FSAV433_06 [FAIRCHILD]
High-Bandwidth (550MHz) Three-Channel 3:1 Video Switch; 高带宽（ 550MHz的）三通道， 3 ： 1视频开关
| 型号： | FSAV433_06 |
| 厂家： | 
FAIRCHILD SEMICONDUCTOR |
| 描述： | High-Bandwidth (550MHz) Three-Channel 3:1 Video Switch |
| 文件： | 总13页 (文件大小：1704K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
August 2006
FSAV433
High-Bandwidth (550MHz) Three-Channel 3:1 Video
Switch
Features
Description
■ Ground between channels to optimize isolation and
reduce hostile crosstalk
The FSAV433 is an ultra-low power, high-bandwidth
video switch specially designed for switching three ana-
log video signals, including computer RGB and high-def-
inition YPbPr signals. The wide bandwidth (550MHz) of
the switch allows signal passage with minimum edge
and phase distortion, while −70dB non-adjacent channel
crosstalk generates negligible image noise between
active channels. Optimized differential gain and phases
maintain the image integrity of video applications, while
low On Resistance offers low signal insertion loss.
■ -70dB non-adjacent channel crosstalk at 30MHz
■ 6.5Ω typical On Resistance (RON
■ -3dB bandwidth: 550MHz
)
■ Low power consumption (1µA max)
Applications
■ RGB Video Switch in LCD, Plasma, and Projection
displays
The Fairchild switch family derives from and embodies
Fairchild’s proven switch technology used for years in its
74LVX3L384 (FST3384) bus switch product.
■ DVD-RW, notebook
Ordering Information
Pb-
Package
Number
Packing
Package Description
Order Number
(1)
Method
Free
20-Terminal Depopulated Quad Very-Thin Flat Pack No
FSAV433BQX
FSAV433MTC
MLP020B
MTC20
Yes
Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
Tape & Reel
Tube
20-Lead Thin Shrink Small Outline Package (TSSOP),
JEDEC MO-153, 4.4mm Wide
Yes
20-Lead Thin Shrink Small Outline Package (TSSOP),
JEDEC MO-153, 4.4mm Wide
FSAV433MTCX
MTC20
Yes
Tape & Reel
Notes:
1. Pb-Free package per JEDEC J-STD-020B.
Application Diagram
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
Analog Symbol
Pin Descriptions
Pin Name
S1, S2
A
Description
Select Input
Bus A
B1–B3
Bus B
Truth Table
S
S
2
Function
Disconnect
A = B1
1
Low
Low
High
High
Low
High
Low
High
A = B2
A = B3
Connection Diagrams
1B1
1B2
20
19
18
17
16
15
14
13
12
11
1
2
Vcc
S1
1B3
3
S2
GND
2B1
4
1A
5
GND
2A
2B2
6
2B3
7
GND
3A
GND
3B1
8
9
GND
3B3
3B2
10
Figure 1. Pin Assignments for TSSOP
(Top Through View)
Figure 2. Pad Assignments for DQFN
(Top Through View)
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
2
Absolute Maximum Ratings
The “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. The
device should not be operated at these limits. The parametric values defined in the Electrical Characteristics tables are
not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table defines the condi-
tions for actual device operation
Symbol
VCC
Min.
-0.5
Max.
+4.6
+0.05
+4.6
-50
Units
Parameter
Supply Voltage
V
VS
DC Switch Voltage
DC Input Voltage(2)
-0.5V to VCC
-0.5 to
VIN
V
lIK
DC Input Diode Current VIN < 0V
DC Output Sink Current
DC VCC/GND Current
Storage Temperature Range
Human Body Model
mA
mA
mA
°C
IOUT
100
ICC/IGND
TSTG
ESD
±100
+150
7
-65
kV
Notes:
2. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are
observed.
(3)
Recommended Operating Conditions
Symbol
VCC
Min.
2.3
Max.
3.6
Units
Parameter
Power Supply Operating
Input Voltage
V
VIN
0V
VCC
+85
TA
Free Air Operating Temperature
−40
°C
Notes:
3. Unused control inputs must be held HIGH or LOW. They may not float.
© 2005 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSAV433 Rev. 1.4.1
3
DC Electrical Characteristics
Typical values are at TA = +25°C unless otherwise specified.
T = −40 °C to +85
A
V
CC
°C
Symbol
Parameter
Conditions
Units
(V)
Min. Typ. Max.
Analog Signal Range
Clamp Diode Voltage
HIGH Level Input Voltage
0
2.0
V
V
VIK
VIH
IIN = −18 mA
3.0
2.3
-1.2
1.8
3.0 - 3.6 2.0
V
VIL
LOW Level Input Voltage
Input Leakage Current
2.3
3.0 - 3.6
3.6
0.7
0.8
V
µA
µA
Ω
II
0 ≤ VIN ≤ 3.6V
±1.0
±1.0
13.0
9.0
IOFF
RON
OFF-STATE Leakage Current 0 ≤ A, B ≤ VCC, See Figure 7
Switch On Resistance(4)
3.6
VIN = 1.0V
2.3
9.0
6.5
ION = 13 mA, See Figure 6
VIN = 2.0V
3.0
Ω
2.3
10.0 15.0
Ω
ION = 26 mA, See Figure 6
VIN = VCC or GND, IOUT = 0
One Control Input at 3.0V
Other Inputs at VCC or GND
3.0
6.5
9.0
1.0
Ω
ICC
Quiescent Supply Current
3.6
µA
µA
ICCT
Increase in ICC per Control
Input
3.6
10.0
Notes:
4. Measured by the voltage drop between A and B pins at the indicated current through the switch. On resistance is
determined by the lower of the voltages on the two (A or B) pins.
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
4
AC Electrical Characteristics
Typical values are at VCC = 3.3V and TA = +25°C unless otherwise specified.
T = −40°C to +85°C
V
A
Figure
Number
CC
Symbol
Parameter
Conditions
Units
(V)
Min. Typ. Max.
tON
Turn ON Time S-to-Bus A
3.0 to 3.6
2.3 to 2.7
3.0 to 3.6
2.3 to 2.7
5.5
7.0
Figures
9,10
VB = 2.0V
ns
tOFF
Turn OFF Time S-to-Bus A
4.0
Figures
9,10
VB = 2.0V
5.0
ns
%
°
DG
DP
Differential Gain
RL = 75Ω,f= 3.58MHz 3.0 to 3.6
RL = 75Ω,f= 3.58MHz 3.0 to 3.6
0.2
Differential Phase
0.1
OIRR
Non-Adjacent OFF-Isolation f = 30MHz, RL = 75Ω 3.0 to 3.6
−45.0
−45.0
Adjacent OFF-Isolation
2.3 to 2.7
dB Figure 12
Figures
Non-Adjacent Channel
Crosstalk
XTALK
RL = 75Ω, f= 30MHz 3.0 to 3.6
−70.0
−70.0
550
Adjacent Channel Crosstalk
-3dB Bandwidth
2.3 to 2.7
dB
13,14
BW
RL = 50Ω
RL = 75Ω
3.0 to 3.6
3.0 to 3.6
300
MHz Figure 11
Capacitance
Typical values are at VCC = 3.3V and TA = +25°C unless otherwise specified.
Figure
T = −40°C to +85°C
Symbol
Parameter
Conditions
Units
A
Number
CIN
CON
COFF
Control Pin Input Capacitance VCC = 0V
3.0
15.0
4.0
pF
pF
pF
A/B ON Capacitance
VCC = 3.0V = 0V
VCC = 3.0V
Figure 16
Figure 15
Port B OFF Capacitance
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
5
Typical Characteristics
Figure 3. Gain vs. Frequency
Figure 4. OFF Isolation
Figure 5. Crosstalk
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
6
Test Diagrams
RL and CL are functions of application environment (50,
75, or 100Ω) CL includes test fixture and stray capaci-
tance
Figure 9. Test Circuit Load
Figure 6. On Resistance
Figure 10. Turn ON / Turn OFF Waveforms
Figure 7. OFF Leakage
Figure 8. ON Leakage
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
7
Test Diagrams
RL and CL are function of application environment (50, 75, or 100W)
CL includes test fixture and stray capacitance
Figure 11. Bandwidth
RS and RT are function of application environment (50, 75, or 100W)
OFF Isolation = 20 Log (VOUT / VIN)
Figure 12. Channel OFF Isolation
Crosstalk = 20 Long (VOUT / VIN)
Figure 13. Adjacent Channel Crosstalk
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
8
Test Diagrams (Continued)
RS and RT are function of application environment (50, 75, or 100Ω)
Crosstalk = 20 Long (VOUT / VIN)
Figure 14. Non-Adjacent Channel-to-Channel Crosstalk
Figure 15. Channel OFF Capacitance
Figure 16. Channel ON Capacitance
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
9
Tape and Reel Specification
Tape Format for DQFN
Package
Tape
Section
Number
Cavities
125 (typ)
2500/3000
75 (typ)
Cavity
Status
Empty
Filled
Cover Tape
Status
Designator
Leader (Start End)
Carrier
Sealed
BQX
Sealed
Trailer (Hub End)
Empty
Sealed
Tape Dimensions
Dimensions are in millimeters unless otherwise noted.
REEL DIMENSIONS
Dimensions are in millimeters unless otherwise noted.
Tape Size
A
B
C
D
N
W1
W2
13.0
(330)
0.059
(1.50)
0.512
(13.00)
0.795
7.008
(178)
0.488
(12.4)
0.724
(18.4)
12 mm
(20.20)
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
10
Physical Dimensions
Dimensions are in millimeters unless otherwise noted.
Figure 17. 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 4.5mm
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
11
Physical Dimensions (Continued)
Dimensions are in millimeters unless otherwise noted.
Figure 18. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
12
© 2005 Fairchild Semiconductor Corporation
FSAV433 Rev. 1.4.1
www.fairchildsemi.com
13
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