FDP16N50_12 [FAIRCHILD]
500V N-Channel MOSFET; 500V N沟道MOSFET![FDP16N50_12](http://pdffile.icpdf.com/pdf1/p00183/img/icpdf/FDP16N_1036250_icpdf.jpg)
型号: | FDP16N50_12 |
厂家: | ![]() |
描述: | 500V N-Channel MOSFET |
文件: | 总10页 (文件大小:800K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
![](http://public.icpdf.com/style/img/ads.jpg)
July 2012
TM
UniFET
FDP16N50 / FDPF16N50 / FDPF16N50T
500V N-Channel MOSFET
Features
Description
•
•
•
•
•
•
16A, 500V, RDS(on) = 0.38Ω @VGS = 10 V
Low gate charge ( typical 32 nC)
Low Crss ( typical 20 pF)
Fast switching
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies and active power factor
correction.
100% avalanche tested
Improved dv/dt capability
D
G
TO-220F
FDPF Series
S
TO-220
FDP Series
G D
S
G
D S
Absolute Maximum Ratings
FDPF16N50 /
FDPF16N50T
Symbol
Parameter
FDP16N50
Unit
VDSS
Drain-Source Voltage
Drain Current
500
V
ID
- Continuous (TC = 25°C)
- Continuous (TC = 100°C)
16
9.6
16 *
9.6 *
A
A
(Note 1)
(Note 2)
IDM
Drain Current
- Pulsed
64
64 *
A
V
VGSS
EAS
IAR
Gate-Source voltage
±30
780
16
Single Pulsed Avalanche Energy
Avalanche Current
mJ
A
(Note 1)
(Note 1)
(Note 3)
EAR
dv/dt
PD
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
20
mJ
V/ns
4.5
Power Dissipation
(TC = 25°C)
- Derate above 25°C
200
1.59
38.5
0.3
W
W/°C
TJ, TSTG
TL
Operating and Storage Temperature Range
-55 to +150
300
°C
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
°C
* Drain current limited by maximum junction temperature
Thermal Characteristics
FDPF16N50 /
FDPF16N50T
Symbol
Parameter
FDP16N50
Unit
RθJC
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
0.63
0.5
3.3
--
°C/W
°C/W
°C/W
RθCS
RθJA
62.5
62.5
©2012 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Package Marking and Ordering Information
Device Marking
FDPF16N50
Device
FDPF16N50
FDPF16N50T
Package
TO-220F
TO-220F
Reel Size
Tape Width
Quantity
-
-
-
-
50
50
FDPF16N50T
Electrical Characteristics
T
= 25°C unless otherwise noted
C
Symbol
Parameter
Conditions
Min. Typ. Max Units
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250μA
D = 250μA, Referenced to 25°C
500
--
--
--
--
V
ΔBVDSS
Breakdown Voltage Temperature
Coefficient
I
0.5
V/°C
/
ΔTJ
IDSS
Zero Gate Voltage Drain Current
VDS = 500V, VGS = 0V
DS = 400V, TC = 125°C
--
--
--
--
1
10
μA
μA
V
IGSSF
IGSSR
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
VGS = 30V, VDS = 0V
VGS = -30V, VDS = 0V
--
--
--
--
100
nA
nA
-100
On Characteristics
VGS(th) Gate Threshold Voltage
RDS(on)
VDS = VGS, ID = 250μA
3.0
--
--
5.0
0.38
--
V
Ω
S
Static Drain-Source
On-Resistance
V
GS = 10V, ID = 8A
0.31
23
gFS
Forward Transconductance
VDS = 40V, ID = 8A
(Note 4)
--
Dynamic Characteristics
Ciss
Coss
Crss
Input Capacitance
VDS = 25V, VGS = 0V,
f = 1.0MHz
--
--
--
1495
235
20
1945
310
30
pF
pF
pF
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
td(on) Turn-On Delay Time
tr
td(off)
tf
VDD = 250V, ID = 16A
RG = 25Ω
--
--
--
--
--
--
--
40
150
65
90
310
140
170
45
ns
ns
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
ns
(Note 4, 5)
(Note 4, 5)
80
ns
Qg
VDS = 400V, ID = 16A
32
nC
nC
nC
V
GS = 10V
Qgs
Qgd
8.5
14
--
--
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
--
--
--
--
--
--
--
9.2
37
1.4
--
A
A
ISM
VSD
trr
Drain-Source Diode Forward Voltage
Reverse Recovery Time
VGS = 0V, IS = 16A
--
V
VGS = 0V, IS = 16A
490
5.0
ns
μC
dIF/dt =100A/μs
(Note 4)
Qrr
Reverse Recovery Charge
--
NOTES:
1. Repetitive Rating: Pulse width limited by maximum junction temperature
2. L = 5.5mH, I = 16A, V = 50V, R = 25Ω, Starting T = 25°C
AS
DD
G
J
3. I ≤ 16A, di/dt ≤ 200A/μs, V ≤ BV
, Starting T = 25°C
SD
DD
DSS
J
4. Pulse Test: Pulse width ≤ 300μs, Duty Cycle ≤ 2%
5. Essentially Independent of Operating Temperature Typical Characteristics
2
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Typical Performance Characteristics
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
VGS
102
Top :
15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
101
100
10-1
Bottom : 5.5 V
101
150oC
25oC
-55oC
* Notes :
1. 250μs Pulse Test
* Notes :
1. VDS = 40V
o
2. TC = 25
C
2. 250μs Pulse Test
10 12
100
10-1
100
101
2
4
6
8
VDS, Drain-Source Voltage [V]
VGS, Gate-Source Voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperatue
0.6
0.5
VGS = 10V
101
0.4
VGS = 20V
150oC
0.3
25oC
* Notes :
1. VGS = 0V
o
* Note : TJ = 25 C
2. 250μs Pulse Test
100
0.2
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
0
5
10
15
20
25
30
35
40
VSD, Source-Drain voltage [V]
ID, Drain Current [A]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
4000
12
C
iss = Cgs + Cgd (Cds = shorted)
oss = Cds + Cgd
Crss = Cgd
C
VDS = 100V
VDS = 250V
VDS = 400V
10
8
3000
2000
1000
0
Coss
6
C
iss
4
* Note :
1. VGS = 0 V
C
rss
2. f = 1 MHz
2
* Note : ID = 16A
0
10-1
100
101
0
10
20
30
40
VDS, Drain-Source Voltage [V]
QG, Total Gate Charge [nC]
3
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Typical Performance Characteristics (Continued)
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
3.0
2.5
2.0
1.5
1.0
1.2
1.1
1.0
* Notes :
1. VGS = 0 V
0.9
0.8
* Notes :
1. VGS = 10 V
2. ID = 250μA
0.5
2. ID = 8 A
0.0
-100
-100
-50
0
50
100
150
200
-50
0
50
100
150
200
TJ, Junction Temperature [oC]
TJ, Junction Temperature [oC]
Figure 9-1. Maximum Safe Operating Area
- FDP16N50
Figure 9-2. Maximum Safe Operating Area
- FDPF16N50 / FDPF16N50T
102
102
101
100
10-1
10-2
10 μs
10 μs
100 μs
100 μs
101
1 ms
1 ms
10 ms
100 ms
10 ms
Operation in This Area
is Limited by R DS(on)
DC
Operation in This Area
is Limited by R DS(on)
100 ms
100
DC
-1
10
* Notes :
* Notes :
1. TC = 25 o
C
1. TC = 25 o
2. TJ = 150 o
C
C
2. TJ = 150 o
C
3. Single Pulse
3. Single Pulse
-2
10
100
101
102
100
101
102
VDS, Drain-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 10. Maximum Drain Currentvs. Case Temperature
20
15
10
5
0
25
50
75
100
125
150
TC, Case Temperature [oC]
4
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Typical Performance Characteristics (Continued)
Figure 11-1. Transient Thermal Response Curve - FDP16N50
1 00
D =0 .5
0 .2
10 -1
0.1
PDM
0 .0 5
0 .02
t1
t2
*
N o te s
:
o
0.01
1 . Z θ JC (t)
=
0.63 C /W M ax.
2 . D u ty F actor, D = t1/t2
10 -2
3 . T JM
-
T C
=
P D M
* Z θ JC (t)
sing le p ulse
10 -3
1 0-5
1 0-4
10 -2
10 -1
1 00
10 1
t1 , S q u a re W a ve P u lse D u ra tio n [se c]
Figure 11-2. Transient Thermal Response Curve - FDPF16N50 / FDPF16N50T
D =0 .5
1 00
0 .2
0 .1
0 .0 5
PDM
10 -1
0 .0 2
t1
0.01
t2
*
N o te s
1 . Z θ JC (t)
2 . D u ty F actor, D = t1/t2
:
o
3.3 C /W M ax.
=
10 -2
1 0-5
sing le pu lse
3 . T JM
-
T C
=
P D M
1 00
* Z θ JC (t)
1 0-4
10 -3
10 -2
10 -1
10 1
t1 , S q u a re W a ve P u lse D u ra tio n [se c]
5
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
6
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Peak Diode Recovery dv/dt Test Circuit & Waveforms
7
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Mechanical Dimensions
TO-220F
2.54 0.20
(0.70)
10.16 0.20
(7.00)
ø3.18 0.10
(1.00x45°)
MAX1.47
0.80 0.10
(30
°
)
#1
0.35 0.10
2.54TYP
+0.10
–0.05
0.50
2.76 0.20
2.54TYP
[2.54 0.20
]
[2.54 0.20]
9.40 0.20
Dimensions in Millimeters
www.fairchildsemi.com
8
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
Package Dimensions
TO-220F Potted
* Front/Back Side Isolation Voltage : AC 2500V
Dimensions in Millimeters
9
www.fairchildsemi.com
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
®
®
2Cool™
F-PFS™
FRFET
Global Power Resource
Green Bridge™
PowerTrench
PowerXS™
The Power Franchise
®
®
AccuPower™
AX-CAP™*
SM
Programmable Active Droop™
®
®
BitSiC
QFET
TinyBoost™
TinyBuck™
TinyCalc™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
QS™
Quiet Series™
RapidConfigure™
™
®
TinyLogic
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
Current Transfer Logic™
Saving our world, 1mW/W/kW at a time™
®
DEUXPEED
Marking Small Speakers Sound Louder SignalWise™
Dual Cool™
EcoSPARK
EfficentMax™
ESBC™
and Better™
MegaBuck™
MICROCOUPLER™
MicroFET™
SmartMax™
®
TranSiC
®
SMART START™
Solutions for Your Success™
TriFault Detect™
TRUECURRENT *
®
®
SPM
μSerDes™
MicroPak™
STEALTH™
®
®
MicroPak2™
MillerDrive™
MotionMax™
Motion-SPM™
mWSaver™
OptoHiT™
SuperFET
®
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
Fairchild
®
UHC
®
Fairchild Semiconductor
FACT Quiet Series™
Ultra FRFET™
UniFET™
VCX™
VisualMax™
VoltagePlus™
XS™
®
®
SupreMOS
FACT
®
SyncFET™
Sync-Lock™
®*
FAST
®
OPTOLOGIC
OPTOPLANAR
FastvCore™
FETBench™
FlashWriter
FPS™
®
®
*
®
tm
*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used here in:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or
effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website,
www.Fairchildsemi.com, under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their
parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed
application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the
proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild
Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild
Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of
up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and
warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is
committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Datasheet contains the design specifications for product development. Specifications
may change in any manner without notice.
Advance Information
Formative / In Design
Datasheet contains preliminary data; supplementary data will be published at a later
date. Fairchild Semiconductor reserves the right to make changes at any time without
notice to improve design.
Preliminary
First Production
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to
make changes at any time without notice to improve the design.
No Identification Needed
Obsolete
Full Production
Datasheet contains specifications on a product that is discontinued by Fairchild
Semiconductor. The datasheet is for reference information only.
Not In Production
Rev. I61
www.fairchildsemi.com
10
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1
©2020 ICPDF网 联系我们和版权申明