FDR4420A [FAIRCHILD]

Single N-Channel, Logic Level, PowerTrenchTM MOSFET; 单N沟道逻辑电平MOSFET PowerTrenchTM
FDR4420A
型号: FDR4420A
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

Single N-Channel, Logic Level, PowerTrenchTM MOSFET
单N沟道逻辑电平MOSFET PowerTrenchTM

文件: 总4页 (文件大小:227K)
中文:  中文翻译
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June 1998  
FDR4420A  
Single N-Channel, Logic Level, PowerTrenchTM MOSFET  
General Description  
Features  
The SuperSOT-8 family of N-Channel Logic Level MOSFETs  
have been designed to provide a low profile, small footprint  
alternative to industry standard SO-8 little foot type product.  
11 A, 30 V. RDS(ON) = 0.009 W @ VGS = 10 V,  
RDS(ON) = 0.013 W @ VGS = 4.5 V.  
Fast switching speed.  
These MOSFETs are produced using Fairchild Semiconductor's  
advanced PowerTrench process that has been tailored to  
minimize the on-state resistance and yet maintain superior  
switching performance.  
Low gate charge.  
Small footprint 38% smaller than a standard SO-8.  
These devices are well suited for low voltage and battery  
powered applications where small package size is required  
Low profile package(1mm thick).  
without compromising power handling and fast switching.  
Power handling capability similar to SO-8.  
SuperSOTTM-8  
SuperSOTTM-6  
SOT-23  
SOIC-16  
SO-8  
SOT-223  
S
5
6
7
8
4
3
2
1
D
D
S
G
D
D
1
pin  
SuperSOTTM-8  
D
Absolute Maximum Ratings TA = 25oC unless otherwise noted  
Symbol Parameter  
FDR4420A  
Units  
Drain-Source Voltage  
30  
V
VDSS  
VGSS  
ID  
Gate-Source Voltage  
Draint Current - Continuous  
- Pulsed  
±20  
V
A
(Note 1a)  
11  
40  
1.8  
Maximum Power Dissipation  
(Note 1a)  
(Note 1b)  
PD  
W
1
(Note 1c)  
0.9  
TJ,TSTG  
Operating and Storage Temperature Range  
-55 to 150  
°C  
THERMAL CHARACTERISTICS  
RqJA  
RqJC  
Thermal Resistance, Junction-to-Ambient (Note 1a)  
Thermal Resistance, Junction-to-Case  
70  
20  
°C/W  
°C/W  
(Note 1)  
© 1998 Fairchild Semiconductor Corporation  
FDR4420 Rev.D  
Electrical Characteristics (TA = 25OC unless otherwise noted )  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
OFF CHARACTERISTICS  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0 V, ID = 250 µA  
30  
V
ID = 250 µA, Referenced to 25 o C  
mV /oC  
Breakdown Voltage Temp. Coefficient  
Zero Gate Voltage Drain Current  
20  
DBVDSS/DTJ  
1
µA  
µA  
nA  
nA  
IDSS  
VDS = 24 V, VGS = 0 V  
10  
TJ = 55°C  
IGSS  
IGSS  
Gate - Body Leakage Current  
Gate - Body Leakage, Reverse  
VGS = 20 V, VDS= 0 V  
VGS = -20 V, VDS= 0 V  
100  
-100  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage Temp.Coefficient  
ID = 250 µA, Referenced to 25 o C  
VDS = VGS, ID = 250 µA  
-6  
mV /oC  
V
DVGS(th)/DTJ  
VGS(th)  
Gate Threshold Voltage  
1
1.4  
3
Static Drain-Source On-Resistance  
0.0075  
0.0125  
0.01  
0.009  
0.016  
0.013  
RDS(ON)  
VGS = 10 V, ID = 11A  
W
TJ =125°C  
VGS = 4.5 V, ID = 9 A  
VGS = 10 V, VDS = 5 V  
VDS = 10 V, ID= 11 A  
ID(ON)  
gFS  
On-State Drain Current  
30  
A
S
Forward Transconductance  
25  
DYNAMIC CHARACTERISTICS  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = 15 V, VGS = 0 V,  
f = 1.0 MHz  
2560  
560  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
280  
SWITCHING CHARACTERISTICS (Note 2)  
Turn - On Delay Time  
Turn - On Rise Time  
Turn - Off Delay Time  
Turn - Off Fall Time  
Total Gate Charge  
11  
15  
25  
21  
23  
7
20  
27  
40  
34  
33  
ns  
ns  
tD(on)  
tr  
tD(off)  
tf  
VDD = 10 V, ID = 1 A,  
VGS = 10V, RGEN = 1 W  
ns  
ns  
nC  
nC  
nC  
Qg  
Qgs  
Qgd  
VDS = 15 V, ID = 9.3 A,  
VGS = 5 V  
Gate-Source Charge  
Gate-Drain Charge  
11  
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS  
Maximum Continuous Drain-Source Diode Forward Current  
Drain-Source Diode Forward Voltage  
1.5  
1.2  
A
V
IS  
0.7  
VSD  
VGS = 0 V, IS = 1.5 A (Note 2)  
Notes:  
1. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RqJC is guaranteed by design  
while RqCA is determined by the user's board design. RqJA shown below for single device operation on FR-4 board in still air.  
c. 135OC/W on a 0.005 in2 of pad  
of 2oz copper.  
b. 125OC/W on a 0.026 in2 of pad  
of 2oz copper.  
a. 70OC/W on a 1 in2 pad of 2oz  
copper.  
Scale 1 : 1 on letter size paper  
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.  
FDR4420 Rev.D  
Typical Electrical Characteristics  
3
2.5  
2
40  
V
=10V  
GS  
4.0V  
3.5V  
6.0V  
4.5V  
32  
24  
16  
8
V
= 3.0V  
GS  
3.0V  
3.5  
4.0  
1.5  
1
4.5  
24  
5.0  
6.0  
32  
10  
2.5V  
0.5  
0
0
8
16  
40  
0
0.4  
0.8  
1.2  
1.6  
2
I
, DRAIN CURRENT (A)  
V
, DRAIN-SOURCE VOLTAGE (V)  
D
DS  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
Figure 1. On-Region Characteristics.  
0.04  
0.035  
0.03  
1.8  
1.6  
1.4  
1.2  
1
ID = 5.5A  
I
= 11A  
D
V
=10V  
GS  
0.025  
0.02  
TA = 125oC  
0.015  
0.01  
0.8  
25o  
C
0.6  
-50  
0.005  
-25  
0
25  
50  
75  
100  
125  
150  
2
4
6
8
10  
T , JUNCTION TEMPERATURE (°C)  
J
V
,GATE-SOURCE VOLTAGE (V)  
GS  
Figure 3. On-Resistance Variation  
with Temperature.  
Figure 4. On Resistance Variation with  
Gate-To-Source Voltage.  
40  
50  
V
=0V  
T = -55°C  
J
GS  
V
= 10V  
DS  
25°C  
125°C  
5
1
40  
30  
20  
10  
0
T = 125°C  
J
25°C  
0.1  
0.01  
-55°C  
0.001  
0.0001  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1
1.5  
2
2.5  
3
3.5  
4
V
, BODY DIODE FORWARD VOLTAGE (V)  
V
, GATE TO SOURCE VOLTAGE (V)  
SD  
GS  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage  
Variation with Source Current  
and Temperature.  
FDR4420 Rev.D  
Typical Electrical Characteristics (continued)  
10  
5000  
VDS = 5V  
ID = 11A  
10V  
3000  
2000  
C
iss  
8
15V  
6
4
2
0
1000  
500  
C
C
oss  
f = 1 MHz  
= 0V  
V
rss  
GS  
200  
0.1  
0.3  
1
3
10  
30  
0
10  
20  
Q
30  
40  
50  
60  
V
, DRAIN TO SOURCE VOLTAGE (V)  
DS  
, GATE CHARGE (nC)  
g
Figure 8. Capacitance Characteristics.  
Figure 7. Gate Charge Characteristics.  
100  
50  
40  
30  
20  
10  
SINGLE PULSE  
R qJA= 135°C/W  
TA = 25°C  
20  
5
1
0.3  
0.1  
VGS = 10V  
SINGLE PULSE  
R
JA= 135°C/W  
q
0.03  
0.01  
TA = 25°C  
0
0.0001  
0.001  
0.01  
0.1  
1
10  
100 300  
0.1  
0.2  
0.5  
1
2
5
10  
30 50  
SINGLE PULSE TIME (SEC)  
V
, DRAIN-SOURCE VOLTAGE (V)  
DS  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum Power  
Dissipation.  
1
D = 0.5  
0.2  
0.5  
R
(t) = r(t) * R  
JA  
q
JA  
R
0.3  
0.2  
q
= 135°C/W  
JA  
q
0.1  
0.1  
P(pk)  
0.05  
t
0.05  
1
t
2
0.02  
0.01  
Single Pulse  
0.03  
0.02  
T
- T = P * R  
(t)  
JA  
J
A
q
Duty Cycle, D = t / t  
1
2
0.01  
0.0001  
0.001  
0.01  
0.1  
, TIME (sec)  
1
10  
100  
300  
t
1
Figure 11.Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in note 1c.  
Transient thermal response will change depending on the circuit board design.  
FDR4420 Rev.D  

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