FDP16N50_12 [FAIRCHILD]

500V N-Channel MOSFET; 500V N沟道MOSFET
FDP16N50_12
型号: FDP16N50_12
厂家: FAIRCHILD SEMICONDUCTOR    FAIRCHILD SEMICONDUCTOR
描述:

500V N-Channel MOSFET
500V N沟道MOSFET

文件: 总10页 (文件大小:800K)
中文:  中文翻译
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July 2012  
TM  
UniFET  
FDP16N50 / FDPF16N50 / FDPF16N50T  
500V N-Channel MOSFET  
Features  
Description  
16A, 500V, RDS(on) = 0.38Ω @VGS = 10 V  
Low gate charge ( typical 32 nC)  
Low Crss ( typical 20 pF)  
Fast switching  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
100% avalanche tested  
Improved dv/dt capability  
D
G
TO-220F  
FDPF Series  
S
TO-220  
FDP Series  
G D  
S
G
D S  
Absolute Maximum Ratings  
FDPF16N50 /  
FDPF16N50T  
Symbol  
Parameter  
FDP16N50  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
500  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
16  
9.6  
16 *  
9.6 *  
A
A
(Note 1)  
(Note 2)  
IDM  
Drain Current  
- Pulsed  
64  
64 *  
A
V
VGSS  
EAS  
IAR  
Gate-Source voltage  
±30  
780  
16  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
20  
mJ  
V/ns  
4.5  
Power Dissipation  
(TC = 25°C)  
- Derate above 25°C  
200  
1.59  
38.5  
0.3  
W
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
* Drain current limited by maximum junction temperature  
Thermal Characteristics  
FDPF16N50 /  
FDPF16N50T  
Symbol  
Parameter  
FDP16N50  
Unit  
RθJC  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Case-to-Sink Typ.  
Thermal Resistance, Junction-to-Ambient  
0.63  
0.5  
3.3  
--  
°C/W  
°C/W  
°C/W  
RθCS  
RθJA  
62.5  
62.5  
©2012 Fairchild Semiconductor Corporation  
1
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Package Marking and Ordering Information  
Device Marking  
FDPF16N50  
Device  
FDPF16N50  
FDPF16N50T  
Package  
TO-220F  
TO-220F  
Reel Size  
Tape Width  
Quantity  
-
-
-
-
50  
50  
FDPF16N50T  
Electrical Characteristics  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Conditions  
Min. Typ. Max Units  
Off Characteristics  
BVDSS  
Drain-Source Breakdown Voltage  
VGS = 0V, ID = 250μA  
D = 250μA, Referenced to 25°C  
500  
--  
--  
--  
--  
V
ΔBVDSS  
Breakdown Voltage Temperature  
Coefficient  
I
0.5  
V/°C  
/
ΔTJ  
IDSS  
Zero Gate Voltage Drain Current  
VDS = 500V, VGS = 0V  
DS = 400V, TC = 125°C  
--  
--  
--  
--  
1
10  
μA  
μA  
V
IGSSF  
IGSSR  
Gate-Body Leakage Current, Forward  
Gate-Body Leakage Current, Reverse  
VGS = 30V, VDS = 0V  
VGS = -30V, VDS = 0V  
--  
--  
--  
--  
100  
nA  
nA  
-100  
On Characteristics  
VGS(th) Gate Threshold Voltage  
RDS(on)  
VDS = VGS, ID = 250μA  
3.0  
--  
--  
5.0  
0.38  
--  
V
Ω
S
Static Drain-Source  
On-Resistance  
V
GS = 10V, ID = 8A  
0.31  
23  
gFS  
Forward Transconductance  
VDS = 40V, ID = 8A  
(Note 4)  
--  
Dynamic Characteristics  
Ciss  
Coss  
Crss  
Input Capacitance  
VDS = 25V, VGS = 0V,  
f = 1.0MHz  
--  
--  
--  
1495  
235  
20  
1945  
310  
30  
pF  
pF  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
VDD = 250V, ID = 16A  
RG = 25Ω  
--  
--  
--  
--  
--  
--  
--  
40  
150  
65  
90  
310  
140  
170  
45  
ns  
ns  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
ns  
(Note 4, 5)  
(Note 4, 5)  
80  
ns  
Qg  
VDS = 400V, ID = 16A  
32  
nC  
nC  
nC  
V
GS = 10V  
Qgs  
Qgd  
8.5  
14  
--  
--  
Drain-Source Diode Characteristics and Maximum Ratings  
IS  
Maximum Continuous Drain-Source Diode Forward Current  
Maximum Pulsed Drain-Source Diode Forward Current  
--  
--  
--  
--  
--  
--  
--  
9.2  
37  
1.4  
--  
A
A
ISM  
VSD  
trr  
Drain-Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0V, IS = 16A  
--  
V
VGS = 0V, IS = 16A  
490  
5.0  
ns  
μC  
dIF/dt =100A/μs  
(Note 4)  
Qrr  
Reverse Recovery Charge  
--  
NOTES:  
1. Repetitive Rating: Pulse width limited by maximum junction temperature  
2. L = 5.5mH, I = 16A, V = 50V, R = 25Ω, Starting T = 25°C  
AS  
DD  
G
J
3. I 16A, di/dt 200A/μs, V BV  
, Starting T = 25°C  
SD  
DD  
DSS  
J
4. Pulse Test: Pulse width 300μs, Duty Cycle 2%  
5. Essentially Independent of Operating Temperature Typical Characteristics  
2
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
VGS  
102  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.5 V  
6.0 V  
101  
100  
10-1  
Bottom : 5.5 V  
101  
150oC  
25oC  
-55oC  
* Notes :  
1. 250μs Pulse Test  
* Notes :  
1. VDS = 40V  
o
2. TC = 25  
C
2. 250μs Pulse Test  
10 12  
100  
10-1  
100  
101  
2
4
6
8
VDS, Drain-Source Voltage [V]  
VGS, Gate-Source Voltage [V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperatue  
0.6  
0.5  
VGS = 10V  
101  
0.4  
VGS = 20V  
150oC  
0.3  
25oC  
* Notes :  
1. VGS = 0V  
o
* Note : TJ = 25 C  
2. 250μs Pulse Test  
100  
0.2  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
2.2  
2.4  
0
5
10  
15  
20  
25  
30  
35  
40  
VSD, Source-Drain voltage [V]  
ID, Drain Current [A]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
4000  
12  
C
iss = Cgs + Cgd (Cds = shorted)  
oss = Cds + Cgd  
Crss = Cgd  
C
VDS = 100V  
VDS = 250V  
VDS = 400V  
10  
8
3000  
2000  
1000  
0
Coss  
6
C
iss  
4
* Note :  
1. VGS = 0 V  
C
rss  
2. f = 1 MHz  
2
* Note : ID = 16A  
0
10-1  
100  
101  
0
10  
20  
30  
40  
VDS, Drain-Source Voltage [V]  
QG, Total Gate Charge [nC]  
3
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
1.2  
1.1  
1.0  
* Notes :  
1. VGS = 0 V  
0.9  
0.8  
* Notes :  
1. VGS = 10 V  
2. ID = 250μA  
0.5  
2. ID = 8 A  
0.0  
-100  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Figure 9-1. Maximum Safe Operating Area  
- FDP16N50  
Figure 9-2. Maximum Safe Operating Area  
- FDPF16N50 / FDPF16N50T  
102  
102  
101  
100  
10-1  
10-2  
10 μs  
10 μs  
100 μs  
100 μs  
101  
1 ms  
1 ms  
10 ms  
100 ms  
10 ms  
Operation in This Area  
is Limited by R DS(on)  
DC  
Operation in This Area  
is Limited by R DS(on)  
100 ms  
100  
DC  
-1  
10  
* Notes :  
* Notes :  
1. TC = 25 o  
C
1. TC = 25 o  
2. TJ = 150 o  
C
C
2. TJ = 150 o  
C
3. Single Pulse  
3. Single Pulse  
-2  
10  
100  
101  
102  
100  
101  
102  
VDS, Drain-Source Voltage [V]  
VDS, Drain-Source Voltage [V]  
Figure 10. Maximum Drain Currentvs. Case Temperature  
20  
15  
10  
5
0
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
4
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Typical Performance Characteristics (Continued)  
Figure 11-1. Transient Thermal Response Curve - FDP16N50  
1 00  
D =0 .5  
0 .2  
10 -1  
0.1  
PDM  
0 .0 5  
0 .02  
t1  
t2  
*
N o te s  
:
o
0.01  
1 . Z θ JC (t)  
=
0.63 C /W M ax.  
2 . D u ty F actor, D = t1/t2  
10 -2  
3 . T JM  
-
T C  
=
P D M  
* Z θ JC (t)  
sing le p ulse  
10 -3  
1 0-5  
1 0-4  
10 -2  
10 -1  
1 00  
10 1  
t1 , S q u a re W a ve P u lse D u ra tio n [se c]  
Figure 11-2. Transient Thermal Response Curve - FDPF16N50 / FDPF16N50T  
D =0 .5  
1 00  
0 .2  
0 .1  
0 .0 5  
PDM  
10 -1  
0 .0 2  
t1  
0.01  
t2  
*
N o te s  
1 . Z θ JC (t)  
2 . D u ty F actor, D = t1/t2  
:
o
3.3 C /W M ax.  
=
10 -2  
1 0-5  
sing le pu lse  
3 . T JM  
-
T C  
=
P D M  
1 00  
* Z θ JC (t)  
1 0-4  
10 -3  
10 -2  
10 -1  
10 1  
t1 , S q u a re W a ve P u lse D u ra tio n [se c]  
5
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Gate Charge Test Circuit & Waveform  
Resistive Switching Test Circuit & Waveforms  
Unclamped Inductive Switching Test Circuit & Waveforms  
6
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Peak Diode Recovery dv/dt Test Circuit & Waveforms  
7
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Mechanical Dimensions  
TO-220F  
2.54 0.20  
(0.70)  
10.16 0.20  
(7.00)  
ø3.18 0.10  
(1.00x45°)  
MAX1.47  
0.80 0.10  
(30  
°
)
#1  
0.35 0.10  
2.54TYP  
+0.10  
–0.05  
0.50  
2.76 0.20  
2.54TYP  
[2.54 0.20  
]
[2.54 0.20]  
9.40 0.20  
Dimensions in Millimeters  
www.fairchildsemi.com  
8
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
Package Dimensions  
TO-220F Potted  
* Front/Back Side Isolation Voltage : AC 2500V  
Dimensions in Millimeters  
9
www.fairchildsemi.com  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  
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Rev. I61  
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10  
FDP16N50 / FDPF16N50 / FDPF16N50T Rev. C1  

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