak
1
8
NC
HSD–
D–
VCC
2
3
4
7
6
5
OE
HSD+
D+
GND
Figure 3. Pin Assignments for US8
Pin Descriptions
Pin Name
Description
Bus Switch Enable
Data Ports
OE
D+, D−, HSD+, HSD−
NC
No Connect
Truth Table
Function
OE
HIGH
LOW
Disconnect
D+, D− = HSD
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
2
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera-
ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi-
tion, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only.
Symbol
Parameter
Minimum
-0.5V
-0.5V
-0.5V
-0.5
Maximum
Unit
V
V
Supply Voltage
4.6
4.6
CC
(1)
V
DC Input Voltage
V
S
IN
IK
HSD
V
+0.3
V
CC
(1)
V
DC Switch Voltage
D+, D−
+4.6
V
I
DC Input Diode Current
DC Output Current
-50
mA
mA
°C
kV
kV
I
50
+150
7.5
8
OUT
T
Storage Temperature
-65
STG
All Pins
ESD
Human Body Model
I/O to GND
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Minimum
Maximum
Unit
V
V
Supply Voltage
3.0
0V
0V
-40
4.3
CC
(2)
V
Control Input Voltage
Switch Input Voltage
V
V
V
IN
CC
CC
V
T
Operating Temperature
+85
°C
A
Notes:
1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed. DC switch voltage may never exceed 4.6V.
2. Control input must be held HIGH or LOW and it must not float.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
3
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
T = −40°C to +85°C
A
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min.
Typ. Max.
V
Clamp Diode Voltage
Input Voltage HIGH
I
= −18mA
IN
3.0
-1.2
V
V
IK
3.0 to 3.6
4.3
1.3
1.7
V
IH
3.0 to 3.6
4.3
0.5
0.7
1.0
2.0
V
V
I
Input Voltage LOW
IL
Control Input Leakage
OFF State Leakage
V
= 0V to V
CC
4.3
-1.0
-2.0
μA
μA
IN
IN
I
0 ≤ HSD ≤ V
4.3
OZ
CC
Power OFF Leakage
Current (D+, D–)
V
V
= 0.0V to 4.3V,
IN
I
0
-2.0
2.0
μA
OFF
= 0V
CC
(3)
R
Switch On Resistance
V
V
= 0.4V, I = −8mA
3.0
3.0
6.5
10.0
Ω
Ω
ON
IN
IN
IN
ON
(4)
ΔR
Delta R
= 0.4V, I = −8mA
0.35
ON
ON
ON
V
I
= 0.0V −1.0V,
= −8mA
(3)
R
Flatness R Flatness
3.0
4.3
2.0
Ω
ON
ON
ON
V
= 0.0V or V
,
CC
IN
I
Quiescent Supply Current
1.0
μA
CC
I
= 0
OUT
Increase in I Current
CC
I
per Control Voltage and
V
= 2.6V, V = 4.3V
4.3
10.0
μA
CCT
IN
CC
V
Levels
CC
Notes:
3. Measured by the voltage drop between Dn, HSD, and Dn pins at the indicated current through the switch.
On resistance is determined by the lower of the voltage on the two ports.
4. Guaranteed by characterization.
AC Electrical Characteristics
All typical values are for VCC = 3.3V are at 25°C unless otherwise specified.
T = −40°C to +85°C
A
Figure
Number
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min. Typ. Max.
Turn-On Time,
OE to Output
V
= 0.8V, R = 50Ω,
IN
L
t
3.0 to 3.6
3.0 to 3.6
3.3
15.0
12.0
0.25
30.0
25.0
ns
ns
ns
ns
dB
dB
Figure 12
Figure 12
ON
C = 5pF
L
Turn-Off Time,
OE to Output
V
= 0.8V, R = 50Ω,
IN L
t
OFF
C = 5pF
L
Figure 10
Figure 11
(4)
t
Propagation Delay
R = 50Ω, C = 5pF
L L
PD
R = 50Ω, C = 5pF,
V
L
L
t
Break-Before-Make
3.0 to 3.6
3.0 to 3.6
3.0 to 3.6
2.0
6.5
Figure 13
Figure 16
Figure 17
BBM
= 0.8V
IN
Off Isolation
(Non-Adjacent)
O
R = 50Ω, f = 240MHz
-35.0
-55.0
IRR
T
Non-Adjacent Channel
Crosstalk
Xtalk
BW
R = 50Ω, f = 240MHz
T
R = 50Ω, C = 0pF
720
550
T
L
-3dB Bandwidth
3.0 to 3.6
MHz Figure 15
R = 50Ω, C = 5pF
T
L
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
4
USB Hi-Speed Related AC Electrical Characteristics
T = −40°C to
A
Figure
Number
+85°C
V
(V)
Symbol
Parameter
Conditions
Unit
CC
Min. Typ. Max.
Channel-to-Chan-
nel Skew
Figure 10
Figure 14
t
C = 5pF
3.0 to 3.6
3.0 to 3.6
50.0
ps
ps
(5)
SK(O)
L
Skew of Opposite
Transitions of the
Figure 10
Figure 14
t
C = 5pF
20.0
SK(P)
L
(5)
Same Output
R = 50Ω, C = 5pF,
L
L
(5)
t
Total Jitter
t = t = 500ps at 480 Mbps 3.0 to 3.6
200
ps
J
R
F
15
(PRBS = 2 − 1)
Note:
5. Guaranteed by design.
Capacitance
T = −40°C to +85°C
A
Figure
Number
Symbol
Parameter
Conditions
Unit
Min.
Typ.
1.0
Max.
C
Control Pin Input Capacitance
D1 , D2 , Dn On Capacitance
V
V
V
= 0V
pF
pF
pF
Figure 19
Figure 18
Figure 19
IN
CC
CC
CC
C
= 3.3, OE = 0V
and OE = 3.3
3.7
ON
n
n
C
D1 , D2 Off Capacitance
1.7
OFF
n
n
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
5
Typical Characteristics
0
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
VCC = 3.3V
-1
CL = 0pF
VCC = 3.3V
-2
-3
-4
-5
-6
-7
-8
1
10
100
1000
10000
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
Figure 5. Gain vs. Frequency
Figure 6. Off Isolation
0
-10
-20
VCC = 3.3V
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
1
10
100
1000
Frequency (MHz)
Figure 7. Crosstalk
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
6
Test Diagrams
VON
FSUSB31
FSUSB31
IDn(OFF)
NC
HSD
VIN
Dn
A
VIN
ION
OE
VS = 0 or VCC
OE
VS = 0 to VCC
GND
GND
GND
RON = VON / ION
Each switch port is tested separately.
Figure 8. On Resistance
Figure 9. Off Leakage
FSUSB31
tFALL = 500ps
tRISE = 500ps
800mV
HSD
D+, D–
VIN
90%
50%
90%
50%
VOUT
CL*
RL
Input: HSD+,
HSD–
400mV
RS
GND
10%
10%
GND
VOE
GND
VOH
Output: D+, D–
50%
50%
RL, RS, and CL are functions of the application environment
(see AC Electrical tables for specific values).
VOL
tPLH
tPHL
*CL includes test fixture and stray capacitance.
Figure 10. AC Test Circuit Load
Figure 11. Switch Propagation Delay Waveforms
(tPD
)
tFALL = 2.5ns
tRISE = 2.5ns
VCC
90%
/2
90%
Input – OE
V
V
/2
CC
CC
10%
10%
GND
VOH
90%
90%
Output – VOUT
VOL
tON
tOFF
Figure 12. Turn On / Turn Off Waveform (tON / tOFF
)
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
7
Test Diagrams (Continued)
VCC
VCC
HSDn
VO
VOUT
CL*
VCC
0V
D+, D–
Control
Input
HSDn
50%
RL
tR = tF = 2.5ns (10–90%)
S
VOUT
Control
Input
GND
0.9 x VOUT
tD
*CL includes test fixture and stray capacitance.
Figure 13. Break-Before-Make (tBBM
)
tFALL = 500ps
tRISE = 500ps
800mV
90%
50%
90%
50%
Input: D+, D–
10%
10%
400mV
t
FALL = 500ps
tRISE = 500ps
800mV
VOH
Output1: HSD1+
HSD1–
90%
50%
90%
50%
50%
50%
nput: HSDn+
HSDn–
VOL
10%
10%
tPLH1
tPHL1
400mV
VOH
VOH
50%
50%
50%
50%
Output1: D2+, D2–
Output: D+, D–
VOL
VOL
tPLH
tPHL
tPLH2
tPHL2
TSK(P) = | tPHL – tPLH
Pulse Skew, TSK(P)
|
TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2
Output Skew, TSK(OUT)
|
Figure 14. Switch Skew Tests
Network Analyzer
FSUSB31
RS
VIN
VS
GND
GND
V
OE
GND
VOUT
RT
GND
RS and RT are functions of the application environment
(see AC Electrical Tables for specific values).
GND
Figure 15. Bandwidth
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
8
Test Diagrams (Continued)
Network Analyzer
FSUSB31
RS
VIN
VS
GND
GND
RT
V
OE
GND
GND
GND
VOUT
RT
GND
OFF-Isolation = 20 Log (VOUT /VIN
)
Figure 16. Channel Off Isolation
NC
Network Analyzer
FSUSB31
RS
VIN
VS
GND
V
GND
OE
GND
RT
GND
RT
VOUT
GND
R
S and RT are functions of the application environment
GND
(50, 75 or 100Ω).
Crosstalk = 20 Log (VOUT / VIN
)
Figure 17. Non-Adjacent Channel-to-Channel Crosstalk
FSUSB31
FSUSB31
Dn
Dn
Capacitance
Meter
OE
OE
Capacitance
VOE = 0 or VCC
Meter
VOE = 0 or VCC
F = 240MHz
F = 240MHz
HSDn
HSDn
Figure 18. Channel On Capacitance
Figure 19. Channel Off Capacitance
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
9
Application Guidance: Meeting USB 2.0 Vbus Short Requirements
In section 7.1.1 of the USB 2.0 specification, it notes that
USB devices must be able to withstand a Vbus short to
D+ or D- when the USB devices is either powered off or
powered on. The FSUSB31 can be successfully config-
ured to meet both these requirements.
Power-On Protection
The USB 2.0 specification also notes that the USB
device should be capable of withstanding a Vbus short
during transmission of data. Fairchild recommends add-
ing a 100Ω series resister between the switch VCC pin
and supply rail to protect against this case. This modifi-
cation works by limiting current flow back into the VCC
rail during the over-voltage event so current remains
within the safe operating range. In this application, the
switch passes the full 5.25V input signal through to the
selected output, while maintaining specified off isolation
on the un-selected pins.
Power-Off Protection
For a Vbus short circuit, the switch is expected to with-
stand such a condition for at least 24 hours. The
FSUSB31 has specially designed circuitry which pre-
vents unintended signal bleed through as well as guar-
anteed system reliability during a power-down, over-
voltage condition. The protection has been added to the
common pins (D+, D-).
VCC= 3.6 V
100 Ohms
D+ = 5.25V
HSD+
HSD-
FSUSB31
D- = 5.25V
Figure 20. A 100Ω resistor in series with the VCC supply allows the FSUSB31 to withstand a Vbus
short when powered up
For more information, see Applications Note AN-6022 Using the FSUSB30/FSUSB31 to Comply with
USB 2.0 Fault Condition Requirements at www.fairchildsemi.com
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
10
Tape and Reel Specification
Tape Format for MircoPak
Package
Designator
Tape
Section
Number
Cavities
Cavity
Status
Cover Tape
Status
Leader (Start End)
Carrier
125 (typ)
5000
Empty
Filled
Sealed
Sealed
Sealed
L8X
Trailer (Hub End)
75 (typ)
Empty
Tape Dimension
Dimensions are in millimeters unless otherwise specified.
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
11
Reel Dimension for MircoPak
Dimensions are in inches (millimeters) unless otheriwise specified.
Tape Size
A
B
C
D
N
W1
W2
W3
7.0
(177.8)
0.059
(1.50)
0.512
0.795
2.165 0.331 + 0.059/−0.000 0.567
W1 + 0.078/−0.039
(W1 + 2.00/−1.00)
(8mm)
(13.00) (20.20) (55.00)
(8.40 + 1.50/−0.00)
(14.40)
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.5
www.fairchildsemi.com
12
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 21. Pb-Free, 8-Lead US8, JEDEC MO-187, Variation CA 3.1mm Wide
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
13
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 22. Pb-Free, 8-Lead MicroPak, 1.6mm Wide
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
www.fairchildsemi.com
14
© 2006 Fairchild Semiconductor Corporation
FSUSB31 Rev. 1.0.6
15
www.fairchildsemi.com
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