FDP7030BLS [FAIRCHILD]

30V N-Channel PowerTrench㈢SyncFET⑩; 30V N通道PowerTrench㈢SyncFET⑩
FDP7030BLS
型号: FDP7030BLS
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

30V N-Channel PowerTrench㈢SyncFET⑩
30V N通道PowerTrench㈢SyncFET⑩

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
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May 2001  
FDP7030BLS / FDB7030BLS  
30V N-Channel PowerTrenchÒ SyncFET™  
General Description  
Features  
This MOSFET is designed to replace a single MOSFET  
and parallel Schottky diode in synchronous DC:DC  
power supplies. This 30V MOSFET is designed to  
maximize power conversion efficiency, providing a low  
·
56 A, 30 V.  
RDS(ON) = 10.5 mW @ VGS = 10 V  
RDS(ON) = 16.5 mW @ VGS = 4.5 V  
·
·
·
Includes SyncFET Schottky body diode  
Low gate charge (15nC typical)  
RDS(ON)  
and low gate charge.  
The FDP7030BLS  
includes an integrated Schottky diode using Fairchild’s  
monolithic SyncFET technology. The performance of  
the FDP7030BLS as the low-side switch in  
a
synchronous rectifier is indistinguishable from the  
High performance trench technology for extremely  
low RDS(ON) and fast switching  
performance of the FDP7030BL in parallel with  
Schottky diode.  
a
·
High power and current handling capability  
D
D
G
G
G
S
TO-263AB  
FDB Series  
TO-220  
D
FDP Series  
S
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
30  
V
VGSS  
ID  
Gate-Source Voltage  
V
±20  
56  
Drain Current – Continuous  
(Note 1)  
(Note 1)  
A
– Pulsed  
160  
65  
PD  
W
Total Power Dissipation @ T = 25°C  
C
Derate above 25°C  
W/°C  
°C  
0.43  
TJ, TSTG  
TL  
Operating and Storage Junction Temperature Range  
–65 to +100  
Maximum lead temperature for soldering purposes,  
1/8” from case for 5 seconds  
°C  
275  
Thermal Characteristics  
RqJC  
Thermal Resistance, Junction-to-Case  
2.3  
°C/W  
°C/W  
RqJA  
Thermal Resistance, Junction-to-Ambient  
62.5  
Package Marking and Ordering Information  
Device Marking  
FDB7030BLS  
FDP7030BLS  
Device  
Reel Size  
Tape width  
24mm  
Quantity  
FDB7030BLS  
FDP7030BLS  
13’’  
800 units  
45  
Tube  
n/a  
FDP7030BLS Rev B(W)  
Ó 2001 Fairchild Semiconductor Corporation  
Electrical Characteristics  
T
= 25°C unless otherwise noted  
A
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Off Characteristics  
BVDSS  
Drain–Source Breakdown Voltage  
VGS = 0 V,  
ID = 1 mA  
30  
V
DBVDSS  
DTJ  
Breakdown Voltage Temperature  
Coefficient  
ID = 10 mA, Referenced to 25°C  
22  
mV/°C  
IDSS  
Zero Gate Voltage Drain Current  
Gate–Body Leakage, Forward  
Gate–Body Leakage, Reverse  
VDS = 24 V,  
VGS = 20 V,  
VGS = –20 V  
VGS = 0 V  
VDS = 0 V  
VDS = 0 V  
500  
100  
µA  
nA  
nA  
IGSSF  
IGSSR  
–100  
On Characteristics  
(Note 2)  
VGS(th)  
Gate Threshold Voltage  
VDS = VGS  
,
ID = 1 mA  
1
2.3  
3
V
DVGS(th)  
DTJ  
Gate Threshold Voltage  
Temperature Coefficient  
ID = 1 mA, Referenced to 25°C  
–4.4  
mV/°C  
mW  
RDS(on)  
Static Drain–Source  
On–Resistance  
VGS = 10 V,  
VGS = 4.5 V,  
ID = 28 A  
ID = 23 A  
8.6  
13.2  
12.4  
10.5  
16.5  
16.5  
VGS=10 V, ID = 28A, TJ = 100°C  
ID(on)  
gFS  
On–State Drain Current  
VGS = 10 V,  
VDS = 5 V,  
VDS = 5 V  
ID = 28 A  
50  
A
S
Forward Transconductance  
47  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
1708  
474  
pF  
pF  
pF  
VDS = 15 V,  
f = 1.0 MHz  
VGS = 0 V,  
Output Capacitance  
Reverse Transfer Capacitance  
134  
Switching Characteristics (Note 2)  
td(on)  
Turn–On Delay Time  
Turn–On Rise Time  
Turn–Off Delay Time  
Turn–Off Fall Time  
Total Gate Charge  
Gate–Source Charge  
Gate–Drain Charge  
11  
8
21  
16  
48  
29  
21  
ns  
ns  
VDS = 15 V,  
VGS = 10 V,  
ID = 1 A,  
RGEN = 6 W  
tr  
td(off)  
tf  
30  
16  
15  
7
ns  
ns  
Qg  
nC  
nC  
nC  
VDS = 15 V,  
VGS = 5 V  
ID = 28 A  
Qgs  
Qgd  
5
Drain–Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain–Source Diode Forward Current  
3.5  
0.7  
A
V
VSD  
Drain–Source Diode Forward  
Voltage  
VGS = 0 V, IS = 3.5 A  
VGS = 0 V, IS = 7 A  
IF = 11.5A,  
(Note 1)  
(Note 1)  
0.44  
0.60  
20  
trr  
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
ns  
diF/dt = 300 A/µs  
(Note 2)  
Qrr  
20  
nC  
Notes:  
1. Pulse Test: Pulse Width < 300ms, Duty Cycle < 2.0%  
2. See “SyncFET Schottky body diode characteristics” below.  
FDP7030BLS Rev B(W)  
Typical Characteristics  
120  
2
1.8  
1.6  
1.4  
1.2  
1
VGS = 10V  
6.0V  
VGS = 4.5V  
5.0V  
90  
5.0V  
4.5V  
60  
30  
0
6.0V  
7.0V  
4.0V  
8.0V  
10V  
0.8  
0
1
2
3
4
5
0
20  
40  
60  
80  
100  
120  
VDS, DRAIN-SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. On-Region Characteristics.  
Figure 2. On-Resistance Variation with  
Drain Current and Gate Voltage.  
0.04  
0.03  
0.02  
0.01  
1.4  
1.2  
1
ID = 28A  
VGS =10V  
ID = 14A  
TA = 100oC  
0.8  
0.6  
TA = 25oC  
-50  
-25  
0
25  
50  
75  
100  
2
4
6
8
10  
TJ, JUNCTION TEMPERATURE (oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 3. On-Resistance Variation with  
Temperature.  
Figure 4. On-Resistance Variation with  
Gate-to-Source Voltage.  
60  
50  
40  
30  
20  
10  
0
10  
TA = 55o C  
25o C  
VGS = 0V  
VDS = 5V  
TA = 100oC  
100oC  
1
25oC  
0.1  
0.01  
-55oC  
0.001  
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
2
2.5  
3
3.5  
4
4.5  
5
VSD, BODY DIODE FORWARD VOLTAGE (V)  
VGS , GATE TO SOURCE VOLTAGE (V)  
Figure 5. Transfer Characteristics.  
Figure 6. Body Diode Forward Voltage Variation  
with Source Current and Temperature.  
FDP7030BLS Rev B(W)  
Typical Characteristics (continued)  
2500  
2000  
1500  
1000  
500  
10  
f = 1MHz  
VGS = 0 V  
VDS = 5V  
ID = 28A  
10V  
8
6
4
2
0
CISS  
15V  
COSS  
CRSS  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
Qg, GATE CHARGE (nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics.  
Figure 8. Capacitance Characteristics.  
1000  
100  
10  
5000  
4000  
3000  
2000  
1000  
0
SINGLE PULSE  
RqJA = 2.3°C/W  
TA = 25°C  
10ms  
100m  
RDS(ON) LIMIT  
1s  
10s  
50s  
DC  
VGS = 10V  
SINGLE PULSE  
RqJA = 2.3oC/W  
TA = 25o  
C
1
0.1  
1
10  
100  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, TIME (sec)  
VD S, DRAIN-SOURCE VOLTAGE (V)  
Figure 9. Maximum Safe Operating Area.  
Figure 10. Single Pulse Maximum  
Power Dissipation.  
1
D = 0.5  
RqJA(t) = r(t) + Rq  
JA  
0.2  
RqJA = 2.3 °C/W  
0.1  
0.1  
0.01  
0.05  
P(pk  
0.02  
0.01  
t1  
t2  
TJ - TA = P * RqJA(t)  
Duty Cycle, D = t1  
t2  
/
SINGLE PULSE  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Figure 11. Transient Thermal Response Curve.  
FDP7030BLS Rev B(W)  
Typical Characteristics (continued)  
SyncFET Schottky Body Diode  
Characteristics  
Fairchild’s SyncFET process embeds a Schottky diode in  
parallel with PowerTrench MOSFET. This diode exhibits  
similar characteristics to a discrete external Schottky  
Schottky barrier diodes exhibit significant leakage at  
high temperature and high reverse voltage. This will  
increase the power in the device.  
diode in parallel with  
FDP7030BLS.  
a
MOSFET.  
Figure 12  
Figure 14. SyncFET diode reverse leakage  
versus drain-source voltage and  
temperature.  
0.1  
TA = 100oC  
0.01  
0.001  
TA = 25oC  
0.0001  
Time: 10ns/div  
0.00001  
0
10  
20  
30  
VDS, REVERSE VOLTAGE (V)  
Figure 12. FDP7030BLS SyncFET body  
diode reverse recovery characteristic.  
For comparison purposes, Figure 13 shows the reverse  
recovery characteristics of the body diode of an  
equivalent size MOSFET produced without SyncFET  
(FDP7030BL).  
Figure 13. Non-SyncFET (FDP7030BL) body  
diode reverse recovery characteristic.  
Time: 10ns/div  
FDP7030BLS Rev B(W)  
TRADEMARKS  
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is  
not intended to be an exhaustive list of all such trademarks.  
OPTOPLANAR™  
PACMAN™  
POP™  
PowerTrench  
QFET™  
QS™  
SuperSOT™-3  
SuperSOT™-6  
SuperSOT™-8  
SyncFET™  
TinyLogic™  
UHC™  
FAST  
FASTr™  
FRFET™  
GlobalOptoisolator™  
GTO™  
ACEx™  
Bottomless™  
CoolFET™  
CROSSVOLT™  
DenseTrench™  
DOME™  
HiSeC™  
ISOPLANAR™  
LittleFET™  
MicroFET™  
MICROWIRE™  
OPTOLOGIC™  
QT Optoelectronics™  
Quiet Series™  
SILENT SWITCHER  
SMART START™  
Stealth™  
UltraFET  
VCX™  
EcoSPARK™  
E2CMOSTM  
EnSignaTM  
FACT™  
FACT Quiet Series™  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER  
NOTICE TOANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD  
DOES NOTASSUMEANY LIABILITYARISING OUT OF THEAPPLICATION OR USE OFANY PRODUCT  
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT  
RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUTTHE EXPRESS WRITTENAPPROVALOF FAIRCHILD SEMICONDUCTOR CORPORATION.  
As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant into  
the body, or (b) support or sustain life, or (c) whose  
failure to perform when properly used in accordance  
with instructions for use provided in the labeling, can be  
reasonably expected to result in significant injury to the  
user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
PRODUCT STATUS DEFINITIONS  
Definition of Terms  
Datasheet Identification  
Product Status  
Definition  
Advance Information  
Formative or  
In Design  
This datasheet contains the design specifications for  
product development. Specifications may change in  
any manner without notice.  
Preliminary  
First Production  
This datasheet contains preliminary data, and  
supplementary data will be published at a later date.  
Fairchild Semiconductor reserves the right to make  
changes at any time without notice in order to improve  
design.  
No Identification Needed  
Obsolete  
Full Production  
This datasheet contains final specifications. Fairchild  
Semiconductor reserves the right to make changes at  
any time without notice in order to improve design.  
Not In Production  
This datasheet contains specifications on a product  
that has been discontinued by Fairchild semiconductor.  
The datasheet is printed for reference information only.  
Rev. H2  

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