FOD050LR1 [FAIRCHILD]
LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers; LVTTL / LVCMOS 3.3V高速晶体管光电耦合器型号: | FOD050LR1 |
厂家: | FAIRCHILD SEMICONDUCTOR |
描述: | LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers |
文件: | 总13页 (文件大小:650K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
October 2006
FOD050L, FOD250L: Single Channel
FOD053L: Dual Channel
LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Features
Description
■ Low power consumption
The FOD250L, FOD050L and FOD053L optocouplers
consist of an AlGaAs LED optically coupled to a high
speed photodetector transistor. These devices are speci-
fied for operation at a 3.3V supply voltage.
■ High speed
■ Available in single channel 8-pin DIP (FOD250L),
8-pin SOIC (FOD050L) or dual channel 8-pin SOIC
(FOD053L)
A separate connection for the bias of the photodiode
improves the speed by several orders of magnitude over
conventional
■ Superior CMR – CM = 50kV/µs (typical) and
H
CM = 35kV/µs (typical)
L
phototransistor optocouplers by reducing the base-col-
lector capacitance of the input transistor.
■ Guaranteed performance over temperature:
0°C to 70°C
■ U.L. recognized (File # E90700)
■ VDE pending
An internal noise shield provides superior common
mode rejection of CM = 50kV/ms (typical) and CM =
35kV/ms (typical).
H
L
Applications
■ Line receivers
■ Pulse transformer replacement
■ High speed logic ground isolation: LVTTL/LVCMOS
■ Wide bandwidth analog coupling
Schematic
8
VCC
8
+
VCC
1
N/C
1
8
1
VF1
_
V01
7
VB
+
2
2
3
4
7
6
5
VF
_
8
8
_
V02
3
6
5
1
VO
1
VF2
GND
N/C
GND
+
4
FOD053L
FOD050L, FOD250L
Truth Table
LED
On
V
O
LOW
Off
HIGH
©2002 Fairchild Semiconductor Corporation
1
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Absolute Maximum Ratings (T = 25°C Unless otherwise specified.)
A
Symbol
Parameter
Value
Units
°C
T
Storage Temperature
Operating Temperature
-40 to +125
-40 to +85
STG
T
°C
OPR
T
Lead Solder Temperature (Wave solder only)
260 for 10 sec
°C
SOL
EMITTER
I (avg)
DC/Average Forward Input Current
Each Channel
Each Channel
25
50
mA
mA
F
I (pk)
Peak Forward Input Current
(50% duty cycle, 1ms P.W.)
F
I (trans) Peak Transient Input Current
Each Channel
1.0
A
F
(≤1 µs P.W., 300pps)
V
P
Reverse Input Voltage
Each Channel
Each Channel
5
V
R
Input Power Dissipation
45
mW
D
(No derating required up to 85°C)
DETECTOR
I
(avg)
(pk)
Average Output Current
Peak Output Current
Emitter-Base Reverse Voltage
Supply Voltage
Each Channel
8
16
mA
mA
V
O
I
Each Channel
O
V
FOD050L, FOD250L only
5
EBR
V
-0.5 to 7
-0.5 to 7
5
V
CC
V
Output Voltage
V
O
I
Base Current
FOD050L, FOD250L only
Each Channel
mA
mW
B
P
Output Power Dissipation
100
D
(No derating required up to 85°C)
2
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Electrical Characteristics (T = 0 to 70°C Unless otherwise specified.)
A
Individual Component Characteristics
Symbol
EMITTER
Parameter
Test Conditions
Device
Min. Typ.** Max. Unit
V
Input Forward Voltage
I = 16mA, T =25°C
All
All
1.45
1.7
1.8
V
V
F
F
A
I = 16mA
F
B
Input Reverse
I = 10µA
5.0
VR
R
Breakdown Voltage
DETECTOR
I
Logic High Output
Current
I = 0mA, V = V = 3.3V,
All
0.001
1
µA
µA
OH
F
O
CC
T = 25°C
A
I
Logic Low Supply
Current
I = 16mA, V = Open,
FOD050L
FOD250L
200
400
0.3
10
CCL
F
O
V
= 3.3V
CC
I
= I = 16mA,
FOD053L
F1
F2
V = Open, V = 3.3V
O
CC
I
Logic High Supply
Current
I = 0mA, V = Open,
FOD050L
FOD250L
µA
CCH
F
O
V
= 3.3V, T = 25°C
CC
A
I = 0mA, V = Open,
FOD053L
F
O
V
= 3.3V
CC
**All Typicals at T = 25°C
A
Transfer Characteristics
Symbol
Parameter
Test Conditions
Device
Min. Typ.** Max. Unit
COUPLED
(1)
CTR
Current Transfer Ratio
I = 16mA, V = 0.4 V,
All
All
15
50
%
V
F
O
V
= 3.3V, T = 25°C
CC
A
V
Logic Low Output
I = 16mA, I = 3mA,
0.3
OL
F
O
Voltage Output Voltage
V
= 3.3V, T = 25°C
CC A
**All Typicals at T = 25°C
A
Note:
1. Current Transfer Ratio is defined as a ratio of output collector current, I , to the forward LED input current, I , times
O
F
100%.
3
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Switching Characteristics (T = 0 to 70°C Unless otherwise specified, V = 3.3V.)
A
CC
Device Min.
All
Symbol
Parameter
Test Conditions
Typ.** Max. Unit
(2)
T
Propagation Delay
Time to Logic Low
R = 1.9kΩ, I = 16mA
(Fig. 10)
25°C
25°C
1.0
2.0
1.0
2.0
µs
PHL
L
F
(2)
T
Propagation Delay
Time to Logic High
R = 1.9kΩ, I = 16mA
All
µs
PLH
L
F
(Fig. 10)
|CM | Common Mode
I = 0mA, V
= 1,000V
,
All
All
5,000
5,000
50,000
50,000
V/µs
V/µs
H
F
CM
P-P
(3,4)
Transient Immunity at
Logic High
R = 4.1kΩ, T = 25°C
(Fig. 11)
L
A
I = 0mA, V
= 1,000V
,
F
CM
P-P
(2,4)
T = 25°C, R = 1.9kΩ
(Fig.
A
L
11)
|CM | Common Mode
I = 16mA, V
= 1,000V ,
P-P
5,000
5,000
35,000
35,000
V/µs
V/µs
L
F
CM
(3,4)
Transient Immunity at
Logic Low
R = 4.1kΩ. T = 25°C
L
A
(Fig. 11)
I = 16mA, V
= 1,000 V
,
P-P
F
CM
(2,4)
R = 1.9kΩ
(Fig. 11)
L
** All Typicals at T = 25°C
A
Isolation Characteristics (T = 0 to 70°C Unless otherwise specified.)
A
Symbol
Characteristics
Test Conditions
Device
Min. Typ.** Max.
Unit
I
Input-Output
Insulation Leakage
Current
Relative humidity = 45%,
All
1.0
µA
I-O
T = 25°C, t = 5s,
A
(5)
V
= 3000VDC
I-O
V
Withstand Insulation
Test Voltage
f = 60Hz, T = 25°C,
FOD050L
FOD053L
2500
5000
V
RMS
ISO
A
(5)
t = 1 min.
FOD250L
All
(5)
11
12
R
C
Resistance
(input to output)
V
= 500VDC
I-O
10
10
Ω
I-O
(5)
Capacitance
f = 1MHz
All
0.2
pF
I-O
(input to output)
Notes:
2. The 1.9kΩ load represents 1 TTL unit load of 1.6mA and 5.6kΩ pull-up resistor.
3. The 4.1kΩ load represents 1 LSTTL unit load of 0.36mA and 6.1kΩ pull-up resistor.
4. Common mode transient immunity in logic high level is the maximum tolerable (positive) dV /dt on the leading
cm
edge of the common mode pulse signal V , to assure that the output will remain in a logic high state
CM
(i.e., V > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative)
O
dV /dt on the trailing edge of the common mode pulse signal, V , to assure that the output will remain in a
cm
CM
logic low state (i.e., V < 0.8V).
O
5. Device is considered a two terminal device: Pins 1, 2, 3 and 4 are shorted together and Pins 5, 6, 7 and 8 are
shorted together.
4
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Typical Performance Curves
Fig. 2 Current Transfer Ratio vs. Forward Current
(FOD050L, FOD053L)
Fig. 1 LED Forward Current vs. Forward Voltage
100
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
V
V
= 0.4V
= 3.3V
Normalized to
O
I
= 16mA, T = 25°C
F
A
CC
10
T
= 70°C
A
T
= 85°C
A
T
= 85°C
A
T
= 70°C
T
A
= -40°C
A
A
1
0.1
T
= 25°C
A
T
= 25°C
A
T = 0C°C
A
T
= 0°C
0.01
0.001
T
= -40°C
A
0.9
1.0
1.1
V
1.2
1.3
1.4
1.5
1.6
1.7
0
5
10
15
20
25
- Forward Voltage (V)
I
- Forward Current (mA)
F
F
Fig. 3 Current Transfer Ratio vs. Input Forward Current
(FOD250L)
Fig. 4 Current Transfer Ratio vs. Ambient Temperature
1.4
1.3
1.2
1.1
1.6
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
V
V
= 0.4V
= 3.3V
Normalized to
O
I
V
V
= 16mA
= 0.4V
F
Normalized to T = 25°C
I
= 16mA, T = 25°C
A
F
CC
A
O
1.4
1.2
1.0
0.8
0.6
0.4
0.2
T
= 85°C
= 70°C
A
= 3.3V
CC
T
A
T
= 25°C
= 0°C
A
1.0
0.9
0.8
0.7
T
A
T
= -40°C
A
0.6
0.5
0.0
0.0
0
5
10
15
20
25
-40
-20
0
20
40
60
80
100
I
- Forward Current (mA)
F
T
- Ambient Temperature (°C)
A
Fig. 5 Output Current vs. Output Voltage
Fig 6. Logic High Output Current vs. Ambient Temperature
12
10
8
10
T
V
= 25°C
V
I
= V = 3.3V
CC
= 0
A
O
= 3.3V
CC
F
I
= 25mA
F
1
20mA
15mA
10mA
5mA
6
0.1
4
2
0
0.01
-40
-20
0
20
40
60
80
100
0
2
4
6
8
10
12
14
16
T
- Ambient Temperature ( C)
A
V
- Output Voltage (V)
O
5
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Fig. 8 Propagation Delay vs. Ambient Temperature
Fig. 7 Supply Current vs. Input Forward Current
120
100
80
60
40
20
0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
= 3.3V
T
= 25°C
CC
A
I
= 16mA
V
= 3.3V
CC
F
t
, R = 4.1kΩ
PLH
L
t
, R = 1.9kΩ
PLH
L
t
, R = 1.9kΩ & 4.1kΩ
PHL
L
0
2
4
6
8
10
12
14
16
-40
-20
0
20
40
60
80
100
I
- Input Forward Current (mA)
T
- Ambient Temperature (°C)
F
A
Fig. 9 Propagation Delay vs Load Resistance
10
V
T
= 3.3V
CC
= 25°C
A
t
, I = 16mA
F
PLH
t
, I = 10mA
F
PLH
1
t
, I = 10mA
F
PHL
t
, I = 16mA
PHL
F
0.1
2
3
5
1
10
R - Load Resistance (kΩ)
L
6
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Fig. 10 Switching Time Test Circuit
Noise
Shield
Noise
Shield
Pulse
+
VCC
I
F
V
CC
Generator
tr = 5ns
+3.3 V
+3.3 V
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
Pulse
ZO = 50
Ω
R
L
Generator
tr = 5ns
V
F1
IF
+
VB
V01
-
10% DUTY CYCLE
VO
RL
ZO= 50
10% D.C.
I/f< 100µs
Ω
I/f < 100µS
VF
-
C
L
= 1.5 pF
VO
V02
-
VO
I
F
V
F2
0.1 µF
MONITOR
+
0.1 µF
IF Monitor
GND
Rm
Rm
C
L = 1.5 pF
GND
Test Circuit for FOD050L and FOD250L
Test Circuit for FOD053L
IF
0
3.3 V
VO
50%
50%
VOL
TPHL
TPLH
Fig. 11 Common Mode Immunity Test Circuit
IF
Noise
Shield
Noise
Shield
VCC
V
CC
+
+3.3 V
+3.3 V
VO
1
2
3
4
8
7
6
5
1
2
3
4
8
7
6
5
IF
R
L
V
F1
+
VB
V01
-
RL
A
VF
-
A
VO
V02
B
-
0.1 µF
VO
0.1 µF
B
VFF
V
F2
VFF
+
GND
GND
-
VCM
+
-
VCM
-
+
Pulse Gen
Pulse Gen
Test Circuit for FOD050L and FOD250L
Test Circuit for FOD053L
VCM 1000 V
0 V
90% 90%
10%
tr
10%
tf
VO
3.3 V
VOL
Switch at A : IF = 0 mA
VO
Switch at A : IF = 16 mA
7
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Ordering Information
Order Entry
Identifier
Option
Description
No Suffix
FOD250L
FOD050L
Through Hole (DIP package only)
Surface Mount Lead Form (SOIC-8 package only)
Surface Mount Lead Bend (DIP package only)
Surface Mount; Tape and reel (DIP package only)
Surface Mount; VDE0884 (DIP package only)
S
FOD250LS
SD
SV
FOD250LSD
Pending Approval
Pending Approval
SDV
Surface Mount; Tape and reel, VDE0884 (1000 units per reel)
(DIP package only)
T
TV
R1
R1V
R2
R2V
V
FOD250LT
0.4" Lead Spacing (DIP package only)
Pending Approval
FOD050LR1
0.4" Lead Spacing, VDE0884 (DIP package only)
Tape and Reel (500 units per reel) (SOIC-8 package only)
VDE, Tape and Reel (500 units per reel) (SOIC-8 package only)
Tape and Reel (2500 units per reel) (SOIC-8 package only)
VDE, Tape and Reel (2500 units per reel) (SOIC-8 package only)
VDE (SOIC-8 package only)
Pending Approval
FOD050LR2
Pending Approval
Pending Approval
Marking Information
DIP
SOIC
2
1
1
50L
6
2
6
X
V
YY S
250L
V XX YY T1
5
3
4
5
3
4
Definitions
1
2
Fairchild logo
Device number
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
3
4 (DIP) Two digit year code, e.g., ‘03’
4 (SOIC) One digit year code, e.g., ‘3’
5
6
Two digit work week ranging from ‘01’ to ‘53’
Assembly package code
8
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Package Dimensions (8-Pin DIP)
Through Hole
Surface Mount
PIN 1
ID.
0.390 (9.91)
0.370 (9.40)
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.270 (6.86)
0.250 (6.35)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.200 (5.08)
0.140 (3.55)
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0.045 [1.14]
15° MAX
0.022 (0.56)
0.016 (0.41)
0.016 (0.40)
0.008 (0.20)
0.315 (8.00)
MIN
0.300 (7.62)
TYP
0.100 (2.54) TYP
0.100 (2.54)
TYP
0.405 (10.30)
MIN
Lead Coplanarity : 0.004 (0.10) MAX
0.4” Lead Spacing
8-Pin DIP
PIN 1
ID.
0.070 (1.78)
0.270 (6.86)
0.250 (6.35)
0.060 (1.52)
0.390 (9.91)
0.370 (9.40)
0.100 (2.54)
0.295 (7.49)
0.415 (10.54)
0.030 (0.76)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.200 (5.08)
0.140 (3.55)
0.154 (3.90)
0.120 (3.05)
0.022 (0.56)
0.016 (0.41)
0° to 15°
0.016 (0.40)
0.008 (0.20)
0.400 (10.16)
TYP
0.100 (2.54) TYP
Note:
All dimensions are in inches (millimeters)
9
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
Package Dimensions (8-Pin SOIC)
Surface Mount
8-Pin Small Outline
PIN 1
ID.
0.024 (0.61)
0.164 (4.16)
0.144 (3.66)
0.060 (1.52)
0.275 (6.99)
0.155 (3.94)
0.202 (5.13)
0.182 (4.63)
0.010 (0.25)
0.006 (0.16)
0.143 (3.63)
0.123 (3.13)
0.244 (6.19)
0.224 (5.69)
0.050 (1.27)
0.008 (0.20)
0.003 (0.08)
0.021 (0.53)
0.011 (0.28)
0.050 (1.27)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
Note:
All dimensions are in inches (millimeters)
10
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
8-Pin DIP (FOD250L)
Carrier Tape Specification
12.0 0.1
4.0 0.1
Ø1.55 0.05
1.75 0.10
4.90 0.20
4.0 0.1
0.30 0.05
7.5 0.1
16.0 0.3
10.30 0.20
13.2 0.2
Ø1.6 0.1
0.1 MAX
10.30 0.20
User Direction of Feed
Reflow Profile
• Peak reflow temperature
• Time of temperature higher than 245°C
260°C (package surface temperature)
40 seconds or less
• Number of reflows
Three
10s
300
250
200
150
100
50
260°
245°
40s
50
100
150
200
250
Time (s)
11
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
8-Pin SOIC (FOD050L, FOD053L)
Carrier Tape Specification
8.0 0.10
2.0 0.05
3.50 0.20
Ø1.5 MIN
0.30 MAX
4.0 0.10
1.75 0.10
5.5 0.05
12.0 0.3
5.20 0.20
8.3 0.10
Ø1.5 0.1/-0
6.40 0.20
User Direction of Feed
0.1 MAX
Reflow Profile
300
280
260
240
220
200
180
160
140
120
100
80
260°C
>245°C = 42 Sec
Time above
183°C = 90 Sec
°C
1.822°C/Sec Ramp up rate
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
12
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.
®
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PowerSaver™
SILENT SWITCHER
SMART START™
SPM™
UniFET™
UltraFET
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ActiveArray™
Bottomless™
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CoolFET™
CROSSVOLT™
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®
HiSeC™
Stealth™
Wire™
2
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SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TCM™
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ImpliedDisconnect™
IntelliMAX™
ISOPLANAR™
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MICROCOUPLER™
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MicroPak™
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RapidConnect™
µSerDes™
TinyPWM™
TinyPower™
®
TinyLogic
TINYOPTO™
TruTranslation™
UHC™
Across the board. Around the world.™
The Power Franchise
®
ScalarPump™
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE
APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER
ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S
WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which,
(a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in
accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Advance Information
Product Status
Definition
Formative or In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve
design.
No Identification Needed
Obsolete
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice to improve design.
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I20
13
www.fairchildsemi.com
FOD050L, FOD250L, FOD053L Rev. 1.0.0
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